CN114008700A - 显示装置及其制备方法 - Google Patents
显示装置及其制备方法 Download PDFInfo
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- CN114008700A CN114008700A CN202080000844.XA CN202080000844A CN114008700A CN 114008700 A CN114008700 A CN 114008700A CN 202080000844 A CN202080000844 A CN 202080000844A CN 114008700 A CN114008700 A CN 114008700A
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/302—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements characterised by the form or geometrical disposition of the individual elements
- G09F9/3026—Video wall, i.e. stackable semiconductor matrix display modules
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
- G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
- G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2300/00—Aspects of the constitution of display devices
- G09G2300/02—Composition of display devices
- G09G2300/026—Video wall, i.e. juxtaposition of a plurality of screens to create a display screen of bigger dimensions
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2300/00—Aspects of the constitution of display devices
- G09G2300/04—Structural and physical details of display devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Power Engineering (AREA)
- Multimedia (AREA)
- Computer Hardware Design (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
Abstract
本公开实施例的显示装置包括:多个显示面板;每个所述显示面板具有相对的显示侧和背侧;定位基板,设置在所述显示面板的背侧方向;多个连接结构,每个所述显示面板对应至少一个连接结构,所述显示面板通过其对应的连接结构以粘结方式固定在所述定位基板上;其中,每个所述连接结构包括:固定件,连接在所述显示面板背侧;第一连接件,与所述固定件可拆卸连接;第二连接件,与所述定位基板可拆卸连接,且通过第一粘结结构与第一连接件粘结,以使所述显示面板以粘结方式固定在所述定位基板上。
Description
PCT国内申请,说明书已公开。
Claims (16)
- PCT国内申请,权利要求书已公开。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CN2020/092804 WO2021237551A1 (zh) | 2020-05-28 | 2020-05-28 | 显示装置及其制备方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN114008700A true CN114008700A (zh) | 2022-02-01 |
CN114008700B CN114008700B (zh) | 2023-10-24 |
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CN202080000844.XA Active CN114008700B (zh) | 2020-05-28 | 2020-05-28 | 显示装置及其制备方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US11984052B2 (zh) |
CN (1) | CN114008700B (zh) |
WO (1) | WO2021237551A1 (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115148111A (zh) * | 2022-06-24 | 2022-10-04 | Tcl华星光电技术有限公司 | 显示装置及其制备方法 |
WO2023246351A1 (zh) * | 2022-06-24 | 2023-12-28 | 京东方科技集团股份有限公司 | 子显示面板组件和拼接显示装置 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114170918B (zh) * | 2021-12-10 | 2023-10-03 | Tcl华星光电技术有限公司 | 拼接式发光面板以及显示装置 |
CN114495732B (zh) * | 2022-03-29 | 2023-10-13 | 深圳市华星光电半导体显示技术有限公司 | 一种拼接显示装置及其制作方法 |
CN117916791A (zh) * | 2022-08-19 | 2024-04-19 | 京东方科技集团股份有限公司 | 子显示面板组件和拼接显示装置 |
Citations (8)
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CN1461961A (zh) * | 2002-05-30 | 2003-12-17 | Lg.菲利浦Lcd株式会社 | 制造液晶显示器的系统和用该系统制造液晶显示器的方法 |
CN204946486U (zh) * | 2015-09-06 | 2016-01-06 | 济南大境电子技术有限公司 | 显示屏拼接装置 |
CN205711743U (zh) * | 2016-06-12 | 2016-11-23 | 温州市交通投资集团有限公司 | 一种干湿接缝的钢‑混凝土组合桥面板 |
CN107978235A (zh) * | 2017-12-30 | 2018-05-01 | 广州市高博林电子有限公司 | Led显示屏 |
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2020
- 2020-05-28 WO PCT/CN2020/092804 patent/WO2021237551A1/zh active Application Filing
- 2020-05-28 CN CN202080000844.XA patent/CN114008700B/zh active Active
- 2020-05-28 US US17/279,677 patent/US11984052B2/en active Active
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CN1461961A (zh) * | 2002-05-30 | 2003-12-17 | Lg.菲利浦Lcd株式会社 | 制造液晶显示器的系统和用该系统制造液晶显示器的方法 |
CN204946486U (zh) * | 2015-09-06 | 2016-01-06 | 济南大境电子技术有限公司 | 显示屏拼接装置 |
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WO2019099985A1 (en) * | 2017-11-20 | 2019-05-23 | Corning Incorporated | Sub-displays and methods for fabricating tiled displays from sub-displays |
CN107978235A (zh) * | 2017-12-30 | 2018-05-01 | 广州市高博林电子有限公司 | Led显示屏 |
CN108986679A (zh) * | 2018-09-21 | 2018-12-11 | 惠州市艾比森光电有限公司 | 显示模组拼接结构及显示屏 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN115148111A (zh) * | 2022-06-24 | 2022-10-04 | Tcl华星光电技术有限公司 | 显示装置及其制备方法 |
WO2023246351A1 (zh) * | 2022-06-24 | 2023-12-28 | 京东方科技集团股份有限公司 | 子显示面板组件和拼接显示装置 |
Also Published As
Publication number | Publication date |
---|---|
WO2021237551A1 (zh) | 2021-12-02 |
US20220198969A1 (en) | 2022-06-23 |
CN114008700B (zh) | 2023-10-24 |
US11984052B2 (en) | 2024-05-14 |
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