CN113423559A - 用于粉末床熔融合系统的原位热处理 - Google Patents

用于粉末床熔融合系统的原位热处理 Download PDF

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CN113423559A
CN113423559A CN201980092095.5A CN201980092095A CN113423559A CN 113423559 A CN113423559 A CN 113423559A CN 201980092095 A CN201980092095 A CN 201980092095A CN 113423559 A CN113423559 A CN 113423559A
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普拉比尔·坎蒂·乔杜里
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Abstract

提供了一种用于PBF系统的原位热处理的设备。用于基于PBF的3‑D打印机的设备可以包括用于加热气体的加热元件，其中已加热气体经由3‑D打印机的至少一个端口输送，以在打印期间在构建件上进行热处理。用于基于PBF的3‑D打印机的设备可以包括用于改变气体的温度的温度调节元件、用于将气体输送到多个端口的至少一个通道、以及用于确定气体温度和经由多个端口中的不同端口施加气体的持续时间的控制器。

Description

用于粉末床熔融合系统的原位热处理
相关申请的交叉引用
本申请要求2018年12月21日提交的标题为“IN-SITU THERMAL TREATMENT FORPBF SYSTEMS”的美国临时申请No.62/784,282和2019年12月19日提交的标题为“IN SITUTHERMAL TREATMENT FOR PBF SYSTEMS”的美国专利申请No.16/721,797的权益，它们的全部内容通过引用明确结合于此。
技术领域
本公开总体上涉及粉末床熔融合(PBF)系统，并且更具体地涉及用于PBF系统的原位热处理。
背景技术
PBF系统可以生产具有复杂几何形状(包括一些用传统制造工艺难以或不可能创建的形状)的结构(称为构建件)。PBF系统逐层地(即逐片地)创建构建件。每个片都可以通过这样的过程来形成，即沉积一层粉末并施加能量束以熔化粉末层中的与构建件在该层中的横截面相一致的区域。熔化的粉末冷却并融合以形成构建件的片。可以重复该过程以形成构建件的下一个片，以此类推，直到构建件完成。因为每一层都沉积在前一层的顶部上，所以把PBF想象成从基底向上逐片地形成构件是很有用的。
PBF系统的长期挑战在于，由于沉积所述层的粉末床中的高温度梯度，在构建件中可能会出现残余的开裂或变形。实践者经常实施额外的后处理热处理步骤来改善这些温度梯度的不利影响。这些步骤通常会略微有些成功，但是带来了更长的总体构建时间。
发明内容
下文将更全面地描述用于PBF系统的原位热处理的设备和方法的几个方面。
在各个方面，用于基于PBF的三维(3-D)打印机的热处理设备可以包括用于加热气体的加热元件，其中已加热气体经由3-D打印机的至少一个端口输送，该端口被定位成在打印期间在构建件上进行热处理。
在各个方面，用于在基于PBF的3-D打印机中进行热处理的方法可以包括加热气体，并且经由3-D打印机的布置在构建件附近的至少一个端口输送已加热气体，以在打印期间在构建件上进行热处理。
在各个方面，用于基于PBF的3-D打印机的热处理设备可以包括温度调节元件，其用于改变气体的温度；至少一个通道，其用于将气体输送到分布在构建件的不同的竖直区域的多个端口；以及控制器，其用于确定气体温度和经由多个端口中的不同端口施加气体的持续时间，其中，温度调节元件被引导以在3-D打印期间，以不同的确定的气体温度和不同的施加持续时间，可变地将气体输送到多个端口中的不同端口，从而稳定构建件的热特性。
从下面的详细描述中，其他方面对于本领域技术人员来说将变得显而易见，其中仅通过说明的方式示出和描述了几个实施例。如本领域技术人员将认识到的，本文的概念能够用于其他和不同的实施例，并且几个细节能够在各种其他方面进行改变，所有这些都不脱离本公开。因此，附图和详细描述在本质上被认为是说明性的，而不是限制性的。
附图说明
在附图中，用于PBF系统的原位热处理的设备和方法的各个方面现在将通过示例而非限制的方式呈现在详细描述中，其中：
图1A-D示出了在不同操作阶段期间的示例PBF系统。
图2示出了示例性的能量束源和偏转器系统。
图3A-B示出了在沉积粉末层之前和之后的示例性粉末床的透视图。
图4示出了结合基于PBF的打印机一起工作的示例性热处理设备系统。
图5示出了用于在基于PBF的3-D打印机中进行热处理的示例性方法。
具体实施方式
下面结合附图阐述的详细描述旨在提供对本文公开的概念的各种示例性实施例的描述，而不是旨在代表可以实践本公开的唯一实施例。本公开中使用的术语“示例性”意味着“用作示例、实例或说明”，并且不应该被解释为比本公开中呈现的其他实施例更优选或更有利。详细描述包括具体的细节，目的是提供全面且完整的公开，向本领域技术人员充分传达概念的范围。然而，本公开可以在没有这些具体细节的情况下实施。在一些情况下，众所周知的结构和部件可以以框图的形式示出，或者完全省略，以避免模糊贯穿本公开呈现的各种概念。
本公开涉及用于管理残余应力、微观结构以及经由基于PBF增材制造(AM)的系统生产的构建件中出现的其它加工伪迹的技术。PBF AM工艺在越来越多的行业中用于制造金属结构和部件。PBF AM工艺导致打印的构建件中残余应力的发展。这些残余应力的程度可能根据诸如所使用材料和构建件几何形状的因素而变化。通常，这些残余应力是由熔化池和构建板之间的温度差决定的高冷却速率的结果。
虽然一般适用于所有PBF系统，特别是基于激光的PBF(L-PBF)系统，但随着额外的层被添加到构件上，熔化池和沉积在粉末床中的先前的层之间的温度梯度继续增加。因此，在L-PBF系统中的构建件通常需要额外的后AM处理步骤，包括应力消除措施，以避免构建件从构建板上移除时的零件变形。具有高导热率和低比热的材料通常更容易发生这种变形，并且可能需要更多的后AM关注。
例如，解决这个问题的一个常规措施是制造者预先计算预期应力和预计变形。3-D打印后，制造者从3-D打印机中取出带有构建件的构建板，并将整体结构放入到专用的烘烤箱中，以施加预先计算的热量并解决其他变量以减少应力。这种方法的一个缺点是，在进行热处理后，预估的解决方案的参数通常难以与实际结果精确匹配，并且仍然会出现一定量的变形。这种不匹配通常与构建件的复杂性成正比，其中更大的不匹配在复杂零件中更明显。
除了残余应力产生和变形问题之外，PBF系统中使用的某些材料需要生成的构建件经受后AM热处理操作以获得所需的微观结构和性能。热处理操作作为一系列后处理步骤在构建件上进行。这些步骤会为整个制造过程增加大量额外的时间，超过了仅进行构建件的AM生产。热力后处理所需的额外时间会明显地更长，例如，比与使用非AM技术(比如铸造、锻造或焊接)制造结构相关的相对较短的时间段更长。在PBF AM工艺中，3-D打印时间在许多情况下可能更加堪比后续的热处理持续时间。这些后AM操作可能会不希望地向整个产品构建增加大量时间。
本公开解决了与传统后处理技术相关的上述问题。一种用于基于PBF的系统的原位热处理设备(“TTA”)包括气体输送结构，该气体输送结构能够输送已加热气体，以清除在L-PBF融合期间产生的羽状物。在各种实施例中，TTA与PBF 3-D打印机部分地或完全地集成。在另一个实施例中，TTA是单独的设备，其可以被改装或以其他方式可操作地联接至3-D打印机。TTA可以利用任何合适的热源。TTA不仅可以将已加热气体输送到打印床的顶部层，还可以将已加热气体输送到熔化池下方和构建板上方的已打印材料(例如经由TTA的内部端口或通道)。将已加热气体运送到端口用于热处理过程的通道可以被构建到3-D打印机的打印床或其他部分中，或者可以随后通过替换零件、改装结构和/或通过改变3-D打印机本身而被添加到3-D打印机中。
在实施例中，TTA包括控制器、气体源、加热元件、多个传感器和多个端口，每个都协同作用以在3-D打印零件上执行原位操作。在一个实施例中，TTA包括通向布置在3-D打印机的构建层上或构建层附近的端口的至少一个通道，以及一个或更多个通向布置在3-D打印机的下腔室中(比如随着打印过程进行，构建件的已制造部分下降到的位置)的端口的通道。每个端口都可以经由通道连接到加热设备。已加热气体可以从加热元件经由单个通道流动(为了效率)，并且在之后分支到多个通道，多个通道中的每个通道都通向布置在用于进行热处理操作的关键位置处的端口。
加热元件可以从气体源接收气体，该气体可以是例如惰性气体。加热元件可以基于确定的残余应力消除或零件的进一步热处理将气体加热到期望的温度，并且可以输送气体。TTA端口可以集成在现有的基于PBF的打印机中。
在一个实施例中，TTA的剩余结构可以构成附加设备。也就是说，TTA本身可以包括额外的、独立的设备，该设备(可选地)被单独地提供，并且然后可连接至基于PBF的3-D打印机。TTA端口可以包括偏转器挡板或其他结构，以引导已加热气体的流动，并确保该流动在PBF设备中本质上是层流。TTA可以包括一个或更多个传感器来获得或以其他方式监测温度。监测的温度可以被发送到TTA控制器。必要时，TTA控制器可以指示TTA更改温度。例如，TTA控制器可以与一个或更多个传感器通信并协调其操作，以更改TTA上或TTA内的一个或更多个对应位置处的温度。
在一个实施例中，顶部层的温度在3-D打印期间增加，例如增加100开氏度(K)，以便降低顶部层和熔化池之间的整体的温度梯度，这可以最小化零件所需的额外热处理的量。虽然100开氏度用于示例性的目的，但是基于系统参数，其他值可能同样适用。
增材制造(AM)。AM涉及使用存储的几何模型在构建板上累积分层的材料，以生产具有由模型限定的特征的三维(3-D)构建件。AM技术能够使用各种材料打印复杂的部件。3-D物体可以基于计算机辅助设计(CAD)模型来制造。CAD模型可以用于生成一组与特定3-D打印机兼容的指令或命令。AM过程可以使用CAD模型和打印指令创建实体三维物体。
一种示例性AM技术是PBF。PBF系统使用执行合适的打印指令的控制器以逐层地创建构建件。每一层都是通过沉积一层粉末并根据控制器指令将粉末的指定部分暴露于能量束(比如激光)而形成的。能量束经由偏转器施加，以熔化粉末层中的与构建件在该层中的横截面一致的区域。熔化的粉末冷却并融合以形成构建件的片。可以重复该过程以形成构建件的下一个片，依此类推。每一层都沉积在前一层的顶部上。所得到的结构是从基底向上逐片地组合而成的构建件。
在示例性实施方式中，本公开可以使用基于PBF的3-D打印，但不限于此应用。图1A-D示出了在不同操作阶段期间的示例PBF系统100。PBF系统100可以包括沉积器101，其能够沉积每层金属粉末；能量束源103，其能够产生能量束；偏转器105，其能够施加能量束以融合粉末材料；以及构建板107，其能够支撑一个或更多个构建件(比如构建件109)。PBF系统100还可以包括定位在粉末床容器内的构建底板111。粉末床容器的壁被示出为粉末床容器壁112。构建底板111可以降低构建板107，使得沉积器101可以沉积下一层并且腔室113可以封闭其他部件。沉积器101可以包括容纳粉末117(比如金属粉末)的进料器115，以及可以整平每层粉末的顶部的整平器119。
具体参照1A，该图示出了在构建件的片109已经融合之后而在下一层粉末沉积之前的PBF系统100。事实上，图1A示出了这样的时间，此时PBF系统100已经沉积并融合了多个层(例如50层)中的片以形成构建件109的当前状态(例如由50个片形成)。已经沉积的多个层创建了粉末床121，该粉末床包括已沉积但未融合的粉末。PBF系统100可以包括温度传感器122，其可以感测工作区域的区域中的温度，比如构建件109、粉末床的表面等。例如，温度传感器122可以包括朝向工作区域定向的热像仪、附接到粉末床附近区域的热电偶等。
图1B示出了处于一个阶段的PBF系统100，在这一阶段中，构建底板111可以降低粉末层厚度123。构建底板111的降低导致构建件109和粉末床121下降粉末层厚度123，使得粉末床和构建件的顶部比粉末床容器壁112的顶部低粉末层厚度。以这种方式，例如，可以在粉末床121和构建件109的顶部上产生具有一致厚度的空间，所述一致厚度等于粉末层厚度123。
图1C示出了处于一个阶段的PBF系统100，在这一阶段中，沉积器101可以将粉末117沉积在形成在粉末床121和构建件109的顶部上方的空间中。在这个示例中，沉积器101可以跨越该空间，同时从进料器115释放粉末117。整平器119可以整平释放的粉末，以形成具有粉末层厚度123的厚度的粉末层125。应当注意，本公开中的图1A-D和其他图中的元件不一定按比例绘制，而是可以为了更好地示出本文描述的概念的目的而画得更大或更小。例如，粉末层125的示出厚度(即，粉末层厚度123)大于用于示例的50个先前沉积层的实际厚度。
图1D示出了处于一个阶段的PBF系统100，在这一阶段中，能量束源103可以生成能量束127并且偏转器105可以施加能量束来融合构建件109中的下一个片。在各种实施例中，能量束源103可以是电子束源，能量束127可以是电子束，并且偏转器105可以包括偏转板，该偏转板可以生成电场，该电场使电子束偏转以横跨待融合的区域进行扫描。在各种实施例中，能量束源103可以是激光器，能量束127可以是激光束，并且偏转器105可以包括光学系统，该光学系统可以反射和/或折射激光束以横跨待融合的区域进行扫描。在各种实施例中，能量束源103和/或偏转器105可以调制能量束，例如，随着偏转器扫描，打开和关闭能量束，使得能量束仅施加在粉末层的合适区域中。例如，在各种实施例中，能量束可以由数字信号处理器(DSP)调制。
图2示出了示例性的能量束源和偏转器系统。在这个示例中，能量束是电子束。能量束源可以包括电子栅极201、电子栅极调制器203和聚焦器205。控制器206可以控制电子栅极201和电子栅极调制器203来生成电子束207，并且可以控制聚焦器205来将电子束207聚焦成聚焦的电子束209。为了在附图中提供更清晰的视图，控制器206和其他部件之间的连接未示出。聚焦的电子束209可以通过偏转器213而横跨粉末层211进行扫描。偏转器213可以包括两个x偏转板215和两个y偏转板217。控制器206可以控制偏转器213在x偏转板215之间生成电场，以沿x方向偏转聚焦的电子束209，并在y偏转板217之间生成电场，以沿y方向偏转聚焦的电子束。在各种实施例中，偏转器可以包括一个或更多个磁线圈来偏转电子束。
束传感器219可以感测聚焦的电子束209的偏转量，并且可以将该信息发送到控制器206。控制器206可以使用该信息来调节电场的强度，以便实现期望的偏转量。聚焦的电子束209可以通过扫描聚焦的电子束而施加至粉末层211以熔化松散的粉末221，从而形成融合的粉末223。
图3A-B示出了在沉积一层粉末之前和之后的示例性粉末床的透视图。图3A示出了扫描过程发生之后的粉末床301。该图示出了第n个构建件片303的顶部表面，该片是由能量束源/偏转器305扫描能量束以在第n个粉末层307中融合粉末而形成的片(其中n是粉末层的数量)。图3B示出了在沉积下一个粉末层(即第n+1个粉末层309)之后的粉末床301的状态。该图还示出了待融合的下一个片(即第n+1个片311的轮廓)的轮廓。
TTA。图4描绘了结合基于PBF的打印机一起工作的TTA系统的概念性图示。
控制器400可以包括处理系统，该处理系统具有一个或更多个处理器和用于存储和执行进行原位操作的代码的存储器。在一些实施例中，控制器400可以与打印机的中央控制器集成或作为其一部分。在其他实施例中，控制器400可以是专用的控制器，或者内置在TTA内的控制器。
加热设备/元件410可以生成热量以提供通过控制器400经由控制传感器420控制的温度。监测传感器430可以测量温度并将其报告给控制器400。在原位操作期间，热量输入(气体)源440将储存的惰性气体或其他物质传递给加热元件410。加热元件410将气体加热到由控制器400确定的期望的温度，并经由一个或更多个通道450、451和452将已加热气体输送到端口460、461和462(或者等效地，联接到加热元件410的单独的输送结构输送已加热气体)。
在该实施例中，端口460、461和462策略性地定位在不同的位置，以向构建件的不同部分提供最佳的热处理。因此，端口(460、461和462)出口可以位于在打印床中沉积的当前层上或附近的不同位置，或者位于包括降低的腔室的PBF设备的构建板470的上方或下方，以最佳地接近可能需要应力消除或热处理的构建件的期望部分。这些位置可以包括打印床/打印腔室的顶部、侧壁或其他表面，以及打印床表面以下邻近打印材料的区域。
在一个实施例中，与每个端口相关联的是偏转器挡板(例如，挡板480、481和482)，当气体离开一个或更多个端口时，偏转器挡板将气体导向成预定的方向流动(例如，气体流动490、491和492)。上述说明，包括设备的结构和端口的数量，仅用于示例性的目的，并且可以使用任何数量和几何形状的加热元件、输送元件、控制元件和/或端口来使原位热传递能够发生在AM过程中的期望点处，以优化3-D打印质量。
图5是基于PBF的3-D打印机中的热处理的示例性方法的流程图。该方法包括加热(500)气体和输送(510)已加热气体。例如，已加热气体可以经由3-D打印机的布置在构建件附近的至少一个端口输送，以在打印期间在构建件上进行热处理。
因为热处理是在实际的3-D打印期间原位进行的，所以在3-D打印过程完成后，它们有利地需要显著更少的额外热处理时间(如果有的话)。因此，可以在单次3-D渲染中同时进行多个操作。在3-D渲染期间施加热处理使制造效率最大化，并使整体的处理时间最小化。使用本公开的特征，可以实现基于PBF的3-D打印的益处，而不需要对应地增加低效的后处理热管理技术。
因此，例如，不同于通常需要非常昂贵的精密器械来制造单一类型部件的传统工具和加工技术，3-D打印可以(部分地或全部地)在需要的地方替代这些传统的减材制造技术，以从基底处向上创建高度定制的和几何复杂的结构和部件。或者，TTA可以与这些传统技术中的某些技术结合使用，以增强这些技术并提高它们的效率。
此外，因为本文公开的TTA能够在打印期间原位进行热后处理操作，所以在完成构建件之后，通常不需要委派额外的时间来在之后进行热操作。因此，减少了与任何给定的构建件相关的总的后处理时间(例如，可以包括移除3-D打印支撑件)。相关的优点在于在原位提供加热操作使得热操作能够在构建件完成之前选择性地应用于构建件。例如，在额外的材料覆盖潜在地有问题的结构并添加额外的力和/或覆盖原本可以在未覆盖状态下进行热处理的材料(例如顶部层)之前，应力消除操作可以向所述结构的更大的表面积提供热量。凭借其多个端口，TTA还可以输送已加热气体以在更大面积上清除生成的羽状物(在需要的实施例中)。
因此，因为TTA可以具有端口，所述端口能够在3-D打印期间(并且可选地，紧接其后)的不同阶段在构建件的不同高度上进行动态的温度控制，所以热处理可以比构建件被取出并且整个热处理仅在打印完成之后进行的传统情况更精确。使用TTA，因此可以提高最终结构的整体质量。
如上所述，在一个实施例中，在3-D打印过程期间，通过对顶部层施加热，例如通过提高顶部层的温度，顶部层的温度梯度在熔化之前被显著降低。该动作可以显著降低置于构建件上的应力，因为熔化池和构建件的顶部层的剩余部分之间的温度梯度较低。
示例性热处理技术。在一个实施例中，原位应力降低技术可以应用于铝合金。例如，铝合金通常具有大约20×10-6m/(mK)的热膨胀系数，并因此容易产生残余应力，该残余应力导致构建件在与构建板分离时的变形。基于已知的热膨胀，在零件温度上每升高100摄氏度就导致0.002的弹性应变的降低，这转化为大约140MPa的残余应力降低，这可以使用本文的技术经由均衡合金经历的热梯度来施加。虽然各种材料都可以从这一过程中受益，但这种应力降低操作在铝合金中很重要，因为在某些情况下，它可以代表材料的疲劳强度的三分之一到一半。
在另一个实施例中，马氏体时效钢在一定温度下进行时效处理，使得钢的微观结构包含百分之百(100％)的马氏体。马氏体通过从奥氏体转变而形成的，在连续冷却期间很难维持。在转变为马氏体之前，需要一定温度的时效处理操作，在该温度处，奥氏体在较长的一段时间中是稳定的。马氏体时效热处理操作可以包括在相对较低的温度(例如，大约500℃)下的持续的热处理。TTA可以被配置成应用原位热处理以在3-D打印期间对材料进行时效处理以获得马氏体相。控制器可以使TTA能够根据打印材料的时效处理要求来施加能够平衡温度和时间的原位处理。
与后处理操作(其能力受到完整的构建件的限制)不同，在TTA的情况下，首先打印的层可以暴露于处于较低温度的气体更长时间。相反，根据温度-时间转换关系，随后打印的层可以暴露于更高温度的气体更短的时间。结果是在3-D打印过程结束时得到最佳时效处理的材料。
例如，在3-D打印操作期间，通过在不同时间改变不同高度的气体的温度，构建腔室的冷却速率可以在不同高度选择性地调节。因此，TTA可以确保在示例性的十小时打印期间，较低的层处于较低温度较长时间，而较高的层处于较高温度较短时间，从而均衡微结构变化。为了均衡温度并使零件的整体应力最小化，可以提前或动态地计算温度和用于施加该温度的时间。因此，可以经由横跨构建件的顶部、底部和中间部分输送的气体来施加均衡的温度，使得较低的部分被成比例地加热，而较高的部分被成比例地冷却。
这种原位选择性的均衡可以使整个零件具有相同的特性。该技术与现有方法相反，在现有方法中，零件的淬火和时效处理在打印后以耗时的操作来进行，通常导致整体构建的低效率以及在用于均衡零件的不均匀热性能的淬火与时效处理操作中的固有的不确定性。原位热处理可以用来取代这种传统的工艺，从而节省时间并最小化热应力。
提供本公开是为了使本领域的任何技术人员能够实践本文描述的各个方面。对于本领域技术人员来说，贯穿本公开呈现的对这些示例性实施例的各种改变将是显而易见的，并且本文公开的概念可以应用于用于PBF系统的原位热处理的其他技术。因此，权利要求不旨在限于贯穿本公开呈现的示例性实施例，而是符合与语言权利要求一致的全部范围。本领域普通技术人员已知的或以后将会知道的贯穿本公开描述的示例性实施例的元件的所有结构和功能等同物旨在被权利要求所包含。此外，本文公开的任何内容都不旨在专用于公众，无论这种公开是否在权利要求中明确陈述。任何权利要求要素都不得根据35U.S.C.§112(f)的规定或适用司法管辖区的类似法律进行解释，除非该要素明确使用短语“用于……的方式”进行陈述，或者在方法权利要求的情况下，该要素使用短语“用于……的步骤”进行陈述。

Claims (15)

1.一种用于基于粉末床融合的三维(3-D)打印机的热处理设备，包括：
用于加热气体的加热元件，
其中，已加热气体经由所述3-D打印机的至少一个端口输送，所述端口被定位成在打印期间在构建件上进行热处理。
2.根据权利要求1所述的设备，其中，所述热处理包括残余应力降低。
3.根据权利要求1所述的设备，其中，所述热处理包括基于选择的气体温度和热处理持续时间对构建件中的材料进行时效处理。
4.根据权利要求1所述的设备，其中，所述至少一个端口联接到偏转器挡板，以引导所输送的已加热气体相对于构建件的流动。
5.根据权利要求1所述的设备，其中，所输送的气体能够运作以减小构建件的下部分和上部分之间的温度差。
6.根据权利要求1所述的设备，其中，所述至少一个端口被定位成将已加热气体输送到沉积在所述3-D打印机的打印床中的打印材料的顶部层。
7.根据权利要求6所述的设备，其中，所述至少一个端口包括被定位成将已加热气体输送至构建件的已打印部分的一个或更多个端口，所述已打印部分在对应于顶部层的熔化池下方并且在所述3-D打印机的构建板上方。
8.根据权利要求1所述的设备，其中
所述3-D打印机包括下腔室，在打印期间，构建件被降低到所述下腔室中，并且
至少所述一个端口布置在所述下腔室中。
9.根据权利要求1所述的设备，进一步包括气体储存元件，所述气体储存元件联接到所述加热元件并被配置为供应气体。
10.根据权利要求1所述的设备，进一步包括控制器，所述控制器联接至所述加热元件，用于确定与构建件有关的热处理的温度、持续时间和位置中的一个或更多个。
11.根据权利要求10所述的设备，进一步包括监测传感器，所述监测传感器联接到所述控制器，用于监测已加热气体的温度。
12.根据权利要求11所述的设备，其中，所述控制器进一步被配置为从所述监测传感器接收监测的温度，并指示所述加热元件将温度改变至新值。
13.根据权利要求10所述的设备，进一步包括一个或更多个通道，所述通道布置在所述加热元件的输出端处并且延伸到所述至少一个端口，用于输送已加热气体。
14.一种用于基于粉末床融合的三维(3-D)打印机的热处理设备，包括：
温度调节元件，用于改变气体的温度；
至少一个通道，用于将气体输送到分布在构建件的不同竖直区域处的多个端口；以及
控制器，用于确定经由所述多个端口中的不同端口施加气体的持续时间以及气体温度，
其中，所述温度调节元件被引导以在打印期间以不同的确定的气体温度和不同的施加持续时间，可变地将气体输送到所述多个端口中的不同端口，从而稳定所述构建件的多个热特性。
15.根据权利要求14所述的设备，其中，所述温度调节元件被配置成加热所述构建件的下部分并冷却所述构建件的上部分。
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