CN113611790A - 一种led显示模组 - Google Patents
一种led显示模组 Download PDFInfo
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- CN113611790A CN113611790A CN202110794808.1A CN202110794808A CN113611790A CN 113611790 A CN113611790 A CN 113611790A CN 202110794808 A CN202110794808 A CN 202110794808A CN 113611790 A CN113611790 A CN 113611790A
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
Abstract
Description
Claims (10)
Priority Applications (1)
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CN202110794808.1A CN113611790A (zh) | 2021-07-14 | 2021-07-14 | 一种led显示模组 |
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CN202110794808.1A CN113611790A (zh) | 2021-07-14 | 2021-07-14 | 一种led显示模组 |
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CN113611790A true CN113611790A (zh) | 2021-11-05 |
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CN202110794808.1A Pending CN113611790A (zh) | 2021-07-14 | 2021-07-14 | 一种led显示模组 |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114133841A (zh) * | 2021-11-30 | 2022-03-04 | 惠州市艾比森光电有限公司 | 超黑涂料、led显示屏及led显示屏的制备方法 |
CN114710876A (zh) * | 2022-04-22 | 2022-07-05 | 惠州市艾比森光电有限公司 | Led显示模组及其制备方法、电子设备 |
CN114867189A (zh) * | 2022-05-13 | 2022-08-05 | 深圳市洲明科技股份有限公司 | 超黑复合涂层及其制备方法 |
CN115340803A (zh) * | 2022-08-19 | 2022-11-15 | 元旭半导体科技(无锡)有限公司 | 导电涂覆材料及制备方法,显示面板及封装方法 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN203232869U (zh) * | 2013-04-02 | 2013-10-09 | 佛山市国星光电股份有限公司 | 高对比度led显示模组 |
US20140342480A1 (en) * | 2011-09-14 | 2014-11-20 | Mtek-Smart Corporation | Method for manufacturing led, apparatus for manufacturing led, and led |
WO2016192452A1 (zh) * | 2015-05-29 | 2016-12-08 | 广州市鸿利光电股份有限公司 | Csp led的封装方法和csp led |
CN206210839U (zh) * | 2016-11-10 | 2017-05-31 | 佛山市国星光电股份有限公司 | 一种高对比度高出光性的户外led器件和led显示屏 |
CN206353543U (zh) * | 2016-10-27 | 2017-07-25 | 广东信达光电科技有限公司 | 一种led芯片 |
CN110098306A (zh) * | 2018-09-03 | 2019-08-06 | 深圳市洲明科技股份有限公司 | 一种集成封装显示模组 |
CN110797450A (zh) * | 2019-10-29 | 2020-02-14 | 长春希龙显示技术有限公司 | 基于模压技术的表面一致性封装led显示单元 |
US20210111313A1 (en) * | 2019-10-14 | 2021-04-15 | Lextar Electronics Corporation | Light emitting diode package |
-
2021
- 2021-07-14 CN CN202110794808.1A patent/CN113611790A/zh active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140342480A1 (en) * | 2011-09-14 | 2014-11-20 | Mtek-Smart Corporation | Method for manufacturing led, apparatus for manufacturing led, and led |
CN203232869U (zh) * | 2013-04-02 | 2013-10-09 | 佛山市国星光电股份有限公司 | 高对比度led显示模组 |
WO2016192452A1 (zh) * | 2015-05-29 | 2016-12-08 | 广州市鸿利光电股份有限公司 | Csp led的封装方法和csp led |
CN206353543U (zh) * | 2016-10-27 | 2017-07-25 | 广东信达光电科技有限公司 | 一种led芯片 |
CN206210839U (zh) * | 2016-11-10 | 2017-05-31 | 佛山市国星光电股份有限公司 | 一种高对比度高出光性的户外led器件和led显示屏 |
CN110098306A (zh) * | 2018-09-03 | 2019-08-06 | 深圳市洲明科技股份有限公司 | 一种集成封装显示模组 |
US20210111313A1 (en) * | 2019-10-14 | 2021-04-15 | Lextar Electronics Corporation | Light emitting diode package |
CN110797450A (zh) * | 2019-10-29 | 2020-02-14 | 长春希龙显示技术有限公司 | 基于模压技术的表面一致性封装led显示单元 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114133841A (zh) * | 2021-11-30 | 2022-03-04 | 惠州市艾比森光电有限公司 | 超黑涂料、led显示屏及led显示屏的制备方法 |
CN114710876A (zh) * | 2022-04-22 | 2022-07-05 | 惠州市艾比森光电有限公司 | Led显示模组及其制备方法、电子设备 |
CN114867189A (zh) * | 2022-05-13 | 2022-08-05 | 深圳市洲明科技股份有限公司 | 超黑复合涂层及其制备方法 |
CN115340803A (zh) * | 2022-08-19 | 2022-11-15 | 元旭半导体科技(无锡)有限公司 | 导电涂覆材料及制备方法,显示面板及封装方法 |
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Country or region after: China Address after: No. 62 Xinye Road, Guangzhou Economic and Technological Development Zone, Guangzhou City, Guangdong Province, 510000 Applicant after: Guangzhou Huigu New Materials Technology Co.,Ltd. Address before: 510000, No. 62 Xinye Road, Guangzhou Economic and Technological Development Zone, Luogang District, Guangzhou City, Guangdong Province Applicant before: Guangzhou Huigu New Materials Technology Co.,Ltd. Country or region before: China |
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