CN113437010A - Robot and semiconductor processing apparatus - Google Patents
Robot and semiconductor processing apparatus Download PDFInfo
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- CN113437010A CN113437010A CN202110608342.1A CN202110608342A CN113437010A CN 113437010 A CN113437010 A CN 113437010A CN 202110608342 A CN202110608342 A CN 202110608342A CN 113437010 A CN113437010 A CN 113437010A
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- 238000012545 processing Methods 0.000 title claims abstract description 13
- 239000004065 semiconductor Substances 0.000 title claims abstract description 11
- 238000001179 sorption measurement Methods 0.000 claims description 85
- 238000007664 blowing Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 14
- 230000008569 process Effects 0.000 abstract description 13
- 239000000126 substance Substances 0.000 abstract 1
- 239000006227 byproduct Substances 0.000 description 22
- 238000010521 absorption reaction Methods 0.000 description 9
- 238000000605 extraction Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
- B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manipulator (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The application discloses manipulator and semiconductor processing equipment, the disclosed manipulator include support arm (100) and adsorb piece (200), support arm (100) with adsorb piece (200) fixed linking to each other, adsorb piece (200) and seted up the negative pressure and adsorb the hole, adsorb the outside edge of piece (200) and seted up convex opening (211), convex opening (211) are located the both sides that adsorb piece (200) carried on the back respectively with support arm (100). The technical scheme that this application adopted can solve among the background art the manipulator more easily with the accessory substance that the process chamber produced in the course of working attached to treating the machined part, finally lead to treating the not good problem of quality of machined part.
Description
Technical Field
The application relates to the technical field of semiconductor processing technology, in particular to a manipulator and semiconductor processing equipment.
Background
In the related art, a semiconductor processing apparatus conveys a workpiece to be processed by a robot. In a specific working process, the mechanical arm can transfer the workpiece to be processed from the bearing cavity to the process cavity, so that the workpiece to be processed is processed in the process cavity. Because the process chamber can generate byproducts in the process of processing, the manipulator is easy to be stained with the byproducts when taking out the processed workpiece to be processed from the process chamber. This results in that the next time the robot picks up the workpiece to be machined from the load-bearing chamber and transports it to the process chamber, these by-products adhere to the unprocessed workpiece to be machined, which leads to problems in the quality of the workpiece to be machined during the machining in the process chamber. Through detection, the common problem is that the workpiece to be processed has a polycrystal phenomenon, and finally the quality of the workpiece to be processed is poor.
Disclosure of Invention
The embodiment of the application aims to disclose a manipulator and semiconductor processing equipment, and aims to solve the problem that the manipulator in the related art is easy to attach a by-product generated in a process chamber in a processing process to a workpiece to be processed, and finally causes the poor quality of the workpiece to be processed.
In order to solve the technical problem, the following technical scheme is adopted in the application:
in a first aspect, the embodiment of the application provides a manipulator, the disclosed manipulator includes the support arm and adsorbs the piece, the support arm with it is fixed continuous to adsorb the piece, adsorb the piece and seted up the negative pressure and adsorb the hole, the outside edge that adsorbs the piece has seted up convex opening, convex opening with the support arm is located respectively adsorb the both sides that the piece carried on the back mutually.
In a second aspect, embodiments of the present application provide a semiconductor processing apparatus comprising a robot as described in any of the above.
The technical scheme adopted by the application can achieve the following beneficial effects:
the manipulator disclosed in the embodiment of the application improves the structure of the manipulator in the correlation technique, and the circular arc opening is arranged in the region which is distributed back to back with the supporting arm on the adsorption piece, so that the phenomenon that byproducts are easy to appear in the region where the circular arc opening is arranged can be alleviated, the condition that the manipulator causes the workpiece to be processed to be infected with the byproducts can be indirectly alleviated, the byproducts to be processed are less, the influence of the byproducts on the quality of the workpiece to be processed can be alleviated, and the quality of the workpiece to be processed can be improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments or the background art of the present application, the drawings needed to be used in the description of the embodiments or the background art will be briefly described below, and it is obvious for those skilled in the art to obtain other drawings without any inventive exercise.
Fig. 1 is a top view of a robot disclosed in an embodiment of the present application.
Description of reference numerals:
100-a support arm;
200-adsorption piece, 210-outer ring adsorption area, 211-circular arc opening, 212-first adsorption hole, 220-inner ring adsorption area, 221-second adsorption hole and 230-connecting hole.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions of the present application will be described in detail and completely with reference to the following specific embodiments of the present application and the accompanying drawings. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Technical solutions disclosed in the embodiments of the present application are described in detail below with reference to the accompanying drawings.
Referring to fig. 1, the present embodiment discloses a robot and a semiconductor processing apparatus, and the disclosed robot includes a support arm 100 and a suction member 200.
The support arm 100 is a support structure of the robot and is capable of supporting the suction unit 200, and the suction unit 200 is a main functional structure of the robot and is capable of picking up a processed workpiece to be processed, such as a wafer, by the support function of the support arm 100. The support arm 100 is fixedly connected with the suction member 200, so that the connection relationship between the support arm 100 and the suction member 200 is stable, and the support arm 100 can stably support the suction member 200.
The adsorption piece 200 is provided with a negative pressure adsorption hole, and the pressure in the negative pressure adsorption hole is negative pressure, so that when the negative pressure adsorption hole is close to a to-be-picked workpiece, the to-be-picked workpiece can be adsorbed to the adsorption piece 200 to realize the picking function of the manipulator. The outer edge of the adsorbing member 200 is provided with a circular arc-shaped opening 211, and the circular arc-shaped opening 211 and the supporting arm 100 are respectively positioned at two sides of the adsorbing member 200 which are opposite to each other. One side of the adsorption piece 200 opposite to the support arm 100 is opposite to the reference edge, in related experiments, the area opposite to the reference edge is an area with more byproducts, and the circular-arc-shaped opening 211 is formed in the area opposite to the reference edge, so that more byproducts can be prevented from being generated in the area opposite to the reference edge, and the manipulator can pollute the workpiece to be processed when picking up the workpiece to be processed.
The manipulator disclosed in the embodiment of the application improves the structure of the manipulator in the related art, and the adsorption part 200 is provided with the arc-shaped opening 211 in the region which is distributed opposite to the support arm 100, so that the phenomenon that byproducts easily appear in the region opposite to the reference edge provided with the arc-shaped opening 211 can be relieved, the situation that the manipulator causes the workpiece to be processed to be contaminated with the byproducts can be indirectly relieved, the byproducts contaminated by the workpiece to be processed are less, the influence of the byproducts on the quality of the workpiece to be processed can be relieved, and the quality of the workpiece to be processed can be improved.
In the manipulator disclosed in the embodiment of the present application, the center of the circular arc-shaped opening 211 may coincide with the center of the adsorbing member 200, so that the circle formed by the radius of the circular arc-shaped opening 211 and the circle formed by the radius of the adsorption piece 200 can be concentric circles, so that the circular arc-shaped opening 211 can be easily opened on the adsorption piece 200, thereby simplifying the production of the circular arc-shaped notch 211 in the manipulator, and it was found in the related experiments that the by-products of the workpiece are more concentrated in the area within an angle range opposite to the reference edge, in this case, the central angle of the circular arc-shaped cutout 211 may be greater than or equal to 60 °, and less than or equal to 120 °, so that the area in which the byproducts are concentrated can be cut off, thereby forming the circular arc-shaped gap 211, and further reducing the area of the mechanical arm where byproducts are concentrated to reduce the pollution of the byproducts on the workpiece to be processed.
Meanwhile, the opening of the arc-shaped notch 211 on the adsorbing part 200 is to cut off part of the structure on the adsorbing part 200, so that the weight of the adsorbing part 200 can be reduced, the supporting arm 100 is helpful for supporting the adsorbing part 200 more stably, the sag of the manipulator when moving, placing and taking the workpiece to be machined can be improved, and the phenomenon that the workpiece to be machined is contaminated by-products due to uneven stress when the manipulator moves, places and takes the workpiece to be machined under relatively uneven conditions can be avoided.
In a further technical solution, the center line of the circular arc-shaped notch 211 along the radial direction of the suction member 200 may be a first center line, the center line of the support arm 100 along the radial direction of the suction member 200 may be a second center line, and the first center line and the second center line are collinear and both pass through the center of the suction member 200. In this case, the center line of the circular arc-shaped notch 211 coincides with the center line of the support arm 100, that is, the circular arc-shaped notch 211 and the support arm 100 are symmetrically disposed in the robot hand, so that the support of the suction tool 200 by the support arm 100 can be balanced. Optionally, the whole adsorbing element 200 and the supporting arm 100 may be axisymmetric structures, so that the supporting arm 100 can uniformly support the whole structure of the adsorbing element 200, and thus, in the process of the operation of the manipulator, the adsorbing element 200 can be favorably adsorbed by the negative pressure of the workpiece to be processed through the negative pressure adsorbing hole.
In the robot disclosed in the embodiment of the present application, the suction member 200 may include an inner ring suction region 220 and an outer ring suction region 210, the inner ring suction region 220 and the outer ring suction region 210 are coaxially disposed, and the inner ring suction region 220 is located within the outer ring suction region 210. In this case, the suction member 200 has different suction regions, which are specifically divided into an inner ring suction region 220 and an outer ring suction region 210, and the outer ring suction region 210 is disposed around the inner ring suction region 220.
In an optional scheme, the circular arc-shaped opening 211 may be opened on an edge of the outer ring adsorption region 210 facing away from the inner ring adsorption region 220, and the negative pressure adsorption hole is opened on at least one of the inner ring adsorption region 220 and the outer ring adsorption region 210, specifically, the negative pressure adsorption hole may be opened in the inner ring adsorption region 220, and under the condition that the inner ring adsorption region 220 is recessed in the outer ring adsorption region 210, the inner ring adsorption region 220 in the adsorption member 200 may form a negative pressure cavity, and a relatively balanced pressure value in the negative pressure cavity may facilitate the adsorption member 200 to stably pick up a workpiece to be processed, so as to avoid contamination caused by unstable contact between the adsorption member 200 and the workpiece to be processed, and improve the usability of the manipulator. Of course, the negative pressure adsorption hole may also be provided on the outer ring adsorption area 210, or the negative pressure adsorption hole may be provided on the inner ring adsorption area 220 and the outer ring adsorption area 210 at the same time, and the specific position where the negative pressure adsorption hole is provided is not limited in this embodiment of the application.
In a further embodiment, the negative pressure suction holes may include a plurality of first suction holes 212 and a plurality of second suction holes 221, the plurality of first suction holes 212 are spaced apart from each other in the outer ring suction region 210, and the plurality of second suction holes 221 are spaced apart from each other in the inner ring suction region 220. Under the condition, the negative pressure adsorption holes are formed in the inner ring adsorption area 220 and the outer ring adsorption area 210, so that the larger area on the adsorption piece 200 can realize the negative pressure adsorption function, and meanwhile, the interval arrangement of the first adsorption holes 212 and the second adsorption holes 221 can be beneficial to quickly forming a negative pressure cavity in the inner ring adsorption area 220, so that the starting efficiency of the adsorption piece 200 for picking up the workpiece to be processed can be improved.
In another alternative scheme, the plurality of second adsorption holes 221 may include a strip-shaped hole and a plurality of circular holes, the strip-shaped hole is disposed inside the circular arc-shaped opening 211, and the plurality of second adsorption holes 221 are distributed at intervals along the circumferential direction of the inner ring adsorption area 220. Under this kind of condition, the through-flow area in the round hole is great for the bar hole, promptly at the same time, the gaseous flow that passes through in the bar hole can be bigger than the gaseous flow that passes through in the round hole for the bar hole can promote the start-up efficiency when adsorbing the piece 200 and picking up the work piece of treating further. Simultaneously, can set up the bar hole into the hole that can adjust the air flow size for the staff can adjust the size of the air flow that can pass through the bar hole according to actual demand, is used for adapting to the different demands of picking up of machined part are treated to absorption piece 200.
In the robot hand disclosed in the embodiment of the present application, the plurality of first suction holes 212 may include a first group of first suction holes 212 and a second group of first suction holes 212, and the first group of first suction holes 212 and the second group of first suction holes 212 are symmetrically disposed on a connection line passing through the center of the circular arc-shaped opening 211 and the center of the circle of the suction piece 200. In this case, the first group of first suction holes 212 and the second group of first suction holes 212 are symmetrically disposed on two sides of the circular arc-shaped opening 211, that is, the first group of first suction holes 212 and the second group of first suction holes 212 are symmetrically disposed on the suction member 200, so that the picking function of the suction member 200 on the workpiece to be processed can be balanced, and the supporting function of the support arm 100 on the suction member 200 can also be balanced.
In a further technical solution, the first group of first absorption holes 212 may be distributed in a preset shape, the first group of first absorption holes 212 distributed in the preset shape may be relatively concentrated to a point, and the distance between the first group of first absorption holes 212 and the center of the absorption piece 200 may not be equal, so that the first group of first absorption holes 212 may perform an absorption function on the to-be-processed piece in multiple directions, and the to-be-processed piece may receive absorption forces from different directions, and thus the absorption piece 200 may realize stability in absorbing the to-be-processed piece in a low flow negative pressure.
In an optional scheme, the preset shape may be multiple, and generally, for the first group of first adsorption holes 212 to be symmetrical and concentrated, the preset shape may be a W shape, a V shape, or an S shape, and the like, and such a preset shape can avoid a slip phenomenon caused by uneven stress on the workpiece to be processed to some extent, thereby reducing the possibility that the manipulator is contaminated with byproducts in the process of repeatedly picking up the workpiece to be processed. The embodiment of the present application does not limit the specific shape of the preset shape.
In the robot hand disclosed in the embodiment of the present application, the distance between each of the first group of first suction holes 212 and the second group of first suction holes 212 and the circular arc-shaped notch 211 may be a first distance, the distance between each of the first group of first suction holes 212 and the second group of first suction holes 212 and the support arm 100 may be a second distance, the first distance is the distance between the center of the first group of first suction holes 212 and the center of the second group of first suction holes 212 and the center of the support arm 100, and the second distance is the distance between the center of the first group of first suction holes 212 and the center of the second group of first suction holes 212 and the center of the support arm 100.
In an optional scheme, the first distance may be smaller than the second distance, under such a condition, the first group of first adsorption holes 212 and the second group of first adsorption holes 212 are formed at positions relatively close to the circular arc opening 211, and since the area on the adsorption piece 200 where the circular arc opening 211 is formed cannot be provided with negative pressure adsorption holes, a phenomenon that the workpiece to be processed is not uniformly picked up may occur on the adsorption piece 200, and the arrangement of the first group of first adsorption holes 212 and the second group of first adsorption holes 212 close to the circular arc opening 211 can alleviate the problem that the area where the circular arc opening 211 is formed cannot be provided with negative pressure adsorption holes to a certain extent, so that the adsorption piece 200 treats the workpiece to be non-uniformly picked up.
In the manipulator disclosed in the embodiment of the present application, the size of the circular arc-shaped notch 211 in the radial direction of the suction member 200 may be a first size, and the size of the outer ring suction region 210 in the radial direction of the suction member 200 may be a second size, where the first size is smaller than the second size. Under the condition, the partial edge of the outer ring adsorption area 210 is provided with the circular arc-shaped opening 211, namely, only the area with more concentrated byproducts is cut off, so that the integrity of the adsorption piece 200 can be ensured to a greater extent, the circular arc-shaped opening 211 is not contacted with the inner ring adsorption area 220, the inner ring adsorption area 220 is complete, and then the negative pressure adsorption hole is formed in the inner ring adsorption area 220 to ensure that the adsorption piece 200 can realize the function.
In the manipulator disclosed in the embodiment of the present application, connecting hole 230 can be seted up on the surface of adsorption part 200 negative pressure adsorption hole dorsad, connecting hole 230 and negative pressure adsorption hole intercommunication, the manipulator can also include negative pressure gas extraction pipeline and positive pressure gas supply pipeline, the gas pressure in the negative pressure gas extraction pipeline is less than atmospheric pressure, the gas pressure in the positive pressure gas supply pipeline can be higher than atmospheric pressure, negative pressure gas extraction pipeline and positive pressure gas supply pipeline all are connected with connecting hole 230 for can be negative pressure environment in connecting hole 230, also can be positive pressure environment.
Specifically, the manipulator may have different states, and when the manipulator is in the first state, the manipulator is in a working state, the negative pressure air exhaust pipeline is communicated with the connection hole 230, and the positive pressure air supply pipeline is blocked from the connection hole 230, and the negative pressure air exhaust pipeline is used for exhausting air from the connection hole 230; at this time, a negative pressure environment is formed in the connection hole 230, and the negative pressure suction hole can be communicated with the negative pressure suction pipeline through the connection hole 230 to realize the negative pressure environment on the surface of the suction member 200, so that the manipulator can realize the negative pressure pickup of the workpiece to be processed. And under the condition that the manipulator is in the second state, after the manipulator finishes working for a long time, or before the manipulator starts, the negative pressure air exhaust pipeline is blocked from the connecting hole 230, the positive pressure air supply pipeline is communicated with the connecting hole 230, and the positive pressure air supply pipeline is used for blowing air to the connecting hole 230, at this time, the negative pressure adsorption hole can be communicated with the positive pressure air supply pipeline through the connecting hole 230, so that the negative pressure adsorption hole in the adsorption piece 200 can be purged by gas with higher pressure, thereby realizing the cleaning function of the adsorption piece 200, and further avoiding the pollution of the original by-product on the adsorption piece 200 to the subsequently picked workpiece to be processed.
Based on the manipulator, the embodiment of the application also discloses semiconductor processing equipment, and the manipulator is the manipulator in any one of the above.
In the embodiments of the present application, the difference between the embodiments is described in detail, and different optimization features between the embodiments can be combined to form a better embodiment as long as the differences are not contradictory, and further description is omitted here in view of brevity of the text.
The above description is only an example of the present application and is not intended to limit the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.
Claims (13)
1. The utility model provides a manipulator, its characterized in that, includes support arm (100) and adsorbs piece (200), support arm (100) with adsorb piece (200) fixed linking to each other, adsorb piece (200) and seted up the negative pressure and adsorb the hole, the outside edge that adsorbs piece (200) has seted up circular arc opening (211), circular arc opening (211) with support arm (100) are located respectively adsorb the both sides that piece (200) carried on the back mutually.
2. The manipulator according to claim 1, wherein the center of the circular arc-shaped notch (211) coincides with the center of the suction member (200), and the central angle of the circular arc-shaped notch (211) is greater than or equal to 60 ° and less than or equal to 120 °.
3. The manipulator according to claim 2, wherein the center line of the circular arc-shaped notch (211) along the radial direction of the suction member (200) is a first center line, the center line of the support arm (100) along the radial direction of the suction member (200) is a second center line, and the first center line and the second center line are collinear and both pass through the center of the suction member (200).
4. The mechanical hand according to claim 1, wherein the adsorption member (200) comprises an inner ring adsorption region (220) and an outer ring adsorption region (210), the inner ring adsorption region (220) and the outer ring adsorption region (210) are coaxially arranged, the inner ring adsorption region (220) is located within the outer ring adsorption region (210), the circular arc-shaped opening (211) is opened on an edge of the outer ring adsorption region (210) facing away from the inner ring adsorption region (220), the negative pressure adsorption hole is opened on at least one of the inner ring adsorption region (220) and the outer ring adsorption region (210), and the inner ring adsorption region (220) is recessed in the outer ring adsorption region (210).
5. The robot hand according to claim 4, wherein the negative pressure suction holes include a plurality of first suction holes (212) and a plurality of second suction holes (221), the plurality of first suction holes (212) are disposed at intervals in the outer ring suction region (210), and the plurality of second suction holes (221) are disposed at intervals in the inner ring suction region (220).
6. The mechanical hand according to claim 5, wherein the plurality of second suction holes (221) comprise a strip-shaped hole and a plurality of round holes, the strip-shaped hole is arranged on the inner side of the circular arc-shaped notch (211), and the round holes are distributed at intervals along the circumferential direction of the inner ring suction region (220).
7. The robot hand according to claim 5, wherein the plurality of first suction holes (212) include a first group of first suction holes (212) and a second group of first suction holes (212), and the first group of first suction holes (212) and the second group of first suction holes (212) are symmetrically arranged with a line passing through a center of the circular arc-shaped cutout (211) and a center of the circle of the suction member (200).
8. The manipulator according to claim 7, characterized in that the first set of first suction holes (212) are distributed in a predetermined shape, and the first set of first suction holes (212) are not all equidistant from the center of the suction member (200).
9. The manipulator according to claim 8, wherein the preset shape is a W-shape, a V-shape, or an S-shape.
10. The manipulator according to claim 7, wherein the first group of first suction holes (212) and the second group of first suction holes (212) are both at a first distance from the circular arc-shaped notch (211), the first group of first suction holes (212) and the second group of first suction holes (212) are both at a second distance from the support arm (100), and the first distance is smaller than the second distance.
11. The manipulator according to claim 4, wherein the circular arc-shaped notch (211) has a first dimension in a radial direction of the suction member (200), and the outer ring suction region (210) has a second dimension in the radial direction of the suction member (200), and the first dimension is smaller than the second dimension.
12. The mechanical hand according to claim 1, wherein a connecting hole (230) is formed in a surface of the suction member (200) facing away from the negative pressure suction hole, the connecting hole (230) is communicated with the negative pressure suction hole, the mechanical hand further comprises a negative pressure air exhaust pipeline and a positive pressure air supply pipeline, the negative pressure air exhaust pipeline and the positive pressure air supply pipeline are both connected with the connecting hole (230), wherein:
under the condition that the manipulator is in a first state, the negative pressure air exhaust pipeline is communicated with the connecting hole (230), the positive pressure air supply pipeline is blocked from the connecting hole (230), and the negative pressure air exhaust pipeline is used for exhausting air from the connecting hole (230);
under the condition that the manipulator is in the second state, the negative pressure air exhaust pipeline is blocked from the connecting hole (230), the positive pressure air supply pipeline is communicated with the connecting hole (230), and the positive pressure air supply pipeline is used for blowing air to the connecting hole (230).
13. A semiconductor processing apparatus, characterized by comprising the robot of any one of claims 1 to 12.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110608342.1A CN113437010B (en) | 2021-06-01 | 2021-06-01 | Manipulator and semiconductor processing equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110608342.1A CN113437010B (en) | 2021-06-01 | 2021-06-01 | Manipulator and semiconductor processing equipment |
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| Publication Number | Publication Date |
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| CN113437010A true CN113437010A (en) | 2021-09-24 |
| CN113437010B CN113437010B (en) | 2024-05-17 |
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| CN202110608342.1A Active CN113437010B (en) | 2021-06-01 | 2021-06-01 | Manipulator and semiconductor processing equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115229832A (en) * | 2022-09-02 | 2022-10-25 | 中国电子科技集团公司第二十六研究所 | Scratch-proof vacuum adsorption type wafer taking and placing device and manufacturing method thereof |
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| CN115229832A (en) * | 2022-09-02 | 2022-10-25 | 中国电子科技集团公司第二十六研究所 | Scratch-proof vacuum adsorption type wafer taking and placing device and manufacturing method thereof |
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| CN113437010B (en) | 2024-05-17 |
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