CN113660779A - Circuit board processing and positioning method - Google Patents
Circuit board processing and positioning method Download PDFInfo
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- CN113660779A CN113660779A CN202110785633.8A CN202110785633A CN113660779A CN 113660779 A CN113660779 A CN 113660779A CN 202110785633 A CN202110785633 A CN 202110785633A CN 113660779 A CN113660779 A CN 113660779A
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- positioning
- circuit board
- positioning hole
- holes
- hole
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
Abstract
The invention belongs to the technical field of circuit board processing and positioning, and particularly relates to a circuit board processing and positioning method. The circuit board processing and positioning method comprises the following steps: drilling, preparing a bottom plate and a drilling machine, using a first tool path and drilling the PCB through the drilling machine, and simultaneously processing a plurality of first positioning holes on the PCB. Metallization, namely separating the PCB from the bottom plate and carrying out metallization treatment on the PCB; and aligning, namely preparing an alignment plate, setting a second tool path according to the first tool path, and processing a second positioning hole on the alignment plate by using the second tool path and a drilling machine. And the back drill is used for stacking the metallized PCB on the alignment plate, and adjusting the relative position of the PCB and the alignment plate to enable any first positioning hole to be communicated with the corresponding second positioning hole and fix the PCB. The invention can realize the repeated positioning of the PCB in the back drilling step, and has simple positioning process, high precision and low cost.
Description
Technical Field
The invention belongs to the technical field of circuit board processing and positioning, and particularly relates to a circuit board processing and positioning method.
Background
At present, with the improvement of the speed of a single-layer PCB (Printed Circuit Board), the application of the PCB back drilling process is more and more extensive, and the redundant metal plating in a through hole is removed mainly by using a processing mode of depth control drilling so as to reduce the antenna crosstalk effect and improve the quality and the integrity of signals. The method for processing and positioning the special circuit board by drilling the through hole once and metalizing the through hole twice removes the copper part of the hole which is not beneficial to signal transmission, and the shorter the residual stub is, the better the integrity of the signal transmission is.
The processing technology comprises the following steps: the circuit board is placed on a machine tool and drilled, then the drilled circuit board is taken out for metallization, and finally the metallized circuit board is subjected to back drilling on the machine tool. After drilling, the circuit board needs to be taken away and metallized, and finally back-drilled.
However, there is an error in the alignment accuracy between the drill hole and the back drill, and the higher the alignment accuracy between the drill hole and the back drill, the higher the processing quality of the circuit board. In the prior art, the method for realizing the positioning of the circuit board during back drilling mainly comprises the steps of shooting the position of the circuit board during drilling and the position of the circuit board during back drilling through a camera on a machine tool, and correcting and positioning the circuit board through image processing.
Disclosure of Invention
An object of the embodiments of the present application is to provide a method for positioning a circuit board, which aims to solve the problem of how to improve the processing quality of the circuit board and reduce the processing and positioning costs of the circuit board.
In order to achieve the purpose, the technical scheme adopted by the application is as follows: the circuit board processing and positioning method is characterized by comprising the following steps:
drilling, namely preparing a bottom plate and a drilling machine, fixing the bottom plate to the drilling machine, flatly paving and fixing a circuit board to the bottom plate, drilling the circuit board by using a first tool path and the drilling machine, and simultaneously machining a plurality of first positioning holes in the circuit board, wherein the first positioning holes are arranged around the center circumference of the circuit board at intervals;
metallization, separating the circuit board from the bottom plate, and carrying out metallization treatment on the circuit board;
aligning, namely preparing an alignment plate, setting a second tool path according to the first tool path, laminating and fixing the alignment plate on the bottom plate, and processing a second positioning hole on the alignment plate by using the second tool path and a drilling machine, wherein the position information of the second positioning hole is related to the position information of the first positioning hole, and the number of the second positioning holes is matched with that of the first positioning holes and is arranged in a one-to-one correspondence manner;
and back drilling, namely, arranging the metallized circuit board on the alignment plate in a stacking manner, adjusting the relative position of the circuit board and the alignment plate to enable any first positioning hole to be communicated with the corresponding second positioning hole and fix the circuit board, and performing back drilling processing on the circuit board by using a third cutter path and a drilling machine.
In one embodiment, each of the second positioning holes is offset by a first predetermined distance in a direction toward a plate center of the alignment plate.
In one embodiment, the diameter of the first positioning hole and the diameter of the second positioning hole are equal, and the first predetermined distance ranges from greater than zero to less than the diameter of the first positioning hole.
In one embodiment, each of the second positioning holes is offset a second predetermined distance in a direction away from the plate center of the alignment plate.
In one embodiment, the diameter of the first positioning hole and the diameter of the second positioning hole are equal, and the second predetermined distance ranges from greater than zero to less than the diameter of the first positioning hole.
In one embodiment, the first positioning holes are arranged in pairs.
In one embodiment, the bottom plate has a positioning surface facing downward and a fixing surface facing upward and used for fixing the positioning plate, the fixing surface has light emitting holes at positions corresponding to the second positioning holes, each light emitting hole penetrates through the positioning surface, a light source is disposed at the positioning surface, and light from the light source enters the light emitting holes and sequentially exits the corresponding second positioning holes and the corresponding first positioning holes.
In one embodiment, the positioning surface has light entrance grooves formed at positions corresponding to the light exit holes, one end of each light entrance groove communicates with the corresponding light exit hole, the other end of each light entrance groove penetrates through the side surface of the bottom plate, and the light source is disposed in each light entrance groove.
In one embodiment, the light exit hole is provided with two corresponding light entrance grooves, and the extending directions of the paths of the two light entrance grooves are orthogonal.
The beneficial effect of this application lies in: when each first positioning hole and the corresponding second positioning hole are communicated in an aligned mode, due to the fact that the position information of the first positioning hole is related to the position information of the second positioning hole, the PCB can be kept at the same position in the back drilling step and the drilling step, repeated positioning of the PCB in the back drilling step is completed, and the positioning process is simple, high in precision and low in cost.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or exemplary technical descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on the drawings without creative efforts.
Fig. 1 is a flow chart of positioning and processing of a PCB provided in an embodiment of the present application;
FIG. 2 is a schematic diagram of positioning and processing a PCB board provided by an embodiment of the present application;
fig. 3 is a perspective view of the base plate of fig. 2.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the present application.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. The terms "upper", "lower", "left", "right", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description, but do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed in a specific orientation, and operate, and thus are not to be construed as limiting the present application, and the specific meanings of the above terms may be understood by those skilled in the art according to specific situations. The terms "first", "second" and "first" are used merely for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "plurality" is two or more unless specifically limited otherwise.
Referring to fig. 1 and fig. 3, an embodiment of the present application provides a method for processing and positioning a Circuit board, which is used to process a board-shaped Circuit board, optionally, the Circuit board is a printed Circuit board (pcb) (printed Circuit board) 30, and the method for processing and positioning a Circuit board includes the following steps:
s1: drilling, namely preparing a bottom plate 10 and a drilling machine, fixing the bottom plate 10 to the drilling machine, flatly laying and fixing the PCB 30 on the bottom plate 10, drilling the PCB 30 by using a first tool path and the drilling machine, and simultaneously processing a plurality of first positioning holes 31 on the PCB 30, wherein the first positioning holes 31 are arranged around the periphery of the center of the PCB 30 at intervals; optionally, in this embodiment, four first positioning holes 31 are formed, and the four first positioning holes 31 are respectively located at four plate corners of the target object.
S2: metallization, namely separating the PCB 30 from the bottom plate 10 and carrying out metallization treatment on the PCB 30; optionally, the hole processed by the first cutting path on the target object is subjected to metallization treatment. The metallized hole is formed by chemically reacting a thin layer of copper on the wall of the hole between the top and bottom layers of the PCB 30 to interconnect the top and bottom layers of the PCB.
S3: in the alignment, the alignment plate 20 is prepared, a second tool path is set according to the first tool path, the alignment plate 20 is laminated and fixed to the base plate 10, the second positioning hole 21 is formed in the alignment plate 20 by a drill using the second tool path, and the position information of the second positioning hole 21 is related to the position information of the first positioning hole 31, that is, the position information of the first positioning hole 31 is copied to the alignment plate 20 through the second positioning hole 21 by the second tool path. Alternatively, the second positioning holes 21 are arranged circumferentially around the plate center of the aligning plate 20. The number of the second positioning holes 21 is matched with the number of the first positioning holes 31, and the second positioning holes are arranged in a one-to-one correspondence manner. The position information of the first positioning holes 31 is copied to the second positioning holes 21 by the aligning plate 20, and each first positioning hole 31 and each second positioning hole 21 are arranged in one-to-one correspondence.
S4: and back drilling, namely, arranging the metallized PCB 30 on the alignment plate 20 in a stacking manner, and adjusting the relative position of the PCB 30 and the alignment plate 20 to enable any first positioning hole 31 to be communicated with the corresponding second positioning hole 21 and fix the PCB 30. And then the third tool path is used for carrying out back drilling processing on the PCB 30 through a drilling machine.
Referring to fig. 1 and fig. 3, when each first positioning hole 31 and the corresponding second positioning hole 21 are aligned and communicated, since the position information of the first positioning hole 31 is related to the position information of the second positioning hole 21, the PCB 30 is maintained at the same position in the back drilling step as that in the drilling step, and the PCB 30 is repeatedly positioned in the back drilling step, the positioning process is simple and the cost is low.
In one embodiment, each of the second positioning holes 21 is offset by a first predetermined distance in a direction toward the plate center of the aligning plate 20. Alternatively, in the alignment step of S3, the area determined by the first positioning hole 31 and the area determined by the second positioning hole 21 overlap, so that the first positioning hole 31 and the corresponding second positioning hole 21 communicate, and the smaller the overlapped area is, the higher the positioning accuracy after the first positioning hole 31 and the second positioning hole 21 are fitted is, and therefore, the first predetermined distance is greater than zero and smaller than the diameter of the first positioning hole 31.
Referring to fig. 1 and 3, in an embodiment, the aperture of the first positioning hole 31 and the aperture of the second positioning hole 21 are equal, and the range of the first predetermined distance is greater than zero and smaller than the diameter of the first positioning hole 31.
In one embodiment, each second positioning hole 21 is offset a second predetermined distance in a direction away from the plate center of the alignment plate 20. Alternatively, in the alignment step of S3, the area determined by the first positioning hole 31 and the area determined by the second positioning hole 21 overlap, so that the first positioning hole 31 and the corresponding second positioning hole 21 communicate, and the smaller the overlapped area is, the higher the positioning accuracy after the first positioning hole 31 and the second positioning hole 21 are fitted is, and therefore, the second predetermined distance is greater than zero and smaller than the diameter of the first positioning hole 31.
Referring to fig. 1 and 3, in an embodiment, the diameter of the first positioning hole 31 is equal to the diameter of the second positioning hole 21, and the second predetermined distance is greater than zero and smaller than the diameter of the first positioning hole 31.
In one embodiment, the first positioning holes 31 are provided in pairs. Optionally, two first positioning holes 31 are disposed at a right angle of the PCB 30, and the number of the second positioning holes 21 is adapted to the number of the first positioning holes 31. The two first positioning holes 31 are formed at the same position, so that the positioning accuracy of the PCB 30 is improved.
Referring to fig. 1 and 3, in an embodiment, the bottom plate 10 has a positioning surface 14 facing downward and a fixing surface 13 facing upward and used for fixing the positioning plate 20, the fixing surface 13 has light emitting holes 11 corresponding to the positions of the second positioning holes 21, each light emitting hole 11 penetrates through the positioning surface 14, a light source is disposed at the positioning surface 14, and light of the light source enters the light emitting hole 11 and sequentially emits out of the corresponding second positioning hole 21 and the corresponding first positioning hole 31. The light passing through the light source sequentially penetrates through the second positioning hole 21 and the first positioning hole 31, so that the first positioning hole 31 and the corresponding second positioning hole 21 are visually and rapidly judged to be in a communication state.
Referring to fig. 1 and fig. 3, in an embodiment, a light inlet groove 12 is formed on the positioning surface at a position corresponding to each light outlet hole 11, one end of the light inlet groove 12 is communicated with the corresponding light outlet hole 11, the other end of the light inlet groove 12 penetrates through the side surface of the bottom plate 10, and a light source is disposed in each light inlet groove 12. By arranging the light source in the light-entering groove 12, the structure is compact, and light can enter the light-exiting hole 11.
In one embodiment, the light exit hole 11 is correspondingly provided with two light entrance grooves 12, and the extending directions of the paths of the two light entrance grooves 12 are orthogonal. Optionally, a plurality of light incident grooves 12 are formed, so that the light sources can be placed from a plurality of directions, and convenience in light source arrangement is improved.
The above are merely alternative embodiments of the present application and are not intended to limit the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement or the like made within the spirit and principle of the present application shall be included in the scope of the claims of the present application.
Claims (9)
1. A circuit board processing and positioning method is characterized by comprising the following steps:
drilling, namely preparing a bottom plate and a drilling machine, fixing the bottom plate to the drilling machine, flatly paving and fixing a circuit board to the bottom plate, drilling the circuit board by using a first tool path and the drilling machine, and simultaneously machining a plurality of first positioning holes in the circuit board, wherein the first positioning holes are arranged around the center circumference of the circuit board at intervals;
metallization, separating the circuit board from the bottom plate, and carrying out metallization treatment on the circuit board;
aligning, namely preparing an alignment plate, setting a second tool path according to the first tool path, laminating and fixing the alignment plate on the bottom plate, and processing a second positioning hole on the alignment plate by using the second tool path and a drilling machine, wherein the position information of the second positioning hole is related to the position information of the first positioning hole, and the number of the second positioning holes is matched with that of the first positioning holes and is arranged in a one-to-one correspondence manner;
and back drilling, namely, arranging the metallized circuit board on the alignment plate in a stacking manner, adjusting the relative position of the circuit board and the alignment plate to enable any first positioning hole to be communicated with the corresponding second positioning hole and fix the circuit board, and performing back drilling processing on the circuit board by using a third cutter path and a drilling machine.
2. The circuit board processing and positioning method according to claim 1, wherein: each of the second positioning holes is offset by a first predetermined distance in a direction toward a plate center of the aligning plate.
3. The circuit board processing and positioning method according to claim 2, wherein: the aperture of the first positioning hole is equal to that of the second positioning hole, and the range of the first preset distance is larger than zero and smaller than the diameter of the first positioning hole.
4. The circuit board processing and positioning method according to claim 1, wherein: each second positioning hole is offset by a second preset distance along the direction departing from the plate center of the aligning plate.
5. The circuit board processing and positioning method according to claim 4, wherein: the aperture of the first positioning hole is equal to that of the second positioning hole, and the range of the second preset distance is larger than zero and smaller than the diameter of the first positioning hole.
6. The circuit board processing and positioning method according to claim 1, wherein: the first positioning holes are arranged in pairs.
7. The circuit board processing and positioning method according to any one of claims 1 to 6, wherein: the bottom plate is provided with a downward alignment surface and an upward fixing surface for fixing the alignment plate, the fixing surface is provided with light emitting holes corresponding to the second positioning holes, each light emitting hole penetrates through the alignment surface, a light source is arranged at the alignment surface, and light of the light source enters the light emitting holes and sequentially emits the corresponding second positioning holes and the corresponding first positioning holes.
8. The circuit board processing and positioning method according to claim 7, wherein: the positioning surface is provided with light inlet grooves corresponding to the light outlet holes, one ends of the light inlet grooves are communicated with the corresponding light outlet holes, the other ends of the light inlet grooves penetrate through the side surface of the bottom plate, and the light sources are arranged in the light inlet grooves.
9. The circuit board processing and positioning method according to claim 8, wherein: the light outlet hole is correspondingly provided with two light inlet grooves, and the extending directions of the paths of the two light inlet grooves are orthogonally arranged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110785633.8A CN113660779B (en) | 2021-07-12 | 2021-07-12 | Circuit board processing and positioning method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110785633.8A CN113660779B (en) | 2021-07-12 | 2021-07-12 | Circuit board processing and positioning method |
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| CN113660779A true CN113660779A (en) | 2021-11-16 |
| CN113660779B CN113660779B (en) | 2022-08-26 |
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2021
- 2021-07-12 CN CN202110785633.8A patent/CN113660779B/en active Active
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