CN113261091A - 保护膜形成用复合片及半导体芯片的制造方法 - Google Patents

保护膜形成用复合片及半导体芯片的制造方法 Download PDF

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Publication number
CN113261091A
CN113261091A CN201980079821.XA CN201980079821A CN113261091A CN 113261091 A CN113261091 A CN 113261091A CN 201980079821 A CN201980079821 A CN 201980079821A CN 113261091 A CN113261091 A CN 113261091A
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CN
China
Prior art keywords
protective film
forming
film
composite sheet
meth
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201980079821.XA
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English (en)
Chinese (zh)
Inventor
古野健太
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of CN113261091A publication Critical patent/CN113261091A/zh
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/025—Electric or magnetic properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68377—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support with parts of the auxiliary support remaining in the finished device

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Dicing (AREA)
  • Laser Beam Processing (AREA)
  • Adhesive Tapes (AREA)
CN201980079821.XA 2018-12-05 2019-11-27 保护膜形成用复合片及半导体芯片的制造方法 Pending CN113261091A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018-228529 2018-12-05
JP2018228529 2018-12-05
PCT/JP2019/046430 WO2020116288A1 (fr) 2018-12-05 2019-11-27 Feuille composite pour formation de film de protection et procédé de production de puce semi-conductrice

Publications (1)

Publication Number Publication Date
CN113261091A true CN113261091A (zh) 2021-08-13

Family

ID=70973491

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980079821.XA Pending CN113261091A (zh) 2018-12-05 2019-11-27 保护膜形成用复合片及半导体芯片的制造方法

Country Status (5)

Country Link
JP (1) JP7497297B2 (fr)
KR (1) KR20210098975A (fr)
CN (1) CN113261091A (fr)
TW (1) TWI837233B (fr)
WO (1) WO2020116288A1 (fr)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008280520A (ja) * 2007-04-11 2008-11-20 Furukawa Electric Co Ltd:The 半導体固定用粘着テープ
JP2013120839A (ja) * 2011-12-07 2013-06-17 Lintec Corp 保護膜形成層付ダイシングシートおよびチップの製造方法
JP2015018157A (ja) * 2013-07-12 2015-01-29 日立化成株式会社 感光性導電フィルム、並びにこれを用いた導電パターンの形成方法及び導電パターン基板
CN104342053A (zh) * 2013-07-30 2015-02-11 日东电工株式会社 表面保护薄膜及光学构件
CN105647410A (zh) * 2014-11-27 2016-06-08 日东电工株式会社 表面保护薄膜、表面保护薄膜的制造方法及光学构件
CN107148663A (zh) * 2014-12-25 2017-09-08 电化株式会社 激光切割用粘合片以及半导体装置的制造方法
CN108778721A (zh) * 2016-03-04 2018-11-09 琳得科株式会社 保护膜形成用复合片
CN108884244A (zh) * 2016-04-28 2018-11-23 琳得科株式会社 保护膜形成用膜及保护膜形成用复合片

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5432853B2 (fr) 1971-10-11 1979-10-17
TW201100529A (en) * 2009-06-30 2011-01-01 3M Innovative Properties Co Anti-static protection film and product containing the same
JP5776957B2 (ja) * 2010-10-29 2015-09-09 ナガセケムテックス株式会社 熱硬化型導電性コーティング用組成物、光学フィルム及びプロテクトフィルム
JP6077922B2 (ja) 2012-12-10 2017-02-08 日東電工株式会社 ダイシングテープ一体型接着シート、ダイシングテープ一体型接着シートを用いた半導体装置の製造方法、及び、半導体装置
CN104870592B (zh) * 2012-12-19 2016-10-12 昭和电工株式会社 光学膜用粘着剂组合物及表面保护膜
WO2017086249A1 (fr) * 2015-11-17 2017-05-26 住友化学株式会社 Film de résine revêtu d'adhésif autocollant et stratifié optique comprenant celui-ci
CN106280603B (zh) * 2016-08-05 2019-01-18 张家港康得新光电材料有限公司 一种抗静电透光膜涂料及其应用
CN108164728A (zh) * 2017-11-23 2018-06-15 上海世系新材料有限公司 抗静电液组合物及抗静电聚酯薄膜的制备方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008280520A (ja) * 2007-04-11 2008-11-20 Furukawa Electric Co Ltd:The 半導体固定用粘着テープ
JP2013120839A (ja) * 2011-12-07 2013-06-17 Lintec Corp 保護膜形成層付ダイシングシートおよびチップの製造方法
JP2015018157A (ja) * 2013-07-12 2015-01-29 日立化成株式会社 感光性導電フィルム、並びにこれを用いた導電パターンの形成方法及び導電パターン基板
CN104342053A (zh) * 2013-07-30 2015-02-11 日东电工株式会社 表面保护薄膜及光学构件
CN105647410A (zh) * 2014-11-27 2016-06-08 日东电工株式会社 表面保护薄膜、表面保护薄膜的制造方法及光学构件
CN107148663A (zh) * 2014-12-25 2017-09-08 电化株式会社 激光切割用粘合片以及半导体装置的制造方法
CN108778721A (zh) * 2016-03-04 2018-11-09 琳得科株式会社 保护膜形成用复合片
CN108884244A (zh) * 2016-04-28 2018-11-23 琳得科株式会社 保护膜形成用膜及保护膜形成用复合片

Also Published As

Publication number Publication date
TW202038319A (zh) 2020-10-16
KR20210098975A (ko) 2021-08-11
JP7497297B2 (ja) 2024-06-10
TWI837233B (zh) 2024-04-01
JPWO2020116288A1 (ja) 2021-10-21
WO2020116288A1 (fr) 2020-06-11

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