CN113594391B - Surface mounting device and surface mounting method of silicon-based OLED glass cover plate - Google Patents
Surface mounting device and surface mounting method of silicon-based OLED glass cover plate Download PDFInfo
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- CN113594391B CN113594391B CN202110879540.1A CN202110879540A CN113594391B CN 113594391 B CN113594391 B CN 113594391B CN 202110879540 A CN202110879540 A CN 202110879540A CN 113594391 B CN113594391 B CN 113594391B
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- 239000011521 glass Substances 0.000 title claims abstract description 122
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 57
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 57
- 239000010703 silicon Substances 0.000 title claims abstract description 57
- 238000000034 method Methods 0.000 title claims abstract description 28
- 238000001179 sorption measurement Methods 0.000 claims abstract description 76
- 239000003292 glue Substances 0.000 claims abstract description 63
- 239000000758 substrate Substances 0.000 claims abstract description 35
- 238000010438 heat treatment Methods 0.000 claims abstract description 30
- 238000010030 laminating Methods 0.000 claims abstract description 27
- 238000010521 absorption reaction Methods 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims description 7
- 238000003475 lamination Methods 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 230000008569 process Effects 0.000 abstract description 10
- 238000004026 adhesive bonding Methods 0.000 abstract description 8
- 238000004806 packaging method and process Methods 0.000 abstract description 2
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 230000003190 augmentative effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Abstract
The invention belongs to the technical field of silicon-based OLED screen packaging, and discloses a surface mounting device and a bonding method of a silicon-based OLED glass cover plate. The surface mounting device comprises an adsorption head and a bonding pressure head; the adsorption head is detachably connected to the external manipulator, the adsorption head can place the glass cover plate on the silicon substrate, the adsorption head comprises an adsorption surface, the adsorption surface can be abutted against the glass cover plate, the adsorption head is provided with a plurality of vacuum adsorption holes, and the vacuum adsorption holes are configured to adsorb the glass cover plate; the laminating pressure head sliding connection is in the absorption head, and the laminating pressure head includes the heating surface, and the heating surface can support and press and heat the glue under the glass apron. The adhesive bonding device is provided with the slidable adhesive bonding pressure head for heating and pre-curing the glue under the glass cover plate, so that the offset problem of the glass cover plate in the adhesive bonding process can be avoided, the glue overflow of the silicon substrate is reduced, and the silicon substrate is prevented from being polluted by residual glue; the attaching method of the silicon-based OLED glass cover plate is applied to the attaching device, so that attaching precision and product yield are improved.
Description
Technical Field
The invention relates to the technical field of silicon-based OLED screen packaging, in particular to a surface mounting device and a bonding method of a silicon-based OLED glass cover plate.
Background
The silicon-based OLED display has the advantages of high resolution, high integration level, low power consumption, small volume, light weight and the like, is a core device of a near-to-eye display system, and is widely applied to AR (augmented reality) glasses, VR (virtual reality) helmets, infrared detectors and 3D (three-dimensional) medical equipment, and the market share is higher and higher.
The production process flow of the silicon-based OLED micro-display device in the current market is complex, when the glass cover plates are packaged, dispensing equipment is needed to be used for dispensing on the surface of the silicon substrate, an auxiliary production jig is used, and then a plurality of glass cover plates are mounted in a pasting mode. In the process of pasting before glue solidification and the process of pasting and pressing after pasting, the glass cover plate is easy to slide to cause a deviation phenomenon; especially, when the adsorption head for adsorbing the glass cover plate breaks vacuum, the problem that the glass cover plate is deviated due to air flow release is solved, the glass cover plate is limited by means of the appearance of the jig, but the patch precision is reduced, and even the glass cover plate is scratched by the jig; and the offset of the glass cover plate can cause glue overflow and adhere to the surface of the jig, so that the residual glue on the surface of the jig pollutes the silicon substrate.
Disclosure of Invention
The invention aims to provide a paster device and a laminating method of a silicon-based OLED glass cover plate, wherein the paster device can avoid the deviation problem of the glass cover plate in the laminating process, reduce the glue overflow of a silicon substrate and prevent the silicon substrate from being polluted by residual glue; the attaching method of the silicon-based OLED glass cover plate is applied to the attaching device, so that attaching precision is improved, and product yield is increased.
To achieve the purpose, the invention adopts the following technical scheme:
in one aspect, there is provided a patch device comprising:
the adsorption head is detachably connected to the external manipulator, the adsorption head can place the glass cover plate on the silicon substrate, the adsorption head comprises an adsorption surface, the adsorption surface can be abutted against the glass cover plate, the adsorption head is provided with a plurality of vacuum adsorption holes, and the vacuum adsorption holes are configured to adsorb the glass cover plate;
the laminating pressure head, laminating pressure head sliding connection in the absorption head, the laminating pressure head includes the heating surface, the heating surface can support and press and heat glue under the glass apron.
As a preferable structure of the present invention, the present invention further comprises a pulse heating device configured to heat the bonding head by a pulse current.
As a preferable structure of the invention, the adsorption head is arranged around the bonding pressure head in a surrounding way, and a plurality of vacuum adsorption holes are uniformly arranged around the bonding pressure head at intervals.
As a preferable structure of the present invention, the material of the bonding head includes metal.
As a preferable structure of the present invention, the material of the adsorption head includes ceramic.
On the other hand, a bonding method of a silicon-based OLED glass cover plate is provided, and the bonding device is applied, and comprises the following steps:
s1, dispensing is carried out on the surface of a silicon substrate;
s2, an adsorption head of the surface mounting device adsorbs a glass cover plate through vacuum adsorption, an external manipulator controls the adsorption head to place the glass cover plate at a corresponding position of the silicon substrate coated with glue, and the adsorption head stays together with the glass cover plate;
s3, after the glue is leveled, the attaching pressure head slides along the adsorption head and abuts against and attaches the glass cover plate after the first setting time;
s4, heating the glass cover plate by the laminating pressure head to pre-cure the central area of the glue;
step S5, the attaching pressure head stops heating, the adsorption head breaks vacuum to stop adsorbing the glass cover plate, the surface mounting device lifts and leaves the glass cover plate, the UV lamp is started to irradiate the glass cover plate, so that the glue is solidified, and the attaching of the glass cover plate is completed.
As a preferred embodiment of the present invention, the step S5 further includes the following steps: and S6, repeating the steps S1 to S5 until the lamination of a plurality of glass cover plates is completed.
In a preferred embodiment of the present invention, in the step S3, the first set time is 2S to 5S.
In a preferred embodiment of the present invention, in the step S3, a bonding pressure of the bonding head to the glass cover plate is 0.1MPa to 0.5MPa.
In a preferred embodiment of the present invention, in the step S4, the heating temperature of the bonding head is 100 to 150 ℃.
The invention has the beneficial effects that: the adhesive bonding device is provided with the slidable adhesive bonding pressure head, the heating surface of the adhesive bonding pressure head can press and heat the glass cover plate, the glass cover plate conducts heat to the glue for pre-curing, the pre-cured glue can tightly bond the glass cover plate on the back of the silicon substrate, the glass cover plate is prevented from sliding caused by air flow released by the adsorption head in the vacuum breaking process, the offset problem of the glass cover plate in the adhesive bonding process is avoided, the adhesive bonding precision is ensured, the glue overflowing of the silicon substrate is reduced, and the silicon substrate is prevented from being polluted by residual glue. According to the bonding method of the silicon-based OLED glass cover plate, the bonding device is applied, in the process of bonding the silicon-based OLED glass cover plate, the glass cover plate is placed at the corresponding position of the back surface of the silicon substrate by the adsorption head and is coated with glue, the glue is enabled to be fully leveled, after the first set time, the bonding pressure head slides down and heats the glass cover plate to enable the central area of the glue to be pre-cured, then the adsorption head breaks vacuum to separate from the glass cover plate, the pre-cured glue is stronger in adhesive force and cannot flow randomly, the glass cover plate is prevented from sliding, the glue overflow phenomenon is avoided, the bonding precision is improved, and the product yield is increased.
Drawings
Fig. 1 is a schematic structural diagram of a patch device according to an embodiment of the present invention;
fig. 2 is a top view of a patch device according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a patch device according to an embodiment of the present invention.
In the figure:
1. an adsorption head; 11. an adsorption surface; 12. vacuum adsorption holes; 2. attaching a pressing head; 21. a heating surface;
100. a glass cover plate; 200. a silicon substrate; 300. glue.
Detailed Description
The invention is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting thereof. It should be further noted that, for convenience of description, only some, but not all of the structures related to the present invention are shown in the drawings.
In the description of the present invention, unless explicitly stated and limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
In the present invention, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.
In the description of the present embodiment, the terms "upper", "lower", "left", "right", and the like are orientation or positional relationships based on those shown in the drawings, merely for convenience of description and simplicity of operation, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the invention. Furthermore, the terms "first," "second," and the like, are used merely for distinguishing between descriptions and not for distinguishing between them.
Example 1
As shown in fig. 1-3, an embodiment of the present invention provides a patch device for attaching a glass cover plate 100 to a silicon-based OLED. The surface mounting device comprises an adsorption head 1 and a bonding pressure head 2. The adsorption head 1 is detachably connected to an external robot, and the adsorption head 1 can place the glass cover plate 100 on the back surface of the silicon substrate 200 under the control of the external robot. The suction head 1 includes a suction face 11, the suction face 11 being capable of abutting against the glass cover plate 100, the suction head 1 being provided with a plurality of vacuum suction holes 12, the vacuum suction holes 12 being configured to suction the glass cover plate 100. After the adsorption head 1 is adsorbed to the glass cover plate 100 by vacuum, the glass cover plate 100 is placed on the back surface of the dispensing-completed silicon substrate 200. The laminating pressure head 2 sliding connection is in absorption head 1, and laminating pressure head 2 includes heating surface 21, and heating surface 21 can support and press and heat glass apron 100. The paster device of this embodiment is through setting up slidable laminating pressure head 2, laminating pressure head 2's heating surface 21 can support and press and heat glass apron 100, glass apron 100 gives glue 300 with heat conduction, pre-cure, glue 300 after the pre-cure can be with glass apron 100 tightly laminating in the silicon substrate 200 back, prevent that absorption head 1 from causing glass apron 100 to slide at the air current that breaks vacuum in-process release, avoid glass apron 100 off normal problem in the laminating in-process, guarantee laminating precision, reduce the excessive glue of silicon substrate 200, prevent incomplete glue pollution silicon substrate 200, improve the product yield. Preferably, the paster device is also provided with a pneumatic system, and the sliding of the laminating pressure head 2 is controlled through a cylinder of the pneumatic system, so that the movement precision of the laminating pressure head 2 is higher, and the whole pneumatic system is lighter and has small volume.
Further, the bonding apparatus further includes a pulse heating apparatus configured to heat the bonding head 2 by a pulse current. When the laminating pressure head 2 is heated by pulse current, heat is directly generated in the laminating pressure head 2, the corresponding heating speed is high, and the heating temperature is convenient to accurately control. The structure of the pulse heating device and the principle of pulse heating on the bonding press head 2 are the prior art in the field, and the embodiment is not described herein.
Further, as shown in fig. 2, the suction head 1 is disposed around the bonding head 2, and the plurality of vacuum suction holes 12 are uniformly spaced around the bonding head 2. In this embodiment, a connecting hole is provided in the adsorption head 1, and the side surface of the bonding press head 2 is slidably connected in the connecting hole, so that the glass cover plate 100 can be heated by the bonding press head 2 when the adsorption head 1 adsorbs the glass cover plate 100. The adsorption heads 1 are arranged around the bonding pressure head 2 in a surrounding manner, so that the plurality of vacuum adsorption holes 12 are uniformly distributed, the adsorption force to the glass cover plate 100 is uniformly distributed, and the external manipulator is prevented from falling off in the process of moving the glass cover plate 100; when the bonding press head 2 heats the glue 300 under the glass cover plate 100, the adsorption heads 1 around the bonding press head 2 can isolate heat, so that the glue 300 which is not fully leveled around is prevented from being pre-cured and can not be completely leveled and unfolded.
Further, the material of the bonding head 2 includes metal, and the material of the adsorption head 1 includes ceramic. The pulse heating device can rapidly heat the metal material by pulse current, so that the pre-solidification of the glue 300 is rapidly realized; in addition, the adsorption head 1 of the ceramic material has good heat insulation performance and is not easy to oxidize at high temperature, the linear expansion coefficient is low, the influence of the high temperature of the laminating pressure head 2 is not easy, the situation that the glue 300 around the glue 300 coating area is cured without leveling is avoided, and the product yield is improved.
Example two
The embodiment of the invention provides a bonding method of a silicon-based OLED glass cover plate, which is applied to a patch device in the first embodiment and comprises the following steps of:
step S1, dispensing is carried out on the surface of a silicon substrate 200;
in this embodiment, the patch device further includes a dispensing assembly, and the dispensing assembly is used to dispense the adhesive on the surface of the silicon substrate 200. The dispensing component is provided with an air circuit system with adjustable air pressure, can simultaneously control the air pressure of the feeding glue barrel and the air inlet pressure of the glue inlet valve, adopts non-contact type injection dispensing, improves dispensing consistency, reduces material waste, and avoids excessive dispensing to cause glue overflow.
S2, an adsorption head 1 of the surface mounting device adsorbs the glass cover plate 100 through the vacuum adsorption holes 12, an external manipulator controls the adsorption head 1 to place the glass cover plate 100 at a corresponding position of the back surface of the silicon substrate 200 coated with the glue 300, and the adsorption head 1 stays together with the glass cover plate 100;
in this embodiment, the patch device further includes a CCD vision positioning system and an automatic vision sampling inspection system, and uses an alignment camera to photograph the glass cover plate 100 and the silicon substrate 200 respectively, and then uses an external manipulator to control the adsorption head 1 to attach the glass cover plate 100 to the back of the silicon substrate 200, so as to ensure the attaching precision. As shown in fig. 1, the suction head 1 sucks the glass cover plate 100 and places it on the silicon substrate 200 coated with the glue 300, at this time, the glue 300 is not leveled yet.
Step S3, after the glue 300 is leveled, the attaching pressure head 2 slides along the adsorption head 1 and is attached to the glass cover plate 100;
in this step S3, the adsorption time for the glass cover plate 100 needs to be delayed after the glass cover plate 100 is attached to the back surface of the silicon substrate 200 by the adsorption head 1, and preferably, in this embodiment, the first set time is 2S to 5S. After 2 s-5 s, the glue 300 can be fully leveled and uniformly distributed between the glass cover plate 100 and the silicon substrate 200, and can effectively adhere the glass cover plate 100. When the glue 300 is sufficiently leveled, the bonding press head 2 slides down to bond and press the glass cover plate 100, as shown in fig. 3. Preferably, the bonding pressure of the bonding pressure head 2 to the glass cover plate 100 is 0.1MPa to 0.5MPa, so that the glass cover plate 100 can be fully bonded with the glue 300, the glue 300 is further spread, and the pressure exceeding the safety coefficient is not applied to the silicon substrate 200.
Step S4, heating the glass cover plate 100 by the laminating press head 2 to pre-cure the central area of the glue 300;
in the step S4, the pulse heating device heats the bonding press head 2 by the pulse current, so as to pre-cure the glue 300 under the glass cover plate 100, the pre-cured glue 300 has stronger adhesive force and can not flow randomly, and the glue overflow phenomenon is avoided. Preferably, the heating temperature of the laminating head 2 is 100-150 ℃, so that the glue 300 can be fully pre-cured.
S5, stopping heating by the bonding press head 2, breaking vacuum by the adsorption head 1 to stop adsorbing the glass cover plate 100, lifting the surface mounting device and leaving the glass cover plate 100, starting a UV lamp to irradiate the glass cover plate 100, curing the glue 300, and finishing bonding of the glass cover plate 100;
in the step S5, the adhesive force of the glue 300 after full pre-curing to the glass cover plate 100 is stronger, and the released air flow can not cause the glass cover plate 100 to slide to form a deviation phenomenon in the process of breaking vacuum by the adsorption head 1, so that the attaching precision is improved; meanwhile, the UV lamp is turned on to irradiate the glue 300 under the glass cover plate 100, so that the glue 300 is finally cured, and the glass cover plate 100 is attached.
Further, the step S5 further includes the following steps: and S6, repeating the steps S1 to S5 until the encapsulation of the plurality of glass cover plates 100 is completed. Since the back surface of the silicon substrate 200 in this embodiment needs to encapsulate multiple glass cover plates 100, the steps S1 to S5 are repeated, and the corresponding positions of each glass cover plate 100 are respectively glued, bonded, and heated, so that the bonding of all the glass cover plates 100 on the back surface of the whole silicon substrate 200 is completed.
In the attaching method of the silicon-based OLED glass cover plate provided by the invention, the attaching device in the first embodiment is applied, in the process of attaching the silicon-based OLED glass cover plate 100 to the silicon-based OLED glass cover plate 100, the adsorption head 1 places the glass cover plate 100 at a corresponding position of the back surface of the silicon substrate 200 coated with the glue 300 and stays so that the glue 300 is fully leveled, after a first set time, the attaching pressure head 2 slides down and heats the glass cover plate 100 to pre-cure the central area of the glue 300, and then the adsorption head 1 breaks vacuum to separate from the glass cover plate 100, so that the pre-cured glue 300 has stronger adhesive force and can not flow randomly, the glass cover plate 100 is prevented from sliding, the glue overflow phenomenon is avoided, the attaching precision is improved, and the product yield is increased.
It is to be understood that the above examples of the present invention are provided for clarity of illustration only and are not limiting of the embodiments of the present invention. Various obvious changes, rearrangements and substitutions can be made by those skilled in the art without departing from the scope of the invention. It is not necessary here nor is it exhaustive of all embodiments. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the invention are desired to be protected by the following claims.
Claims (9)
1. A patch device, comprising:
an adsorption head (1), the adsorption head (1) is detachably connected to an external manipulator, the adsorption head (1) can place a glass cover plate (100) on a silicon substrate (200), the adsorption head (1) comprises an adsorption surface (11), the adsorption surface (11) can be abutted against the glass cover plate (100), the adsorption head (1) is provided with a plurality of vacuum adsorption holes (12), and the vacuum adsorption holes (12) are configured to adsorb the glass cover plate (100);
the laminating pressure head (2), laminating pressure head (2) sliding connection in absorption head (1), laminating pressure head (2) include heating surface (21), heating surface (21) can support and press and heat glue (300) under glass apron (100); the vacuum adsorption device is characterized in that a connecting hole is formed in the adsorption head (1), the lamination pressure head (2) is slidably arranged in the connecting hole, the adsorption head (1) is annularly arranged around the lamination pressure head (2), and a plurality of vacuum adsorption holes (12) are uniformly arranged at intervals around the lamination pressure head (2).
2. Patch device according to claim 1, characterized in that it further comprises a pulse heating device configured to heat the application ram (2) by means of a pulsed current.
3. Patch device according to claim 1, characterized in that the material of the application ram (2) comprises metal.
4. Patch device according to claim 1, characterized in that the material of the suction head (1) comprises ceramic.
5. A method for attaching a silicon-based OLED glass cover plate, using the patch device of any one of claims 1-4, comprising the steps of:
s1, dispensing is carried out on the surface of a silicon substrate (200);
s2, an adsorption head (1) of the surface mount device adsorbs a glass cover plate (100) through a vacuum adsorption hole (12), an external manipulator controls the adsorption head (1) to place the glass cover plate (100) at a corresponding position of the silicon substrate (200) coated with glue (300), and the adsorption head (1) stays together with the glass cover plate (100);
step S3, after the glue (300) is leveled, the attaching pressure head (2) slides along the adsorption head (1) and abuts against and attaches the glass cover plate (100) after a first set time;
s4, heating the glass cover plate (100) by the laminating press head (2) to pre-cure the central area of the glue (300);
step S5 the laminating pressure head (2) stops heating, the adsorption head (1) breaks vacuum and stops adsorbing the glass cover plate (100), the paster device is lifted and leaves the glass cover plate (100), a UV lamp is started to irradiate the glass cover plate (100), so that the glue (300) is solidified, and the lamination of the glass cover plate (100) is completed.
6. The method for attaching a glass cover plate to a silicon-based OLED according to claim 5, wherein the following step S5 is further included: and S6, repeating the steps S1 to S5 until the lamination of a plurality of glass cover plates (100) is completed.
7. The method according to claim 5, wherein in the step S3, the first set time is 2S to 5S.
8. The bonding method of a silicon-based OLED glass cover sheet according to claim 5, wherein in the step S3, the bonding pressure of the bonding head (2) to the glass cover sheet (100) is 0.1MPa to 0.5MPa.
9. The method according to claim 5, wherein in the step S4, the heating temperature of the bonding head (2) is 100 ℃ to 150 ℃.
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| CN202110879540.1A CN113594391B (en) | 2021-08-02 | 2021-08-02 | Surface mounting device and surface mounting method of silicon-based OLED glass cover plate |
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| CN202110879540.1A CN113594391B (en) | 2021-08-02 | 2021-08-02 | Surface mounting device and surface mounting method of silicon-based OLED glass cover plate |
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| CN113594391B true CN113594391B (en) | 2024-02-02 |
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| CN103465602A (en) * | 2013-09-27 | 2013-12-25 | 无锡宇宁光电科技有限公司 | Glue attaching method of capacitive touch panel |
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| KR101713929B1 (en) * | 2015-12-24 | 2017-03-08 | 주식회사 포스코티엠씨 | Adhesive Type Laminate Core Manufacturing Apparatus |
| CN106427160A (en) * | 2016-08-26 | 2017-02-22 | 广东韦达尔科技有限公司 | Laminating machine having film transfer mechanism |
| JP2019077172A (en) * | 2017-10-19 | 2019-05-23 | 陽程科技股▲ふん▼有限公司 | Curved surface bonding device and bonding method thereof |
| CN209920704U (en) * | 2019-04-30 | 2020-01-10 | 深圳市欣中大自动化技术有限公司 | Vacuum adsorption hot-pressing device |
| CN210346083U (en) * | 2019-06-11 | 2020-04-17 | 南京新酶合医药科技有限公司 | Upacatinib decompression drying device |
| CN212991126U (en) * | 2020-09-08 | 2021-04-16 | 南京攀诺德自动化设备有限公司 | OLED vacuum laminating packaging equipment |
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