CN204894712U - Flip shi reben moulding -die utensil - Google Patents
Flip shi reben moulding -die utensil Download PDFInfo
- Publication number
- CN204894712U CN204894712U CN201520533553.3U CN201520533553U CN204894712U CN 204894712 U CN204894712 U CN 204894712U CN 201520533553 U CN201520533553 U CN 201520533553U CN 204894712 U CN204894712 U CN 204894712U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- template
- flexible circuit
- flip
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a flip shi reben moulding -die utensil comprises first template and second template, its characterized in that, the upper surface of first template are provided with the absorption gas pocket, the adjacent both sides limit of adsorbing the gas pocket respectively fixed mounting have vertical dog and horizontal dog, the second template is constituteed by the base with base active link's apron, and top one side of apron is equipped with and is provided with softness circuit board fixed slot, is provided with the absorption gas pocket in the softness circuit board fixed slot. The utility model discloses a set up vertical dog and horizontal dog in first template, the glass function piece of the OGS structure of being convenient for is fixed a position fast, it adsorbs the softness circuit board fixed slot of gas pocket and set up softness circuit board protection groove on the base to set up simultaneously the area on the apron of second template, the rigidity and the protection of softness circuit board have been improved, avoid causing the damage to the softness circuit board in the operation of this pressure of heat, the efficiency of softness circuit board and the operation of this pressure of glass function piece heat is improved and product quality, reducing production cost.
Description
Technical field
The utility model belongs to mobile phone parts production mould technical field, specifically relates to this compression mould of heat of a kind of glass function sheet laminating of flexible circuit board and OGS structure in mobile phone is produced.
Background technology
This press of heat is a kind of by flexible circuit board and glass function sheet, by the equipment fit together after special conducting resinl heating.This compression mould uses on this press of heat, and flexible circuit board, with much adsorbing pore, can be fixed in surface in laminating process.Existing operational method is, first the glass function sheet of OGS structure being placed on one has on the platform of vacuum suction, again the flexible circuit board being stained with paper self-adhesive tape is placed on the platform of band vacuum suction, then by hot press, the glass function sheet and flexible circuit board that post conducting resinl is fit together.Because being with the platform of vacuum suction to be that equipment vendors wear, although be applicable to the flexible circuit board of various type product, it is comparatively large that flexible circuit board fixes post gap, needs hot repressing operation after manual setting.The drawback of this operational method is that flexible circuit board is movement easily, and after easily causing hot pressing, off normal is bad, consumes cost high in production; Need operator to adjust flexible circuit Board position often, operating efficiency is low.
OGS(Oneglasssolution) structure: the technology directly forming ITO conducting film and sensor on cover glass.One block of glass plays the double action of cover glass and touch sensor simultaneously.
Utility model content
Technical problem to be solved in the utility model is to provide this press die of a kind of flip-shell heat, improves the fixing means of flexible circuit board, reduces the number of times that operator adjusts flexible circuit Board position, improves operating efficiency.
For above-mentioned purpose, the utility model by the following technical solutions,
A kind of this compression mould of flip-shell heat, be made up of the first template and the second template, it is characterized in that, the upper surface of the first template is provided with absorption pore, is installed with vertical block and horizontal block respectively at the adjacent dual-side of absorption pore; Second template forms by base with the cover plate of base active link, and the side, top of cover plate is provided with flexible circuit board holddown groove, is provided with absorption pore in flexible circuit board holddown groove.
In order to obtain better technique effect, the side of described base is installed with two bearings, and cover plate is installed on two bearings by the rotating shaft be installed on one side; On described base, the side relative with bearing be provided with flexible circuit board protector; Suprasil bar is provided with between the first described template and the second described template.
The utility model has the advantages that; by arranging vertical block and horizontal block in the first template; be convenient to the glass function sheet quick position of OGS structure; the flexible circuit board holddown groove of band absorption pore is set simultaneously on the cover plate of the second template and flexible circuit board protector is set on base; the position improving flexible circuit board is fixed and protects; avoid causing damage to flexible circuit board in this press operation of heat; improve flexible circuit board and glass function sheet heat this pressure operating efficiency and product quality, reduce production cost.
Accompanying drawing explanation
Fig. 1 is the utility model example structure schematic diagram;
Fig. 2 is that the utility model embodiment A is to sectional view;
Fig. 3 is the utility model embodiment quartz bar sectional view;
Fig. 4 is the utility model using state schematic diagram;
In figure: 1-first template, 11-adsorbs pore, the horizontal block of 12-; the vertical block of 13-, 2-second template, 21-base; 211-bearing, 212-flexible circuit board protector, 22-cover plate; 221-flexible circuit board holddown groove; 222-negative pressure pore, 223-rotating shaft, 3-suprasil bar; the glass function sheet of 4-OGS structure, 5-flexible circuit board.
Detailed description of the invention
Below in conjunction with drawings and Examples, the utility model is described in further detail.
See Fig. 1 to Fig. 4, a kind of this compression mould of flip-shell heat, is made up of the first template 1 and the second template 2, and the upper surface of the first template 1 is provided with absorption pore 11, is installed with horizontal block 12 and vertical block 13 respectively at the adjacent dual-side of absorption pore 11; Second template 2 forms by base 21 with the cover plate 22 of base 21 active link, and the side, top of cover plate 22 is provided with flexible circuit board holddown groove 221, is provided with negative pressure pore 222 in flexible circuit board holddown groove 221; The side of described base 21 is installed with two bearings 211, and cover plate 22 is installed on two bearings 211 by the rotating shaft 223 be installed on one side; On described base 21, the side relative with bearing 211 be provided with flexible circuit board protector 212; Suprasil bar is provided with between the first described template and the second described template.
When the utility model uses, as shown in Figure 4, the glass function sheet 4 of OGS structure is placed on the surface of the first mould, its side close contact is used for horizontal block 12 and the vertical block 13 of L-type location, open air extractor, the glass function sheet 4 of OGS structure is adsorbed by absorption pore 11 and is closely attached to the first die surface, flexible circuit board 5 is laid in the flexible circuit board holddown groove 221 of the cover plate 22 of the second template 2, open air extractor, flexible circuit board 5 is adsorbed by negative pressure pore 222 and is closely attached in flexible circuit board holddown groove, cover plate 22 is overturn, the position that the glass function sheet 4 of flexible circuit board 5 and OGS structure is fitted overlaps on quartz bar 3, light demonstrates the contraposition situation of the glass function sheet 4 of flexible circuit board 5 and OGS structure from the bottom up on the display screen of board through quartz bar 3, the horizontal level of trickle adjustment second template 2, after ensureing the circuit one_to_one corresponding of position to be fit, start the operation button of this press of heat, carry out this press operation of heat and just complete laminating operation.Cover plate 22 overturns rear flexible circuit board 5 in the flexible circuit board protector 212 of the second template 2, avoids flexible circuit board 5 to be damaged by pressure when this press operation of heat.
The utility model is provided with the groove 205 of flexible circuit board 5 correspondence in the second template 2, add the cover plate 202 the second template 2 having and can overturn, the absorption pore 11 that can adsorb is provided with in the groove 201 that cover plate is arranged, can fixed-area larger or distortion flexible circuit board 5, make it not move.
The utility model is convenient to the glass function sheet quick position of OGS structure; the flexible circuit board holddown groove of band absorption pore is set simultaneously on the cover plate of the second template and flexible circuit board protector is set on base; the position improving flexible circuit board is fixed and protects; avoid causing damage to flexible circuit board in this press operation of heat; improve flexible circuit board and glass function sheet heat this pressure operating efficiency and product quality, reduce production cost.
Claims (4)
1. this compression mould of flip-shell heat, be made up of the first template and the second template, it is characterized in that, the upper surface of the first template is provided with absorption pore, is installed with vertical block and horizontal block respectively at the adjacent dual-side of absorption pore; Second template forms by base with the cover plate of base active link, and the side, top of cover plate is provided with flexible circuit board holddown groove, is provided with absorption pore in flexible circuit board holddown groove.
2. as claimed in claim 1 flip-shell heat this compression mould, it is characterized in that, the side of described base is installed with two bearings, and cover plate is installed on two bearings by the rotating shaft be installed on one side.
3. this compression mould of flip-shell heat as claimed in claim 1, it is characterized in that, on described base, the side relative with bearing be provided with flexible circuit board protector.
4. as claimed in claim 1 flip-shell heat this compression mould, it is characterized in that, between the first described template and the second described template, be provided with suprasil bar.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520533553.3U CN204894712U (en) | 2015-07-22 | 2015-07-22 | Flip shi reben moulding -die utensil |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520533553.3U CN204894712U (en) | 2015-07-22 | 2015-07-22 | Flip shi reben moulding -die utensil |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204894712U true CN204894712U (en) | 2015-12-23 |
Family
ID=54916921
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520533553.3U Active CN204894712U (en) | 2015-07-22 | 2015-07-22 | Flip shi reben moulding -die utensil |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204894712U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110121242A (en) * | 2019-05-20 | 2019-08-13 | 深圳市深科达智能装备股份有限公司 | The quick remodeling structure of flexible circuit board |
| CN113594391A (en) * | 2021-08-02 | 2021-11-02 | 昆山梦显电子科技有限公司 | Surface mounting device and method for attaching silicon-based OLED glass cover plate |
-
2015
- 2015-07-22 CN CN201520533553.3U patent/CN204894712U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110121242A (en) * | 2019-05-20 | 2019-08-13 | 深圳市深科达智能装备股份有限公司 | The quick remodeling structure of flexible circuit board |
| CN110121242B (en) * | 2019-05-20 | 2024-03-15 | 深圳市深科达智能装备股份有限公司 | Quick change structure of flexible circuit board |
| CN113594391A (en) * | 2021-08-02 | 2021-11-02 | 昆山梦显电子科技有限公司 | Surface mounting device and method for attaching silicon-based OLED glass cover plate |
| CN113594391B (en) * | 2021-08-02 | 2024-02-02 | 昆山梦显电子科技有限公司 | Surface mounting device and surface mounting method of silicon-based OLED glass cover plate |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204622748U (en) | The gasbag-type joint tool of touch screen top-surface camber glass | |
| CN104551587B (en) | Battery-mounting device | |
| CN204701246U (en) | The full abutted equipment of OCA | |
| CN204391053U (en) | Flexible vacuum alignment and lamination equipment | |
| CN207932079U (en) | A kind of film sticking equipment of Curved screen | |
| CN204894712U (en) | Flip shi reben moulding -die utensil | |
| CN202805881U (en) | Polaroid attaching machine | |
| CN105269491A (en) | Positioning and fitting tool for refrigerator display screen | |
| CN208514958U (en) | A kind of plane film sticking apparatus | |
| CN104441912A (en) | Polaroid attaching machine | |
| CN103129767A (en) | Film pasting device and film pasting method | |
| CN202192831U (en) | Laminating mechanism of touch panel laminating machine | |
| CN204925546U (en) | Attached device of polaroid | |
| CN203368948U (en) | Reinforcement pressing device of soft and hard combine plate | |
| CN103386801A (en) | Novel optical transparent adhesive tape gluing system | |
| CN203902961U (en) | Trademark hold-down device | |
| CN203666080U (en) | Novel bubble-free vacuum laminating machine | |
| CN204846460U (en) | Hinge formula sticking film machine | |
| KR20220000151A (en) | Protective film attaching apparatus | |
| CN202584082U (en) | Full-automatic mobile phone capacitive screen optical cement vacuum pressing machine | |
| CN204367529U (en) | A kind of vacuum abutted equipment | |
| CN211195252U (en) | A box with a net device for OCA laminating | |
| KR20130006957U (en) | apparatus for transcirption printing used hear of sublimation upon smart phone case | |
| CN205249591U (en) | Glass placing frame | |
| CN201152916Y (en) | Related panel element laminating machine of LCD |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: Fengshou Industrial Park, Wannian high tech Industrial Zone, Shangrao City, Jiangxi Province (within Jiangxi Lianchuang (Wannian) Electronics Co., Ltd.) Patentee after: Wannian Lianchuang Display Technology Co., Ltd Address before: 330096 Nanchang high tech Zone, Jiangxi, Jingdong Avenue, No. 1699 Patentee before: JIANGXI LIANXING DISPLAY INNOVATION BODY CO., LTD. |
|
| CP03 | Change of name, title or address |