CN113582690B - 一种超低温烧结微波介质材料Zn2V2O7及其制备方法 - Google Patents

一种超低温烧结微波介质材料Zn2V2O7及其制备方法 Download PDF

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CN113582690B
CN113582690B CN202110776968.3A CN202110776968A CN113582690B CN 113582690 B CN113582690 B CN 113582690B CN 202110776968 A CN202110776968 A CN 202110776968A CN 113582690 B CN113582690 B CN 113582690B
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李波
曹慧敏
韩如意
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Abstract

本发明属于电子陶瓷及其制造领域,具体提供一种超低温烧结微波介质材料Zn2V2O7及其制备方法,用以解决现有焦钒酸盐体系电子陶瓷的烧结温度偏高、均无法实现超低温烧结的问题。本发明提供的超低温烧结微波介质材料的化学式为:Zn2V2O7,微观结构为单斜晶体结构的Zn2V2O7晶相,能够实现焦钒酸盐体系电子陶瓷在680~740℃下的超低温烧结,且具有优良的微波介电性能:介电常数为8.6~9.7、Q×f值为15000~24000GHz、谐振频率温度系数为‑93~‑54ppm/℃;并且,该超低温烧结微波介质材料相对密度大、晶粒生长均匀、原子堆积率高、微观结构致密,从而获得了低的介电损耗;另外,该超低温烧结微波介质材料制备工艺简单、生产成本低,有利于实现工业化生产。

Description

一种超低温烧结微波介质材料Zn2V2O7及其制备方法
技术领域
本发明属于电子陶瓷及其制造领域,具体涉及一种超低温烧结微波介质材料Zn2V2O7及其制备方法。
背景技术
随着5G通信的飞速发展,微波介质材料已被广泛应用于谐振器、滤波器、天线等微波器件制备领域。为满足更高频率的工作要求,微波介质材料需要具备低介电常数、低介电损耗及近零谐振频率温度系数。随着微波介质陶瓷的深入研究,从高温烧结向低温烧结甚至超低温烧结方向发展。近年来的研究表明,钼酸盐、钒酸盐、硼酸盐、钨酸盐等为潜在的超低温烧结微波介电材料。其中,钒酸盐以其固有烧结温度低、微波性能优良等优点而被广泛关注,进一步的,焦钒酸盐体系作为钒酸盐中的重要体系,更加受到关注。如Joung等人在文章“Formation and Microwave Dielectric Properties of the Mg2V2O7 Ceramics”,“Formation Process and Microwave Dielectric Properties of the R2V2O7(R=Ba,Sr,and Ca)Ceramics”中报道了Mg2V2O7,Sr2V2O7,Ca2V2O7,Ba2V2O7的晶体结构和微波介电性能。以上已报道的焦钒酸盐体系陶瓷均为三斜晶体结构,其烧结温度分别为:1050℃、1000℃、950℃、900℃。
鉴于焦钒酸盐系列陶瓷的烧结温度偏高,本发明在保证低损耗的应用要求下提供一种超低温烧结微波介质材料Zn2V2O7及其制备方法。
发明内容
本发明的目的在于针对现有焦钒酸盐体系电子陶瓷的烧结温度偏高、均无法实现超低温烧结的问题,提供一种超低温烧结微波介质材料Zn2V2O7及其制备方法,实现焦钒酸盐体系电子陶瓷在680~740℃下的超低温烧结,且微波介质材料Zn2V2O7具备良好的微波介电性能。
为实现上述目的,本发明采用的技术方案为:
一种超低温烧结微波介质材料,其特征在于,所述微波介质材料的化学式为:Zn2V2O7
进一步的,所述微波介质材料为单斜晶体结构的Zn2V2O7晶相。
进一步的,所述超低温烧结微波介质材料的制备方法,其特征在于,包括以下步骤:
步骤1.以分析纯ZnO、V2O5为原料,按照化学式Zn2V2O7的摩尔比进行配料;
步骤2.以酒精、锆球为球磨介质,将原料放入尼龙罐中球磨4~6小时,一次球磨结束后将混合料置于70~80℃烘箱中干燥;
步骤3.对干燥料进行过筛,然后在600~650℃下预烧3~4小时,得到预烧料;
步骤4.以酒精、锆球为球磨介质,将预烧料放入尼龙罐中球磨4~6小时,二次球磨结束后出料置于70~80℃烘箱中干燥;
步骤5.将干燥料与聚乙烯醇(PVA)溶液混合、造粒,在10~20MPa干压得到生坯;
步骤6.将生坯在680~740℃的温度烧结5~6小时,得到所述微波介质材料。
本发明的有益效果在于:
1.本发明提供一种超低温烧结微波介质材料Zn2V2O7,单一晶相为:Zn2V2O7,晶体结构为:单斜晶体结构;所得陶瓷的相对密度大,晶粒生长均匀,原子堆积率高,微观结构致密,从而获得了低的介电损耗;
2.本发明提供的超低温烧结微波介质材料Zn2V2O7的烧结温度为680~740℃,实现超低温烧结,使之有潜力成为下一代超低温烧结微波介电材料;
综上所述,本发明提供超低温烧结微波介质材料Zn2V2O7,能够实现680~740℃的超低温烧结,且具有优良的微波介电性能:介电常数为8.6~9.7、Q×f值为15000~24000GHz、谐振频率温度系数为-93~-54ppm/℃;尤其在720℃烧结温度下拥有最优微波介电性能:εr=9.67、 Q×f=23968GHz、τf=-54.3ppm/℃;并且,该超低温烧结微波介质材料的制备工艺简单、生产成本低,有利于实现工业化生产。
附图说明
图1为实施例3制备得微波介质材料Zn2V2O7在720℃烧结温度下的XRD图。
图2为实施例3制备得微波介质材料Zn2V2O7在720℃烧结温度下的SEM图。
具体实施方式
下面结合附图和实施例对本发明做进一步详细说明。
本发明共提供4个实施例,每个实施例提供的超低温烧结微波介质材料配方及烧结温度为:Zn2V2O7,其中烧结温度为680℃、700℃、720℃、740℃;所述超低温烧结微波陶瓷材料均采用如下方法进行制备:
步骤1.按照Zn2V2O7的摩尔比,以分析纯ZnO、V2O5为原料进行配料;
步骤2.以酒精、锆球为球磨介质,将原料放入尼龙罐中球磨4~6小时,一次球磨结束后将混合料置于70~80℃烘箱中干燥;
步骤3.对干燥料进行过筛,然后在600~650℃下预烧3~4小时,得到初步合成晶相的预烧料;
步骤4.以酒精、锆球为球磨介质,将预烧料放入尼龙罐中球磨4~6小时,二次球磨结束后出料置于70~80℃烘箱中干燥;
步骤5.将干燥料与聚乙烯醇(PVA)溶液混合、造粒,在10~20MPa干压得到生坯;
步骤6.将生坯在680~740℃的温度烧结5~6小时,得到所述微波陶瓷材料。
以上4个实施例的具体工艺参数及微波介电性能如下表所示:
编号 烧结温度(℃) ε<sub>r</sub> Q×f值(GHz) τ<sub>f</sub>(ppm/℃)
实施例1 680 8.69 15462 -84.0
实施例2 700 8.96 16549 -84.5
实施例3 720 9.67 23968 -54.3
实施例4 740 9.53 17159 -93.4
由上表可见,本发明提供超低温烧结微波介质材料Zn2V2O7,其在680~740℃烧结温度下拥有优良的微波介电性能:介电常数为8.6~9.7、Q×f值为15000~24000GHz、谐振频率温度系数为-93~-54ppm/℃,符合微波介质材料的应用需求。另外,实施例3制备得微波介质材料 Zn2V2O7的XRD、SEM如图1、图2所示,由图可见,XRD衍射图谱的特征峰与PDF#29-1 396匹配完好,表明了所制陶瓷为单一晶相的Zn2V2O7,由SEM结果可知陶瓷微观结构致密、相对密度大、气孔率小,从而获得了低的介电损耗。
以上所述,仅为本发明的具体实施方式,本说明书中所公开的任一特征,除非特别叙述,均可被其他等效或具有类似目的的替代特征加以替换;所公开的所有特征、或所有方法或过程中的步骤,除了互相排斥的特征和/或步骤以外,均可以任何方式组合。

Claims (2)

1.一种超低温烧结微波介质材料,其特征在于,所述微波介质材料的化学式为:Zn2V2O7;所述微波介质材料的介电常数为8.6~9.7、Q×f值为15000~24000GHz、谐振频率温度系数为-93~-54ppm/℃;所述微波介质材料由以下步骤制备:
步骤1. 以分析纯ZnO、V2O5为原料,按照化学式Zn2V2O7的摩尔比进行配料;
步骤2. 以酒精、锆球为球磨介质,将原料放入尼龙罐中球磨4~6小时,一次球磨结束后将混合料置于70~80℃烘箱中干燥;
步骤3. 对干燥料进行过筛,然后在 600~650℃下预烧3~4小时,得到预烧料;
步骤4. 以酒精、锆球为球磨介质,将预烧料放入尼龙罐中球磨4~6小时,二次球磨结束后出料置于70~80℃烘箱中干燥;
步骤5. 将干燥料与聚乙烯醇(PVA)溶液混合、造粒,在10~20MPa干压得到生坯;
步骤6. 将生坯在680~740℃的温度烧结5~6小时 ,得到所述微波介质材料。
2.按权利要求1所述超低温烧结微波介质材料,其特征在于,所述微波介质材料为单斜晶体结构的Zn2V2O7晶相。
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