CN113782652B - 一种量子垒掺杂的紫外led外延片及其制造方法 - Google Patents
一种量子垒掺杂的紫外led外延片及其制造方法 Download PDFInfo
- Publication number
- CN113782652B CN113782652B CN202111179571.2A CN202111179571A CN113782652B CN 113782652 B CN113782652 B CN 113782652B CN 202111179571 A CN202111179571 A CN 202111179571A CN 113782652 B CN113782652 B CN 113782652B
- Authority
- CN
- China
- Prior art keywords
- layer
- quantum barrier
- quantum
- epitaxial wafer
- ultraviolet led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/04—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
- H01L33/06—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction within the light emitting region, e.g. quantum confinement structure or tunnel barrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0062—Processes for devices with an active region comprising only III-V compounds
- H01L33/0066—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound
- H01L33/007—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound comprising nitride compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of group III and group V of the periodic system
- H01L33/32—Materials of the light emitting region containing only elements of group III and group V of the periodic system containing nitrogen
- H01L33/325—Materials of the light emitting region containing only elements of group III and group V of the periodic system containing nitrogen characterised by the doping materials
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202111179571.2A CN113782652B (zh) | 2021-10-11 | 2021-10-11 | 一种量子垒掺杂的紫外led外延片及其制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202111179571.2A CN113782652B (zh) | 2021-10-11 | 2021-10-11 | 一种量子垒掺杂的紫外led外延片及其制造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN113782652A CN113782652A (zh) | 2021-12-10 |
CN113782652B true CN113782652B (zh) | 2022-11-15 |
Family
ID=78855198
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202111179571.2A Active CN113782652B (zh) | 2021-10-11 | 2021-10-11 | 一种量子垒掺杂的紫外led外延片及其制造方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN113782652B (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116314499B (zh) * | 2023-01-17 | 2023-10-20 | 淮安澳洋顺昌光电技术有限公司 | 有源垒层掺Mg的外延结构及制备方法和芯片 |
CN116504889B (zh) * | 2023-04-28 | 2024-02-23 | 江西兆驰半导体有限公司 | 一种发光二极管外延片及其制备方法、发光二极管 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105405939A (zh) * | 2015-12-02 | 2016-03-16 | 华灿光电(苏州)有限公司 | 一种发光二极管及其制造方法 |
CN106571416A (zh) * | 2016-11-04 | 2017-04-19 | 华灿光电(浙江)有限公司 | 一种发光二极管外延片及其制造方法 |
CN208589459U (zh) * | 2018-06-29 | 2019-03-08 | 江西兆驰半导体有限公司 | 一种紫外发光二极管 |
CN109616559A (zh) * | 2018-12-04 | 2019-04-12 | 深圳市洲明科技股份有限公司 | 一种AlGaN基紫外LED外延片结构及其制备方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103545406A (zh) * | 2012-07-16 | 2014-01-29 | 展晶科技(深圳)有限公司 | 多量子阱结构及发光二极管 |
CN102820392B (zh) * | 2012-08-31 | 2016-02-03 | 华灿光电股份有限公司 | 一种发光二极管的外延片及其制造方法 |
CN111490137B (zh) * | 2020-06-23 | 2020-10-16 | 华灿光电(浙江)有限公司 | 发光二极管外延片、显示阵列及其制作方法 |
-
2021
- 2021-10-11 CN CN202111179571.2A patent/CN113782652B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105405939A (zh) * | 2015-12-02 | 2016-03-16 | 华灿光电(苏州)有限公司 | 一种发光二极管及其制造方法 |
CN106571416A (zh) * | 2016-11-04 | 2017-04-19 | 华灿光电(浙江)有限公司 | 一种发光二极管外延片及其制造方法 |
CN208589459U (zh) * | 2018-06-29 | 2019-03-08 | 江西兆驰半导体有限公司 | 一种紫外发光二极管 |
CN109616559A (zh) * | 2018-12-04 | 2019-04-12 | 深圳市洲明科技股份有限公司 | 一种AlGaN基紫外LED外延片结构及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
CN113782652A (zh) | 2021-12-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN113782652B (zh) | 一种量子垒掺杂的紫外led外延片及其制造方法 | |
CN109216519B (zh) | 一种发光二极管外延片及其制造方法 | |
JP5836338B2 (ja) | 窒化物半導体構造及び半導体発光デバイス | |
WO2019015186A1 (zh) | 一种紫外led外延结构 | |
CN108682722B (zh) | 一种AlGaN基紫外LED外延片及其制备方法 | |
CN110752279B (zh) | 一种具有超薄铝铟氮插入层的紫外发光二极管及其制备方法 | |
CN109950371B (zh) | 紫外led外延结构及其制备方法 | |
CN110265514B (zh) | 发光二极管外延片的生长方法及发光二极管外延片 | |
CN109616559A (zh) | 一种AlGaN基紫外LED外延片结构及其制备方法 | |
CN110957401B (zh) | 一种发光二极管及其制作方法 | |
CN111048636A (zh) | 一种氧化镓基紫外发光二极管及其制备方法 | |
CN106159047B (zh) | 具有pn掺杂量子垒的发光二极管外延结构及其制备方法 | |
CN106887493B (zh) | 一种发光二极管的外延片及其制备方法 | |
CN108598224B (zh) | 一种发光二极管外延片的制作方法及其发光二极管外延片 | |
CN109755361A (zh) | 一种提高势阱质量的led外延结构及其制备方法 | |
CN108987544B (zh) | 一种发光二极管外延片及其制造方法 | |
CN108550668B (zh) | 一种发光二极管外延片及其制作方法 | |
KR20130102210A (ko) | 질화물 반도체 발광소자 및 그 제조방법 | |
CN110085713B (zh) | 一种带有插入层的多量子阱发光二极管及其制备方法 | |
CN109473520B (zh) | 一种发光二极管外延片及其制造方法 | |
CN108598222B (zh) | 一种发光二极管外延片及其生长方法 | |
CN113097353B (zh) | 一种紫外led及其制作方法 | |
CN107146836A (zh) | 具有渐变In组分p型InGaN导电层的GaN基绿光LED外延结构及其制备方法 | |
CN108987540B (zh) | 一种发光二极管外延片的制作方法及其发光二极管外延片 | |
CN110600595A (zh) | 铝镓氮基紫外led外延结构及紫外led灯 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB03 | Change of inventor or designer information | ||
CB03 | Change of inventor or designer information |
Inventor after: Wang Xinqiang Inventor after: Luo Wei Inventor after: Kang Junjie Inventor after: Yuan Ye Inventor after: Wang Weiyun Inventor after: Liu Shangfeng Inventor after: Li Tai Inventor before: Wang Xinqiang Inventor before: Luo Wei Inventor before: Kang Junjie Inventor before: Yuan Ye Inventor before: Wang Weiyun Inventor before: Liu Shangfeng Inventor before: Li Tai Inventor before: Wan Wenting |
|
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20220324 Address after: Building A1, innovation city, Songshanhu University, Dongguan, Guangdong 523000 Applicant after: Material Laboratory of Songshan Lake Address before: 523000 Room 302, building 12, No. 1, Xuefu Road, Songshanhu Park, Dongguan City, Guangdong Province Applicant before: Zhongzi semiconductor technology (Dongguan) Co.,Ltd. |
|
GR01 | Patent grant | ||
GR01 | Patent grant |