CN113808977B - 晶圆存取总成及其晶圆存取装置与晶圆载具 - Google Patents

晶圆存取总成及其晶圆存取装置与晶圆载具 Download PDF

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CN113808977B
CN113808977B CN202110437448.XA CN202110437448A CN113808977B CN 113808977 B CN113808977 B CN 113808977B CN 202110437448 A CN202110437448 A CN 202110437448A CN 113808977 B CN113808977 B CN 113808977B
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潘世峰
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Daliyu Technology Co ltd
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Abstract

本申请实施例提供一种晶圆存取总成及其晶圆存取装置与晶圆载具，晶圆存取装置具有底座可平移或旋转、滑动轴、两个或两个以上连动板、两个或两个以上手臂、以及至少两个定位侧壁，底座具有长槽，滑动轴可沿长槽平移滑动，各连动板皆套设于滑动轴，每一个手臂由连动板一端延伸而出，两个定位侧壁分别设于底座两侧，每一个定位侧壁具有两个或两个以上轨道供连动板的凸柱伸入，各轨道宽度由定位侧壁的前端朝后端渐小。晶圆存取总成具有晶圆存取装置及晶圆载具。借此，晶圆载具的体积可缩减一半，且晶圆存取装置可同时真空吸附两个或两个以上晶圆，达到更高的晶圆存取效率。

Description

晶圆存取总成及其晶圆存取装置与晶圆载具
技术领域
本申请实施例关于一种存取晶圆及运送晶圆的技术，特别是指一种既省时又能减少运送体积的晶圆存取总成及其晶圆存取装置与晶圆载具。
背景技术
晶圆是半导体制程中主要的基材，由于晶圆易碎，且一旦已经完成曝光、显影、蚀刻等制程并等待进行切割的晶圆受到污染，所造成的损失更是令人咋舌，因此在运送晶圆的过程中往往需要使用经过特别设计的密封容器来保护。现有技术是通过机械手臂(waferrobot)抓取晶圆使其于“运送晶圆盒”与“晶圆传输系统”之间取出或置入，因此，为了配合生产线的机台，熟知晶圆盒的固定肋(slit)间距大约为10mm左右，使得25片装的晶圆盒具有一定体积，另一方面，机械手臂来回在“运送晶圆盒”与“晶圆传输系统”之间一次仅抓取一片晶圆，效率显然不高，当大量的晶圆需跨厂区运送时，其所占用的仓储体积、运送时间与运送成本相当可观。
发明内容
有鉴于此，本申请实施例的目的在于提供一种晶圆存取总成及其晶圆存取装置与晶圆载具，其存取晶圆的效率较高，且可大幅缩减晶圆载具在运送晶圆时的所占体积。
为达上述目的，本申请实施例揭露一种晶圆存取装置，包含有底座、滑动轴、两个或两个以上连动板、两个或两个以上手臂、以及至少两个定位侧壁；该底座可平移或旋转，该底座具有长槽，该长槽具有第一端以及第二端；该滑动轴的一端容置于该长槽中，该滑动轴沿该长槽于该第一端与该第二端之间平移滑动；每一个连动板具有板体、穿孔穿设于该板体、以及至少两个凸柱由该板体的相对两侧凸伸而出，各该穿孔供该滑动轴穿过而使各该连动板皆套设于该滑动轴；每一个手臂由该连动板的板体的一端延伸而出；两个定位侧壁，分别设于该底座的两侧，使该底座的长槽位于两个定位侧壁之间，每一个定位侧壁的内侧具有两个或两个以上固定肋，同一个定位侧壁上的每两个固定肋之间形成轨道供该连动板的其中一个凸柱伸入，各该轨道的宽度由该定位侧壁的前端朝向其后端逐渐变小。
为达上述目的，本申请实施例另揭露一种晶圆载具，用以供上述的晶圆存取装置将晶圆取出或置入，该晶圆载具包含有上板、下板、两个侧板、后板、开口、容置空间、以及卡匣结构，该容置空间由该上板、该下板、两个侧板、与该后板共同围构而成，该开口位于该容置空间的开放端，该卡匣结构容置于该容置空间中，该卡匣结构的左侧壁与右侧壁分别设有两个或两个以上凸肋，每两个凸肋之间形成插槽，该左侧壁与该右侧壁上的插槽及凸肋的位置均相互对应。
为达上述目的，本申请实施例另揭露一种晶圆存取总成，包含有上述的晶圆存取装置、以及上述的晶圆载具，该晶圆存取装置将晶圆取出或置入该晶圆载具。
如此一来，该晶圆载具放置晶圆的所占体积相较于现有结构可大幅缩减一半，尤其当大量的晶圆需跨厂区运送时，其所占用的仓储体积也仅为现有的一半；另一方面，由于该晶圆存取装置具有两个或两个以上手臂，因此可同时真空吸附两个或两个以上晶圆进行运送，相较于现有结构的机械手臂一次只能吸取一片晶圆，该晶圆存取装置更能省下不少晶圆的真空吸附与运送时间，达到更高的晶圆存取效率。
附图说明
图1为本申请第一较佳实施例的晶圆存取装置的立体图；
图2为本申请第一较佳实施例的定位侧壁与底座的立体图；
图3为本申请第一较佳实施例的晶圆存取总成的立体图；
图4为本申请第一较佳实施例的晶圆载具的立体图；
图5为现有晶圆载具与本申请第一较佳实施例的晶圆存取装置的立体图；
图6至图13为本申请第一较佳实施例的晶圆存取装置的作动图；
图14为本申请第二较佳实施例的晶圆存取装置的立体图。
附图标记说明：
10、晶圆存取装置；
20、固定座；
30、底座；32、长槽；321、第一端；323第二端；
40、滑动轴；
50、连动板；52、板体；54、穿孔；56、凸柱；
60、手臂；
70、定位侧壁；72、固定肋；74、轨道；76、前端；78、后端；
80、晶圆存取总成；
90、晶圆载具；91、上板；92、下板；93、侧板；94、后板；95、开口；96、容置空间；97、卡匣结构；975、凸肋；977、插槽；
100、晶圆载具；
W、晶圆。
具体实施方式
请参考图1，是本申请第一较佳实施例所提供的晶圆存取装置10，其具有固定座20、底座30、滑动轴40、两个或两个以上连动板50、两个或两个以上手臂60、以及两个定位侧壁70。
该底座30设于该固定座20上，该底座30可相对该固定座20平移或旋转，该底座30具有长槽32，该长槽32具有第一端321以及第二端323。于其他可能的实施例中，该固定座20可省略不设或由其他结构取代，惟该底座30仍具有可平移或旋转的功能。
该滑动轴40的一端容置于该长槽32中，该滑动轴40沿该长槽32于该第一端321与该第二端323之间平移滑动。
每一个连动板50具有板体52、穿孔54穿设于该板体52、以及两个凸柱56由该板体52的相对两侧凸伸而出，各该穿孔54供该滑动轴40穿过而使各该连动板50皆套设于该滑动轴40。于本申请实施例中，该些连动板50的数量为25个，于其他可能的实施例中，该些连动板50的数量可视需求改变。
每一个手臂60由其中连动板50的板体52的一端延伸而出，故可理解的是，该些手臂60的数量应与该些连动板50的数量相同，于本申请实施例中，该些手臂60的数量亦为25个。每一个手臂60可用来真空吸附一片晶圆W(如图5所示)。
请参考图1与图2，两个定位侧壁70分别设于该底座30的两侧，使该底座30的长槽32位于两个定位侧壁70之间，每一个定位侧壁70的内侧具有两个或两个以上固定肋72，同一个定位侧壁70上的每两个固定肋72之间形成轨道74供该连动板50的其中一个凸柱56伸入，各该轨道74的宽度由该定位侧壁70的前端76朝向其后端78逐渐变小，于本申请实施例中，各该轨道74位于该定位侧壁70的前端76的宽度为10mm，各该轨道74位于该定位侧壁70的后端78的宽度为5mm，于其他可能的实施例中，各该轨道74位于该定位侧壁70的前端76或后端78的宽度可视需求改变，例如各该轨道74位于该后端78的宽度可介在3mm以上且小于10mm的范围内。
请参考图3，是本申请第一较佳实施例所提供的晶圆存取总成80，其具有上述的晶圆存取装置10、以及晶圆载具90，该晶圆载具90用以供该晶圆存取装置10将晶圆W取出或置入，该晶圆载具90的结构与现有结构大致相同，如图4所示，该晶圆载具90具有上板91、下板92、两个侧板93、后板94、开口95、容置空间96、以及卡匣结构97，该容置空间96由该上板91、该下板92、两个侧板93、与该后板94共同围构而成，该开口95位于该容置空间95的开放端，该卡匣结构97容置于该容置空间96中，该卡匣结构97于两个侧板93处分别设有两个或两个以上凸肋975，每两个凸肋975之间形成插槽977，位于其中一个侧板93处的插槽977与位置所对应的另一个侧板93处的插槽977系是供同一片晶圆W置入存放，于本申请实施例中，该晶圆载具90与现有结构最大的差异在于每一个插槽977的宽度为5mm，于其他可能的实施例中，该些插槽977的宽度可视需求改变，例如每一个插槽977的宽度可介在3mm以上且小于10mm的范围内。
请参考图5，附图左方的晶圆载具100为现有的晶圆载具，可以是晶圆盒或产线机台等，因此详细结构不再赘述，现有的晶圆载具100共可装载25片晶圆，且每片晶圆之间的间距为10mm，为了方便说明及附图精简化，附图中的晶圆数量是以3片作为示范。以下将进一步说明该晶圆存取装置10将晶圆W由现有的晶圆载具100取出并置入于该晶圆载具90的流程。
请搭配上述附图并参考图6至图13，首先，该晶圆存取装置10系位于现有的晶圆载具100与该晶圆载具90之间(如图6所示)，且该底座30的长槽32的第一端321较靠近现有的晶圆载具100、该第二端323较靠近该晶圆载具90；该滑动轴40开始沿该长槽32朝该第一端321平移滑动，待该滑动轴40抵达该长槽32的第一端321时(如图7所示)，该底座30便相对该固定座20由初始位置朝现有晶圆载具100的方向平移(如图8所示)，该滑动轴40在平移滑动的同时则驱使该些连动板50连同该些手臂60一起朝该晶圆载具100的方向移动，此时，每一个连动板50上的两个凸柱56分别位在对应的每一个轨道74中滑动，当两个凸柱56滑动到该轨道74位于该定位侧壁70的前端76时(即该滑动轴40亦抵达该长槽32的第一端321)，各连动板50之间的距离为10mm，以符合现有晶圆载具100的结构规格，随着该底座30继续平移，各该手臂60便可伸入于该晶圆载具100中，并各自真空吸附一片晶圆W；接着，如图9所示，该底座30相对该固定座20朝该晶圆载具90的方向平移，待该底座30回到初始位置后，该滑动轴40则沿该长槽32朝该第二端323平移滑动，此时该滑动轴40驱使该些连动板50也朝该晶圆载具90的方向移动，连带地使该些手臂60与吸附的晶圆W也退离该晶圆载具100，当该滑动轴40朝该第二端323移动时，每一个连动板50上的两个凸柱56亦在对应的每一个轨道74中滑动，由于各该轨道74的宽度由该定位侧壁70的前端76朝向其后端78逐渐变小，因此两个凸柱56在滑动的过程中，使得各该连动板50之间的距离越来越小，亦即该些手臂60所真空吸附的晶圆W之间的距离也越缩越小，如图10所示，直到两个凸柱56滑动到该轨道74位于该定位侧壁70的后端78时(即该滑动轴40亦抵达该长槽32的第二端323)，各连动板50之间的距离为5mm，亦即各晶圆W之间的距离为5mm。
接着，如图11所示，该底座30相对该固定座20原地旋转180°，使该些手臂60所吸附的晶圆W朝向该晶圆载具90的开口95，此时，该长槽32的第二端323较靠近现有的晶圆载具100、该第一端321较靠近该晶圆载具90，该底座30旋转完毕后，便相对该固定座20朝该晶圆载具90的方向平移，需特别注意的是，此时该滑动轴40仍持续停留于该长槽32的第二端323，并不会朝向该第一端321滑动，才能确保各晶圆W之间的距离保持在5mm；随着该底座30继续平移，该底座30带动了该滑动轴40朝该晶圆载具90的方向位移，连带地使该些连动板50、该些手臂60以及吸附住的晶圆W一同朝该晶圆载具90的方向位移，直到该些手臂60伸入于该晶圆载具90中，如图12所示，并将真空吸附的晶圆W置入于所对应的该些插槽977中，该底座30便可相对该固定座20朝远离该晶圆载具90的方向平移，而驱使该些手臂60退离该晶圆载具90，如图13所示，如此便完成了该晶圆存取装置10将晶圆W由现有的晶圆载具100取出并置入于该晶圆载具90的流程。
由于该晶圆载具90每一个插槽977的宽度为5mm，因此放置在该晶圆载具90中的每一个晶圆W之间的距离仅为5mm，故相较于现有结构，该晶圆载具90放置25片晶圆的所占体积可大幅缩减50％，尤其当大量的晶圆需跨厂区运送时，其所占用的仓储体积也仅为现有的一半；此外，借由该晶圆存取装置10的定位侧壁70上的轨道74宽度由该前端76朝向该后端78逐渐变小，该晶圆存取装置10可将晶圆W由现有的晶圆载具100取出并置入于该晶圆载具90，再利用该晶圆载具90进行晶圆运送等移动需求，换言之，该晶圆存取装置10可令各晶圆W之间的距离快速地由10mm缩小至5mm，过程简易不繁琐，而轻松达到上述减少所占体积的功效；另一方面，由于该晶圆存取装置10具有两个或两个以上手臂60，更详细地说，该晶圆存取装置10可具有25个手臂60，因此可以在同一时间真空吸附25片晶圆进行运送，相较于现有结构的机械手臂一次只能吸取一片晶圆，该晶圆存取装置10更能省下不少晶圆的真空吸附与运送时间，达到更高的晶圆存取效率，甚至，该晶圆存取装置10也可用来存取半导体晶圆以外的其他对象或是运用在其他领域，例如该晶圆存取装置10也可同时存取两个或两个以上扩片环、光罩等，或是面板产业的玻璃基板等，而不局限在半导体的晶圆。
基于本申请实施例的精神，该晶圆存取装置10的结构可加以变化，举例来说，请参考图14，是本申请第二较佳实施例所提供的晶圆存取装置10’，该晶圆存取装置10’的结构与第一较佳实施例提供的晶圆存取装置10大致相同，惟该晶圆存取装置10’具有四个定位侧壁70，每两个定位侧壁70并排设于该底座30的两侧，且各该连动板50具有四个凸柱56，每两个凸柱56由该板体52的相对两侧凸伸而出，各该连动板50的四个凸柱56分别伸入四个定位侧壁70上所对应的轨道74中，如此一来，当该滑动轴40沿该长槽32由该第一端321朝该第二端323平移滑动时，各该连动板50可具有较高的稳定性。
以上所述仅为本申请的较佳可行实施例，非因此即局限本申请的保护范围，故凡是运用本申请说明书及附图内容的等效技术、手段等变化，均同理皆包含于本申请的保护范围内。

Claims (8)

1.一种晶圆存取装置，其特征在于，其包含有：
底座，所述底座可平移或旋转，所述底座具有长槽，所述长槽具有第一端以及第二端；
滑动轴，一端容置于所述长槽中，所述滑动轴沿所述长槽于所述第一端与所述第二端之间平移滑动；
两个或两个以上连动板，每一个所述连动板具有板体、穿孔穿设于所述板体、以及至少两个凸柱由所述板体的相对两侧凸伸而出，各所述穿孔供所述滑动轴穿过而使各所述连动板皆套设于所述滑动轴；
两个或两个以上手臂，每一个所述手臂由所述连动板的所述板体的一端延伸而出；以及
至少两个定位侧壁，分别设于所述底座的两侧，使所述底座的长槽位于两个所述定位侧壁之间，每一个所述定位侧壁的内侧具有两个或两个以上固定肋，同一个所述定位侧壁上的每两个固定肋之间形成轨道供所述连动板的其中一个所述凸柱伸入，各所述轨道的宽度由所述定位侧壁的前端朝向其后端逐渐变小。
2.如权利要求1所述的晶圆存取装置，其特征在于，其中各所述轨道位于所述定位侧壁的前端的宽度为10mm，各所述轨道位于所述定位侧壁的后端的宽度为3mm以上且小于10mm。
3.如权利要求2所述的晶圆存取装置，其特征在于，其中各所述轨道位于所述定位侧壁的后端的宽度为5mm。
4.如权利要求1所述的晶圆存取装置，其特征在于，其包含有四个所述定位侧壁，每两个所述定位侧壁并排设于所述底座的两侧。
5.如权利要求4所述的晶圆存取装置，其特征在于，其中各所述连动板具有四个所述凸柱，每两个所述凸柱由所述板体的相对两侧凸伸而出。
6.一种晶圆存取总成，用以运送晶圆，其特征在于，所述晶圆存取总成包含有：
权利要求1至5任一项所述的晶圆存取装置；以及
晶圆载具，包含有上板、下板、两个侧板、后板、容置空间、开口、以及卡匣结构，容置空间由所述上板、所述下板、两个所述侧板、及所述后板共同围构而成，开口位于所述容置空间的开放端，卡匣结构容置于所述容置空间中，所述卡匣结构的左侧壁与右侧壁分别设有两个或两个以上凸肋，每两个所述凸肋之间形成插槽，所述左侧壁与所述右侧壁上的所述插槽及所述凸肋的位置均相互对应；
其中，所述晶圆存取装置将所述晶圆取出或置入所述晶圆载具。
7.如权利要求6所述的晶圆存取总成，其特征在于，其中每一个所述插槽的宽度为3mm以上且小于10mm。
8.如权利要求6所述的晶圆存取总成，其特征在于，其中每一个所述插槽的宽度为5mm。
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