CN113474892B - 用于图像传感器的基板 - Google Patents
用于图像传感器的基板 Download PDFInfo
- Publication number
- CN113474892B CN113474892B CN202080013169.4A CN202080013169A CN113474892B CN 113474892 B CN113474892 B CN 113474892B CN 202080013169 A CN202080013169 A CN 202080013169A CN 113474892 B CN113474892 B CN 113474892B
- Authority
- CN
- China
- Prior art keywords
- conductive pattern
- insulating
- disposed
- image sensor
- insulating portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 154
- 230000003287 optical effect Effects 0.000 claims description 6
- 239000010410 layer Substances 0.000 description 213
- 238000009413 insulation Methods 0.000 description 41
- 239000010949 copper Substances 0.000 description 36
- 239000007769 metal material Substances 0.000 description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 19
- 229910052802 copper Inorganic materials 0.000 description 19
- 239000010931 gold Substances 0.000 description 17
- 238000007747 plating Methods 0.000 description 17
- 230000000052 comparative effect Effects 0.000 description 16
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 16
- 238000000034 method Methods 0.000 description 15
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 15
- 229910052751 metal Inorganic materials 0.000 description 13
- 239000002184 metal Substances 0.000 description 13
- 230000008569 process Effects 0.000 description 12
- 229910002056 binary alloy Inorganic materials 0.000 description 10
- 239000010936 titanium Substances 0.000 description 10
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 9
- 229910052737 gold Inorganic materials 0.000 description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 7
- 229910052759 nickel Inorganic materials 0.000 description 7
- 229910052709 silver Inorganic materials 0.000 description 7
- 239000004332 silver Substances 0.000 description 7
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 229910002058 ternary alloy Inorganic materials 0.000 description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000002313 adhesive film Substances 0.000 description 5
- 229910052697 platinum Inorganic materials 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 5
- 229910052719 titanium Inorganic materials 0.000 description 5
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 4
- 229910052790 beryllium Inorganic materials 0.000 description 4
- 229910017052 cobalt Inorganic materials 0.000 description 4
- 239000010941 cobalt Substances 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- 239000003522 acrylic cement Substances 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000007667 floating Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000004713 Cyclic olefin copolymer Substances 0.000 description 2
- 229910000640 Fe alloy Inorganic materials 0.000 description 2
- 229910001374 Invar Inorganic materials 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- 229910008433 SnCU Inorganic materials 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 239000005354 aluminosilicate glass Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 229920002457 flexible plastic Polymers 0.000 description 1
- 230000008570 general process Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000005304 optical glass Substances 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
- 230000002335 preservative effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000036632 reaction speed Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000006058 strengthened glass Substances 0.000 description 1
- 239000002335 surface treatment layer Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14636—Interconnect structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14634—Assemblies, i.e. Hybrid structures
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Studio Devices (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
- Lens Barrels (AREA)
- Adjustment Of Camera Lenses (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410416877.2A CN118398633A (zh) | 2019-02-07 | 2020-02-06 | 图像传感器基板 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2019-0014398 | 2019-02-07 | ||
| KR1020190014398A KR20200097086A (ko) | 2019-02-07 | 2019-02-07 | 이미지 센서용 기판 및 이를 포함하는 카메라 모듈 |
| PCT/KR2020/001704 WO2020162688A1 (fr) | 2019-02-07 | 2020-02-06 | Substrat pour capteur d'image |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410416877.2A Division CN118398633A (zh) | 2019-02-07 | 2020-02-06 | 图像传感器基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113474892A CN113474892A (zh) | 2021-10-01 |
| CN113474892B true CN113474892B (zh) | 2024-04-30 |
Family
ID=71948329
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202080013169.4A Active CN113474892B (zh) | 2019-02-07 | 2020-02-06 | 用于图像传感器的基板 |
| CN202410416877.2A Pending CN118398633A (zh) | 2019-02-07 | 2020-02-06 | 图像传感器基板 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410416877.2A Pending CN118398633A (zh) | 2019-02-07 | 2020-02-06 | 图像传感器基板 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20220102417A1 (fr) |
| EP (1) | EP3923332A4 (fr) |
| JP (2) | JP7299991B2 (fr) |
| KR (2) | KR20200097086A (fr) |
| CN (2) | CN113474892B (fr) |
| TW (3) | TWI754214B (fr) |
| WO (1) | WO2020162688A1 (fr) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20220109674A (ko) * | 2021-01-29 | 2022-08-05 | 엘지이노텍 주식회사 | 렌즈 구동 장치 및 이를 포함하는 카메라 모듈 |
| JP2022122057A (ja) * | 2021-02-09 | 2022-08-22 | 日本電産サンキョー株式会社 | 光学ユニット |
| JP7471341B2 (ja) * | 2021-04-21 | 2024-04-19 | エルジー イノテック カンパニー リミテッド | 回路基板、イメージセンサーモジュール、レンズ駆動装置、およびこれを含むカメラモジュール |
| US20240098348A1 (en) * | 2022-07-21 | 2024-03-21 | Meta Platforms Technologies, Llc | Camera module on flexible interconnect tape |
| TWI827505B (zh) * | 2022-08-03 | 2023-12-21 | 大立光電股份有限公司 | 可移動式電子感光模組、相機模組及電子裝置 |
| WO2024075398A1 (fr) * | 2022-10-06 | 2024-04-11 | ソニーセミコンダクタソリューションズ株式会社 | Module de caméra et dispositif d'imagerie |
| JP2024085328A (ja) | 2022-12-14 | 2024-06-26 | 日東電工株式会社 | 配線回路基板およびその製造方法 |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101133352A (zh) * | 2005-05-24 | 2008-02-27 | 松下电器产业株式会社 | 摄像机模块 |
| CN102971670A (zh) * | 2011-07-01 | 2013-03-13 | 松下电器产业株式会社 | 摄像装置 |
| CN103649827A (zh) * | 2011-08-12 | 2014-03-19 | 夏普株式会社 | 照相机模块 |
| CN104808416A (zh) * | 2014-01-28 | 2015-07-29 | Lg伊诺特有限公司 | 镜头移动单元和具有镜头移动单元的摄像头模块 |
| CN108351573A (zh) * | 2015-11-16 | 2018-07-31 | 三美电机株式会社 | 透镜驱动装置、摄像机模块及摄像机搭载装置 |
| CN108602663A (zh) * | 2015-11-05 | 2018-09-28 | 麦穆斯驱动有限公司 | Mems致动器组结构 |
| CN108780207A (zh) * | 2016-03-11 | 2018-11-09 | 苹果公司 | 具有用于移动图像传感器的音圈电机的光学图像稳定 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5624529B2 (ja) * | 2011-09-27 | 2014-11-12 | 株式会社東芝 | 手振れ補正装置及び撮像装置 |
| US8817116B2 (en) * | 2011-10-28 | 2014-08-26 | Lg Innotek Co., Ltd. | Camera module |
| JP6135109B2 (ja) * | 2012-12-07 | 2017-05-31 | ソニー株式会社 | 固体撮像素子および固体撮像素子の製造方法ならびに電子機器 |
| KR101504024B1 (ko) * | 2013-08-27 | 2015-03-18 | 삼성전기주식회사 | 렌즈 구동 장치 및 이를 포함하는 카메라 모듈 |
| US9621775B2 (en) * | 2014-05-06 | 2017-04-11 | Mems Drive, Inc. | Electrical bar latching for low stiffness flexure MEMS actuator |
| CN114153103B (zh) * | 2016-01-19 | 2024-04-26 | Lg伊诺特有限公司 | 透镜驱动装置、相机模组及光学设备 |
| CN109937381B (zh) * | 2016-10-05 | 2021-10-29 | Lg伊诺特有限公司 | 透镜驱动装置及包括透镜驱动装置的相机模块和光学装置 |
| JP2020515881A (ja) | 2016-12-16 | 2020-05-28 | ハッチンソン テクノロジー インコーポレイテッドＨｕｔｃｈｉｎｓｏｎ Ｔｅｃｈｎｏｌｏｇｙ Ｉｎｃｏｒｐｏｒａｔｅｄ | 光学画像安定化サスペンションにおけるセンサシフト構造 |
| US10863094B2 (en) | 2017-07-17 | 2020-12-08 | Apple Inc. | Camera with image sensor shifting |
| KR102522700B1 (ko) * | 2019-01-08 | 2023-04-18 | 엘지이노텍 주식회사 | 카메라 모듈 및 이를 포함하는 카메라 장치 |
-
2019
- 2019-02-07 KR KR1020190014398A patent/KR20200097086A/ko not_active Application Discontinuation
-
2020
- 2020-02-06 WO PCT/KR2020/001704 patent/WO2020162688A1/fr unknown
- 2020-02-06 EP EP20752924.9A patent/EP3923332A4/fr active Pending
- 2020-02-06 US US17/426,763 patent/US20220102417A1/en active Pending
- 2020-02-06 JP JP2021546371A patent/JP7299991B2/ja active Active
- 2020-02-06 CN CN202080013169.4A patent/CN113474892B/zh active Active
- 2020-02-06 CN CN202410416877.2A patent/CN118398633A/zh active Pending
- 2020-02-07 TW TW109103933A patent/TWI754214B/zh active
- 2020-02-07 TW TW112100632A patent/TW202321804A/zh unknown
- 2020-02-07 TW TW110147990A patent/TWI801050B/zh active
-
2023
- 2023-01-18 JP JP2023005689A patent/JP7556991B2/ja active Active
- 2023-05-25 KR KR1020230067498A patent/KR20230078623A/ko active IP Right Grant
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101133352A (zh) * | 2005-05-24 | 2008-02-27 | 松下电器产业株式会社 | 摄像机模块 |
| CN102971670A (zh) * | 2011-07-01 | 2013-03-13 | 松下电器产业株式会社 | 摄像装置 |
| CN103649827A (zh) * | 2011-08-12 | 2014-03-19 | 夏普株式会社 | 照相机模块 |
| CN104808416A (zh) * | 2014-01-28 | 2015-07-29 | Lg伊诺特有限公司 | 镜头移动单元和具有镜头移动单元的摄像头模块 |
| CN108602663A (zh) * | 2015-11-05 | 2018-09-28 | 麦穆斯驱动有限公司 | Mems致动器组结构 |
| CN108351573A (zh) * | 2015-11-16 | 2018-07-31 | 三美电机株式会社 | 透镜驱动装置、摄像机模块及摄像机搭载装置 |
| CN108780207A (zh) * | 2016-03-11 | 2018-11-09 | 苹果公司 | 具有用于移动图像传感器的音圈电机的光学图像稳定 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2023052464A (ja) | 2023-04-11 |
| WO2020162688A1 (fr) | 2020-08-13 |
| EP3923332A4 (fr) | 2022-12-28 |
| TWI801050B (zh) | 2023-05-01 |
| EP3923332A1 (fr) | 2021-12-15 |
| CN113474892A (zh) | 2021-10-01 |
| KR20200097086A (ko) | 2020-08-18 |
| JP2022520370A (ja) | 2022-03-30 |
| US20220102417A1 (en) | 2022-03-31 |
| TWI754214B (zh) | 2022-02-01 |
| TW202101104A (zh) | 2021-01-01 |
| JP7556991B2 (ja) | 2024-09-26 |
| TW202215137A (zh) | 2022-04-16 |
| JP7299991B2 (ja) | 2023-06-28 |
| KR20230078623A (ko) | 2023-06-02 |
| TW202321804A (zh) | 2023-06-01 |
| CN118398633A (zh) | 2024-07-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102632558B1 (ko) | 카메라 모듈 및 이를 포함하는 카메라 장치 | |
| CN113474892B (zh) | 用于图像传感器的基板 | |
| KR102688063B1 (ko) | 이미지 센서용 기판 및 이를 포함하는 카메라 모듈 | |
| US20230209163A1 (en) | Substrate for image sensor | |
| KR102705984B1 (ko) | 이미지 센서용 기판 및 이를 포함하는 카메라 모듈 | |
| KR20240145429A (ko) | 이미지 센서용 기판 및 이를 포함하는 카메라 모듈 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |