CN113993288A - 一种半显影干膜法实现精细线路的蚀刻方法 - Google Patents
一种半显影干膜法实现精细线路的蚀刻方法 Download PDFInfo
- Publication number
- CN113993288A CN113993288A CN202111394712.2A CN202111394712A CN113993288A CN 113993288 A CN113993288 A CN 113993288A CN 202111394712 A CN202111394712 A CN 202111394712A CN 113993288 A CN113993288 A CN 113993288A
- Authority
- CN
- China
- Prior art keywords
- dry film
- developing
- semi
- etching
- fine circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 49
- 238000005530 etching Methods 0.000 title claims abstract description 23
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229910052802 copper Inorganic materials 0.000 claims abstract description 13
- 239000010949 copper Substances 0.000 claims abstract description 13
- 239000000463 material Substances 0.000 claims abstract description 7
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 5
- 230000000694 effects Effects 0.000 claims description 8
- 229920002120 photoresistant polymer Polymers 0.000 abstract description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 238000000576 coating method Methods 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 239000003814 drug Substances 0.000 description 4
- 238000002791 soaking Methods 0.000 description 4
- 238000005507 spraying Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000006303 photolysis reaction Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000035484 reaction time Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 235000017550 sodium carbonate Nutrition 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202111394712.2A CN113993288A (zh) | 2021-11-23 | 2021-11-23 | 一种半显影干膜法实现精细线路的蚀刻方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202111394712.2A CN113993288A (zh) | 2021-11-23 | 2021-11-23 | 一种半显影干膜法实现精细线路的蚀刻方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN113993288A true CN113993288A (zh) | 2022-01-28 |
Family
ID=79750051
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202111394712.2A Pending CN113993288A (zh) | 2021-11-23 | 2021-11-23 | 一种半显影干膜法实现精细线路的蚀刻方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN113993288A (zh) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005136430A (ja) * | 2004-11-15 | 2005-05-26 | Nec Kagoshima Ltd | パターン形成方法 |
CN101377619A (zh) * | 2008-09-17 | 2009-03-04 | 彩虹集团电子股份有限公司 | 一种游星轮片蚀刻法生产工艺 |
JP2013210424A (ja) * | 2012-03-30 | 2013-10-10 | Hoya Corp | 欠陥評価用マスクブランク及びその製造方法、並びに欠陥評価方法 |
CN112969300A (zh) * | 2021-01-28 | 2021-06-15 | 盐城维信电子有限公司 | 一种柔性电路板蚀刻加工方法 |
-
2021
- 2021-11-23 CN CN202111394712.2A patent/CN113993288A/zh active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005136430A (ja) * | 2004-11-15 | 2005-05-26 | Nec Kagoshima Ltd | パターン形成方法 |
CN101377619A (zh) * | 2008-09-17 | 2009-03-04 | 彩虹集团电子股份有限公司 | 一种游星轮片蚀刻法生产工艺 |
JP2013210424A (ja) * | 2012-03-30 | 2013-10-10 | Hoya Corp | 欠陥評価用マスクブランク及びその製造方法、並びに欠陥評価方法 |
CN112969300A (zh) * | 2021-01-28 | 2021-06-15 | 盐城维信电子有限公司 | 一种柔性电路板蚀刻加工方法 |
Non-Patent Citations (1)
Title |
---|
刘晓阳;朱斌;张良静;: "用于HDI的新型感光抗蚀材料与图形转移技术", 印制电路信息, no. 11 * |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0003801B1 (en) | Use of photosensitive stratum to create through-hole connections in circuit boards | |
TW201126573A (en) | Pattern forming method and pattern forming apparatus | |
US4283243A (en) | Use of photosensitive stratum to create through-hole connections in circuit boards | |
CN102361542B (zh) | 具台阶的印刷电路板制作工艺 | |
TWI721172B (zh) | 用於使用光可成像層之半導體封裝體的系統與方法 | |
US20070072129A1 (en) | Method for forming flexible printed circuit boards | |
JP2007142092A (ja) | 高密度配線基板の製法およびそれを用いて製造した高密度配線基板、電子装置ならびに電子機器 | |
WO2015043261A1 (zh) | 光刻胶的去除方法、曝光装置以及显示基板的制造方法 | |
CN113993288A (zh) | 一种半显影干膜法实现精细线路的蚀刻方法 | |
CN109561597B (zh) | 自清洁柔性导电线路的制备方法及具有其的柔性设备 | |
CN108207081A (zh) | 印刷电路板线路的喷墨打印制造方法 | |
CN107689321B (zh) | 图案化光阻的形成方法及其结构 | |
CN104105352B (zh) | 一种铝蚀刻柔性线路板的制造方法 | |
CN110783253B (zh) | 一种显示基板的制作方法、显示基板和显示装置 | |
KR20060132380A (ko) | 회로기판의 패턴 형성방법 및 이를 이용하여 제조된회로기판 | |
KR20100028330A (ko) | 미세 패턴을 갖는 실린더의 제조 방법 | |
CN110621116A (zh) | 一种封装基板的制作方法 | |
JPS6148831A (ja) | 光硬化性構造体 | |
US20180317325A1 (en) | Circuit board and method for manufacturing the same | |
JPS62280751A (ja) | 印刷配線板の現像方法 | |
JP2000156556A (ja) | スルーホール部を有する基板へのレジスト層形成方法及びプリント配線基板の製造方法 | |
CN105934102A (zh) | 一种基于激光蚀刻的电路印制方法 | |
JPS63182889A (ja) | プリント配線板の製造方法 | |
JP3168091B2 (ja) | 立体回路形成方法 | |
US6676991B2 (en) | Etch resist using printer technology |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20240131 Address after: 221300 north of Liaohe Road and west of Huashan Road, Pizhou Economic Development Zone, Xuzhou City, Jiangsu Province Applicant after: Jiangsu SHANGDA Semiconductor Co.,Ltd. Country or region after: China Address before: 518100 floors 1-4, 2-3, building a, Huangpu Runhe Industrial Park, South Ring Road, Huangpu Community, Shajing street, Bao'an District, Shenzhen City, Guangdong Province Applicant before: LEADER-TECH ELECTRONICS (SHENZHEN) Inc. Country or region before: China |
|
TA01 | Transfer of patent application right |