JP2022520370A - イメージセンサ用基板 - Google Patents
イメージセンサ用基板 Download PDFInfo
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- JP2022520370A JP2022520370A JP2021546371A JP2021546371A JP2022520370A JP 2022520370 A JP2022520370 A JP 2022520370A JP 2021546371 A JP2021546371 A JP 2021546371A JP 2021546371 A JP2021546371 A JP 2021546371A JP 2022520370 A JP2022520370 A JP 2022520370A
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- 238000000034 method Methods 0.000 description 19
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- 239000010936 titanium Substances 0.000 description 10
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 9
- 229910052737 gold Inorganic materials 0.000 description 9
- 229910052759 nickel Inorganic materials 0.000 description 8
- 229910052709 silver Inorganic materials 0.000 description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 7
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- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 5
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- 229910000679 solder Inorganic materials 0.000 description 5
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 5
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
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- 239000004033 plastic Substances 0.000 description 2
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- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
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- 125000006850 spacer group Chemical group 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- 208000036829 Device dislocation Diseases 0.000 description 1
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- 229910008433 SnCU Inorganic materials 0.000 description 1
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- 239000013013 elastic material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920002457 flexible plastic Polymers 0.000 description 1
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- 229910052738 indium Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
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- 238000010295 mobile communication Methods 0.000 description 1
- 239000005304 optical glass Substances 0.000 description 1
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- 239000003755 preservative agent Substances 0.000 description 1
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- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14636—Interconnect structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14634—Assemblies, i.e. Hybrid structures
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Studio Devices (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
Abstract
Description
実施例は、イメージセンサ用基板に関するものであって、特にレンズバレルを中心に相対移動が可能なイメージセンサ用基板およびこれを含むカメラモジュールに関するものである。
Claims (10)
- 絶縁層と、
前記絶縁層上に配置される伝導性パターン部と、を有し、
前記絶縁層は、
第1絶縁部と、
前記第1絶縁部の周囲を囲んで配置され、第1オープン領域を挟んで前記第1絶縁部から離隔する第2絶縁部と、を有し、
前記伝導性パターン部は、
前記第1絶縁部上に配置された第1伝導性パターン部と、
前記第2絶縁部上に配置された第2伝導性パターン部と、
前記第1オープン領域上に配置され、前記第1伝導性パターン部と第2伝導性パターン部とを互いに連結する延長パターン部と、を有し、
前記延長パターン部は、前記第1オープン領域のコーナ領域上に配置される曲げ部分を有する、イメージセンサ用基板。 - 前記第2伝導性パターン部は、前記第2絶縁部の中央を中心にコーナ領域に偏って配置される、請求項1に記載のイメージセンサ用基板。
- 前記第1伝導性パターン部は、前記第1絶縁部の複数の領域上にそれぞれ位置し、
前記第2伝導性パターン部は、前記複数の領域と向かい合う前記第2絶縁部の複数の領域上にそれぞれ位置し、
前記延長パターン部は、前記第1絶縁部の第1領域上に配置された第1伝導性パターン部と前記第2絶縁部の第2領域上に配置された第2伝導性パターン部との間を連結し、
前記第1領域と第2領域とは、互いに向かい合わない、請求項1に記載のイメージセンサ用基板。 - 前記延長パターン部の長さは、互いに向かい合う領域に配置された第1伝導性パターン部と第2伝導性パターン部との間の直線距離よりも大きい、請求項3に記載のイメージセンサ用基板。
- 前記絶縁層は、前記第1オープン領域上に配置された延長絶縁部を有し、
前記延長絶縁部は、前記延長パターン部と垂直方向内で重なる、請求項1に記載のイメージセンサ用基板。 - 前記延長絶縁部の幅は、前記延長パターン部の幅よりも大きい、請求項5に記載のイメージセンサ用基板。
- 前記絶縁層と前記伝導性パターン部との間にボンディングシートを有し、
前記ボンディングシートは、
前記第1絶縁部と前記第1伝導性パターン部との間の第1ボンディング部と、
前記第2絶縁部と前記第2伝導性パターン部との間の第2ボンディング部と、
前記延長絶縁部と前記延長パターン部との間の延長ボンディング部と、を有する、請求項5に記載のイメージセンサ用基板。 - 前記延長パターン部は、
金属層と、
前記金属層上のメッキ層と、を有し、
前記メッキ層は、前記第1オープン領域上に配置された前記延長パターン部の側面および下面を囲んで配置される、請求項1に記載のイメージセンサ用基板。 - 前記絶縁層の下に配置され、前記第1オープン領域と重なる第2オープン領域を有するスプリングプレートを有し、
前記スプリングプレートは、
第1プレート部と、
前記第2オープン領域を挟んで前記第1プレート部と離隔する第2プレート部と、
前記第2オープン領域上に配置され、前記第1プレート部と第2プレート部とを連結する弾性部材と、を有する、請求項1に記載のイメージセンサ用基板。 - 前記第1オープン領域は、
第1オープン部と、
前記コーナ領域を挟んで、前記第1オープン部と連結される第2オープン部と、を有し、
前記延長パターン部は、
前記第1オープン部上に配置されて、前記第1伝導性パターン部と連結される第1部分と、
前記第2オープン部上に配置されて、前記第2伝導性パターン部と連結される第2部分と、を有し、
前記曲げ部分は、前記コーナ領域上で前記第1部分と第2部分とを連結する、請求項1に記載のイメージセンサ用基板。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP2023005689A JP2023052464A (ja) | 2019-02-07 | 2023-01-18 | イメージセンサ用基板 |
Applications Claiming Priority (3)
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KR10-2019-0014398 | 2019-02-07 | ||
KR1020190014398A KR20200097086A (ko) | 2019-02-07 | 2019-02-07 | 이미지 센서용 기판 및 이를 포함하는 카메라 모듈 |
PCT/KR2020/001704 WO2020162688A1 (ko) | 2019-02-07 | 2020-02-06 | 이미지 센서용 기판 |
Related Child Applications (1)
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JP2023005689A Division JP2023052464A (ja) | 2019-02-07 | 2023-01-18 | イメージセンサ用基板 |
Publications (2)
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JP2022520370A true JP2022520370A (ja) | 2022-03-30 |
JP7299991B2 JP7299991B2 (ja) | 2023-06-28 |
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JP2021546371A Active JP7299991B2 (ja) | 2019-02-07 | 2020-02-06 | イメージセンサ用基板 |
JP2023005689A Pending JP2023052464A (ja) | 2019-02-07 | 2023-01-18 | イメージセンサ用基板 |
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JP2023005689A Pending JP2023052464A (ja) | 2019-02-07 | 2023-01-18 | イメージセンサ用基板 |
Country Status (7)
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US (1) | US20220102417A1 (ja) |
EP (1) | EP3923332A4 (ja) |
JP (2) | JP7299991B2 (ja) |
KR (2) | KR20200097086A (ja) |
CN (1) | CN113474892B (ja) |
TW (3) | TW202321804A (ja) |
WO (1) | WO2020162688A1 (ja) |
Cited By (1)
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WO2024075398A1 (ja) * | 2022-10-06 | 2024-04-11 | ソニーセミコンダクタソリューションズ株式会社 | カメラモジュール、および、撮像装置 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20220109674A (ko) * | 2021-01-29 | 2022-08-05 | 엘지이노텍 주식회사 | 렌즈 구동 장치 및 이를 포함하는 카메라 모듈 |
JP2022122057A (ja) * | 2021-02-09 | 2022-08-22 | 日本電産サンキョー株式会社 | 光学ユニット |
JP7471341B2 (ja) * | 2021-04-21 | 2024-04-19 | エルジー イノテック カンパニー リミテッド | 回路基板、イメージセンサーモジュール、レンズ駆動装置、およびこれを含むカメラモジュール |
US20240098348A1 (en) * | 2022-07-21 | 2024-03-21 | Meta Platforms Technologies, Llc | Camera module on flexible interconnect tape |
TWI827505B (zh) * | 2022-08-03 | 2023-12-21 | 大立光電股份有限公司 | 可移動式電子感光模組、相機模組及電子裝置 |
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2020
- 2020-02-06 US US17/426,763 patent/US20220102417A1/en active Pending
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- 2020-02-06 JP JP2021546371A patent/JP7299991B2/ja active Active
- 2020-02-06 CN CN202080013169.4A patent/CN113474892B/zh active Active
- 2020-02-06 WO PCT/KR2020/001704 patent/WO2020162688A1/ko unknown
- 2020-02-07 TW TW112100632A patent/TW202321804A/zh unknown
- 2020-02-07 TW TW110147990A patent/TWI801050B/zh active
- 2020-02-07 TW TW109103933A patent/TWI754214B/zh active
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2023
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JP2023052464A (ja) | 2023-04-11 |
TW202101104A (zh) | 2021-01-01 |
CN113474892B (zh) | 2024-04-30 |
EP3923332A1 (en) | 2021-12-15 |
KR20230078623A (ko) | 2023-06-02 |
US20220102417A1 (en) | 2022-03-31 |
TWI754214B (zh) | 2022-02-01 |
TW202321804A (zh) | 2023-06-01 |
EP3923332A4 (en) | 2022-12-28 |
TWI801050B (zh) | 2023-05-01 |
KR20200097086A (ko) | 2020-08-18 |
CN113474892A (zh) | 2021-10-01 |
WO2020162688A1 (ko) | 2020-08-13 |
JP7299991B2 (ja) | 2023-06-28 |
TW202215137A (zh) | 2022-04-16 |
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