JP2023052464A - イメージセンサ用基板 - Google Patents
イメージセンサ用基板 Download PDFInfo
- Publication number
- JP2023052464A JP2023052464A JP2023005689A JP2023005689A JP2023052464A JP 2023052464 A JP2023052464 A JP 2023052464A JP 2023005689 A JP2023005689 A JP 2023005689A JP 2023005689 A JP2023005689 A JP 2023005689A JP 2023052464 A JP2023052464 A JP 2023052464A
- Authority
- JP
- Japan
- Prior art keywords
- conductive pattern
- insulating
- image sensor
- extended
- pattern portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 130
- 229910052751 metal Inorganic materials 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 17
- 239000010410 layer Substances 0.000 description 212
- 238000009413 insulation Methods 0.000 description 62
- 239000010949 copper Substances 0.000 description 37
- 230000009975 flexible effect Effects 0.000 description 31
- 229910052802 copper Inorganic materials 0.000 description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 19
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 19
- 239000007769 metal material Substances 0.000 description 18
- 239000010931 gold Substances 0.000 description 16
- 230000000052 comparative effect Effects 0.000 description 15
- 230000006870 function Effects 0.000 description 15
- 238000000034 method Methods 0.000 description 15
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 15
- 238000007747 plating Methods 0.000 description 14
- 230000008569 process Effects 0.000 description 14
- 229910002056 binary alloy Inorganic materials 0.000 description 10
- 238000010586 diagram Methods 0.000 description 10
- 229910052718 tin Inorganic materials 0.000 description 10
- 239000010936 titanium Substances 0.000 description 10
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 8
- 229910052737 gold Inorganic materials 0.000 description 8
- 229910052759 nickel Inorganic materials 0.000 description 8
- 229910052709 silver Inorganic materials 0.000 description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 7
- 239000000654 additive Substances 0.000 description 7
- 239000004332 silver Substances 0.000 description 7
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 6
- 230000000903 blocking effect Effects 0.000 description 6
- 238000007667 floating Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 229910002058 ternary alloy Inorganic materials 0.000 description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 5
- 229910052697 platinum Inorganic materials 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 5
- 229910052719 titanium Inorganic materials 0.000 description 5
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000002313 adhesive film Substances 0.000 description 4
- 229910052790 beryllium Inorganic materials 0.000 description 4
- 229910017052 cobalt Inorganic materials 0.000 description 4
- 239000010941 cobalt Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- 239000003522 acrylic cement Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- 239000004713 Cyclic olefin copolymer Substances 0.000 description 2
- 229910001374 Invar Inorganic materials 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- 229910008433 SnCU Inorganic materials 0.000 description 1
- 229910007116 SnPb Inorganic materials 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000005354 aluminosilicate glass Substances 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 229920002457 flexible plastic Polymers 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 239000005304 optical glass Substances 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
- 230000002335 preservative effect Effects 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000006058 strengthened glass Substances 0.000 description 1
- 239000002335 surface treatment layer Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14636—Interconnect structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14634—Assemblies, i.e. Hybrid structures
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Studio Devices (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
- Lens Barrels (AREA)
- Adjustment Of Camera Lenses (AREA)
Abstract
Description
実施例は、イメージセンサ用基板に関するものであって、特にレンズバレルを中心に相対移動が可能なイメージセンサ用基板およびこれを含むカメラモジュールに関するものである。
Claims (10)
- 絶縁層と、
前記絶縁層上に配置される伝導性パターン部と、を有し、
前記絶縁層は、
第1絶縁部と、
前記第1絶縁部の周囲を囲んで配置され、第1オープン領域を挟んで前記第1絶縁部から離隔する第2絶縁部と、を有し、
前記伝導性パターン部は、
前記第1絶縁部上に配置された第1伝導性パターン部と、
前記第2絶縁部上に配置された第2伝導性パターン部と、
前記第1オープン領域上に配置され、前記第1伝導性パターン部と第2伝導性パターン部とを互いに連結する延長パターン部と、を有し、
前記延長パターン部は、前記第1オープン領域のコーナ領域上に配置される曲げ部分を有する、イメージセンサ用基板。 - 前記第2伝導性パターン部は、前記第2絶縁部の中央を中心にコーナ領域に偏って配置される、請求項1に記載のイメージセンサ用基板。
- 前記第1伝導性パターン部は、前記第1絶縁部の複数の領域上にそれぞれ位置し、
前記第2伝導性パターン部は、前記複数の領域と向かい合う前記第2絶縁部の複数の領域上にそれぞれ位置し、
前記延長パターン部は、前記第1絶縁部の第1領域上に配置された第1伝導性パターン部と前記第2絶縁部の第2領域上に配置された第2伝導性パターン部との間を連結し、
前記第1領域と第2領域とは、互いに向かい合わない、請求項1に記載のイメージセンサ用基板。 - 前記延長パターン部の長さは、互いに向かい合う領域に配置された第1伝導性パターン部と第2伝導性パターン部との間の直線距離よりも大きい、請求項3に記載のイメージセンサ用基板。
- 前記絶縁層は、前記第1オープン領域上に配置された延長絶縁部を有し、
前記延長絶縁部は、前記延長パターン部と垂直方向内で重なる、請求項1に記載のイメージセンサ用基板。 - 前記延長絶縁部の幅は、前記延長パターン部の幅よりも大きい、請求項5に記載のイメージセンサ用基板。
- 前記絶縁層と前記伝導性パターン部との間にボンディングシートを有し、
前記ボンディングシートは、
前記第1絶縁部と前記第1伝導性パターン部との間の第1ボンディング部と、
前記第2絶縁部と前記第2伝導性パターン部との間の第2ボンディング部と、
前記延長絶縁部と前記延長パターン部との間の延長ボンディング部と、を有する、請求項5に記載のイメージセンサ用基板。 - 前記延長パターン部は、
金属層と、
前記金属層上のメッキ層と、を有し、
前記メッキ層は、前記第1オープン領域上に配置された前記延長パターン部の側面および下面を囲んで配置される、請求項1に記載のイメージセンサ用基板。 - 前記絶縁層の下に配置され、前記第1オープン領域と重なる第2オープン領域を有するスプリングプレートを有し、
前記スプリングプレートは、
第1プレート部と、
前記第2オープン領域を挟んで前記第1プレート部と離隔する第2プレート部と、
前記第2オープン領域上に配置され、前記第1プレート部と第2プレート部とを連結する弾性部材と、を有する、請求項1に記載のイメージセンサ用基板。 - 前記第1オープン領域は、
第1オープン部と、
前記コーナ領域を挟んで、前記第1オープン部と連結される第2オープン部と、を有し、
前記延長パターン部は、
前記第1オープン部上に配置されて、前記第1伝導性パターン部と連結される第1部分と、
前記第2オープン部上に配置されて、前記第2伝導性パターン部と連結される第2部分と、を有し、
前記曲げ部分は、前記コーナ領域上で前記第1部分と第2部分とを連結する、請求項1に記載のイメージセンサ用基板。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020190014398A KR20200097086A (ko) | 2019-02-07 | 2019-02-07 | 이미지 센서용 기판 및 이를 포함하는 카메라 모듈 |
KR10-2019-0014398 | 2019-02-07 | ||
JP2021546371A JP7299991B2 (ja) | 2019-02-07 | 2020-02-06 | イメージセンサ用基板 |
PCT/KR2020/001704 WO2020162688A1 (ko) | 2019-02-07 | 2020-02-06 | 이미지 센서용 기판 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021546371A Division JP7299991B2 (ja) | 2019-02-07 | 2020-02-06 | イメージセンサ用基板 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2023052464A true JP2023052464A (ja) | 2023-04-11 |
Family
ID=71948329
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021546371A Active JP7299991B2 (ja) | 2019-02-07 | 2020-02-06 | イメージセンサ用基板 |
JP2023005689A Pending JP2023052464A (ja) | 2019-02-07 | 2023-01-18 | イメージセンサ用基板 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021546371A Active JP7299991B2 (ja) | 2019-02-07 | 2020-02-06 | イメージセンサ用基板 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20220102417A1 (ja) |
EP (1) | EP3923332A4 (ja) |
JP (2) | JP7299991B2 (ja) |
KR (2) | KR20200097086A (ja) |
CN (1) | CN113474892B (ja) |
TW (3) | TW202321804A (ja) |
WO (1) | WO2020162688A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20220109674A (ko) * | 2021-01-29 | 2022-08-05 | 엘지이노텍 주식회사 | 렌즈 구동 장치 및 이를 포함하는 카메라 모듈 |
JP2022122057A (ja) * | 2021-02-09 | 2022-08-22 | 日本電産サンキョー株式会社 | 光学ユニット |
EP4084586A1 (en) * | 2021-04-21 | 2022-11-02 | LG Innotek Co., Ltd. | A circuit board, an image sensor module, a lens driving device, and a camera module including the same |
US20240098348A1 (en) * | 2022-07-21 | 2024-03-21 | Meta Platforms Technologies, Llc | Camera module on flexible interconnect tape |
TWI827505B (zh) * | 2022-08-03 | 2023-12-21 | 大立光電股份有限公司 | 可移動式電子感光模組、相機模組及電子裝置 |
WO2024075398A1 (ja) * | 2022-10-06 | 2024-04-11 | ソニーセミコンダクタソリューションズ株式会社 | カメラモジュール、および、撮像装置 |
JP2024085328A (ja) | 2022-12-14 | 2024-06-26 | 日東電工株式会社 | 配線回路基板およびその製造方法 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4174542B2 (ja) * | 2005-05-24 | 2008-11-05 | 松下電器産業株式会社 | カメラモジュール |
JP5221824B1 (ja) * | 2011-07-01 | 2013-06-26 | パナソニック株式会社 | 撮像装置 |
JP5405622B2 (ja) * | 2011-08-12 | 2014-02-05 | シャープ株式会社 | カメラモジュール |
JP5624529B2 (ja) * | 2011-09-27 | 2014-11-12 | 株式会社東芝 | 手振れ補正装置及び撮像装置 |
US8817116B2 (en) * | 2011-10-28 | 2014-08-26 | Lg Innotek Co., Ltd. | Camera module |
JP6135109B2 (ja) * | 2012-12-07 | 2017-05-31 | ソニー株式会社 | 固体撮像素子および固体撮像素子の製造方法ならびに電子機器 |
KR101504024B1 (ko) * | 2013-08-27 | 2015-03-18 | 삼성전기주식회사 | 렌즈 구동 장치 및 이를 포함하는 카메라 모듈 |
EP3260898B1 (en) * | 2014-01-28 | 2021-09-15 | LG Innotek Co., Ltd. | Lens moving unit and camera module having the same |
US9621775B2 (en) * | 2014-05-06 | 2017-04-11 | Mems Drive, Inc. | Electrical bar latching for low stiffness flexure MEMS actuator |
US10516348B2 (en) * | 2015-11-05 | 2019-12-24 | Mems Drive Inc. | MEMS actuator package architecture |
JP6708920B2 (ja) * | 2015-11-16 | 2020-06-10 | ミツミ電機株式会社 | レンズ駆動装置、カメラモジュール及びカメラ搭載装置 |
US10830980B2 (en) * | 2016-01-19 | 2020-11-10 | Lg Innotek Co., Ltd. | Lens driving apparatus, camera module, and optical instrument |
JP6710775B2 (ja) * | 2016-03-11 | 2020-06-17 | アップル インコーポレイテッドApple Inc. | 画像センサを移動させるボイスコイルモータを有する光学画像安定化 |
EP3525040B1 (en) * | 2016-10-05 | 2021-06-02 | LG Innotek Co., Ltd. | Lens driving device, and camera module and optical device comprising same |
KR102507615B1 (ko) | 2016-12-16 | 2023-03-09 | 허친슨 테크놀로지 인코포레이티드 | 광학 이미지 안정화 서스펜션에서의 센서 이동 구조 |
US10863094B2 (en) | 2017-07-17 | 2020-12-08 | Apple Inc. | Camera with image sensor shifting |
KR102522700B1 (ko) * | 2019-01-08 | 2023-04-18 | 엘지이노텍 주식회사 | 카메라 모듈 및 이를 포함하는 카메라 장치 |
-
2019
- 2019-02-07 KR KR1020190014398A patent/KR20200097086A/ko not_active Application Discontinuation
-
2020
- 2020-02-06 US US17/426,763 patent/US20220102417A1/en active Pending
- 2020-02-06 CN CN202080013169.4A patent/CN113474892B/zh active Active
- 2020-02-06 JP JP2021546371A patent/JP7299991B2/ja active Active
- 2020-02-06 WO PCT/KR2020/001704 patent/WO2020162688A1/ko unknown
- 2020-02-06 EP EP20752924.9A patent/EP3923332A4/en active Pending
- 2020-02-07 TW TW112100632A patent/TW202321804A/zh unknown
- 2020-02-07 TW TW109103933A patent/TWI754214B/zh active
- 2020-02-07 TW TW110147990A patent/TWI801050B/zh active
-
2023
- 2023-01-18 JP JP2023005689A patent/JP2023052464A/ja active Pending
- 2023-05-25 KR KR1020230067498A patent/KR20230078623A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
WO2020162688A1 (ko) | 2020-08-13 |
JP7299991B2 (ja) | 2023-06-28 |
TW202215137A (zh) | 2022-04-16 |
JP2022520370A (ja) | 2022-03-30 |
TW202321804A (zh) | 2023-06-01 |
EP3923332A4 (en) | 2022-12-28 |
KR20200097086A (ko) | 2020-08-18 |
TW202101104A (zh) | 2021-01-01 |
EP3923332A1 (en) | 2021-12-15 |
CN113474892B (zh) | 2024-04-30 |
KR20230078623A (ko) | 2023-06-02 |
TWI801050B (zh) | 2023-05-01 |
US20220102417A1 (en) | 2022-03-31 |
TWI754214B (zh) | 2022-02-01 |
CN113474892A (zh) | 2021-10-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR102632558B1 (ko) | 카메라 모듈 및 이를 포함하는 카메라 장치 | |
JP7299991B2 (ja) | イメージセンサ用基板 | |
KR102655831B1 (ko) | 이미지 센서용 기판 및 이를 포함하는 카메라 모듈 | |
US20230209163A1 (en) | Substrate for image sensor | |
JP2023174762A (ja) | イメージセンサー用基板 | |
KR20240026975A (ko) | 이미지 센서용 기판 및 이를 포함하는 카메라 모듈 | |
US20240251149A1 (en) | Camera module and camera apparatus comprising same | |
KR102688063B1 (ko) | 이미지 센서용 기판 및 이를 포함하는 카메라 모듈 | |
KR20240116683A (ko) | 이미지 센서용 기판 및 이를 포함하는 카메라 모듈 | |
CN118398633A (en) | Image sensor substrate |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230118 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20230217 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20240220 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20240520 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240523 |