CN113594391A - Surface mounting device and method for attaching silicon-based OLED glass cover plate - Google Patents
Surface mounting device and method for attaching silicon-based OLED glass cover plate Download PDFInfo
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- CN113594391A CN113594391A CN202110879540.1A CN202110879540A CN113594391A CN 113594391 A CN113594391 A CN 113594391A CN 202110879540 A CN202110879540 A CN 202110879540A CN 113594391 A CN113594391 A CN 113594391A
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- 239000011521 glass Substances 0.000 title claims abstract description 121
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 56
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 56
- 239000010703 silicon Substances 0.000 title claims abstract description 56
- 238000000034 method Methods 0.000 title claims abstract description 30
- 238000001179 sorption measurement Methods 0.000 claims abstract description 89
- 239000003292 glue Substances 0.000 claims abstract description 67
- 238000010030 laminating Methods 0.000 claims abstract description 45
- 239000000758 substrate Substances 0.000 claims abstract description 35
- 238000010438 heat treatment Methods 0.000 claims abstract description 28
- 239000000463 material Substances 0.000 claims description 7
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 abstract description 2
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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Abstract
The invention belongs to the technical field of packaging of silicon-based OLED screens, and discloses a chip mounting device and a method for attaching a silicon-based OLED glass cover plate. The paster device comprises an adsorption head and a laminating pressure head; the adsorption head is detachably connected to an external manipulator, the adsorption head can place the glass cover plate on the silicon substrate, the adsorption head comprises an adsorption surface, the adsorption surface can abut against the glass cover plate, the adsorption head is provided with a plurality of vacuum adsorption holes, and the vacuum adsorption holes are configured to adsorb the glass cover plate; laminating pressure head sliding connection is in adsorption head, and the laminating pressure head includes the heating surface, and the heating surface can support to press and heat the glue under the glass apron. The chip mounting device is provided with the slidable laminating pressure head to heat and pre-cure the glue below the glass cover plate, so that the problem of deviation of the glass cover plate in the laminating process can be avoided, the glue overflow of the silicon substrate is reduced, and the silicon substrate is prevented from being polluted by residual glue; the attaching method of the silicon-based OLED glass cover plate applies the chip attaching device, and chip attaching precision and product yield are improved.
Description
Technical Field
The invention relates to the technical field of packaging of silicon-based OLED screens, in particular to a chip mounting device and a method for attaching a silicon-based OLED glass cover plate.
Background
The silicon-based OLED display has the advantages of high resolution, high integration level, low power consumption, small volume, light weight and the like, is a core device of a near-to-eye display system, is widely applied to AR glasses, VR helmets, infrared detectors and 3D medical equipment, and has higher market share.
The production process flow of the silicon-based OLED micro-display device in the current market is complex, when the glass cover plate is packaged, glue dispensing equipment is needed to be used for dispensing glue on the surface of the silicon substrate, meanwhile, an auxiliary production jig is used, and then a plurality of glass cover plates are mounted in a surface mounting mode. During the process of pasting the adhesive before curing and the process of pressing after pasting, the glass cover plate is easy to slide to cause the deviation phenomenon; particularly, in the vacuum breaking process of the adsorption head for adsorbing the glass cover plate, the problem that the glass cover plate deviates due to the release of air flow needs to be limited by the appearance of the jig, but the paster precision is reduced, and even the glass cover plate is scratched by the jig; and the offset of the glass cover plate can cause glue overflow and adhere to the surface of the jig, so that the residual glue on the surface of the jig pollutes the silicon substrate.
Disclosure of Invention
The invention aims to provide a chip mounting device and a method for attaching a silicon-based OLED glass cover plate, wherein the chip mounting device can avoid the deviation problem of the glass cover plate in the attaching process, reduce the glue overflow of a silicon substrate and prevent the residual glue from polluting the silicon substrate; the attaching method of the silicon-based OLED glass cover plate applies the chip attaching device, the chip attaching precision is improved, and the product yield is increased.
In order to achieve the purpose, the invention adopts the following technical scheme:
in one aspect, a patch device is provided, comprising:
the adsorption head is detachably connected to an external manipulator, the adsorption head can place the glass cover plate on the silicon substrate, the adsorption head comprises an adsorption surface, the adsorption surface can abut against the glass cover plate, the adsorption head is provided with a plurality of vacuum adsorption holes, and the vacuum adsorption holes are configured to adsorb the glass cover plate;
the laminating pressure head, laminating pressure head sliding connection in the adsorption head, the laminating pressure head includes the heating surface, the heating surface can support and press and heat glue under the glass apron.
As a preferable structure of the present invention, the laminating apparatus further includes a pulse heating device configured to heat the laminating head by a pulse current.
As a preferable structure of the invention, the adsorption head is annularly arranged around the laminating pressure head, and the vacuum adsorption holes are uniformly arranged around the laminating pressure head at intervals.
In a preferred structure of the invention, the material of the attaching indenter comprises metal.
As a preferable structure of the present invention, the material of the adsorption head includes ceramic.
On the other hand, the method for attaching the silicon-based OLED glass cover plate comprises the following steps of:
s1, dispensing the surface of the silicon substrate;
s2, an adsorption head of the chip mounting device adsorbs a glass cover plate through a vacuum adsorption hole, an external manipulator controls the adsorption head to place the glass cover plate at a position corresponding to the silicon substrate coated with glue, and the adsorption head and the glass cover plate stay together;
step S3, after the glue is leveled for a first set time, the attaching pressure head slides along the adsorption head and abuts against and attaches the glass cover plate;
step S4, the glass cover plate is heated by the attaching pressure head to pre-cure the central area of the glue;
and S5, stopping heating of the laminating pressure head, breaking vacuum of the adsorption head to stop adsorption of the glass cover plate, lifting the chip device and leaving the glass cover plate, starting a UV lamp to irradiate the glass cover plate, curing the glue, and finishing laminating of the glass cover plate.
As a preferred embodiment of the present invention, the step S5 is further followed by the following steps: and S6, repeating the step S1 to the step S5 until the glass cover plates are attached.
In a preferred embodiment of the present invention, in step S3, the first set time is 2S to 5S.
In a preferred embodiment of the present invention, in step S3, the bonding pressure of the bonding indenter to the glass cover plate is 0.1MPa to 0.5 MPa.
In a preferred embodiment of the present invention, in the step S4, the heating temperature of the bonding indenter is 100 to 150 ℃.
The invention has the beneficial effects that: the chip mounting device provided by the invention is provided with the slidable laminating pressure head, the heating surface of the laminating pressure head can be abutted against and heat the glass cover plate, the glass cover plate can conduct heat to glue water for pre-curing, the pre-cured glue water can tightly laminate the glass cover plate to the back of the silicon substrate, the adsorption head is prevented from sliding due to the fact that air flow released in the vacuum breaking process is avoided, the deviation problem of the glass cover plate in the laminating process is avoided, the laminating precision is ensured, the glue overflow of the silicon substrate is reduced, and the silicon substrate is prevented from being polluted by residual glue. According to the method for attaching the silicon-based OLED glass cover plate, the surface mounting device is applied, in the process of attaching the silicon-based OLED glass cover plate, the adsorption head places the glass cover plate at the position corresponding to the position of the back surface of the silicon substrate coated with the glue and stays the glue, so that the glue is fully leveled, after a first set time, the attachment pressure head slides down and heats the glass cover plate to pre-cure the central area of the glue, then the adsorption head breaks vacuum and separates from the glass cover plate, the pre-cured glue is stronger in adhesive force and cannot flow randomly, the glass cover plate is prevented from sliding, the glue overflow phenomenon is avoided, the surface mounting precision is improved, and the product yield is increased.
Drawings
Fig. 1 is a first schematic structural diagram of a patch device according to an embodiment of the present invention;
fig. 2 is a top view of a patch device according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a patch device according to an embodiment of the present invention.
In the figure:
1. an adsorption head; 11. an adsorption surface; 12. a vacuum adsorption hole; 2. fitting a pressure head; 21. heating the surface;
100. a glass cover plate; 200. a silicon substrate; 300. and (4) glue.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, removably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
In the description of the present embodiment, the terms "upper", "lower", "left", "right", and the like are used based on the orientations and positional relationships shown in the drawings only for convenience of description and simplification of operation, and do not indicate or imply that the referred device or element must have a specific orientation, be configured and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used only for descriptive purposes and are not intended to have a special meaning.
Example one
As shown in fig. 1-3, an embodiment of the invention provides a patch device for attaching a glass cover plate 100 to a silicon-based OLED. The paster device includes adsorption head 1 and laminating pressure head 2. The adsorption head 1 is detachably connected to an external robot, and the adsorption head 1 can place the glass cover plate 100 on the back of the silicon substrate 200 under the control of the external robot. The adsorption head 1 includes an adsorption face 11, the adsorption face 11 can abut against the glass cover plate 100, the adsorption head 1 is provided with a plurality of vacuum adsorption holes 12, and the vacuum adsorption holes 12 are configured to adsorb the glass cover plate 100. After the suction head 1 is sucked to the glass cover plate 100 by vacuum, the glass cover plate 100 is placed on the back surface of the silicon substrate 200 on which dispensing is completed. Laminating pressure head 2 sliding connection is in adsorption head 1, and laminating pressure head 2 includes heating surface 21, and heating surface 21 can support and press and heat glass apron 100. The paster device of this embodiment is through setting up slidable laminating pressure head 2, the heating surface 21 of laminating pressure head 2 can support and press and heat glass apron 100, glue 300 is given with the heat conduction to glass apron 100, carry out the solidification in advance, glue 300 after the solidification in advance can tightly laminate glass apron 100 in the silicon substrate 200 back, prevent that the air current of adsorption head 1 releasing in breaking the vacuum process from causing glass apron 100 to slide, avoid glass apron 100 the off normal problem in the laminating process, guarantee the laminating precision, reduce excessive glue of silicon substrate 200, prevent that the cull from polluting silicon substrate 200, the product yield is improved. Preferably, the paster device still is provided with pneumatic system, and the slip of laminating pressure head 2 is controlled through pneumatic system's cylinder for the motion precision of laminating pressure head 2 is higher, and pneumatic system is whole comparatively light, small in size.
Further, the patch device further includes a pulse heating device configured to heat the attaching indenter 2 by a pulse current. When heating laminating pressure head 2 through impulse current, the inside direct heat that produces of laminating pressure head 2, it is fast to heat corresponding speed, the accurate control heating temperature of being convenient for. The structure of the pulse heating device and the principle of pulse heating the bonding indenter 2 are prior art in the field, and this embodiment is not described herein.
Further, as shown in fig. 2, the adsorption head 1 is disposed around the bonding head 2, and the vacuum adsorption holes 12 are uniformly spaced around the bonding head 2. In this embodiment, be provided with the connecting hole in the adsorption head 1, the side sliding connection of laminating pressure head 2 is in the connecting hole, is convenient for heat glass apron 100 through laminating pressure head 2 when adsorption head 1 is adsorbing glass apron 100. The adsorption head 1 is arranged around the laminating pressure head 2 in a surrounding manner, so that the plurality of vacuum adsorption holes 12 are uniformly distributed, the adsorption force on the glass cover plate 100 is uniformly distributed, and the external mechanical arm is prevented from falling off in the process of moving the glass cover plate 100; when laminating pressure head 2 heats glue 300 under the glass apron 100, laminating pressure head 2 adsorption head 1 all around can completely cut off the heat, avoids glue 300 that not fully levelly all around to be cured in advance and can't flatly expand completely.
Further, the material of the attaching head 2 includes metal, and the material of the adsorption head 1 includes ceramic. The pulse heating device can rapidly heat the metal material by pulse current, so that the pre-curing of the glue 300 is rapidly realized; ceramic material's surface quality is high, adsorption plane 11 has good plane degree, make adsorption plane 11 can well laminate glass apron 100 and guarantee that the adsorption affinity is stable at the vacuum adsorption in-process, in addition, ceramic material's adsorption head 1 has good heat-proof quality and is difficult for the oxidation under high temperature, the coefficient of linear expansion is low, be difficult for receiving the high temperature influence of laminating pressure head 2, avoid coating glue 300 regional glue 300 all around to have the condition that not the levelling is cured, promote the product yield.
Example two
The embodiment of the invention provides a method for attaching a silicon-based OLED glass cover plate, which applies a chip mounting device in the first embodiment and comprises the following steps:
step S1, dispensing the surface of the silicon substrate 200;
in this embodiment, the chip mounting apparatus further includes a dispensing component, and the surface of the silicon substrate 200 is dispensed by the dispensing component. The glue dispensing assembly is provided with an air path system with adjustable air pressure, the air pressure of the feeding glue barrel and the air inlet air pressure of the glue inlet valve can be controlled simultaneously, the glue dispensing assembly adopts non-contact type spraying glue dispensing, the glue dispensing consistency is improved, the material waste is reduced, and excessive glue dispensing is avoided.
S2, adsorbing the glass cover plate 100 by the adsorption head 1 of the chip mounting device through the vacuum adsorption hole 12, controlling the adsorption head 1 by an external manipulator to place the glass cover plate 100 at a position corresponding to the position of the back surface of the silicon substrate 200 coated with the glue 300, and stopping the adsorption head 1 and the glass cover plate 100 together;
in this embodiment, the chip mounting device further includes a CCD vision positioning system and an automatic vision sampling inspection system, and the alignment camera is used to photograph the glass cover plate 100 and the silicon substrate 200 respectively, and then the external mechanical arm is used to control the adsorption head 1 to attach the glass cover plate 100 to the back of the silicon substrate 200, so as to ensure the attachment precision. As shown in fig. 1, the glass cover plate 100 is sucked for the suction head 1 and placed on the silicon substrate 200 coated with the glue 300, and at this time, the glue 300 is not leveled yet.
Step S3, after the glue 300 is leveled after the first set time, the attaching pressure head 2 slides along the adsorption head 1 and is attached to and abuts against the glass cover plate 100;
in step S3, after the suction head 1 attaches the glass cover plate 100 to the back surface of the silicon substrate 200, the suction time of the glass cover plate 100 needs to be delayed, and preferably, in the embodiment, the first set time is 2S to 5S. After 2 s-5 s, the glue 300 can be sufficiently leveled and uniformly distributed between the glass cover plate 100 and the silicon substrate 200, and the glass cover plate 100 can be effectively adhered. After the glue 300 is sufficiently leveled, the attaching press head 2 slides down to attach and press the glass cover plate 100, as shown in fig. 3. Preferably, the bonding pressure of the bonding pressure head 2 to the glass cover plate 100 is 0.1 MPa-0.5 MPa, which not only can enable the glass cover plate 100 to be fully bonded with the glue 300 and further expand the glue 300, but also can not apply pressure exceeding a safety coefficient to the silicon substrate 200.
Step S4, heating the glass cover plate 100 by the attaching pressure head 2 to pre-cure the central area of the glue 300;
in this step S4, the pulse heating device is heated and attached to the pressing head 2 by the pulse current, so as to pre-cure the glue 300 under the glass cover plate 100, and the pre-cured glue 300 has stronger adhesive force and cannot flow randomly, thereby avoiding the overflow phenomenon. Preferably, the heating temperature of the bonding indenter 2 is 100 ℃ to 150 ℃, so that the glue 300 can be fully pre-cured.
Step S5, stopping heating of the laminating pressure head 2, breaking vacuum of the adsorption head 1, stopping adsorption of the glass cover plate 100, lifting the chip mounting device and leaving the glass cover plate 100, starting a UV lamp to irradiate the glass cover plate 100, curing the glue 300, and finishing laminating of the glass cover plate 100;
in the step S5, the adhesive force of the fully pre-cured glue 300 to the glass cover plate 100 is stronger, and the released air flow does not cause the glass cover plate 100 to slide to form a deviation phenomenon in the process of breaking the vacuum by the adsorption head 1, so that the attaching precision is improved; meanwhile, the UV lamp is turned on to irradiate the glue 300 under the glass cover plate 100, so that the glue 300 is finally cured, thereby completing the attachment of the glass cover plate 100.
Further, step S5 is followed by the following steps: and S6, repeating the steps S1-S5 until the plurality of glass cover plates 100 are packaged. Since the back surface of the silicon substrate 200 in this embodiment needs to be packaged with a plurality of glass cover plates 100, the steps S1 to S5 are repeated, and dispensing, bonding, and heating are performed on each glass cover plate 100 at corresponding positions, so that bonding of all the glass cover plates 100 on the back surface of the entire silicon substrate 200 is completed.
According to the method for attaching the silicon-based OLED glass cover plate, provided by the invention, by applying the chip mounting device in the first embodiment, in the process of attaching the silicon-based OLED glass cover plate 100, the adsorption head 1 places the glass cover plate 100 at the corresponding position of the back surface of the silicon substrate 200 coated with the glue 300 and stays so that the glue 300 is fully leveled, after a first set time, the attachment pressure head 2 slides downwards and heats the glass cover plate 100 to pre-cure the central area of the glue 300, then the adsorption head 1 breaks the vacuum and separates from the glass cover plate 100, the pre-cured glue 300 has stronger adhesive force and cannot flow at will, the glass cover plate 100 is prevented from sliding, the glue overflow phenomenon is avoided, the chip mounting precision is improved, and the product yield is increased.
It should be understood that the above-described embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Numerous obvious variations, adaptations and substitutions will occur to those skilled in the art without departing from the scope of the invention. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.
Claims (10)
1. A patch device, comprising:
the glass cover plate vacuum adsorption device comprises an adsorption head (1), wherein the adsorption head (1) is detachably connected to an external manipulator, the adsorption head (1) can place a glass cover plate (100) on a silicon substrate (200), the adsorption head (1) comprises an adsorption surface (11), the adsorption surface (11) can abut against the glass cover plate (100), the adsorption head (1) is provided with a plurality of vacuum adsorption holes (12), and the vacuum adsorption holes (12) are configured to adsorb the glass cover plate (100);
laminating pressure head (2), laminating pressure head (2) sliding connection in adsorption head (1), laminating pressure head (2) are including heating surface (21), heating surface (21) can support and press and heat glue (300) under glass apron (100).
2. A patch device as claimed in claim 1, further comprising a pulse heating device configured to heat the conformable indenter (2) by a pulsed current.
3. A patch device as claimed in claim 1, wherein the suction head (1) is arranged around the laminating head (2), and the vacuum suction holes (12) are arranged around the laminating head (2) at regular intervals.
4. A patch device as claimed in claim 1, characterized in that the material of the conforming ram (2) comprises metal.
5. A patch device as claimed in claim 1, characterized in that the material of the suction head (1) comprises ceramic.
6. A method for attaching a silicon-based OLED glass cover plate by applying the patch device of any one of claims 1-5, which is characterized by comprising the following steps:
step S1, dispensing the surface of the silicon substrate (200);
s2, an adsorption head (1) of the chip mounting device adsorbs a glass cover plate (100) through a vacuum adsorption hole (12), an external manipulator controls the adsorption head (1) to place the glass cover plate (100) at a position corresponding to a position, coated with glue (300), on the silicon substrate (200), and the adsorption head (1) and the glass cover plate (100) stay together;
step S3, after the glue (300) is leveled after a first set time, the attaching pressure head (2) slides along the adsorption head (1) and abuts against and is attached to the glass cover plate (100);
step S4, the laminating pressure head (2) heats the glass cover plate (100) to pre-cure the central area of the glue (300);
step S5, the laminating pressure head (2) stops heating, the adsorption head (1) breaks vacuum and stops adsorbing the glass cover plate (100), the patch device is lifted and separated from the glass cover plate (100), and the UV lamp is started to irradiate the glass cover plate (100), so that the glue (300) is cured, and the laminating of the glass cover plate (100) is completed.
7. The method according to claim 6, further comprising the following steps after the step S5: and S6, repeating the step S1 to the step S5 until the glass cover plates (100) are attached.
8. The method of claim 6, wherein in the step S3, the first set time is 2S to 5S.
9. The method for bonding the silicon-based OLED glass cover plate according to claim 6, wherein in the step S3, the bonding pressure of the bonding indenter (2) to the glass cover plate (100) is 0.1MPa to 0.5 MPa.
10. The method for bonding a silicon-based OLED glass cover plate according to claim 6, wherein the heating temperature of the bonding indenter (2) is 100-150 ℃ in the step S4.
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| CN202110879540.1A CN113594391B (en) | 2021-08-02 | 2021-08-02 | Surface mounting device and surface mounting method of silicon-based OLED glass cover plate |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114031275A (en) * | 2021-11-16 | 2022-02-11 | 徐文静 | Glass hot press molding unit |
| CN114242926A (en) * | 2021-12-17 | 2022-03-25 | 昆山梦显电子科技有限公司 | Paster device and attaching control method |
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| CN114242926A (en) * | 2021-12-17 | 2022-03-25 | 昆山梦显电子科技有限公司 | Paster device and attaching control method |
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