CN113412533A - 具有改进的保质期的可用作硬掩膜和填充材料的含无机氧化物组分和炔氧基取代的旋涂碳组分的旋涂组合物 - Google Patents

具有改进的保质期的可用作硬掩膜和填充材料的含无机氧化物组分和炔氧基取代的旋涂碳组分的旋涂组合物 Download PDF

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CN113412533A
CN113412533A CN202080013446.1A CN202080013446A CN113412533A CN 113412533 A CN113412533 A CN 113412533A CN 202080013446 A CN202080013446 A CN 202080013446A CN 113412533 A CN113412533 A CN 113412533A
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composition
group
spin
alkyl
high carbon
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M·D·拉赫曼
T·赛吉托
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Merck Patent GmbH
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Merck Patent GmbH
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    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
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    • C08L65/00—Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
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    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/69—Inorganic materials
    • H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
    • H10P14/6921—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon
    • H10P14/6922—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon the material containing Si, O and at least one of H, N, C, F or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
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    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
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    • C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
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    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
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    • C09D161/00—Coating compositions based on condensation polymers of aldehydes or ketones; Coating compositions based on derivatives of such polymers
    • C09D161/04—Condensation polymers of aldehydes or ketones with phenols only
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    • C09D171/00—Coating compositions based on polyethers obtained by reactions forming an ether link in the main chain; Coating compositions based on derivatives of such polymers
    • C09D171/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
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    • C08G2261/10—Definition of the polymer structure
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    • C08G2261/141—Side-chains having aliphatic units
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    • C08G2261/10—Definition of the polymer structure
    • C08G2261/14—Side-groups
    • C08G2261/142—Side-chains containing oxygen
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    • C08G2261/30—Monomer units or repeat units incorporating structural elements in the main chain
    • C08G2261/31—Monomer units or repeat units incorporating structural elements in the main chain incorporating aromatic structural elements in the main chain
    • C08G2261/312—Non-condensed aromatic systems, e.g. benzene
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    • C08G2261/30—Monomer units or repeat units incorporating structural elements in the main chain
    • C08G2261/31—Monomer units or repeat units incorporating structural elements in the main chain incorporating aromatic structural elements in the main chain
    • C08G2261/314—Condensed aromatic systems, e.g. perylene, anthracene or pyrene
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    • C08G2261/30—Monomer units or repeat units incorporating structural elements in the main chain
    • C08G2261/32—Monomer units or repeat units incorporating structural elements in the main chain incorporating heteroaromatic structural elements in the main chain
    • C08G2261/324—Monomer units or repeat units incorporating structural elements in the main chain incorporating heteroaromatic structural elements in the main chain condensed
    • C08G2261/3242—Monomer units or repeat units incorporating structural elements in the main chain incorporating heteroaromatic structural elements in the main chain condensed containing one or more oxygen atoms as the only heteroatom, e.g. benzofuran
    • C—CHEMISTRY; METALLURGY
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    • C08G2261/30—Monomer units or repeat units incorporating structural elements in the main chain
    • C08G2261/34—Monomer units or repeat units incorporating structural elements in the main chain incorporating partially-aromatic structural elements in the main chain
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    • C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G2261/90—Applications
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
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    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
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  • Chemical & Material Sciences (AREA)
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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials For Photolithography (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Formation Of Insulating Films (AREA)
CN202080013446.1A 2019-02-22 2020-02-20 具有改进的保质期的可用作硬掩膜和填充材料的含无机氧化物组分和炔氧基取代的旋涂碳组分的旋涂组合物 Pending CN113412533A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201962809072P 2019-02-22 2019-02-22
US62/809,072 2019-02-22
PCT/EP2020/054421 WO2020169702A1 (en) 2019-02-22 2020-02-20 Spin-on compositions comprising an inorganic oxide component and an alkynyloxy substituted spin-on carbon component useful as hard masks and filling materials with improved shelf life

Publications (1)

Publication Number Publication Date
CN113412533A true CN113412533A (zh) 2021-09-17

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CN202080013446.1A Pending CN113412533A (zh) 2019-02-22 2020-02-20 具有改进的保质期的可用作硬掩膜和填充材料的含无机氧化物组分和炔氧基取代的旋涂碳组分的旋涂组合物

Country Status (8)

Country Link
US (1) US11767398B2 (https=)
EP (1) EP3928348B1 (https=)
JP (1) JP7610518B2 (https=)
KR (1) KR102843498B1 (https=)
CN (1) CN113412533A (https=)
SG (1) SG11202106923XA (https=)
TW (1) TWI833908B (https=)
WO (1) WO2020169702A1 (https=)

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* Cited by examiner, † Cited by third party
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IL305619A (en) 2022-09-14 2024-04-01 Shinetsu Chemical Co Compound for forming a metal-containing layer, composition for forming a metal-containing layer, printing method, and semiconductor masking sensitizer
JP2024068637A (ja) * 2022-11-08 2024-05-20 信越化学工業株式会社 金属含有膜形成用化合物、金属含有膜形成用組成物、及びパターン形成方法
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JP2024091495A (ja) * 2022-12-22 2024-07-04 信越化学工業株式会社 金属含有膜形成用化合物、金属含有膜形成用組成物、及びパターン形成方法
JP2024097388A (ja) * 2023-01-06 2024-07-19 信越化学工業株式会社 金属含有膜形成用化合物、金属含有膜形成用組成物、及びパターン形成方法
JP7802711B2 (ja) * 2023-01-06 2026-01-20 信越化学工業株式会社 金属含有膜形成用化合物、金属含有膜形成用組成物、及びパターン形成方法
KR102795114B1 (ko) * 2023-02-14 2025-04-10 삼성에스디아이 주식회사 하드마스크 조성물, 하드마스크 층 및 패턴 형성 방법
JP7802029B2 (ja) 2023-02-15 2026-01-19 信越化学工業株式会社 金属含有膜形成用化合物、金属含有膜形成用組成物、パターン形成方法
JP2024122656A (ja) * 2023-02-28 2024-09-09 信越化学工業株式会社 金属含有膜形成用化合物、金属含有膜形成用組成物、及びパターン形成方法
EP4435516A1 (en) * 2023-03-16 2024-09-25 Shin-Etsu Chemical Co., Ltd. Method for forming resist underlayer film and patterning process
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JP2025099570A (ja) 2023-12-22 2025-07-03 信越化学工業株式会社 金属含有膜形成用化合物、金属含有膜形成用組成物、パターン形成方法
JP2025099887A (ja) 2023-12-22 2025-07-03 信越化学工業株式会社 金属含有膜形成用化合物、金属含有膜形成用組成物、パターン形成方法
JP2025101957A (ja) * 2023-12-26 2025-07-08 信越化学工業株式会社 金属含有膜形成用化合物、金属含有膜形成用組成物、パターン形成方法
JP2025102051A (ja) * 2023-12-26 2025-07-08 信越化学工業株式会社 金属含有膜形成用化合物、金属含有膜形成用組成物、パターン形成方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102124413A (zh) * 2008-08-15 2011-07-13 Az电子材料美国公司 形成反色调图像的硬掩模方法
CN103443161A (zh) * 2011-03-30 2013-12-11 Az电子材料美国公司 抗反射涂层组合物及其方法
US20170018436A1 (en) * 2015-07-14 2017-01-19 Shin-Etsu Chemical Co., Ltd. Resist underlayer film compostion, patterning process, and compound
US20170017156A1 (en) * 2015-07-13 2017-01-19 Shin-Etsu Chemical Co., Ltd. Composition for forming resist underlayer film and patterning process
CN107251203A (zh) * 2015-02-11 2017-10-13 Az电子材料卢森堡有限公司 金属硬掩模组合物和用于在半导体基底上形成精细图案的方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3474054A (en) 1966-09-13 1969-10-21 Permalac Corp The Surface coating compositions containing pyridine salts or aromatic sulfonic acids
US4200729A (en) 1978-05-22 1980-04-29 King Industries, Inc Curing amino resins with aromatic sulfonic acid oxa-azacyclopentane adducts
US4251665A (en) 1978-05-22 1981-02-17 King Industries, Inc. Aromatic sulfonic acid oxa-azacyclopentane adducts
US5187019A (en) 1991-09-06 1993-02-16 King Industries, Inc. Latent catalysts
WO2012145330A1 (en) * 2011-04-18 2012-10-26 The University Of British Columbia Fluorene-9-bisphenol compounds and methods for their use
US9365510B2 (en) * 2012-04-16 2016-06-14 British Columbia Cancer Agency Branch Aziridine bisphenol ethers and related compounds and methods for their use
US9315636B2 (en) * 2012-12-07 2016-04-19 Az Electronic Materials (Luxembourg) S.A.R.L. Stable metal compounds, their compositions and methods
US9152051B2 (en) * 2013-06-13 2015-10-06 Az Electronics Materials (Luxembourg) S.A.R.L. Antireflective coating composition and process thereof
US9296922B2 (en) * 2013-08-30 2016-03-29 Az Electronic Materials (Luxembourg) S.A.R.L. Stable metal compounds as hardmasks and filling materials, their compositions and methods of use
US9274426B2 (en) * 2014-04-29 2016-03-01 Az Electronic Materials (Luxembourg) S.A.R.L. Antireflective coating compositions and processes thereof
JP6641879B2 (ja) * 2015-03-03 2020-02-05 Jsr株式会社 レジスト下層膜形成用組成物、レジスト下層膜及びパターニングされた基板の製造方法
US9958781B2 (en) * 2015-04-24 2018-05-01 Jsr Corporation Method for film formation, and pattern-forming method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102124413A (zh) * 2008-08-15 2011-07-13 Az电子材料美国公司 形成反色调图像的硬掩模方法
CN103443161A (zh) * 2011-03-30 2013-12-11 Az电子材料美国公司 抗反射涂层组合物及其方法
CN107251203A (zh) * 2015-02-11 2017-10-13 Az电子材料卢森堡有限公司 金属硬掩模组合物和用于在半导体基底上形成精细图案的方法
US20170017156A1 (en) * 2015-07-13 2017-01-19 Shin-Etsu Chemical Co., Ltd. Composition for forming resist underlayer film and patterning process
US20170018436A1 (en) * 2015-07-14 2017-01-19 Shin-Etsu Chemical Co., Ltd. Resist underlayer film compostion, patterning process, and compound

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