CN206353543U - 一种led芯片 - Google Patents

一种led芯片 Download PDF

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Publication number
CN206353543U
CN206353543U CN201621181644.6U CN201621181644U CN206353543U CN 206353543 U CN206353543 U CN 206353543U CN 201621181644 U CN201621181644 U CN 201621181644U CN 206353543 U CN206353543 U CN 206353543U
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Prior art keywords
housing
bearing
silver wire
metal pins
led chip
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CN201621181644.6U
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李仁�
王凯
刘亮
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Xiamen Xindeco Optoelectronics Co ltd
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Guangdong Xinda Photoelectric Technology Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Led Device Packages (AREA)

Abstract

本实用新型公开了一种LED芯片，包括支座，金属引脚嵌入支座内，支座外设置有用作为芯片电极的金属管脚，外露的金属管脚向下包裹支座，形成内包脚结构，支座上端设有壳体，壳体内侧面所形成的半功率角度大于110°，用于发光的LED晶片负极通过键合银线焊接在金属引脚上，所述键合银线与金属引脚焊接处设有用于定位键合银线在金属引脚上方便焊接的固定，覆盖所述LED晶片且填充于壳体内部的封装胶体为雾状胶体，所述壳体顶端面或壳体表面喷涂一黑色光学层。内包脚结构有利于显示屏容纳更多的LED芯片，黑色壳体有利于提高对比度，固定胶有助于键合银线的定位，方便焊接，雾状封装胶体能产生漫反射，让光分布均匀，提高出光效率。

Description

一种LED芯片
【技术领域】
本实用新型涉及照明领域，尤其是一种LED芯片。
【背景技术】
现在随这人民生活水平的提高，LED显示屏市场规模也随着提高，由于它有很好的发光率，使用寿命长，对环境适应能力强的优点，发展前景非常广阔，目前国内LED的生产技术中，对比度不高，光源产生漫反射是普遍的问题，现在人民对显示屏的分辨率的要求也越来越高，在现有技术中，普遍贴片LED支架的管脚为直管脚，导致两个支架的间隙大，分辨率不高，为了提高对比度，现有技术中，大多使用“外黑内白”两层框体结构，黑色外壳体包裹着白色内壳体，不仅加工复杂，而且成本高。
【实用新型内容】
本实用新型的目的是克服现有技术的不足而提供一种LED芯片。
针对上述目的，本实用新型采用以下技术方案。
一种LED芯片，其特征在于：包括支座，金属引脚嵌入支座内，支座外设置有用作为芯片电极的金属管脚，外露的金属管脚向下包裹支座，形成内包脚结构，支座上端设有壳体，壳体内侧面所形成的半功率角度大于110°，用于发光的LED晶片负极通过键合银线焊接在金属引脚上，所述键合银线与金属引脚焊接处设有用于定位键合银线在金属引脚上方便焊接的固定胶，覆盖所述LED晶片且填充于壳体内部的封装胶体为雾状胶体，所述壳体顶端面或壳体表面喷涂一黑色光学层。
优选的，所述壳体为一体化结构。
优选的，所述黑色光学层为黑色涂料。
优选的，所述固定胶为导电银胶。
优选的，所述壳体的外表面高度高于内表面高度，让壳体开口部呈台阶状结构。
本案具有如下优点：
本实用新型提供的一种LED芯片，内包脚结构可以使显示屏容纳更多的LED芯片。壳体壳体顶端面或壳体表面喷涂一黑色光学层，有利于提高对比度。固定胶有助于键合银线的定位，方便焊接。雾状封装胶体能产生漫反射，让光分布均匀，提高出光效率，同时也可以消除眩光或光斑，提高显色。壳体开工部呈台阶结构，使光源发光角度扩大。
【附图说明】
图1为本实用新型的示意图；
支座1；金属引脚11；金属管脚12；LED晶片2；封装胶体3；键合银线5；壳体4；固定胶6；顶端面41；表面42；半功率角度α；外表面高度H1；内表面高度H2。
【具体实施方式】
下面结合附图与实施例对本实用新型作详细说明：
一种LED芯片，包括支座1、金属引脚11、金属管脚12、LED晶片2、封装胶体3、键合银线5以及用于反射LED灯光的壳体4。金属引脚11嵌入支座1内用于承载LED晶片2，外露的金属管脚12向下包裹支座1，形成内包脚结构，金属引脚11与金属管脚12为一体化。内包脚结构可以缩短两个贴片LED芯片之间的距离，使得利用该支架生产的LED显示屏容纳更多的LED芯片，提高分辨率。
在焊接时，首先将键合银线5的一端焊接在LED晶片2的负极上，然后利用固定胶6将键合银线5的另一端定位在金属引脚11的焊接处，有利于方便后面的焊接工序，使键合银线5不容易产生偏移。壳体4内侧面所形成的半功率角度α大于110°，使LED光源散光效果好，用户可以大角度的看到光源。外表面高度H1高于内表面高度H2，让壳体开口部呈台阶状结构，使光源发光角度扩大。覆盖所述LED晶片2且填充于壳体4内部的封装胶体3为雾状胶体，使光源产生漫反射，让光分布均匀，提高出光效率，同时也可以消除眩光或光斑，提高显色。所述壳体4顶端面41喷涂一黑色光学层,优选的，所述黑色光学层为黑色涂料，有利于提高对比度。
在其它实施方式中，如图1所示,所述壳体4表面42喷涂一黑色光学层7，优选的，所述黑色光学层为提高对比度的黑色涂料，不限于本实施例。
以上所述仅为本实用新型的优先实施方式，本实用新型并不限定于上述实施方式，只要以基本相同手段实现本实用新型目的的技术方案都属于本实用新型的保护范围之内。

Claims (5)

1.一种LED芯片，其特征在于：包括支座(1)，金属引脚(11)嵌入支座(1)内，支座(1)外设置有用作为芯片电极的金属管脚(12)，外露的金属管脚(12)向下包裹支座(1)，形成内包脚结构，支座(1)上端设有壳体(4)，壳体(4)内侧面所形成的半功率角度(α)大于110°，用于发光的LED晶片(2)负极通过键合银线(5)焊接在金属引脚(11)上，所述键合银线(5)与金属引脚(11)焊接处设有用于定位键合银线(5)在金属引脚(11)上方便焊接的固定胶(6)，覆盖所述LED晶片(2)且填充于壳体(4)内部的封装胶体(3)为雾状胶体，所述壳体(4)顶端面(41)或壳体(4)表面(42)喷涂一黑色光学层。
2.根据权利要求1所述的一种LED芯片，其特征在于：所述壳体(4)为一体化结构。
3.根据权利要求1所述的一种LED芯片，其特征在于：所述黑色光学层为黑色涂料。
4.根据权利要求1所述的一种LED芯片，其特征在于：所述固定胶(6)为导电银胶。
5.根据权利要求1所述的一种LED芯片，其特征在于：所述壳体(4)的外表面高度(H1)高于内表面高度(H2)，让壳体开口部呈台阶状结构。
CN201621181644.6U 2016-10-27 2016-10-27 一种led芯片 Active CN206353543U (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113611790A (zh) * 2021-07-14 2021-11-05 广州慧谷化学有限公司 一种led显示模组

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113611790A (zh) * 2021-07-14 2021-11-05 广州慧谷化学有限公司 一种led显示模组

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Effective date of registration: 20201026

Address after: No.4 and No.12, Hongxi South Road, Xiangan Industrial Zone, torch hi tech Zone, Xiamen City, Fujian Province

Patentee after: Xiamen Xinda Semiconductor Technology Co.,Ltd.

Address before: 528400 Torch Road No. 17, Torch Development Zone, Guangdong, Zhongshan three

Patentee before: GUANGDONG XINDA PHOTOELECTRIC TECHNOLOGY Co.,Ltd.

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Effective date of registration: 20221107

Address after: 361000 Xinda photoelectric complex building, No. 610, Lingdou West Road, Siming District, Xiamen City, Fujian Province

Patentee after: XIAMEN XINDECO OPTOELECTRONICS Co.,Ltd.

Address before: No. 4 and 12, Hongxi South Road, Torch High tech Zone (Xiang'an) Industrial Zone, Xiamen, Fujian, 361000

Patentee before: Xiamen Xinda Semiconductor Technology Co.,Ltd.