CN113691233A - High-reliability wafer-level packaged acoustic surface filter structure and preparation method thereof - Google Patents
High-reliability wafer-level packaged acoustic surface filter structure and preparation method thereof Download PDFInfo
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- CN113691233A CN113691233A CN202110996486.9A CN202110996486A CN113691233A CN 113691233 A CN113691233 A CN 113691233A CN 202110996486 A CN202110996486 A CN 202110996486A CN 113691233 A CN113691233 A CN 113691233A
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- film
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- electroplating
- bottom film
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- 238000002360 preparation method Methods 0.000 title claims abstract description 9
- 238000009713 electroplating Methods 0.000 claims abstract description 49
- 239000011241 protective layer Substances 0.000 claims abstract description 28
- 238000010897 surface acoustic wave method Methods 0.000 claims abstract description 15
- 239000002184 metal Substances 0.000 claims abstract description 11
- 229910052751 metal Inorganic materials 0.000 claims abstract description 11
- 239000010410 layer Substances 0.000 claims description 65
- 229920002120 photoresistant polymer Polymers 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 22
- 238000001259 photo etching Methods 0.000 claims description 20
- 229910000679 solder Inorganic materials 0.000 claims description 20
- 238000007747 plating Methods 0.000 claims description 14
- 238000002955 isolation Methods 0.000 claims description 13
- 238000005260 corrosion Methods 0.000 claims description 12
- 230000007797 corrosion Effects 0.000 claims description 12
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 230000001680 brushing effect Effects 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 4
- 238000003466 welding Methods 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 8
- 238000004806 packaging method and process Methods 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 230000009545 invasion Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/64—Filters using surface acoustic waves
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
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CN202110996486.9A CN113691233A (en) | 2021-08-27 | 2021-08-27 | High-reliability wafer-level packaged acoustic surface filter structure and preparation method thereof |
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CN202110996486.9A CN113691233A (en) | 2021-08-27 | 2021-08-27 | High-reliability wafer-level packaged acoustic surface filter structure and preparation method thereof |
Publications (1)
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CN113691233A true CN113691233A (en) | 2021-11-23 |
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Family Applications (1)
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CN202110996486.9A Pending CN113691233A (en) | 2021-08-27 | 2021-08-27 | High-reliability wafer-level packaged acoustic surface filter structure and preparation method thereof |
Country Status (1)
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CN (1) | CN113691233A (en) |
Citations (16)
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CN105742195A (en) * | 2016-04-01 | 2016-07-06 | 江苏长电科技股份有限公司 | Manufacturing method for etching buried hole-type surface sound filter chip packaging structure |
CN105810590A (en) * | 2016-03-18 | 2016-07-27 | 中国电子科技集团公司第二十六研究所 | Acoustic surface wave filter wafer bonding and packaging technology |
CN206640632U (en) * | 2017-04-13 | 2017-11-14 | 东莞市壹佳柒电子科技有限公司 | Dustproof glass tempering diaphragm |
CN108365829A (en) * | 2017-03-24 | 2018-08-03 | 珠海晶讯聚震科技有限公司 | The preparation method of monocrystalline piezoelectric rf-resonator and filter |
CN110380703A (en) * | 2019-08-13 | 2019-10-25 | 中电科技德清华莹电子有限公司 | A kind of the full wafer wafer level packaging structure and technique of microelectronic device |
CN110729979A (en) * | 2019-09-30 | 2020-01-24 | 中国电子科技集团公司第二十六研究所 | Wafer-level packaging method and structure of film bulk acoustic wave filter |
US20200075443A1 (en) * | 2018-09-04 | 2020-03-05 | Ningbo Semiconductor International Corporation | Wafer-level packaging method and package structure thereof |
CN111555732A (en) * | 2020-05-12 | 2020-08-18 | 中国电子科技集团公司第二十六研究所 | Thin film bulk acoustic wave device packaging structure and packaging method thereof |
CN111952243A (en) * | 2020-08-24 | 2020-11-17 | 浙江集迈科微电子有限公司 | Groove chip embedding process |
WO2021023306A1 (en) * | 2019-08-08 | 2021-02-11 | 厦门云天半导体科技有限公司 | Three-dimensional packaging structure and method for bonding wall fan-out device |
CN112511130A (en) * | 2020-12-18 | 2021-03-16 | 中国电子科技集团公司第二十六研究所 | Wafer-level liquid leakage prevention packaging method applied to surface acoustic wave filter |
CN112530819A (en) * | 2021-02-18 | 2021-03-19 | 中芯集成电路制造(绍兴)有限公司 | Metal bump and manufacturing method thereof |
CN113224011A (en) * | 2020-01-18 | 2021-08-06 | 深圳市麦捷微电子科技股份有限公司 | Wafer-level packaging structure of surface acoustic wave filter and preparation method thereof |
-
2021
- 2021-08-27 CN CN202110996486.9A patent/CN113691233A/en active Pending
Patent Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101431172A (en) * | 2008-07-29 | 2009-05-13 | 华东师范大学 | Reconfigurable microwave low-pass filter containing MEMS switch and its manufacturing method |
CN102856213A (en) * | 2012-08-24 | 2013-01-02 | 中国兵器工业集团第二一四研究所苏州研发中心 | Thin film multilayer wiring manufacturing method based on LTCC (Low Temperature Co-Fired Ceramic) base plate |
CN105140218A (en) * | 2015-09-01 | 2015-12-09 | 中国科学院上海微系统与信息技术研究所 | Method for manufacturing inductor with high quality factor |
CN105810590A (en) * | 2016-03-18 | 2016-07-27 | 中国电子科技集团公司第二十六研究所 | Acoustic surface wave filter wafer bonding and packaging technology |
CN105742195A (en) * | 2016-04-01 | 2016-07-06 | 江苏长电科技股份有限公司 | Manufacturing method for etching buried hole-type surface sound filter chip packaging structure |
CN108365829A (en) * | 2017-03-24 | 2018-08-03 | 珠海晶讯聚震科技有限公司 | The preparation method of monocrystalline piezoelectric rf-resonator and filter |
CN206640632U (en) * | 2017-04-13 | 2017-11-14 | 东莞市壹佳柒电子科技有限公司 | Dustproof glass tempering diaphragm |
US20200075443A1 (en) * | 2018-09-04 | 2020-03-05 | Ningbo Semiconductor International Corporation | Wafer-level packaging method and package structure thereof |
WO2021023306A1 (en) * | 2019-08-08 | 2021-02-11 | 厦门云天半导体科技有限公司 | Three-dimensional packaging structure and method for bonding wall fan-out device |
CN110380703A (en) * | 2019-08-13 | 2019-10-25 | 中电科技德清华莹电子有限公司 | A kind of the full wafer wafer level packaging structure and technique of microelectronic device |
CN110729979A (en) * | 2019-09-30 | 2020-01-24 | 中国电子科技集团公司第二十六研究所 | Wafer-level packaging method and structure of film bulk acoustic wave filter |
CN113224011A (en) * | 2020-01-18 | 2021-08-06 | 深圳市麦捷微电子科技股份有限公司 | Wafer-level packaging structure of surface acoustic wave filter and preparation method thereof |
CN111555732A (en) * | 2020-05-12 | 2020-08-18 | 中国电子科技集团公司第二十六研究所 | Thin film bulk acoustic wave device packaging structure and packaging method thereof |
CN111952243A (en) * | 2020-08-24 | 2020-11-17 | 浙江集迈科微电子有限公司 | Groove chip embedding process |
CN112511130A (en) * | 2020-12-18 | 2021-03-16 | 中国电子科技集团公司第二十六研究所 | Wafer-level liquid leakage prevention packaging method applied to surface acoustic wave filter |
CN112530819A (en) * | 2021-02-18 | 2021-03-19 | 中芯集成电路制造(绍兴)有限公司 | Metal bump and manufacturing method thereof |
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TA01 | Transfer of patent application right |
Effective date of registration: 20220531 Address after: No.23 Xiyong Avenue, Shapingba District, Chongqing 401332 Applicant after: CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION CHONGQING ACOUSTIC-OPTIC-ELECTRONIC CO.,LTD. Address before: 400060 Chongqing Nanping Nan'an District No. 14 Huayuan Road Applicant before: CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION NO.26 Research Institute |
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TA01 | Transfer of patent application right | ||
CB02 | Change of applicant information |
Country or region after: China Address after: No.23 Xiyong Avenue, Shapingba District, Chongqing 401332 Applicant after: CETC Chip Technology (Group) Co.,Ltd. Address before: No.23 Xiyong Avenue, Shapingba District, Chongqing 401332 Applicant before: CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION CHONGQING ACOUSTIC-OPTIC-ELECTRONIC CO.,LTD. Country or region before: China |
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CB02 | Change of applicant information |