CN113474892B - 用于图像传感器的基板 - Google Patents
用于图像传感器的基板 Download PDFInfo
- Publication number
- CN113474892B CN113474892B CN202080013169.4A CN202080013169A CN113474892B CN 113474892 B CN113474892 B CN 113474892B CN 202080013169 A CN202080013169 A CN 202080013169A CN 113474892 B CN113474892 B CN 113474892B
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- conductive pattern
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- image sensor
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14636—Interconnect structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14634—Assemblies, i.e. Hybrid structures
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Studio Devices (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
- Lens Barrels (AREA)
- Adjustment Of Camera Lenses (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2019-0014398 | 2019-02-07 | ||
| KR1020190014398A KR20200097086A (ko) | 2019-02-07 | 2019-02-07 | 이미지 센서용 기판 및 이를 포함하는 카메라 모듈 |
| PCT/KR2020/001704 WO2020162688A1 (fr) | 2019-02-07 | 2020-02-06 | Substrat pour capteur d'image |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113474892A CN113474892A (zh) | 2021-10-01 |
| CN113474892B true CN113474892B (zh) | 2024-04-30 |
Family
ID=71948329
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202080013169.4A Active CN113474892B (zh) | 2019-02-07 | 2020-02-06 | 用于图像传感器的基板 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20220102417A1 (fr) |
| EP (1) | EP3923332A4 (fr) |
| JP (2) | JP7299991B2 (fr) |
| KR (2) | KR20200097086A (fr) |
| CN (1) | CN113474892B (fr) |
| TW (3) | TWI801050B (fr) |
| WO (1) | WO2020162688A1 (fr) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20220109674A (ko) * | 2021-01-29 | 2022-08-05 | 엘지이노텍 주식회사 | 렌즈 구동 장치 및 이를 포함하는 카메라 모듈 |
| JP2022122057A (ja) * | 2021-02-09 | 2022-08-22 | 日本電産サンキョー株式会社 | 光学ユニット |
| EP4084586A1 (fr) * | 2021-04-21 | 2022-11-02 | LG Innotek Co., Ltd. | Carte de circuit, module de capteur d'image, dispositif d'entraînement de lentille et module de caméra les comprenant |
| US20240098348A1 (en) * | 2022-07-21 | 2024-03-21 | Meta Platforms Technologies, Llc | Camera module on flexible interconnect tape |
| TWI827505B (zh) * | 2022-08-03 | 2023-12-21 | 大立光電股份有限公司 | 可移動式電子感光模組、相機模組及電子裝置 |
| WO2024075398A1 (fr) * | 2022-10-06 | 2024-04-11 | ソニーセミコンダクタソリューションズ株式会社 | Module de caméra et dispositif d'imagerie |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101133352A (zh) * | 2005-05-24 | 2008-02-27 | 松下电器产业株式会社 | 摄像机模块 |
| CN102971670A (zh) * | 2011-07-01 | 2013-03-13 | 松下电器产业株式会社 | 摄像装置 |
| CN103649827A (zh) * | 2011-08-12 | 2014-03-19 | 夏普株式会社 | 照相机模块 |
| CN104808416A (zh) * | 2014-01-28 | 2015-07-29 | Lg伊诺特有限公司 | 镜头移动单元和具有镜头移动单元的摄像头模块 |
| CN108351573A (zh) * | 2015-11-16 | 2018-07-31 | 三美电机株式会社 | 透镜驱动装置、摄像机模块及摄像机搭载装置 |
| CN108602663A (zh) * | 2015-11-05 | 2018-09-28 | 麦穆斯驱动有限公司 | Mems致动器组结构 |
| CN108780207A (zh) * | 2016-03-11 | 2018-11-09 | 苹果公司 | 具有用于移动图像传感器的音圈电机的光学图像稳定 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5624529B2 (ja) * | 2011-09-27 | 2014-11-12 | 株式会社東芝 | 手振れ補正装置及び撮像装置 |
| US8817116B2 (en) * | 2011-10-28 | 2014-08-26 | Lg Innotek Co., Ltd. | Camera module |
| JP6135109B2 (ja) * | 2012-12-07 | 2017-05-31 | ソニー株式会社 | 固体撮像素子および固体撮像素子の製造方法ならびに電子機器 |
| KR101504024B1 (ko) * | 2013-08-27 | 2015-03-18 | 삼성전기주식회사 | 렌즈 구동 장치 및 이를 포함하는 카메라 모듈 |
| US9621775B2 (en) * | 2014-05-06 | 2017-04-11 | Mems Drive, Inc. | Electrical bar latching for low stiffness flexure MEMS actuator |
| US10830980B2 (en) * | 2016-01-19 | 2020-11-10 | Lg Innotek Co., Ltd. | Lens driving apparatus, camera module, and optical instrument |
| US11239024B2 (en) * | 2016-10-05 | 2022-02-01 | Lg Innotek Co., Ltd. | Lens moving apparatus, and camera module and optical device comprising same |
| KR102507615B1 (ko) * | 2016-12-16 | 2023-03-09 | 허친슨 테크놀로지 인코포레이티드 | 광학 이미지 안정화 서스펜션에서의 센서 이동 구조 |
| US10863094B2 (en) * | 2017-07-17 | 2020-12-08 | Apple Inc. | Camera with image sensor shifting |
| KR102522700B1 (ko) * | 2019-01-08 | 2023-04-18 | 엘지이노텍 주식회사 | 카메라 모듈 및 이를 포함하는 카메라 장치 |
-
2019
- 2019-02-07 KR KR1020190014398A patent/KR20200097086A/ko not_active Application Discontinuation
-
2020
- 2020-02-06 WO PCT/KR2020/001704 patent/WO2020162688A1/fr unknown
- 2020-02-06 EP EP20752924.9A patent/EP3923332A4/fr active Pending
- 2020-02-06 US US17/426,763 patent/US20220102417A1/en active Pending
- 2020-02-06 JP JP2021546371A patent/JP7299991B2/ja active Active
- 2020-02-06 CN CN202080013169.4A patent/CN113474892B/zh active Active
- 2020-02-07 TW TW110147990A patent/TWI801050B/zh active
- 2020-02-07 TW TW109103933A patent/TWI754214B/zh active
- 2020-02-07 TW TW112100632A patent/TW202321804A/zh unknown
-
2023
- 2023-01-18 JP JP2023005689A patent/JP2023052464A/ja active Pending
- 2023-05-25 KR KR1020230067498A patent/KR20230078623A/ko not_active Application Discontinuation
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101133352A (zh) * | 2005-05-24 | 2008-02-27 | 松下电器产业株式会社 | 摄像机模块 |
| CN102971670A (zh) * | 2011-07-01 | 2013-03-13 | 松下电器产业株式会社 | 摄像装置 |
| CN103649827A (zh) * | 2011-08-12 | 2014-03-19 | 夏普株式会社 | 照相机模块 |
| CN104808416A (zh) * | 2014-01-28 | 2015-07-29 | Lg伊诺特有限公司 | 镜头移动单元和具有镜头移动单元的摄像头模块 |
| CN108602663A (zh) * | 2015-11-05 | 2018-09-28 | 麦穆斯驱动有限公司 | Mems致动器组结构 |
| CN108351573A (zh) * | 2015-11-16 | 2018-07-31 | 三美电机株式会社 | 透镜驱动装置、摄像机模块及摄像机搭载装置 |
| CN108780207A (zh) * | 2016-03-11 | 2018-11-09 | 苹果公司 | 具有用于移动图像传感器的音圈电机的光学图像稳定 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202101104A (zh) | 2021-01-01 |
| EP3923332A1 (fr) | 2021-12-15 |
| JP2022520370A (ja) | 2022-03-30 |
| WO2020162688A1 (fr) | 2020-08-13 |
| KR20230078623A (ko) | 2023-06-02 |
| TW202321804A (zh) | 2023-06-01 |
| CN113474892A (zh) | 2021-10-01 |
| TW202215137A (zh) | 2022-04-16 |
| JP7299991B2 (ja) | 2023-06-28 |
| US20220102417A1 (en) | 2022-03-31 |
| KR20200097086A (ko) | 2020-08-18 |
| EP3923332A4 (fr) | 2022-12-28 |
| TWI754214B (zh) | 2022-02-01 |
| TWI801050B (zh) | 2023-05-01 |
| JP2023052464A (ja) | 2023-04-11 |
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