CN113518906B - 具有传感器元件以及测量和操作电路的测量装置 - Google Patents
具有传感器元件以及测量和操作电路的测量装置 Download PDFInfo
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Abstract
根据本发明的测量装置(1)包括:传感器元件(100),该传感器元件具有电气换能器(130)和传感器主体,该电气换能器用于提供取决于测量变量的初级信号,并且该传感器主体具有平坦表面部分;以及测量和操作电路(200),用于驱动换能器并且用于处理初级信号,该测量和操作电路(200)包括至少一个载体和多个电路部件,该多个电路部件包括至少一个集成电路和无源部件,该载体包括电绝缘载体主体(221、241、261)和导电通路,这些导电通路在载体主体中或在其表面上延伸,该集成电路(224、244、246)和无源部件(226、266)被布置在载体主体表面上并且由导电通路接触;其中,该至少一个载体主体(221)被固定到表面部分,以及该换能器经由导电通路电气地连接到该测量和操作电路的电路部件(224、226),这些部件(224、246、244、246、264、266)利用模塑料(222、242、262)而被封装。
Description
技术领域
本发明涉及一种测量装置,该测量装置包括传感器元件以及测量和操作电路。通用测量装置包括:传感器元件,该传感器元件用于检测测量变量,其中,该传感器元件包括电气换能器,该电气换能器用于提供取决于该测量变量的初级电信号;和传感器主体,该传感器主体包括至少一个平坦表面部分;测量和操作电路,该测量和操作电路用于驱动电气换能器并且用于处理由该电气换能器提供的信号,其中,该测量和操作电路包括至少一个载体和多个电路部件,该多个电路部件包含至少一个集成电路和至少一个离散的无源电气部件,其中,该载体包括电绝缘载体主体和导电轨道,这些导电轨道在载体主体和/或至少一个载体主体表面上行进,其中,该集成电路和无源电气部件被布置在载体主体表面上并且由导电轨道接触。这些初级信号应以尽可能不失真的形式提供给测量和操作电路,以实现转换为对干扰变量和环境影响——诸如温度和湿度——不太敏感的更鲁棒的信号。为此目的,该测量和操作电路靠近于换能器被布置在传感器主体上。
背景技术
公开的专利申请DE 101 35 568A1公开了一种压力测量装置,该压力测量装置包括传感器元件,该测量和操作电路被布置在该传感器元件的后侧上并且由金属帽罩盖。该帽沿着传感器主体的边缘区域中的周向接头、通过活性钎焊焊料以气密密封的方式结合到传感器元件的传感器主体。这是一个非常复杂的制造过程,该制造过程在生产过程中将电路暴露在高热负荷下,并且由于设计而导致相当大的热机械应力和滞后。
公开的专利申请DE 102 00 780A1公开了一种压力测量装置,该压力测量装置包括陶瓷传感器主体和陶瓷罐,该陶瓷罐被布置在传感器主体的后侧上并且由传感器主体封闭。该测量和操作电路被封闭在罐中。同时,该罐用于在后侧上支承传感器主体,即该罐是压力测量装置的机械确定部件。一方面实现气密连接,另一方面实现罐和传感器主体之间的无滞后连接是特别复杂的。
公开的专利申请DE 103 26 975A1公开了一种压力测量装置,该压力测量装置包括压力传感器元件并且还包括测量和操作电路,该压力传感器元件包括电容式换能器,并且该测量和操作电路以气密密封胶囊形式被布置在压力测量单元的传感器主体的后表面上。该气密密封胶囊包括陶瓷或金属材料,并且通过中央支承件或连接线与传感器主体的后表面保持距离。这些连接线形成取决于湿气的寄生电容,其中,这些连接线的疏水性旨在降低湿气依赖性。
公开的专利申请DE 10 2008 054 97A1公开了一种压力测量装置,该压力测量装置包括压力传感器元件,用于封装测量和操作电路的壳体被焊接到该压力传感器元件的后侧上。在该壳体用需焊接到壳体的罩盖闭合之前,在壳体中,该测量和操作电路经由结合线连接到该压力传感器元件的电容式换能器。该设计非常复杂并且需要相对较大的壳体基面,因为结合线仍然必须在壳体内从后传感器表面的自由区域引导到该测量和操作电路。这是昂贵的并且减少了传感器主体后侧上可以支承传感器元件的剩余表面。此外,由于壳体、传感器主体以及壳体与传感器主体之间的焊接材料的热膨胀系数不同,因此,大的壳体基面可能在传感器主体中引起更广泛的热机械应力,从而导致温度滞后。
发明内容
因此,本发明的目的是提供一种测量装置,该测量装置一方面对潮湿条件不敏感,另一方面减小热机械应力对测量装置的影响。该目的通过根据独立权利要求1的测量装置来实现。
根据本发明的测量装置包括:传感器元件,该传感器元件用于检测测量变量,其中,该传感器元件包括电气换能器和传感器主体,该电气换能器用于提供取决于该测量变量的初级电信号,并且,该传感器主体包括至少一个平坦表面部分;测量和操作电路,该测量和操作电路用于驱动电气换能器并且用于处理由该电气换能器(130)提供的初级信号,其中,该测量和操作电路包括至少一个载体和多个电路部件,该多个电路部件包括至少一个集成电路和至少一个离散的无源电气部件,其中,该载体包括电绝缘载体主体和导电轨道,这些导电轨道在载体主体中和/或至少一个载体主体表面上行进,其中,该集成电路和无源电气部件被布置在载体主体表面上并且由导电轨道接触;其中,根据本发明,该载体主体被固定到表面部分,并且该换能器经由导电轨道电气地连接到该测量和操作电路的电路部件,其中,被布置在载体主体上的部件利用模塑料封装,尤其是通过由模塑料注塑成型而进行封装。
通过将测量和操作电路的部件封装在载体上,可以充分保护这些部件免受湿气的影响。
该测量和操作电路优选地包括模数转换器,该模数转换器在处理链的早期阶段将初级信号数字化,使得进一步的信号处理在很大程度上对潮湿条件不敏感。
在本发明的改进中,该载体主体通过球栅阵列被连接到换能器在表面部分中的端接触件。
该载体主体经由球栅阵列与换能器的端接触件的连接导致该传感器主体和载体主体之间暴露的电连接极短。因此,直接暴露在湿气影响下的电连接大大减少。
在本发明的改进中,该壳体连同载体一起形成所谓的芯片级包装。源自英语、但在德语中也很常见的该技术术语指代与使用传统的基于FR的印刷电路板可能实现的相比更进一步的小型化。例如呈球栅阵列形式的接触点之间的距离例如不超过2mm,尤其是不超过1毫米,通过这些接触点将载体安装在基板上和/或连接到触件。
在本发明的改进中,该测量和操作电路的正交投影覆盖第二端面的不超过60%,尤其是不超过50%。
该传感器主体尤其可以包括诸如刚玉的陶瓷材料或诸如不锈钢的金属材料。尽管热膨胀系数存在显著差异,但由于芯片级包装中测量和操作电路的集成度增加,载体主体的基面相对较小,从而使得不同热膨胀系数对测量精度的影响相对较小。
在本发明的改进中,该载体主体包括复合材料,该复合材料包括由塑料——例如,纤维增强塑料——制成的基体,其中,该塑料尤其包括双马来酰亚胺三嗪(BT)或聚酰亚胺,并且其中,这些纤维例如包括玻璃、诸如Al2O3的陶瓷、以及玻璃或陶瓷与诸如聚酰亚胺的塑料的组合。在本发明的改进中,该载体主体具有层压结构。
在本发明的改进中,该传感器主体在表面部分的区域中包括具有第一热膨胀系数的第一材料,并且其中,该载体主体包括具有第二热膨胀系数的第二材料,其中,热膨胀系数彼此相差超过20ppm/K,以使得温度变化会导致不同的纵向膨胀,从而导致传感器主体在表面部分区域中变形和载体主体变形,其中,载体主体的变形能量是传感器主体的变形能量的至少十倍,尤其是至少二十倍,并且优选地是至少四十倍。
通过为载体主体选择合适的材料——例如由包括嵌入纤维的双马来酰亚胺三嗪(BT)制成的基质,可以使得载体主体实现大约4GPa的有效弹性模量。这大约是用于传感器主体的基体的高纯度刚玉材料的弹性模量的1%。在这种材料配对中,用于补偿热膨胀差异的大部分变形能量由载体主体吸收,以使得测量精度不会由于传感器主体的过度变形而受到损害。
在本发明的改进中,该测量和操作电路包括多个载体,这些载体堆叠在彼此上方并且各自都经由球栅阵列连接到载体中的相邻一个。
通过堆叠多个载体,该测量和操作电路的功能可以在其相同的基面的情况下显著扩展,从而可以省去测量装置中常用的主要电子器件,而否则提供这些主要电子器件来用于进行进一步信号处理和信号通信。
在本发明的改进中,该集成电路被构造成基于传输函数和数字化的初级信号来计算表示测量变量的值。
在本发明的改进中,该测量和操作电路包括微处理器,该微处理器被构造成根据自动化技术通信协议,尤其是现场总线协议—例如根据基金会现场总线、程序现场总线、可寻址远程传感器高速通道(HART)的协议—或无线电协议将表示测量变量的值处理成信号。
在本发明的改进中,该集成电路被布置在第一载体上,并且微处理器被布置在第二载体上。
在本发明的改进中,该测量和操作电路还包括能量存储器,尤其是GoldCap、可充电电池或电池。
在本发明的改进中,该能量存储器被布置在与集成电路不同的载体上。
在本发明的改进中,该传感器元件包括压力传感器元件。
在本发明的改进中,该压力传感器元件包括测量膜,其中该传感器主体包括至少部分为圆柱的对应主体,其中,该测量膜在该对应主体的第一端面处以压力密封的方式连接到对应主体,并且其中,该测量和操作电路被布置在背离测量膜的第二端面的表面部分上。
在本发明的改进中,该压力传感器元件包括电容式测量换能器,该电容式测量换能器包括被布置在测量膜上的至少一个第一电极和被布置在对应主体上的至少一个第二电极,这些电极面向彼此,其中,第一电极和第二电极之间的电容取决于测量膜的压力相关偏转,其中至少第二电极经由穿过对应主体的至少一个馈通部连接到该测量和操作电路。代替电容式换能器,类似地可以使用(压电)电阻式换能器。
尽管这里特别地结合压力传感器解释了本发明,但本发明类似地涉及用于工业过程计量的其它测量变量和监控变量的传感器元件,这些变量诸如是填充水平、极限水平、流量、温度、流速、密度、粘度、水分、pH值、电导率或物质混合物的成分。
附图说明
现在将基于附图中所示的示例性实施例更详细地解释本发明。如下示出:
图1是通过根据本发明的测量装置的示例性实施例的示意性纵剖视图。
具体实施方式
图1所示的根据本发明的测量装置的示例性实施例是压力测量装置1,该压力测量装置1包括压力传感器元件100以及测量和操作电路200。
该压力传感器元件100包括圆柱陶瓷对应主体110和陶瓷测量膜120,该陶瓷测量膜通过包括活性钎焊焊料的周向导电接头135、连接到对应主体110的第一端面111,以形成测量室121。该压力传感器元件100还包括电容式换能器130,该电容式换能器包括对应主体110的第一端面111上的至少一个测量电极132以及测量膜120的面向对应主体110的表面上的膜电极134。
测量电极132经由电气馈通件133电流连接到位于对应主体110的第二端面115上的第一接触点137,该第一接触点由金属层形成。膜电极134经由接头135和外表面117的金属涂层136以及对应主体110的第二端面115的部分电流连接到第二接触点139,该第二接触点由金属层形成。
开通到测量室121中的参考压力通道140延伸穿过对应主体110,以使得参考压力能够被施加到测量室121。因此,测量膜120经历偏转,该偏转取决于测量膜120的外侧上的压力p与测量室121中的参考压力之间的差值。这一偏转通过电容式换能器130检测,该电容式换能器130被连接到测量和操作电路200。在该示例性实施例的图示中,该电容式换能器130仅在对应主体侧上包括一个电极,即测量电极132;实际上,对应主体上也可以布置如下电极,即中心测量电极和参考电极,该中心测量电极相对于膜电极134具有电容CP,并且该参考电极相对于膜电极具有电容CR并以环形方式围绕该测量电极,且在该测量膜的休止位置中具有相同的电容。这种包括差分电容器的电容式换能器的传输函数在一阶近似中与(CP-CR)/CP成正比。
在这里所示的示例性实施例中,该测量和操作电路200包括集成封装系统220、240、260的堆叠,这些集成封装系统是所谓的系统级包装阵列220、240、260,在下文中称为SIP。尽管这里提供了三个SIP 220、240、260,但是本发明也可通过仅具有第一SIP 220的测量装置来实施。
第一SIP 220包括载体主体221,该载体主体221包括由多层纤维增强塑料制成的层压件,例如由双马来酰亚胺三嗪制成的塑料基质,其中嵌入纤维,例如聚酰亚胺纤维,其进而可以包括玻璃涂层或陶瓷涂层。导电轨道被制备在层压结构的各层之间并穿过这些层,以便接触第一SIP 220的部件,从而将这些部件彼此连接并连接到传感器元件100的电容式换能器130。载体主体通过球栅阵列固定地连接到对应主体110的第二端面115,其中,该球栅阵列的第一焊球223电流连接到第一接触点137,并且其中,第二焊球225电流连接到第二接触点139,从而将电容式换能器130的电极连接到测量和操作电路200的第一SIP220。虽然图中仅示出了两个触件,但实际上可以存在多个触件、尤其是至少三个触件,即用于CP、CR和测量膜的触件。第一SIP 220包括ASIC 224,该ASIC 224被布置在载体主体221上并且被构造成使得电容式换能器的初级信号数字化,并且基于传输函数根据数字化值提供压力测量值。第一SIP 220还包括无源部件226、尤其是电阻元件和电容器,其邻近于ASIC224被布置在载体主体224上,并且被构造成为ASIC提供稳定的电源电压。ASIC 224和无源部件226通过注塑成型利用模塑料222封装在载体主体221上。该模塑料尤其可以包括环氧树脂。在载体主体221的背离传感器元件110的上侧上,其它接触点与封装部件224、226被布置在由模塑料222形成的胶囊外部,第一SIP 220的信号路径和电源将被连接到上述接触点。
在示例性实施例中,第二SIP 240通过第二球栅阵列被紧固到这些接触点,该第二球栅阵列的焊球243和245在附图中示出;事实上,这里存在明显更多的触件,从而能够在SIP 220、240和第一SIP 220的电源之间进行数据交换。该第二SIP 240类似地包括载体主体241以及测量和操作电路200的用模塑料242封装的部件244、246。部件244、246可以包括电压调节器模块246和用于无线HART协议244的微控制器和/或用于蓝牙协议的微控制器,该用于无线HART协议的微控制器用于与过程自动化技术的控制系统通信、特别是用于测量值传输,该用于蓝牙协议的微控制器用于测量和操作电路200的测量值传输和/或参数化。在载体主体241的背离传感器元件110的上侧上,第二SIP 240在由模塑料242形成的胶囊的外部包括其它接触点,第一和第二SIP 220、240的信号路径和电源将被连接到这些接触点。
在示例性实施例中,第三SIP 260通过第三球栅阵列被紧固到这些接触点,该第三球栅阵列的焊球263和265在附图中示出;事实上,这里存在明显更多的触件,从而能够在该SIP以及第一和第二SIP 220、240的电源之间进行数据交换。第三SIP 260类似地包括载体主体261,并且该测量和操作电路的用模塑料262封装的部件264、266在这里包括用于向测量和操作电路200供电的电池264和用于经由无线HART或蓝牙与控制系统或操作工具通信的天线模块266。
载体241、261以及第二SIP 240和第三SIP 260的模塑料242、262的材料尤其可以是与载体主体221或第一SIP 220的模塑料的那些材料相同的材料。
Claims (16)
1.一种测量装置(1),包括:
传感器元件(100),所述传感器元件(100)用于检测测量变量,其中,所述传感器元件包括电气换能器(130)和传感器主体,所述电气换能器用于提供取决于测量变量的初级电信号,并且所述传感器主体包括至少一个平坦表面部分;
测量和操作电路(200),所述测量和操作电路(200)用于驱动所述电气换能器并且用于处理由所述电气换能器(130)提供的初级信号,其中,所述测量和操作电路(200)包括至少一个载体和多个电路部件,所述多个电路部件包括至少一个集成电路和至少一个离散的无源电气部件,
所述载体包括电绝缘载体主体(221、241、261)和导电轨道,所述导电轨道在所述载体主体和/或至少一个载体主体表面上行进,
所述多个电路部件(224、246、244、246、264、266)被布置在所述载体主体表面上并且由所述导电轨道接触;
其特征在于,
所述传感器元件包括压力传感器元件,
所述集成电路被配置成基于传输函数和数字化的初级信号来计算表示所述测量变量的值,
所述至少一个载体主体(221)被固定到所述表面部分,
所述换能器经由所述导电轨道电气地连接到所述测量和操作电路的电路部件,
所述多个电路部件(224、246、244、246、264、266)被布置在所述载体主体(221、241、261)的所述载体主体表面上、利用模塑料(222、242、262)而被封装,以及
所述载体主体(221)通过球栅阵列(223、225)被连接到所述换能器(130)在所述表面部分中的端接触件,
其中,所述传感器主体在所述表面部分的区域中包括具有第一热膨胀系数的第一材料,并且所述载体主体包括具有第二热膨胀系数的第二材料,其中所述热膨胀系数彼此相差超过20ppm/K,以使得温度改变导致不同的纵向膨胀,从而导致所述传感器主体在所述表面部分区域中变形和所述载体主体变形,所述载体主体的变形能量是所述传感器主体的变形能量的至少十倍。
2.根据权利要求1所述的测量装置(1),其中,所述载体主体包括复合材料,所述复合材料包括由塑料制成的基体。
3.根据权利要求2所述的测量装置(1),其中,所述塑料是纤维增强塑料。
4.根据权利要求2所述的测量装置(1),其中,所述塑料包括双马来酰亚胺三嗪(BT)或聚酰亚胺。
5.根据权利要求3所述的测量装置(1),其中,所述纤维包括玻璃、陶瓷、以及玻璃或陶瓷与塑料的组合。
6.根据权利要求5所述的测量装置(1),其中,所述塑料是聚酰亚胺。
7.根据权利要求1所述的测量装置(1),其中,所述载体主体具有层压结构。
8.根据权利要求1所述的测量装置(1),其中,所述测量和操作电路包括多个载体,所述多个载体堆叠在彼此上方并且各自经由球栅阵列(243、245、263、265)连接到载体的相邻一个。
9.根据权利要求8所述的测量装置(1),其中,所述测量和操作电路包括微处理器,所述微处理器被配置成根据自动化技术通信协议来将表示所述测量变量的值处理为信号,以及
其中,所述集成电路被布置在第一载体上,并且所述微处理器被布置在第二载体上。
10.根据权利要求8或9所述的测量装置(1),其中,所述测量和操作电路(200)进一步包括能量存储器,以及
其中,所述能量存储器被布置在与所述集成电路不同的载体上。
11.根据权利要求1所述的测量装置(1),其中,所述压力传感器元件包括测量膜,所述传感器主体包括至少部分为圆柱的对应主体,所述测量膜在所述对应主体的第一端面处以压力密封的方式连接到所述对应主体,并且,所述测量和操作电路被布置在所述对应主体的背离所述测量膜的第二端面的表面部分上。
12.根据权利要求11所述的测量装置(1),其中,所述压力传感器元件包括电容式测量换能器,所述电容式测量换能器包括被布置在所述测量膜上的至少一个第一电极和被布置在所述对应主体上的至少一个第二电极,所述电极面向彼此,所述第一电极和所述第二电极之间的电容取决于所述测量膜的压力相关偏转,至少所述第二电极经由穿过所述对应主体的至少一个馈通部连接到所述测量和操作电路。
13.根据权利要求11或12所述的测量装置(1),其中,所述测量和操作电路的正交投影覆盖所述第二端面的不超过60%。
14.根据权利要求13所述的测量装置(1),其中,所述测量和操作电路的所述正交投影覆盖所述第二端面的不超过50%。
15.根据权利要求1所述的测量装置(1),其中,所述载体主体的变形能量是所述传感器主体的变形能量的至少二十倍。
16.根据权利要求1所述的测量装置(1),其中,所述载体主体的变形能量是所述传感器主体的变形能量的至少四十倍。
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DE102019104841A1 (de) | 2020-08-27 |
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