CN113640927A - 一种5g光通信模块用多层结构封装陶瓷及其制备方法 - Google Patents
一种5g光通信模块用多层结构封装陶瓷及其制备方法 Download PDFInfo
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- CN113640927A CN113640927A CN202110843532.1A CN202110843532A CN113640927A CN 113640927 A CN113640927 A CN 113640927A CN 202110843532 A CN202110843532 A CN 202110843532A CN 113640927 A CN113640927 A CN 113640927A
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- 239000000919 ceramic Substances 0.000 title claims abstract description 176
- 230000003287 optical effect Effects 0.000 title claims abstract description 39
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 38
- 238000004891 communication Methods 0.000 title claims abstract description 34
- 238000002360 preparation method Methods 0.000 title abstract description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 13
- 238000007639 printing Methods 0.000 claims description 11
- 238000005245 sintering Methods 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 7
- 238000004080 punching Methods 0.000 claims description 6
- 239000002002 slurry Substances 0.000 claims description 6
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 4
- 229910052721 tungsten Inorganic materials 0.000 claims description 4
- 239000010937 tungsten Substances 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000002518 antifoaming agent Substances 0.000 claims description 3
- 238000000498 ball milling Methods 0.000 claims description 3
- 239000003086 colorant Substances 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 3
- 239000002270 dispersing agent Substances 0.000 claims description 3
- 238000000462 isostatic pressing Methods 0.000 claims description 3
- 239000012528 membrane Substances 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 239000004014 plasticizer Substances 0.000 claims description 3
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- 230000008569 process Effects 0.000 claims description 3
- 238000010345 tape casting Methods 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims 1
- 238000003780 insertion Methods 0.000 abstract description 5
- 230000037431 insertion Effects 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 230000005540 biological transmission Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000008054 signal transmission Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/10—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on aluminium oxide
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
- C04B2235/96—Properties of ceramic products, e.g. mechanical properties such as strength, toughness, wear resistance
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
- C04B2235/96—Properties of ceramic products, e.g. mechanical properties such as strength, toughness, wear resistance
- C04B2235/9607—Thermal properties, e.g. thermal expansion coefficient
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Structural Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Compositions Of Oxide Ceramics (AREA)
Abstract
Description
Claims (9)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110843532.1A CN113640927B (zh) | 2021-07-26 | 2021-07-26 | 一种5g光通信模块用多层结构封装陶瓷及其制备方法 |
PCT/CN2022/080314 WO2023005217A1 (zh) | 2021-07-26 | 2022-03-11 | 一种5g光通信模块用多层结构封装陶瓷及其制备方法 |
Applications Claiming Priority (1)
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CN202110843532.1A CN113640927B (zh) | 2021-07-26 | 2021-07-26 | 一种5g光通信模块用多层结构封装陶瓷及其制备方法 |
Publications (2)
Publication Number | Publication Date |
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CN113640927A true CN113640927A (zh) | 2021-11-12 |
CN113640927B CN113640927B (zh) | 2022-10-21 |
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Family Applications (1)
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CN202110843532.1A Active CN113640927B (zh) | 2021-07-26 | 2021-07-26 | 一种5g光通信模块用多层结构封装陶瓷及其制备方法 |
Country Status (2)
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CN (1) | CN113640927B (zh) |
WO (1) | WO2023005217A1 (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114217389A (zh) * | 2021-12-16 | 2022-03-22 | 武汉光迅科技股份有限公司 | 一种光模块中发射高速信号线布局实现方法和装置 |
CN115343812A (zh) * | 2022-08-22 | 2022-11-15 | 德阳三环科技有限公司 | 输入输出构件和制备方法及封装基座和光器件 |
WO2023005217A1 (zh) * | 2021-07-26 | 2023-02-02 | 嘉兴佳利电子有限公司 | 一种5g光通信模块用多层结构封装陶瓷及其制备方法 |
Citations (9)
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US6456172B1 (en) * | 1999-10-21 | 2002-09-24 | Matsushita Electric Industrial Co., Ltd. | Multilayered ceramic RF device |
CN1721899A (zh) * | 2004-02-11 | 2006-01-18 | Jds尤尼弗思公司 | 小型光学分组件 |
JP2009111132A (ja) * | 2007-10-30 | 2009-05-21 | Kyocera Corp | 多層配線基板 |
CN104051352A (zh) * | 2014-06-13 | 2014-09-17 | 中国电子科技集团公司第五十五研究所 | 基于高温共烧陶瓷的毫米波芯片外壳及其制造方法 |
CN105024556A (zh) * | 2015-07-09 | 2015-11-04 | 中国科学院自动化研究所 | 基于低温共烧陶瓷混合集成的dc-dc变换器及其制造方法 |
CN105244324A (zh) * | 2015-11-10 | 2016-01-13 | 河北中瓷电子科技有限公司 | 电子封装用陶瓷绝缘子及其制作方法 |
CN105347777A (zh) * | 2015-11-30 | 2016-02-24 | 中国电子科技集团公司第五十五研究所 | 应用于高频电路的低损耗高温共烧氧化铝黑瓷的制备方法 |
CN109757027A (zh) * | 2019-01-26 | 2019-05-14 | 深圳莱必德科技股份有限公司 | 一种超导高频高速线路板及其制造方法 |
CN109856734A (zh) * | 2019-02-11 | 2019-06-07 | 武汉电信器件有限公司 | 一种光器件的管壳 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4922325A (en) * | 1987-10-02 | 1990-05-01 | American Telephone And Telegraph Company | Multilayer ceramic package with high frequency connections |
SE0200715D0 (sv) * | 2001-12-14 | 2002-03-11 | Optillion Ab | Feedthrough Interconnection Assembly |
US7476040B2 (en) * | 2004-02-02 | 2009-01-13 | Jds Uniphase Corporation | Compact optical sub-assembly with ceramic package |
CN201039143Y (zh) * | 2007-04-24 | 2008-03-19 | 宁波萨基姆波导研发有限公司 | 一种移动终端射频电路与天线的连接结构 |
JP2013153136A (ja) * | 2011-12-27 | 2013-08-08 | Sumitomo Electric Ind Ltd | 発光モジュール及び光トランシーバ |
CN105810591B (zh) * | 2016-04-20 | 2019-03-26 | 中国电子科技集团公司第十三研究所 | 高频、高速陶瓷封装外壳用封闭腔结构陶瓷件的制作方法 |
CN113640927B (zh) * | 2021-07-26 | 2022-10-21 | 嘉兴佳利电子有限公司 | 一种5g光通信模块用多层结构封装陶瓷及其制备方法 |
-
2021
- 2021-07-26 CN CN202110843532.1A patent/CN113640927B/zh active Active
-
2022
- 2022-03-11 WO PCT/CN2022/080314 patent/WO2023005217A1/zh unknown
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6456172B1 (en) * | 1999-10-21 | 2002-09-24 | Matsushita Electric Industrial Co., Ltd. | Multilayered ceramic RF device |
CN1721899A (zh) * | 2004-02-11 | 2006-01-18 | Jds尤尼弗思公司 | 小型光学分组件 |
JP2009111132A (ja) * | 2007-10-30 | 2009-05-21 | Kyocera Corp | 多層配線基板 |
CN104051352A (zh) * | 2014-06-13 | 2014-09-17 | 中国电子科技集团公司第五十五研究所 | 基于高温共烧陶瓷的毫米波芯片外壳及其制造方法 |
CN105024556A (zh) * | 2015-07-09 | 2015-11-04 | 中国科学院自动化研究所 | 基于低温共烧陶瓷混合集成的dc-dc变换器及其制造方法 |
CN105244324A (zh) * | 2015-11-10 | 2016-01-13 | 河北中瓷电子科技有限公司 | 电子封装用陶瓷绝缘子及其制作方法 |
CN105347777A (zh) * | 2015-11-30 | 2016-02-24 | 中国电子科技集团公司第五十五研究所 | 应用于高频电路的低损耗高温共烧氧化铝黑瓷的制备方法 |
CN109757027A (zh) * | 2019-01-26 | 2019-05-14 | 深圳莱必德科技股份有限公司 | 一种超导高频高速线路板及其制造方法 |
CN109856734A (zh) * | 2019-02-11 | 2019-06-07 | 武汉电信器件有限公司 | 一种光器件的管壳 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023005217A1 (zh) * | 2021-07-26 | 2023-02-02 | 嘉兴佳利电子有限公司 | 一种5g光通信模块用多层结构封装陶瓷及其制备方法 |
CN114217389A (zh) * | 2021-12-16 | 2022-03-22 | 武汉光迅科技股份有限公司 | 一种光模块中发射高速信号线布局实现方法和装置 |
CN115343812A (zh) * | 2022-08-22 | 2022-11-15 | 德阳三环科技有限公司 | 输入输出构件和制备方法及封装基座和光器件 |
CN115343812B (zh) * | 2022-08-22 | 2023-10-17 | 德阳三环科技有限公司 | 输入输出构件和制备方法及封装基座和光器件 |
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Publication number | Publication date |
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CN113640927B (zh) | 2022-10-21 |
WO2023005217A1 (zh) | 2023-02-02 |
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Effective date of registration: 20231113 Address after: 314003 No. 66 Zhengyuan Road, Tanghui Street, Jiaxing Economic Development Zone, Zhejiang Province Patentee after: JIAXING GLEAD ELECTRONICS Co.,Ltd. Patentee after: BEIJING BDSTAR NAVIGATION Co.,Ltd. Address before: 314003 No. 66 Zhengyuan Road, Tanghui Street, Jiaxing Economic Development Zone, Zhejiang Province Patentee before: JIAXING GLEAD ELECTRONICS Co.,Ltd. Patentee before: Beijing Beidou Xingtong Navigation Technology Co.,Ltd. Jiaxing Branch |
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