CN218769465U - Jig and jig assembly for wafer thinning and wafer moving - Google Patents
Jig and jig assembly for wafer thinning and wafer moving Download PDFInfo
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- CN218769465U CN218769465U CN202223020581.4U CN202223020581U CN218769465U CN 218769465 U CN218769465 U CN 218769465U CN 202223020581 U CN202223020581 U CN 202223020581U CN 218769465 U CN218769465 U CN 218769465U
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Abstract
The utility model discloses a tool and tool subassembly that is used for wafer attenuate back to move piece. The tool includes: the wafer support is used for bearing a wafer and comprises an adapter part and a wafer support main body part, wherein the adapter part is fixedly arranged at one end of the wafer support main body part along a first direction, the wafer support main body part is provided with a first surface and a second surface which are oppositely arranged along a second direction, a vacuum flow channel is arranged in the wafer support, the first surface of the wafer support main body part is provided with at least one adsorption hole, the adsorption hole is communicated with the vacuum flow channel, and the wafer can be detachably fixed on the first surface in a vacuum adsorption mode; the operation handle, the operation handle with the switching portion detachably fixed connection of piece support, the piece support can with operation handle separation is changed. Adopt the utility model provides a wafer is carried out to tool moves piece before the wafer washs, can reduce lobe of a leaf risk, reduction in production cost and improve the purpose of production efficiency and yield.
Description
Technical Field
The utility model particularly relates to a tool and tool subassembly that is used for wafer attenuate back to move piece belongs to wafer transfer carrier technical field.
Background
After the wafer is thinned and polished, the wafer needs to be moved back to a chuck box for batch cleaning. Due to the thin thickness of the wafer. When an operator manually moves the sheet using the tweezers, the sheet is very likely to be cracked and chipped, which leads to an increase in production cost and a decrease in production efficiency.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a main aim at provides a tool and tool subassembly that is used for wafer attenuate backward movement piece, mainly used carries out the wafer and washs the preceding in-process of waiting and moves the piece to overcome not enough among the prior art.
In order to realize the purpose of the utility model, the utility model adopts the technical scheme that includes:
the utility model provides a tool that is used for wafer attenuate backward movement piece, include:
the wafer support is used for bearing a wafer and comprises an adapter part and a wafer support main body part, wherein the adapter part is fixedly arranged at one end of the wafer support main body part along a first direction, the wafer support main body part is provided with a first surface and a second surface which are oppositely arranged along a second direction, a vacuum flow channel is arranged in the wafer support and can be connected with a vacuum generating mechanism, the first surface of the wafer support main body part is provided with at least one adsorption hole, the adsorption hole is communicated with the vacuum flow channel, the wafer can be detachably fixed on the first surface in a vacuum adsorption mode, and the second direction is crossed with the first direction;
the operation handle, the operation handle with the switching portion detachably fixed connection of piece support, the piece support can with the operation handle separation is changed.
The utility model also provides a tool subassembly that is used for wafer attenuate backward movement piece, include a tool that is used for wafer attenuate backward movement piece, and, the tool subassembly includes that a plurality of pieces hold in the palm, the structure and the size of the connecting portion that a plurality of pieces held in the palm are the same, and the piece that a plurality of pieces held in the palm holds in the palm the structure of main part the same and the size is different, and the piece that a plurality of pieces held in the palm holds in the palm the main part and is used for placing not unidimensional wafer respectively.
Compared with the prior art, the utility model has the advantages that:
1) The utility model provides a jig for wafer thinning and wafer moving, which has simple structure and replaceable wafer support, thereby each jig can be matched and used for transferring wafers with various sizes;
2) The utility model provides a tool for wafer moving after wafer attenuate adsorbs the wafer on piece support surface through vacuum adsorption's mode, simultaneously, in the plane direction that the surface of piece support is located, can place location and spacing to the wafer through setting up the arc spacing face that matches with the peripheral profile of wafer, can guarantee to place accurately when moving the piece and hold in the palm the surface at the piece to and guarantee that the wafer can not drop;
3) Adopt the utility model provides a pair of a tool that is used for wafer attenuate back to move piece carries out the piece that moves before the wafer washs, can reduce lobe of a leaf risk, reduction in production cost and improve the purpose of production efficiency and yield.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the description below are only some embodiments described in the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic structural diagram of a jig for wafer thinning and wafer moving in accordance with embodiment 1 of the present invention;
fig. 2 is a side view of a jig for wafer thinning and wafer moving-back provided in embodiment 1 of the present invention;
fig. 3 is a schematic view of an internal structure of a wafer holder of a jig for wafer thinning and wafer moving back provided in embodiment 1 of the present invention;
fig. 4 is a top view of a wafer holder of a jig for wafer thinning and wafer moving back provided in embodiment 1 of the present invention;
fig. 5 is a side view of a wafer holder of a jig for wafer thinning and wafer moving back provided in embodiment 1 of the present invention;
fig. 6 is a side view of a wafer holder of a jig for wafer thinning and wafer moving back provided in embodiment 2 of the present invention.
Detailed Description
In view of the deficiencies in the prior art, the inventor of the present invention has been keenly studied and practiced in a large number of times to provide the technical solution of the present invention. The technical solution, its implementation and principles, etc. will be further explained as follows.
The utility model provides a tool that is used for wafer attenuate backward movement piece, include:
the wafer support is used for bearing a wafer and comprises an adapter part and a wafer support main body part, wherein the adapter part is fixedly arranged at one end of the wafer support main body part along a first direction, the wafer support main body part is provided with a first surface and a second surface which are oppositely arranged along a second direction, a vacuum flow channel is arranged in the wafer support and can be connected with a vacuum generating mechanism, the first surface of the wafer support main body part is provided with at least one adsorption hole, the adsorption hole is communicated with the vacuum flow channel, the wafer can be detachably fixed on the first surface in a vacuum adsorption mode, and the second direction is crossed with the first direction;
the operation handle, the operation handle with the switching portion detachably fixed connection of piece support, the piece support can with operation handle separation is changed.
Further, the jig for wafer thinning and wafer moving further comprises: and the conversion connecting assembly is fixedly connected with the operating handle and detachably and fixedly connected with the switching part of the sheet support.
Further, conversion coupling assembling includes an at least conversion connecting block and an at least threaded connection spare, all be provided with on the connecting portion that conversion connecting block and piece held in the palm with threaded connection spare assorted connecting hole, threaded connection spare is coaxial to be set up in the connecting hole on the connecting portion that conversion connecting block and piece held in the palm and with connecting portion threaded connection.
Furthermore, the connecting holes in the connecting parts of the conversion connecting block and the sheet support are threaded holes matched with the threaded connecting pieces.
Further, the operating handle is provided on a side facing the first surface of the sheet holder main body portion in the second direction.
Furthermore, the sheet support main body part is provided with a first end and a second end which are oppositely arranged along a first direction, the first end is fixedly connected with the connecting part, an avoiding inclined plane is further arranged in an area, close to the second end, of a second surface of the sheet support main body part, and the thickness between the avoiding inclined plane and the first surface is gradually reduced along the direction of the second end.
Further, the first surface is a rectangular surface, the first surface includes a first region and a second region which are sequentially away from the connection portion along a first direction, the second region and the first region have a height difference in a second direction, the adsorption hole is disposed in the second region,
the whole second area is used as a single wafer placing surface, the area of the second area is smaller than that of a wafer to be placed, an arc-shaped limiting side surface is further arranged between the first area and the second area, the limiting side surface is perpendicular to the wafer placing surface, the width of the limiting side surface in a third direction is the same as that of the first surface, the curvature radius of the limiting side surface is equal to that of the wafer placed on the wafer placing surface, and the third direction is perpendicular to the first direction.
Further, the first surface is a rectangular surface, the first surface comprises a first area and a second area which are sequentially far away from the connecting part along the first direction,
the second area is provided with a plurality of wafer placing surfaces which are sequentially far away from the first area along the first direction, the wafer placing surfaces, the first area and two adjacent wafer placing surfaces have height differences in the second direction, arc-shaped limiting side surfaces are formed between the wafer placing surfaces and the first area and between the two adjacent wafer placing surfaces, the limiting side surfaces are perpendicular to the wafer placing surfaces, the width of each limiting side surface in the third direction is the same as that of the first surface, the curvature radius of each limiting side surface is equal to the radius of a wafer placed on the corresponding wafer placing surface, and the third direction is perpendicular to the first direction.
Furthermore, a plurality of adsorption holes are formed in the wafer placing surface, and the adsorption holes are arranged at intervals along the circumferential direction of the wafer placing surface.
Further, the area of the wafer placing surface is smaller than the area of the wafer placed on the wafer placing surface.
Furthermore, the second area is further provided with an avoidance notch, and the wafer placing surface is arranged around the avoidance notch.
Furthermore, the avoiding gap is communicated with the second end of the wafer support main body part, the wafer placing surface is a non-closed annular surface, and the wafer support main body part is of a non-closed annular structure.
The utility model also provides a tool subassembly that is used for wafer attenuate backward movement piece, include a tool that is used for wafer attenuate backward movement piece, and, the tool subassembly includes that a plurality of pieces hold in the palm, the structure and the size of the connecting portion that a plurality of pieces held in the palm are the same, and the piece that a plurality of pieces held in the palm holds in the palm the structure of main part the same and the size is different, and the piece that a plurality of pieces held in the palm holds in the palm the main part and is used for placing not unidimensional wafer respectively.
As will be described in further detail with reference to the accompanying drawings and specific embodiments, it should be noted that the embodiments of the present invention are intended to explain and explain the structural configuration of the jig for wafer thinning back-moving piece, and unless otherwise specified, the material, size, processing technology, etc. of the components of the jig for wafer thinning back-moving piece are not specifically limited herein, and those skilled in the art can select and adjust the jig according to specific requirements.
Example 1
Referring to fig. 1-5, a jig for wafer thinning and wafer moving is mainly used for wafer moving of wafers with a thickness of 100 micrometers to 200 micrometers, and the jig for wafer thinning and wafer moving comprises a wafer support 100 and an operating handle 200, wherein the operating handle 200 is fixedly connected with the wafer support 100 through a conversion connecting component, wherein the wafer support 100 is used for placing and fixing wafers, and at least the conversion connecting component and the wafer support 100 are fixedly connected through a detachable fixed connecting structure, so that the wafer support 100 can be replaced and used for transferring wafers with different sizes.
In this embodiment, the wafer holder 100 includes a interposer 120 and a wafer holder main body 110, the interposer 120 is fixedly disposed at one end of the wafer holder main body 110 along a first direction, the wafer holder main body 110 is used for placing and fixing a wafer, and the connecting portion 120 is fixedly connected to the conversion connection assembly.
In this embodiment, the sheet holder main body portion 110 and the connecting portion 120 are both of a rectangular parallelepiped structure, the first direction may be a length direction of the sheet holder main body portion 110, in a third direction, a width of the connecting portion 120 is smaller than a width of the sheet holder main body portion 110, and the third direction is a width direction of the sheet holder main body portion 110.
In this embodiment, the conversion connection assembly is detachably and fixedly connected to the switching portion 120 of the operating handle 200 and the sheet holder 100, the conversion connection assembly includes two connection holes 310 formed at the conversion connection block 300 and the plurality of threaded connection members at intervals along the third direction, the connection portions 120 of the conversion connection block 300 and the sheet holder 100 and the operating handle 200 are both provided with connection holes 310 matched with the threaded connection members, the threaded connection members are coaxially disposed in the connection holes 310 of the connection portions 120 of the conversion connection block 300 and the sheet holder 100 and are in threaded connection with the connection portions 120, and the connection structure and the connection mode of the conversion connection block 300 and the operating handle 200 are the same as those of the connection portions 120 of the conversion connection block 300 and the sheet holder 100, that is, the replacement of the sheet holder 100 can be realized by detaching the threaded connection members. It is understood that the connection portion 120 of the conversion connection block 300 and the plate holder 100 and the connection hole 310 of the operation handle 200 are threaded holes matched with the threaded connection members.
In this embodiment, referring to fig. 1, fig. 3 and fig. 4 again, the sheet holder main body 110 has a first surface 1010 and a second surface 1020 oppositely arranged along a second direction, the sheet holder 100 is internally provided with a vacuum flow channel 111, the vacuum flow channel 111 can be connected to a vacuum generating mechanism, the first surface 1010 of the sheet holder main body 110 is provided with a plurality of suction holes 112, the suction holes 112 are communicated with the vacuum flow channel 111, a wafer can be detachably fixed on the first surface 1010 by vacuum suction, the second direction is perpendicular to the first direction, and specifically, the second direction may be a thickness direction of the sheet holder main body 110.
In this embodiment, the plurality of suction holes 112 are sequentially spaced along the circumferential direction of the first surface, so that the suction areas of the wafer are distributed more uniformly, and the stability of suction fixing of the wafer can be improved.
In this embodiment, one or more vacuum flow channels 111 may be provided, and it is understood that one vacuum flow channel may be simultaneously communicated with a plurality of suction holes, or a plurality of vacuum flow channels 111 may be respectively communicated with a plurality of suction holes, where the number, arrangement, layout, and the like of the vacuum flow channels and the suction holes may be set according to specific requirements, and the vacuum flow channels may be provided only inside the sheet holder main body portion 110, or may be provided inside the sheet holder main body portion 110 and the connecting portion 120 at the same time.
In this embodiment, the gas port of the vacuum flow channel 111 is disposed on the connecting portion 120, and a gas pipe connector 400 is further fixedly disposed at the gas port of the vacuum flow channel 111, the gas pipe connector 400 is used for connecting with a gas pipe of a vacuum generating mechanism, wherein the vacuum generating mechanism may be a vacuum pump, etc., and the gas pipe may further be provided with a mechanical foot valve, and the mechanical foot valve is controlled to open and close a vacuum gas flow loop formed between the vacuum generating mechanism and the vacuum flow channel, so as to enable the wafer to be adsorbed and fixed on the first surface of the wafer holder main body portion 110, or to release the adsorption of the wafer, so as to enable the wafer on the first surface of the wafer holder main body portion 110 to be transferred.
It should be noted that, when the vacuum flow channel in the sheet holder main body portion 110 is formed by a subsequent punching process, a hole communicating with the vacuum flow channel may exist on a side surface thereof, and at this time, a plug needs to be disposed at the corresponding hole to plug the hole, and only one required hole is reserved as a connection hole with the vacuum generating mechanism; of course, this is just a possible problem that can be overcome with certain specific fabrication processes, and is not present when using processes such as 3D printing and other fabrication processes.
In this embodiment, the width of the wafer holder main body 110 is smaller than the diameter of the wafer that can be placed on the first surface 1010, that is, when the wafer is placed and fixed on the first surface 1010, at least a portion of the peripheral portion of the wafer extends out of the wafer holder main body 110 without contacting with the first surface, which not only reduces the volume of the wafer holder and the manufacturing cost, but also makes it easier for the wafer to be grabbed again and transferred and for the wafer to be separated because the edge of the wafer extends out of the wafer holder.
In an embodiment, the first surface 1010 is a rectangular surface, the first surface 1010 includes a first region 1011 and a second region 1012 which are sequentially away from the connecting portion 120 along the first direction, the second region 1012 is a region where the wafer is placed and fixed, the suction hole 112 is disposed in the second region 1012, and the second region 1012 and the first region 1011 have a height difference in the second direction, that is, the second region 1012 and the first region 1011 form a step structure, the connection between the second region 1012 and the first region 1011 is a limit side 1013 perpendicular to the second region 1012 and the first region 1011, and a peripheral edge of the wafer placed in the second region 1012 can contact with the limit side 1013, so that the limit side 1013 also serves as a limit surface or a limit structure of the wafer placed in the second region 1012 in the plane direction of the second region.
It is understood that the second region 1012 may be formed by recessing a portion of the first surface 1010 along the second direction.
In an embodiment, the second region 1012 is entirely used as a single wafer placing surface or placing region, the area of the second region 1012 is smaller than the area of the wafer to be placed, and the limiting side surface 1013 is a circular arc surface having a radius of curvature equal to the radius of the wafer placed on the wafer placing surface, that is, the peripheral side surface of the wafer placed on the second region 1012 can be attached to the limiting side surface 1013.
In this embodiment, the second region 1012 is further provided with an avoiding gap 113, the wafer placing surface is disposed around the avoiding gap 113, correspondingly, the plurality of adsorbing holes 112 are also disposed around the avoiding gap 113, and the avoiding gap 113 is further communicated with the peripheral side surface of the wafer holder main body portion 110, that is, the wafer holder main body portion 110 is a non-closed annular structure, the wafer placing surface is a non-closed annular surface, and by disposing the avoiding gap 113, the wafer holder 100 can be kept away from an original bearing mechanism for placing a wafer, the wafer holder is directly disposed at the bottom of the wafer, and the wafer placing surface of the wafer holder is in contact with the wafer from bottom to top and is fixed on the wafer placing surface, so that the wafer is fixed and transferred.
In this embodiment, the sheet holder main body portion 110 has a first end and a second end that are oppositely disposed along a first direction, the first end is fixedly connected to the connecting portion 120, the second end serves as a front end far away from the connecting portion 120, the avoiding notch 113 is communicated with a peripheral side surface (which can be understood as a second end surface) located at the second end of the sheet holder main body portion 110, and during a specific operation, the second end of the sheet holder main body portion 110 serves as a front end.
In this embodiment, an area of the second surface 1020 of the sheet holder main body portion 110 near the second end further has an avoidance slope 1021, a thickness between the avoidance slope 1021 and the first surface 1010 gradually decreases along a direction toward the second end, the second end serves as a front end of the sheet holder main body portion 110, a portion of the second surface of the front end of the sheet holder main body portion 110 is set as an inclined plane, when the sheet holder is placed at the bottom of a wafer for transfer, contact with a structure in an original mechanism for carrying the wafer or blocking of the sheet holder by the structure in the original mechanism can be avoided, and similarly, when the wafer on the sheet holder is placed on a new carrying mechanism, the avoidance slope 1021 also has a similar avoidance function; illustratively, the angle between the escape ramp and the first surface is acute, and may be, for example, 20 to 30 °, preferably 25 °.
In this embodiment, the jig for wafer thinning backward movement sheet provided in this embodiment may further be combined to form a jig assembly for wafer thinning backward movement sheet, the jig assembly includes a plurality of sheet holders 100, the connecting portions 120 of the plurality of sheet holders 100 have the same structure and size, so that the plurality of sheet holders can be fixedly matched with the same operating handle through a conversion connecting block 300, wherein the plurality of sheet holders have the same structure and different sizes, and the plurality of sheet holders can be respectively used for placing and fixing wafers with different sizes, that is, the plurality of sheet holders respectively have second regions with different sizes; for example, the plurality of wafer holders are matched with 4 inch, 6 inch and 8 inch wafers respectively.
Example 2
The structure of a jig for wafer thinning and wafer moving in this embodiment is basically the same as that in embodiment 1, and the same parts are not described again, but the difference between them lies in:
referring to fig. 6, in the present embodiment, the second area 1012 has a plurality of wafer placing surfaces sequentially far away from the first area 1011 along the first direction, the wafer placing surfaces and the first area 1011 as well as two adjacent wafer placing surfaces have height differences in the second direction, a circular arc-shaped limiting side surface 1013 is formed between the wafer placing surfaces and the first area 1011 as well as between two adjacent wafer placing surfaces, the limiting side surface 1013 is perpendicular to the wafer placing surfaces, the width of the limiting side surface 1013 in the third direction is the same as the width of the first surface 1010, and the radius of curvature of the limiting side surface 1013 is equal to the radius of a wafer placed on the wafer placing surface corresponding to the limiting side surface 1013.
It is understood that the first surface 1010 of the sheet holder main body portion 110 has a plurality of step structures sequentially arranged along a first direction, and the step structures are formed by a plurality of regions of the first surface 1010 being gradually recessed along a second direction; for example, the second area may be provided with three wafer placing surfaces, which may be used for placing 8 inch, 6 inch and 4 inch wafers, respectively.
The utility model provides a tool for wafer thinning back wafer moving, simple structure, each tool can be matched and used for the transfer of wafers of various sizes, or the wafer support of the tool can be changed, thereby adapting the transfer of wafers of different sizes; and, the utility model provides a pair of a tool that is used for wafer attenuate back to move piece adsorbs the wafer at piece support surface through vacuum adsorption's mode, simultaneously, on the plane direction at the surface place that the piece held in the palm, can place the location and spacing to the wafer through setting up the spacing face of arc that matches with the peripheral profile of wafer, can be accurate when guaranteeing to move the piece place at piece support surface to and guarantee that the wafer can not drop. Additionally, adopt the utility model provides a pair of a tool that is used for wafer attenuate back to move piece carries out the piece that moves before the wafer washs, can reduce the purpose of lobe of a leaf risk, reduction in production cost and improvement production efficiency and yield.
It should be understood that the above-mentioned embodiments are merely illustrative of the technical concepts and features of the invention, and the purpose of the present invention is to provide those skilled in the art with the understanding of the content of the present invention and the implementation thereof, and therefore, the protection scope of the present invention should not be limited thereby. All equivalent changes and modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.
Claims (10)
1. The utility model provides a tool that is used for wafer attenuate back to move piece which characterized in that includes:
the wafer support is used for bearing a wafer and comprises an adapter part and a wafer support main body part, wherein the adapter part is fixedly arranged at one end of the wafer support main body part along a first direction, the wafer support main body part is provided with a first surface and a second surface which are oppositely arranged along a second direction, a vacuum flow channel is arranged in the wafer support and can be connected with a vacuum generating mechanism, the first surface of the wafer support main body part is provided with at least one adsorption hole, the adsorption hole is communicated with the vacuum flow channel, the wafer can be detachably fixed on the first surface in a vacuum adsorption mode, and the second direction is crossed with the first direction;
the operation handle, the operation handle with the switching portion detachably fixed connection of piece support, the piece support can with operation handle separation is changed.
2. The jig for wafer thinning back wafer as claimed in claim 1, further comprising: and the conversion connecting assembly is fixedly connected with the operating handle and detachably and fixedly connected with the switching part of the sheet support.
3. The jig for wafer thinning back wafer as claimed in claim 2, wherein: the conversion connecting assembly comprises at least one conversion connecting block and at least one threaded connecting piece, connecting holes matched with the threaded connecting pieces are formed in the connecting parts of the conversion connecting block and the sheet support, and the threaded connecting pieces are coaxially arranged in the connecting holes in the connecting parts of the conversion connecting block and the sheet support and are in threaded connection with the connecting parts;
and/or the connecting holes in the connecting parts of the conversion connecting block and the plate support are threaded holes matched with the threaded connecting pieces.
4. The jig for wafer thinning back wafer as claimed in claim 2, wherein: the operating handle is disposed on a side facing the first surface of the sheet holder main body portion in the second direction.
5. The jig for wafer thinning back wafer as claimed in claim 1, wherein: the sheet support main body part is provided with a first end and a second end which are oppositely arranged along a first direction, the first end is fixedly connected with the adapter part, an avoiding inclined plane is further arranged in an area, close to the second end, of a second surface of the sheet support main body part, and the thickness between the avoiding inclined plane and the first surface is gradually reduced along the direction of the second end.
6. The jig for wafer thinning back wafer as claimed in claim 5, wherein: the first surface is a rectangular surface, the first surface comprises a first area and a second area which are sequentially far away from the connecting part along a first direction, the second area and the first area have a height difference in a second direction, the adsorption holes are arranged in the second area,
the whole second area is used as a single wafer placing surface, the area of the second area is smaller than that of a wafer to be placed, an arc-shaped limiting side surface is further arranged between the first area and the second area, the limiting side surface is perpendicular to the wafer placing surface, the width of the limiting side surface in a third direction is the same as that of the first surface, the curvature radius of the limiting side surface is equal to that of the wafer placed on the wafer placing surface, and the third direction is perpendicular to the first direction.
7. The jig for wafer thinning back wafer as claimed in claim 5, wherein: the first surface is a rectangular surface and comprises a first area and a second area which are sequentially far away from the connecting part along a first direction,
the second area is provided with a plurality of wafer placing surfaces which are sequentially far away from the first area along the first direction, the wafer placing surfaces, the first area and two adjacent wafer placing surfaces have height differences in the second direction, arc-shaped limiting side surfaces are formed between the wafer placing surfaces and the first area and between the two adjacent wafer placing surfaces, the limiting side surfaces are perpendicular to the wafer placing surfaces, the width of each limiting side surface in the third direction is the same as that of the first surface, the curvature radius of each limiting side surface is equal to the radius of a wafer placed on the corresponding wafer placing surface, and the third direction is perpendicular to the first direction.
8. The jig for the wafer after thinning the wafer according to claim 6 or 7, characterized in that: the wafer placing surface is provided with a plurality of adsorption holes which are arranged at intervals along the circumferential direction of the wafer placing surface;
and/or the area of the wafer placing surface is smaller than that of the wafer placed on the wafer placing surface.
9. The jig for the wafer after thinning the wafer according to claim 6 or 7, characterized in that: the second area is also provided with an avoidance gap, and the wafer placing surface is arranged around the avoidance gap;
and/or the avoiding gap is also communicated with the second end of the wafer support main body part, the wafer placing surface is a non-closed annular surface, and the wafer support main body part is in a non-closed annular structure.
10. A jig assembly for wafer thinning backward moving sheets is characterized by comprising the jig for wafer thinning backward moving sheets as claimed in any one of claims 1 to 9, wherein the jig assembly comprises a plurality of sheet supports, the connecting parts of the plurality of sheet supports are identical in structure and size, the sheet support main body parts of the plurality of sheet supports are identical in structure and different in size, and the sheet support main body parts of the plurality of sheet supports are respectively used for placing wafers of different sizes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223020581.4U CN218769465U (en) | 2022-11-14 | 2022-11-14 | Jig and jig assembly for wafer thinning and wafer moving |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223020581.4U CN218769465U (en) | 2022-11-14 | 2022-11-14 | Jig and jig assembly for wafer thinning and wafer moving |
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| Publication Number | Publication Date |
|---|---|
| CN218769465U true CN218769465U (en) | 2023-03-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223020581.4U Active CN218769465U (en) | 2022-11-14 | 2022-11-14 | Jig and jig assembly for wafer thinning and wafer moving |
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| Country | Link |
|---|---|
| CN (1) | CN218769465U (en) |
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- 2022-11-14 CN CN202223020581.4U patent/CN218769465U/en active Active
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