CN113461424A - 一种防老化的电瓷绝缘子及其制备方法 - Google Patents
一种防老化的电瓷绝缘子及其制备方法 Download PDFInfo
- Publication number
- CN113461424A CN113461424A CN202110802662.0A CN202110802662A CN113461424A CN 113461424 A CN113461424 A CN 113461424A CN 202110802662 A CN202110802662 A CN 202110802662A CN 113461424 A CN113461424 A CN 113461424A
- Authority
- CN
- China
- Prior art keywords
- porcelain
- aging
- following
- porcelain insulator
- coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052573 porcelain Inorganic materials 0.000 title claims abstract description 98
- 230000003712 anti-aging effect Effects 0.000 title claims abstract description 46
- 239000012212 insulator Substances 0.000 title claims abstract description 40
- 238000002360 preparation method Methods 0.000 title claims abstract description 13
- 239000011248 coating agent Substances 0.000 claims abstract description 49
- 238000000576 coating method Methods 0.000 claims abstract description 49
- 238000000197 pyrolysis Methods 0.000 claims abstract description 26
- 239000011159 matrix material Substances 0.000 claims abstract description 21
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 20
- 229920002545 silicone oil Polymers 0.000 claims abstract description 16
- 229920002050 silicone resin Polymers 0.000 claims abstract description 15
- 239000003085 diluting agent Substances 0.000 claims abstract description 9
- 150000001343 alkyl silanes Chemical class 0.000 claims abstract description 8
- 229920005862 polyol Polymers 0.000 claims abstract description 8
- 150000003077 polyols Chemical class 0.000 claims abstract description 8
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 7
- 239000002994 raw material Substances 0.000 claims abstract description 6
- 239000011230 binding agent Substances 0.000 claims abstract description 5
- 239000003960 organic solvent Substances 0.000 claims abstract description 5
- 239000012948 isocyanate Substances 0.000 claims abstract description 3
- 150000002513 isocyanates Chemical class 0.000 claims abstract description 3
- 238000010438 heat treatment Methods 0.000 claims description 28
- 239000000758 substrate Substances 0.000 claims description 26
- 235000015895 biscuits Nutrition 0.000 claims description 18
- 238000006243 chemical reaction Methods 0.000 claims description 17
- 238000001035 drying Methods 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 15
- 239000000843 powder Substances 0.000 claims description 14
- 238000001816 cooling Methods 0.000 claims description 13
- 239000002243 precursor Substances 0.000 claims description 12
- 239000012298 atmosphere Substances 0.000 claims description 10
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 10
- 235000013870 dimethyl polysiloxane Nutrition 0.000 claims description 10
- 238000000227 grinding Methods 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 10
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 10
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical group C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 claims description 9
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 claims description 9
- 238000004132 cross linking Methods 0.000 claims description 8
- 229920001296 polysiloxane Polymers 0.000 claims description 8
- 229910000831 Steel Inorganic materials 0.000 claims description 7
- 239000011261 inert gas Substances 0.000 claims description 7
- 238000007873 sieving Methods 0.000 claims description 7
- 239000010959 steel Substances 0.000 claims description 7
- 238000005303 weighing Methods 0.000 claims description 7
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims description 5
- 238000005470 impregnation Methods 0.000 claims description 3
- 150000005846 sugar alcohols Polymers 0.000 claims description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical group CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 claims description 2
- 239000002253 acid Substances 0.000 claims description 2
- 238000007598 dipping method Methods 0.000 claims description 2
- 150000002148 esters Chemical class 0.000 claims description 2
- 150000002527 isonitriles Chemical class 0.000 claims description 2
- 230000001681 protective effect Effects 0.000 claims description 2
- 239000011347 resin Substances 0.000 abstract description 22
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 21
- 229920005989 resin Polymers 0.000 abstract description 21
- 229910052710 silicon Inorganic materials 0.000 abstract description 21
- 239000010703 silicon Substances 0.000 abstract description 21
- 239000000463 material Substances 0.000 abstract description 16
- 230000032683 aging Effects 0.000 abstract description 7
- 229920001971 elastomer Polymers 0.000 abstract description 7
- 239000000806 elastomer Substances 0.000 abstract description 7
- 230000035882 stress Effects 0.000 abstract description 6
- 239000000919 ceramic Substances 0.000 abstract description 5
- 230000007774 longterm Effects 0.000 abstract description 4
- 239000005416 organic matter Substances 0.000 abstract description 3
- 239000011148 porous material Substances 0.000 abstract description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 10
- 238000012360 testing method Methods 0.000 description 10
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 239000004925 Acrylic resin Substances 0.000 description 5
- 229920000178 Acrylic resin Polymers 0.000 description 5
- 238000011049 filling Methods 0.000 description 5
- 238000009825 accumulation Methods 0.000 description 4
- 238000007865 diluting Methods 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 238000002791 soaking Methods 0.000 description 4
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 4
- 239000002202 Polyethylene glycol Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 229910021419 crystalline silicon Inorganic materials 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 230000018109 developmental process Effects 0.000 description 3
- 239000003344 environmental pollutant Substances 0.000 description 3
- 230000002209 hydrophobic effect Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 231100000719 pollutant Toxicity 0.000 description 3
- -1 polydimethylsiloxane Polymers 0.000 description 3
- 229920001223 polyethylene glycol Polymers 0.000 description 3
- 238000004321 preservation Methods 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 235000019441 ethanol Nutrition 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 125000001165 hydrophobic group Chemical group 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- 229920005906 polyester polyol Polymers 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- KJOIQMXGNUKOLD-UHFFFAOYSA-N 1-[diacetyl(ethenyl)silyl]ethanone Chemical compound CC(=O)[Si](C=C)(C(C)=O)C(C)=O KJOIQMXGNUKOLD-UHFFFAOYSA-N 0.000 description 1
- 239000004971 Cross linker Substances 0.000 description 1
- 229910008051 Si-OH Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910006358 Si—OH Inorganic materials 0.000 description 1
- 238000012644 addition polymerization Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000003373 anti-fouling effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- SCPWMSBAGXEGPW-UHFFFAOYSA-N dodecyl(trimethoxy)silane Chemical compound CCCCCCCCCCCC[Si](OC)(OC)OC SCPWMSBAGXEGPW-UHFFFAOYSA-N 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229920002601 oligoester Polymers 0.000 description 1
- 229920001610 polycaprolactone Polymers 0.000 description 1
- 239000004632 polycaprolactone Substances 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000007086 side reaction Methods 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000010257 thawing Methods 0.000 description 1
- QQQSFSZALRVCSZ-UHFFFAOYSA-N triethoxysilane Chemical compound CCO[SiH](OCC)OCC QQQSFSZALRVCSZ-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
- C04B35/56—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbides or oxycarbides
- C04B35/565—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbides or oxycarbides based on silicon carbide
- C04B35/571—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbides or oxycarbides based on silicon carbide obtained from Si-containing polymer precursors or organosilicon monomers
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
- C04B35/56—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbides or oxycarbides
- C04B35/5603—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbides or oxycarbides with a well-defined oxygen content, e.g. oxycarbides
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/52—Multiple coating or impregnating multiple coating or impregnating with the same composition or with compositions only differing in the concentration of the constituents, is classified as single coating or impregnation
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
- C04B41/81—Coating or impregnation
- C04B41/89—Coating or impregnation for obtaining at least two superposed coatings having different compositions
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B17/00—Insulators or insulating bodies characterised by their form
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B17/00—Insulators or insulating bodies characterised by their form
- H01B17/50—Insulators or insulating bodies characterised by their form with surfaces specially treated for preserving insulating properties, e.g. for protection against moisture, dirt, or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B19/00—Apparatus or processes specially adapted for manufacturing insulators or insulating bodies
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
- C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
- C04B2235/6562—Heating rate
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
- C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
- C04B2235/6567—Treatment time
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Structural Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Insulators (AREA)
Abstract
本发明公开了一种防老化的电瓷绝缘子,属于绝缘子领域,其包括瓷坯基体和位于瓷坯基体上的防老化涂层;所述瓷坯基体包括以下原料:硅树脂、柔性预聚体、有机溶剂、多元醇、异氰酸酯、扩链交联剂;所述防老化涂层包括以下原料:羟基硅油、长链烷基硅烷、粘结剂以及稀释剂。本发明的一种防老化的电瓷绝缘子,通过采用有机硅树脂进行热解,实现有机物陶瓷化,制得瓷坯基体,再在瓷坯基体的孔隙中填入弹性体,该弹性体一方面能够提高材料的机械强度,另一方面经过长期使用后,该弹性体能够阻止瓷坯基体中产生的应力微裂纹的扩展,一定程度上避免了因应力微裂纹而出现“老化”的现象。
Description
技术领域
本发明涉及绝缘子领域,具体涉及一种防老化的电瓷绝缘子及其制备方法。
背景技术
电瓷作为电力工业的重要组成部分,是指用在电压等级超过1000V,广泛用于输配电线路、电器设备和电站中的电瓷材料,是电力工业发展不可缺少的重要绝缘材料。随着经济的快速发展和人民生活水平的不断提高,作为清洁能源的电力需求日益高涨。电瓷产品需求伴随着电力发展也日益高涨,形成巨大市场空间。但是电瓷长期在户外或表恶劣的环境下运行,会逐渐出现绝缘水平下降的老化现象,影响电瓷绝缘子的使用性能,因此,需要对其进行改进。
发明内容
本发明的目的在于至少解决现有技术中存在的技术问题之一,提供一种防老化的电瓷绝缘子及其制备方法。
本发明的技术解决方案如下:
一种防老化的电瓷绝缘子,包括瓷坯基体和位于瓷坯基体上的防老化涂层;
所述瓷坯基体包括以下原料:硅树脂、柔性预聚体、有机溶剂、多元醇、异氰酸酯、扩链交联剂;
所述防老化涂层包括以下原料:羟基硅油、长链烷基硅烷、粘结剂以及稀释剂。
优选地,所述柔性预聚体为PDMS。
优选地,所述扩链交联剂为脂肪族二醇或二醇醚。
本发明还公开了一种防老化的电瓷绝缘子的制备方法:具体包括以下步骤:
步骤一:将硅树脂进行研磨,过筛,得到硅树脂粉;
步骤二:称取硅树脂粉,加入柔性预聚体和有机溶剂,装入钢制模具中,压力成型,得到素坯;
步骤三:将素坯在60-80℃干燥,升温至200-250℃交联3h,固化得到坯体;
步骤四:将坯体进行热解,冷却得到瓷坯基体;
步骤五:将多元醇在100-110℃下真空脱水,冷却至40-50℃,加入异腈酸酯,在70-90℃下保温反应1-3h,得到弹性预聚体,将弹性预聚体加热,加入扩链交联剂形成反应体系,同时将瓷坯基体浸渍在反应体系中;
步骤六:在步骤五处理后的瓷坯基体上涂覆防老化涂层,固化,制得瓷绝缘子。
优选地,所述步骤四中的热解具体方式为:在惰性气体的保护氛围下,在220-700℃下进行第一阶段温度热解,在700-1100℃下进行第二阶段温度热解,在≥1200℃下进行第三阶段温度热解。
优选地,所述步骤五中,浸渍具体为在压力1-5Mpa且在超声氛围下进行。
优选地,所述步骤一中,硅树脂在研磨之前预先在80-110℃下加热0.5-2h。
优选地,所述步骤六具体为:先将羟基硅油和粘结剂,得到混合前驱体溶液,将混合前驱体溶液涂覆在经步骤五处理后的瓷坯基体表面,干燥,将长链烷基硅烷在稀释剂中稀释,得到涂覆液,继续将涂覆液涂覆在干燥后的瓷坯基体表面。
本发明至少具有以下有益效果之一:
(1)本发明的一种防老化的电瓷绝缘子,通过采用有机硅树脂进行热解,实现有机物陶瓷化,制得瓷坯基体,再在瓷坯基体的孔隙中填入弹性体,该弹性体一方面能够提高材料的机械强度,另一方面经过长期使用后,该弹性体能够阻止瓷坯基体中产生的应力微裂纹的扩展,一定程度上提高了应力微裂纹而“老化”的现象。
(2)本发明的一种防老化的电瓷绝缘子,由于在制备瓷坯基体时,在硅树脂中加入柔性预聚体,由于柔性预聚体中含有大量的Si-CH3键,且柔韧性较好,可更加容易地能够突破空间位阻的影响,从而与Si-H键进行反应;以形成更多的Si-C-Si桥键,进而最终的SiOC网络中增加结构C的含量,从而改善产物的力学性能。
(3)本发明的一种防老化的电瓷绝缘子,由于硅树脂中含有大量的Si-OH活性基团,其在40℃时会软化,产生熔融流动,且在104℃以上发生缩聚交联,随着温度升高,加聚形成Si-C-C-Si新键,说明预固化硅树脂已经交联形成交联网络,通过对硅树脂进行预固化的过程中,一方面会释放出大量水蒸气和其他气体,另一方面使其主链增长,粘度降低,更符合Arrhenius方程的进行。
(4)本发明的一种防老化的电瓷绝缘子,通过防老化涂层中加入羟基硅油,由于羟基硅油上含有的羟基,长链烷基硅烷与羟基反应,使得其上的疏水基团朝外,具有瓷绝缘子表面较优异的疏水性能。
附图说明
图1是本发明实施例的结构示意图;
图中,100-瓷坯基体,200-防老化涂层。
具体实施方式
下面结合实例对本发明作进一步的详细说明。
需要说明的是,PDMS为聚二甲基硅氧烷。
以下份数按照重量份数计算。
硅树脂可以是RSN-6018,RSN-217,MQ102和VMQ101的一种或混合物。以下具体实施例中的硅树脂采用型号为RSN-6018。
多元醇优选采用聚酯多元醇,具体把羧酸与二元醇加入反应器中熔融,通入氮气,于150℃左右反应生成水,逐步蒸出,釜内生成低聚酯混合物。随水分的蒸出,釜内温度逐渐升高,在170~230℃下,真空度逐步降到500Pa,将过量的二元醇和少量副反应产物与反应生成的残留水一起蒸出,得到聚酯多元醇,可以自制,也可以市购,以下实施例采用市购的湖南聚仁化工新材料有限公司生产的聚己内酯多元醇,PCL-2000系列。
实施例1
一种防老化的电瓷绝缘子,包括瓷坯基体100和位于瓷坯基体100上的防老化涂层200;
其制备方法具体为:将硅树脂进行研磨,过60目筛,得到硅树脂粉;称取100份硅树脂粉,加入23份PDMS和500份丙酮溶液,装入钢制模具中,压力成型,得到素坯;将素坯在60℃干燥,升温至200℃交联3h,固化得到坯体;将坯体在惰性气体的保护氛围下,在220-700℃下进行第一阶段温度热解,升温速率为2℃/min,在700℃保温10min,在700-1100℃下进行第二阶段温度热解,升温速率为6℃/min,在1100℃保温5min,在≥1200℃下进行第三阶段温度热解,升温速率为4℃/min,在1300℃保温3min;冷却得到瓷坯基体;将多元醇在100℃下真空脱水,冷却至40℃,加入甲苯二异氰酸酯,在70℃下保温反应1h,得到弹性预聚体,将弹性预聚体加热,加入聚丁二醇形成反应体系,同时将瓷坯基体浸渍在反应体系中;在处理后的瓷坯基体上涂覆防老化涂层,固化,制得瓷绝缘子,具体地,先将10份羟基硅油和50份丙烯酸树脂混合,得到混合前驱体溶液,将混合前驱体溶液涂覆在经步骤五处理后的瓷坯基体表面,干燥,将3份十二烷基三甲氧基硅烷在稀释剂(无水乙醇)中稀释100倍,得到涂覆液,继续将涂覆液涂覆在干燥后的瓷坯基体表面。
实施例2
一种防老化的电瓷绝缘子,包括瓷坯基体100和位于瓷坯基体100上的防老化涂层200;
其制备方法具体为:将硅树脂进行研磨,过60目筛,得到硅树脂粉;称取100份硅树脂粉,加入23份PDMS和500份丙酮溶液,装入钢制模具中,压力成型,得到素坯;将素坯在70℃干燥,升温至250℃交联3h,固化得到坯体;将坯体在惰性气体的保护氛围下,在220-700℃下进行第一阶段温度热解,升温速率为2℃/min,在700℃保温10min,在700-1100℃下进行第二阶段温度热解,升温速率为6℃/min,在1100℃保温10min,在≥1200℃下进行第三阶段温度热解,升温速率为4℃/min,在1300℃保温2min;冷却得到瓷坯基体;将多元醇在110℃下真空脱水,冷却至50℃,加入甲苯二异氰酸酯,在90℃下保温反应3h,得到弹性预聚体,将弹性预聚体加热,加入聚乙二醇醚形成反应体系,同时将瓷坯基体浸渍在反应体系中;在处理后的瓷坯基体上涂覆防老化涂层,固化,制得瓷绝缘子,具体地,先将10份羟基硅油和50份丙烯酸树脂溶液混合,得到混合前驱体溶液,将混合前驱体溶液涂覆在经步骤五处理后的瓷坯基体表面,干燥,将3份丁二烯基三乙氧基硅烷在稀释剂(无水乙醇)中稀释100倍,得到涂覆液,继续将涂覆液涂覆在干燥后的瓷坯基体表面。
实施例3
一种防老化的电瓷绝缘子,包括瓷坯基体100和位于瓷坯基体100上的防老化涂层200;
其制备方法具体为:将硅树脂进行研磨,过60目筛,得到硅树脂粉;称取100份硅树脂粉,加入23份PDMS和500份丙酮溶液,装入钢制模具中,压力成型,得到素坯;将素坯在70℃干燥,升温至200-250℃交联3h,固化得到坯体;将坯体在惰性气体的保护氛围下,在220-700℃下进行第一阶段温度热解,升温速率为2℃/min,在700℃保温10min,在700-1100℃下进行第二阶段温度热解,升温速率为6℃/min,在1100℃保温5min,在≥1200℃下进行第三阶段温度热解,升温速率为4℃/min,在1300℃保温4min;冷却得到瓷坯基体;将多元醇在110℃下真空脱水,冷却至45℃,加入甲苯二异氰酸酯,在80℃下保温反应2h,得到弹性预聚体,将弹性预聚体加热,加入扩链交联剂(聚乙二醇醚)形成反应体系,同时将瓷坯基体浸渍在反应体系中;在处理后的瓷坯基体上涂覆防老化涂层,固化,制得瓷绝缘子,具体地,先将10份羟基硅油和50份丙烯酸树脂混合,得到混合前驱体溶液,将混合前驱体溶液涂覆在经步骤五处理后的瓷坯基体表面,干燥,将4份乙烯基三乙酰基硅烷在稀释剂(无水乙醇)中稀释100倍,得到涂覆液,继续将涂覆液涂覆在干燥后的瓷坯基体表面。
实施例4
本实施例是在实施例2的基础上作出的变化,具体是所述步骤五中,浸渍具体为在压力3Mpa且在超声氛围下进行。
实施例5
本实施例是在实施例4的基础上作出的变化,具体是所述步骤一中,硅树脂在研磨之前预先在80℃下加热1h。
对比例1(无弹性体)
一种防老化的电瓷绝缘子,包括瓷坯基体100和位于瓷坯基体100上的防老化涂层200;
其制备方法具体为:将硅树脂进行研磨,过60目筛,得到硅树脂粉;称取100份硅树脂粉,加入加入23份PDMS和500份丙酮溶液,装入钢制模具中,压力成型,得到素坯;将素坯在70℃干燥,升温至250℃交联3h,固化得到坯体;将坯体在惰性气体的保护氛围下,在220-700℃下进行第一阶段温度热解,升温速率为2℃/min,在700℃保温10min,在700-1100℃下进行第二阶段温度热解,升温速率为6℃/min,在1100℃保温5min,在≥1200℃下进行第三阶段温度热解,升温速率为4℃/min,在1300℃保温3min;冷却得到瓷坯基体;在瓷坯基体上涂覆防老化涂层,固化,制得瓷绝缘子,具体地,先将10份羟基硅油和50份丙烯酸树脂溶液混合,得到混合前驱体溶液,将混合前驱体溶液涂覆在经步骤五处理后的瓷坯基体表面,干燥,将3份长链烷基硅烷在稀释剂(无水乙醇)中稀释100倍,得到涂覆液,继续将涂覆液涂覆在干燥后的瓷坯基体表面。
对比例2(无添加羟基硅油)
一种防老化的电瓷绝缘子,其制备方法具体为:将硅树脂进行研磨,过60目筛,得到硅树脂粉;称取100份硅树脂粉,加入23份PDMS和500份丙酮溶液,装入钢制模具中,压力成型,得到素坯;将素坯在70℃干燥,升温至250℃交联3h,固化得到坯体;将坯体在惰性气体的保护氛围下,在220-700℃下进行第一阶段温度热解,升温速率为2℃/min,在700℃保温10min,在700-1100℃下进行第二阶段温度热解,升温速率为6℃/min,在1100℃保温5min,在≥1200℃下进行第三阶段温度热解,升温速率为4℃/min,在1300℃保温3min;冷却得到瓷坯基体;将多元醇在110℃下真空脱水,冷却至50℃,加入甲苯二异氰酸酯,在90℃下保温反应3h,得到弹性预聚体,将弹性预聚体加热,加入聚乙二醇醚形成反应体系,同时将瓷坯基体浸渍在反应体系中,反应完成后,清理表面,在瓷坯基体上涂覆防老化涂层,固化,制得瓷绝缘子,具体地,将50份丙烯酸树脂溶液涂覆在经步骤五处理后的瓷坯基体表面,干燥。
对比例3
本对比例是在实施例2的基础上作出的变化,具体是步骤二中没有添加PDMS,其他没有变化。
将实施例以及对比例的绝缘子进行以下性能测试,测试结果见表1。
试验1:将试样在-50℃-40℃的条件下反复冻融30次,观察试样是否有裂纹;
试验2:人工模拟积污:国家电网特高压交流试验基地人工积污试验系统进行实验,具体采用50μm的氯化钠和硅藻土模拟污物,淋雨率:1.0mm/min,淋雨10min;人工喷雾15min,干燥60min,在该环境下运行5d,观察试样表面的积污情况;
试验3:将试样进行100h的电晕老化试验后采用接触角测试仪对其测量憎水性接触角,电晕老化实验条件:在3.5kv下对试样进行100h的电晕老化试验。
试验4:抗弯强度采用抗弯试验机测试,断裂韧性采用单边切口梁法(SENB)法测试。
表1实施例及对比例的陶瓷绝缘子的性能测试值;
从上表可以看出,实施例的性能优于对比例,通过对比例1的分析可知,实施例中通过采用有机硅树脂进行热解,实现有机物陶瓷化,制得瓷坯基体,再在瓷坯基体的孔隙中填入弹性体,该弹性体一方面能够提高材料的抗弯强度,另一方面经过长期使用后,该弹性体能够阻止瓷坯基体中产生的应力微裂纹的扩展,一定程度上提高了应力微裂纹而“老化”的现象;通过对比例2的分析可知,通过防老化涂层中加入羟基硅油,由于羟基硅油上含有的羟基,长链烷基硅烷与羟基反应,使得其上的疏水基团朝外,具有瓷绝缘子表面较优异的疏水性能,从而具有防污防积水性能;通过对比例3的分析可知,实施例中采用,在硅树脂中加入柔性预聚体,由于柔性预聚体中含有大量的Si-CH3键,且柔韧性较好,可更加容易地能够突破空间位阻的影响,从而与Si-H键进行反应;以形成更多的Si-C-Si桥键,进而最终的SiOC网络中增加结构C的含量,从而改善产物的力学性能。
其中施例5的性能较优,主要的原因可能是实施例5中采用了通过对硅树脂进行预固化的过程中,一方面会释放出大量水蒸气和其他气体,另一方面使其主链增长,粘度降低,更符合Arrhenius方程的进行。
在不出现冲突的前提下,本领域技术人员可以将上述附加技术特征自由组合以及叠加使用。
在本发明的实施例的描述中,需要理解的是,“-”和“~”表示的是两个数值之同的范围,并且该范围包括端点。例如:“A-B”表示大于或等于A,且小于或等于B的范围。“A~B”表示大于或等于A,且小于或等于B的范围。
在本发明的实施例的描述中,本文中术语“和/或”,仅仅是一种描述关联对象的关联关系,表示可以存在三种关系,例如,A和/或B,可以表示:单独存在A,同时存在A和B,单独存在B这三种情况。另外,本文中字符“/”,一般表示前后关联对象是一种“或”的关系。
以上所述仅为本发明的优先实施方式,只要以基本相同手段实现本发明目的的技术方案都属于本发明的保护范围之内。
Claims (8)
1.一种防老化的电瓷绝缘子,其特征在于:包括瓷坯基体(100)和位于瓷坯基体(100)上的防老化涂层(200);
所述瓷坯基体包括以下原料:硅树脂、柔性预聚体、有机溶剂、多元醇、异氰酸酯、扩链交联剂;
所述防老化涂层包括以下原料:羟基硅油、长链烷基硅烷、粘结剂以及稀释剂。
2.根据权利要求1所述的一种防老化的电瓷绝缘子,其特征在于:所述柔性预聚体为PDMS。
3.根据权利要求1所述的一种防老化的电瓷绝缘子,其特征在于:所述扩链交联剂为脂肪族二醇或二醇醚。
4.一种防老化的电瓷绝缘子的制备方法,其特征在于:包括以下步骤:
步骤一:将硅树脂进行研磨,过筛,得到硅树脂粉;
步骤二:称取硅树脂粉,加入柔性预聚体和有机溶剂,装入钢制模具中,压力成型,得到素坯;
步骤三:将素坯在60-80℃干燥,升温至200-250℃交联3h,固化得到坯体;
步骤四:将坯体进行热解,冷却得到瓷坯基体;
步骤五:将多元醇在100-110℃下真空脱水,冷却至40-50℃,加入异腈酸酯,在70-90℃下保温反应1-3h,得到弹性预聚体,将弹性预聚体加热,加入扩链交联剂形成反应体系,同时将瓷坯基体浸渍在反应体系中;
步骤六:在步骤五处理后的瓷坯基体上涂覆防老化涂层,固化,制得瓷绝缘子。
5.根据权利要求4所述的一种防老化的电瓷绝缘子的制备方法,其特征在于:所述步骤四中的热解具体方式为:在惰性气体的保护氛围下,在220-700℃下进行第一阶段温度热解,在700-1100℃下进行第二阶段温度热解,在≥1200℃下进行第三阶段温度热解。
6.根据权利要求4所述的一种防老化的电瓷绝缘子的制备方法,其特征在于:所述步骤五中,浸渍具体为在压力1-5Mpa且在超声氛围下进行。
7.根据权利要求4所述的一种防老化的电瓷绝缘子的制备方法,其特征在于:所述步骤一中,硅树脂在研磨之前预先在80-110℃下加热0.5-2h。
8.根据权利要求4所述的一种防老化的电瓷绝缘子的制备方法,其特征在于:所述步骤六具体为:先将羟基硅油和粘结剂混合,得到混合前驱体溶液,将混合前驱体溶液涂覆在经步骤五处理后的瓷坯基体表面,干燥,将长链烷基硅烷在稀释剂中稀释,得到涂覆液,继续将涂覆液涂覆在干燥后的瓷坯基体表面。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110802662.0A CN113461424A (zh) | 2021-07-15 | 2021-07-15 | 一种防老化的电瓷绝缘子及其制备方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110802662.0A CN113461424A (zh) | 2021-07-15 | 2021-07-15 | 一种防老化的电瓷绝缘子及其制备方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN113461424A true CN113461424A (zh) | 2021-10-01 |
Family
ID=77880663
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202110802662.0A Pending CN113461424A (zh) | 2021-07-15 | 2021-07-15 | 一种防老化的电瓷绝缘子及其制备方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN113461424A (zh) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102311275A (zh) * | 2011-08-01 | 2012-01-11 | 中国人民解放军国防科学技术大学 | 一种SiOC多孔陶瓷的制备方法 |
CN102504523A (zh) * | 2011-11-03 | 2012-06-20 | 中国电力科学研究院 | 一种高韧性聚氨酯复合绝缘子芯棒及其制备方法 |
CN105694472A (zh) * | 2016-04-26 | 2016-06-22 | 赵勇 | 一种耐湿热老化绝缘子料及其制作方法 |
CN112661471A (zh) * | 2020-12-30 | 2021-04-16 | 苏州爱建电瓷有限公司 | 一种高压线路用高强度柱式电瓷绝缘子及其制作工艺 |
-
2021
- 2021-07-15 CN CN202110802662.0A patent/CN113461424A/zh active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102311275A (zh) * | 2011-08-01 | 2012-01-11 | 中国人民解放军国防科学技术大学 | 一种SiOC多孔陶瓷的制备方法 |
CN102504523A (zh) * | 2011-11-03 | 2012-06-20 | 中国电力科学研究院 | 一种高韧性聚氨酯复合绝缘子芯棒及其制备方法 |
CN105694472A (zh) * | 2016-04-26 | 2016-06-22 | 赵勇 | 一种耐湿热老化绝缘子料及其制作方法 |
CN112661471A (zh) * | 2020-12-30 | 2021-04-16 | 苏州爱建电瓷有限公司 | 一种高压线路用高强度柱式电瓷绝缘子及其制作工艺 |
Non-Patent Citations (5)
Title |
---|
张奇: "《燃烧与爆炸基础兵器科学与技术》", 30 November 2007 * |
杨洋: "一种绝缘子超疏水防覆冰涂层的制备及研究", 《电瓷避雷器》 * |
章基凯: "《有机硅材料》", 31 October 1999 * |
郭庆中: "烷基对有机硅防水剂性能的影响", 《化工新型材料》 * |
黄文润: "《硅烷偶联剂及硅树脂》", 31 August 2010 * |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN105623503A (zh) | 一种用于绝缘子的硅橡胶疏水涂层及其制备方法 | |
CN111057465A (zh) | 一种室温固化的绝缘涂覆材料及其制备方法 | |
CN110982480B (zh) | 单组分阻燃型耐高温硅酮密封胶及其制备方法 | |
CN111423728A (zh) | 一种隔热复合材料及其制备方法 | |
CN114539917B (zh) | 一种自修复防污闪rtv涂料及其制备方法 | |
CN113278361A (zh) | 一种应用于高压输电线的高耐压、长效稳定型绝缘涂料及其制备方法 | |
CN110563991B (zh) | 一种硅橡胶抗电磁干扰绝缘布及其制备方法 | |
CN114316897A (zh) | 一种硅酮密封胶及其制备方法 | |
CN113461424A (zh) | 一种防老化的电瓷绝缘子及其制备方法 | |
CN116396695A (zh) | 一种用于电缆绕包填充的高防护云母复合材料及其制备方法 | |
CN110218454B (zh) | 一种耐漏电起痕的室温硫化液体硅橡胶及其制备方法 | |
CN115820201A (zh) | 一种紫外光-湿气双固化胶及制备方法 | |
CN109054728B (zh) | 一种铜排绝缘护套用液体硅橡胶浸渍液及其浸渍加工工艺 | |
CN112280314B (zh) | 利用磷系阻燃剂改性的含氢硅油制备有机硅泡沫的方法 | |
RU2231844C2 (ru) | Способ гидрозащиты высоковольтных опорных изоляторов | |
CN110540829B (zh) | 一种电子产品用的硅酮密封胶及其制备方法 | |
CN112538331A (zh) | 有机无机杂化改性ms密封胶的制备及其应用 | |
Wang et al. | The Influence of Water Permeation on the Chalking of HTV Silicone Rubber Composites | |
CN116285674B (zh) | 一种电缆线路包覆专用防覆冰本征阻燃绝缘硅酮涂料 | |
CN116102976B (zh) | 一种电缆线路包覆专用防覆冰阻燃绝缘硅涂料 | |
CN114854211A (zh) | 一种机械增强有机硅凝胶及其制备方法 | |
CN112225853A (zh) | 一种高耐热硅凝胶及其制备方法 | |
CN118085583A (zh) | 一种本征型自修复有机硅材料及其制备方法和用途 | |
CN117532973A (zh) | 一种单组份室温快速自固化绝缘包材及其制备方法 | |
CN1407041A (zh) | 高电压绝缘物涂料的合成物及其配制方法和应用 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20211001 |