CN113252985B - Measuring device and measuring method for measuring impedance of high-speed signal line in optical module - Google Patents
Measuring device and measuring method for measuring impedance of high-speed signal line in optical module Download PDFInfo
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- CN113252985B CN113252985B CN202110805329.5A CN202110805329A CN113252985B CN 113252985 B CN113252985 B CN 113252985B CN 202110805329 A CN202110805329 A CN 202110805329A CN 113252985 B CN113252985 B CN 113252985B
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- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
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Abstract
The invention relates to a measuring device and a measuring method for measuring impedance of a high-speed signal wire in an optical module, wherein the high-speed signal wire to be measured in the optical module is communicated with a measuring instrument by the aid of the measuring device, and the measuring device comprises: the Mini-SMP connector comprises a Mini-SMP connector body, a joint component and a clamp body; the joint assembly includes: four ports; the anchor clamps body includes: a first high-speed transmission line and a second high-speed transmission line which are parallel; a reference formation below the two high speed transmission lines; the port S1 of the connector assembly is communicated with a first signal line interface of the Mini-SMP connector through a first high-speed transmission line; the port S2 of the connector assembly is communicated with a second signal line interface of the Mini-SMP connector through a second high-speed transmission line; the other two ports communicate with the ground interface of the Mini-SMP connector through the reference ground. The measuring device can solve the problem that the impedance of a high-speed signal line in an optical module of more than 400G is extremely difficult to measure, and has the advantages of good compatibility, low cost, convenient manufacture and simple operation.
Description
Technical Field
The invention relates to the technical field of optical communication, in particular to a measuring device and a measuring method for measuring impedance of a high-speed signal wire in an optical module.
Background
The data center is a core support platform of cloud computing, along with the development of cloud computing, the network scale of the data center is continuously enlarged, the flow is rapidly increased, and an optical module is indispensable to realize the interconnection of optical networks in the data center. The increase of computing power and internal data exchange capacity of a data center drives the upgrade of an optical network port all the time, in order to cope with the continuous increase of data center traffic, a very large scale data center upgrades a network system on average every three years, the domestic very large scale data center is expected to deploy 400G Ethernet in 2020, the 400G Ethernet enters a large scale deployment stage in 2022, and corresponding optical modules interconnected with the data center are used by matching the 400G QSFP-DD SR8 optical module with multimode optical fibers.
Q in 400G QSFP-DD SR8 means "Quad", 4-way, DD means "Double sensitivity", which is called Quad Small Form Factor Pluggable-Double sensitivity ", that is, the number of high-speed differential electrical signal channels from the optical module gold finger to DSP is 8, that is, 8 transmitting differential electrical signal channels and 8 receiving differential electrical signal channels, according to the standard protocol, wherein there are 4 transmitting high-speed channels and 4 receiving high-speed channels on the front side of PCB, as P1 area in FIG. 1, and 4 transmitting high-speed channels and 4 receiving high-speed channels on the back side of PCB, as P2 area in FIG. 2.
"8" in 400G QSFP-DD SR8 means that the optical signal is transmitted 8-way and the optical signal is received 8-way, that is, there are 8 high-speed differential electrical signal paths from DSP (digital signal processing unit) to driver (transmit driver chip) and 8 high-speed differential electrical signal paths from DSP (digital signal processing unit) to TIA (trans-group amplifier), as shown in region P3 in fig. 1.
The impedance of a gold finger of an optical module to a high-speed differential line of a DSP has a mature test scheme in the prior art, but no technical scheme in the prior art refers to how to measure the impedance of a high-speed signal line between the DSP and a driver (driver) and between the DSP and a TIA.
Disclosure of Invention
Technical problem to be solved
In view of the above disadvantages and shortcomings of the prior art, the present invention provides a measuring apparatus and a measuring method for measuring impedance of a high-speed signal line in an optical module, which can solve the problem of industrial pain that impedance of a high-speed signal line in an optical module of more than 400G is very difficult to measure, and has the advantages of good compatibility, low cost, convenient manufacturing and simple operation.
(II) technical scheme
In order to achieve the purpose, the invention adopts the main technical scheme that:
in a first aspect, an embodiment of the present invention provides a measurement apparatus for measuring impedance of a high-speed signal line in an optical module, wherein the high-speed signal line to be measured in the optical module is communicated with a measurement instrument by means of the measurement apparatus, and the measurement apparatus includes:
the fixture comprises a Mini-SMP connector, a connector assembly and a fixture body, wherein the Mini-SMP connector is used for being connected with the measuring instrument, the connector assembly is used for being connected with a high-speed signal line to be measured, and the fixture body is used for connecting and supporting the Mini-SMP connector and the connector assembly;
the joint assembly includes: the first ground port G1, the first signal line port S1, the second signal line port S2 and the second ground port G2 are arranged at intervals in sequence;
the clamp body includes: a first high-speed transmission line and a second high-speed transmission line which are parallel; the bearing structure is positioned below the first high-speed transmission line and the second high-speed transmission line and used for supporting the reference ground layer, the first high-speed transmission line, the second high-speed transmission line and the Mini-SMP connector; the first high-speed transmission line, the second high-speed transmission line, the reference stratum and the bearing structure are insulated from each other;
the first signal line port S1 is communicated with the first signal line port of the Mini-SMP connector through a first high-speed transmission line;
the second signal line port S2 is communicated with a second signal line port of the Mini-SMP connector through a second high-speed transmission line;
the first ground port G1 and the second ground port G2 are in communication with the ground interface of the Mini-SMP connector through reference ground layers, respectively.
Optionally, the load bearing structure comprises: a carrier and an extension supporting the Mini-SMP connector;
the extension includes: a reinforcing plate made of an insulating material; the bearing part includes: a flexible board made of insulating material.
Optionally, the reference formation is a formation formed by a solid copper sheet;
and/or the clamp body further comprises a protective layer which is integrally formed and protects the first high-speed transmission line, the second high-speed transmission line and the reference stratum;
and/or the measuring device is of a Y-shaped structure, the top end of the Y-shaped structure is a Mini-SMP connector, and the bottom end of the Y-shaped structure is a joint component.
Optionally, each port in the fitting assembly is a female port; the structure of each port and the corresponding connection in the clamp body is integrally formed;
or each port in the joint component is a crescent-shaped port, and each port and the corresponding connected structure in the clamp body are integrally formed.
Optionally, one end of the first high-speed transmission line, which is connected with the Mini-SMP connector, is a sheet structure, and an edge of the sheet structure, which faces the Mini-SMP connector, is flush with an edge of the reference ground layer in the fixture body;
the second high-speed transmission line has the same structure as the first high-speed transmission line.
In a second aspect, an embodiment of the present invention further provides a system for measuring impedance of a high speed signal line in an optical module, including: a measuring instrument and the measuring apparatus for measuring impedance of the high-speed signal line in the optical module according to any one of the first to fourth aspects, wherein the measuring instrument is in communication with the high-speed signal line in the optical module to be measured by means of the measuring apparatus.
In a third aspect, an embodiment of the present invention further provides a measurement method using the measurement system in the second aspect, where the measurement method includes:
judging whether each high-speed signal line to be measured has a disconnection area or not aiming at the high-speed signal line to be measured in the optical module;
if the high-speed signal line exists, welding a coupling capacitor aiming at the disconnection area of each high-speed signal line to be measured;
correspondingly connecting each port of the joint assembly in the measuring device with a specified test point of the high-speed signal line to be measured;
and starting a measuring instrument of the measuring system to obtain a test result of the high-speed signal wire to be tested.
Optionally, before connecting each port of the joint assembly in the measurement apparatus to a designated test point of the high-speed signal line to be measured, the method further includes:
judging whether the surface of the high-speed signal line to be measured is covered with a protective layer;
if the protective layer exists, removing the protective layer of the specified test point of the high-speed signal line to be tested;
and supplying power to the circuit board in the optical module with the protective layer removed by the test board, and further performing corresponding connection of each port of the connector assembly in the measuring device and the designated test point of the high-speed signal line to be measured.
Optionally, the coupling capacitance is a capacitance of 0.01 uF-0.1 uF;
the measuring instrument is an impedance instrument, and the high-speed signal line to be measured is a single-ended high-speed signal line or a differential high-speed signal line.
(III) advantageous effects
The measuring device can solve the problem that the impedance of the high-speed signal line in the optical module of more than 400G is extremely difficult to measure, namely the impedance of the high-speed signal line in the optical module of more than 400G can be measured in a portable mode, and the bearing structure in the clamp body can be set into a soft board or a reinforcing board according to needs, so that the high-speed signal line can be better communicated with the high-speed signal line to be measured, and various bending connections can be set. The measuring device provided by the embodiment of the invention has the advantages of good compatibility, low cost, convenience in manufacturing and simplicity in operation.
In addition, the measuring device is simple to manufacture, and the measuring device meeting the impedance requirement can be manufactured according to the requirement, so that the impedance of various high-speed signal wires in various optical modules can be tested, the convenience in measurement is ensured, and the connection is stable.
When the measuring device is used for measuring, because each port in the connector assembly is independent, the connector assembly can be conveniently loaded at any specified position of a high-speed signal wire to be measured, and the accuracy and the flexibility of a high-speed link in the optical module are guaranteed to be tested.
The measuring device has the advantages of short manufacturing period, low cost, low price and flexibility and convenience in movement, and can accelerate the debugging process of a high-end optical module (namely an optical module above 400G).
In the measuring system, the compatibility of the measuring device and the main equipment is good, the main equipment of the network branch and the main equipment of the TDR module can be matched, and the test method is simple to operate and quick to test.
Drawings
FIG. 1 is a schematic diagram of a high speed differential line on the front side of a PCB in the prior art;
FIG. 2 is a schematic diagram of high speed signal lines on the reverse side of a PCB in the prior art;
FIG. 3 is a schematic view of a measuring device according to an embodiment of the present invention;
FIG. 4 is an enlarged partial schematic view of FIG. 3;
FIG. 5 is a schematic illustration of an edge error of the high speed transmission line of FIG. 3 with a reference formation;
fig. 6 and fig. 7 are schematic structural diagrams of a measurement system according to an embodiment of the present invention.
Description of reference numerals:
11: Mini-SMP connector, 12: high-speed transmission line, i.e., first high-speed transmission line/second high-speed transmission line, 13: joint assembly, 14: reference formation, 15: the anchor clamps body, 16: load-bearing structure, 16a reinforcing plate, 17 primary equipment (i.e., measuring instrument), 18: radio frequency cable, 19 soldered coupling capacitor;
g1: first ground port, S1: first signal line port, S2: second signal line port, G2: a second ground port.
Detailed Description
For the purpose of better explaining the present invention and to facilitate understanding, the present invention will be described in detail by way of specific embodiments with reference to the accompanying drawings.
At present, the impedance of each differential line and high-speed line in a PCB in an optical module has a great influence on the performance of the optical module, and when the optical module is in use, the change of the impedance easily causes the failure of the optical module. The industry is limited to difficult-to-acquire measurement devices, but only concerns about the impedance of the high-speed differential lines of the fingers to the DSP in the optical module, and does not mention the variation of the high-speed signal line/differential line impedance between DSP to driver or DSP to TIA. In practice, the variation of the high speed signal line/differential line impedance from DSP to driver or DSP to TIA has a great influence on the performance of the optical module, and for this reason, how to measure the above impedance becomes a concern for the inventors in technical improvement.
Currently, the industry people propose to customize the high-speed probe station for measurement, which cannot be realized, and has problems: 1) the high-speed probe station is expensive, the customization period is long, the probe is easy to damage and can only be fixed at a certain position and cannot be flexibly moved; 2) due to the fact that the distances between the high-speed differential lines of the high-end PCBs are different in size, the customized probes cannot adapt to various scenes, even the situation that the distances between the probes cannot be matched with the distances between the high-speed signal lines to be tested occurs, and testing cannot be conducted is caused; 3) the high-speed signal wire of the high-end optical module is differentiated from a single end, different probes are needed, and the cost for customizing a plurality of sets of high-speed probe stations is too high; for enterprises in optical communication, it is not possible to implement at all; 4) because the high-speed probe is hard, if the high-speed signal line to be tested is partially arranged on the soft board substrate, the probe point is easy to cause depression and poor contact after going up, and the test is inaccurate. Therefore, the applicant creatively provides a measuring device and a measuring method for solving the problem of measuring the impedance of the high-speed signal line in the optical module.
Example one
Fig. 3 shows a measuring apparatus for measuring impedance of a high speed signal line in an optical module, according to an embodiment of the present invention, wherein the high speed signal line to be measured in the optical module is communicated with a measuring instrument by means of the measuring apparatus, such as the measuring system shown in fig. 6.
In this embodiment, the measuring device may include: the device comprises a Mini-SMP connector 11 used for being connected with the measuring instrument, a connector assembly 13 used for being connected with a high-speed signal wire to be measured, and a clamp body 15 used for connecting and supporting the Mini-SMP connector and the connector assembly.
And a Mini-SMP connector 11 for bridging with a main device 17 (the main device is various measuring instruments), and connecting the measuring device to the main device 17 through a radio frequency cable 18.
The joint assembly includes: the first ground port G1, the first signal port S1, the second signal port S2 and the second ground port G2 are arranged at intervals in sequence. That is, the connector assembly may have a "G-S-G" structure, i.e., "ground-signal-ground", and for the convenience of observation by an operator, the position between the connector assembly and the ground-signal-ground is adjusted to reduce impedance discontinuity at the interface between the connector assembly and the high-speed signal line to be measured, so as to improve the test accuracy, and the end of the G-S-G interface may be designed to be crescent.
The clamp body includes: a first high-speed transmission line 12 and a second high-speed transmission line which are parallel; a reference ground layer 14 positioned below the first high-speed transmission line and the second high-speed transmission line, and a bearing structure 16 supporting the reference ground layer, the first high-speed transmission line and the second high-speed transmission line and the Mini-SMP connector; the first high-speed transmission line, the second high-speed transmission line, the reference formation 14 and the bearing structure 16 are insulated from each other;
the first signal line port S1 is communicated with the first signal line port of the Mini-SMP connector through a first high-speed transmission line;
the second signal line port S2 is communicated with a second signal line port of the Mini-SMP connector through a second high-speed transmission line;
the first ground port G1 and the second ground port G2 communicate with the ground interface of the Mini-SMP connector through the reference formation 14, respectively.
In this embodiment, the first high speed transmission line and the second high speed transmission line are located in a first layer and the reference formation is located in a second layer, for which purpose the measuring device forms a two-layer stack.
In the embodiment, the measuring device is simple to manufacture and low in cost, can solve the problem that the impedance of a high-speed signal line in an optical module of more than 400G is extremely difficult to measure industrial pain points, and has good compatibility. In specific application, the impedance of the high-speed transmission line of the measuring device can be adjusted at will according to the impedance of the high-speed signal line to be measured, so that the optimal matching between the high-speed transmission line and the high-speed signal line can be achieved, the impedance continuity of the whole high-speed link formed by the high-speed transmission line and the high-speed signal line to be measured in the measuring device can be maintained, and the testing precision is improved.
For example, when the impedance of the high-speed signal line to be measured is in the range of 80-90 ohms, a measuring device in the range of 80-90 ohms can be manufactured, and the impedance of the measuring device can reach the range of 80-90 ohms by mainly adjusting the distance between the first high-speed transmission line and the second high-speed transmission line in the clamp body.
Or when the impedance of the high-speed signal line to be measured is in the range of 40-50 ohms, a measuring device in the range of 40-50 ohms can be manufactured, and the impedance of the measuring device can reach the range of 40-50 ohms by adjusting the distance between the first high-speed transmission line and the second high-speed transmission line in the clamp body. Therefore, the impedance continuity of the whole high-speed link formed by the high-speed transmission line and the high-speed signal line to be measured in the measuring device is kept, and the testing precision is improved.
In this embodiment, the above-mentioned bearing structure includes: the load bearing structure comprises: a load bearing portion and an extension portion that supports the Mini-SMP connector, such as the region shown at 16a in fig. 3. In this embodiment, the extension portion may be a reinforcing plate made of an insulating material, and mainly supports the Mini-SMP connector, so that the Mini-SMP connector and the radio frequency cable are more stably connected, and the signal consistency is ensured in the test process. The bearing part is used for supporting two high-speed transmission lines and a reference stratum, a soft board made of an insulating material can be selected, and the bearing part can be connected with a high-speed signal line of any optical module to be tested through a soft board structure. In the embodiment, the soft board structure is used in the joint assembly area, so that the connection stability can be better ensured, and the flexible arrangement is realized in the connection process.
The fixture body in the embodiment is provided with the high-speed transmission line on the upper layer, the reference stratum is arranged below the high-speed transmission line, the transmission of signals is ensured by adopting a two-layer stacking mode, and the accuracy of measurement is ensured. In this embodiment, the reference stratum may be a latticed copper sheet or a solid copper sheet, and preferably, the reference stratum is a stratum formed by the solid copper sheet, so that the precision of the measuring device is effectively improved, and the error effect is reduced.
Of course, in practical applications, the above-mentioned clamp body further includes a protection layer, such as a protection layer formed by a cover film, and the protection layer may be integrally formed to protect the first high-speed transmission line, the second high-speed transmission line and the reference ground layer.
In this embodiment, the shape of the clamp body is not limited, and may be a rectangle, a polygon, or a curved shape, and is selected according to actual needs. The measurement device shown in fig. 3 is a measurement device of a Y-shaped structure, the top end of the Y-shaped structure is a Mini-SMP connector, and the bottom end of the Y-shaped structure is a connector assembly. Namely, the shape of the clamp body is a Y-shaped structure, because the width of the Mini-SMP connector is larger than that of the joint component, the shape of the clamp body is set to be a Y-shaped structure for the convenience of layout.
In particular, each port in the connector assembly of the present embodiment is a female port; in order to make the ports contact with the high speed signal line to be measured better, each port in the connector assembly of the present embodiment is a crescent-shaped port, as shown in fig. 4, and each port and the corresponding connecting structure in the clamp body are integrally formed.
Furthermore, in order to better ensure the connection between the high-speed transmission lines of the clamp body in the measuring device and the interface of the Mini-SMP connector, one ends of the two high-speed transmission lines are arranged into a sheet structure, namely, the end of the first high-speed transmission line connected with the Mini-SMP connector is a sheet structure, and the edge of the sheet structure facing the Mini-SMP connector is flush with the edge of the reference stratum in the clamp body; the second high-speed transmission line has the same structure as the first high-speed transmission line. The edge copper sheet of the reference stratum is paved to the edge of the clamp body, and the edge of the sheet structure of the high-speed transmission line is flush with the edge of the reference stratum, so that the parameter performance under time domain and frequency domain tests is better.
Of course, in a specific manufacturing process, the two edges may be misaligned by an error d smaller than a preset threshold, as shown in fig. 5.
In this embodiment, the measuring device is simple to manufacture, and the measuring device meeting the impedance requirement can be manufactured as required, so that the impedance of each type of high-speed signal line in various optical modules can be tested, the convenience of measurement is ensured, and the connection is stable. Setting the distance between a first high-speed transmission line and a second high-speed transmission line in the clamp body according to the predetermined impedance of the measuring device; the measurement device meeting the impedance requirement is obtained.
The measuring device of the embodiment has the advantages of short manufacturing period and low cost, can accelerate the debugging process of a high-end optical module (namely an optical module above 400G), is low in price, and can be flexibly and conveniently moved.
In addition, it should be noted that the impedance of the measuring apparatus in this embodiment is related to the distance between the two high-speed transmission lines, the line width of each high-speed transmission line, and the distance between each high-speed transmission line and the reference ground layer.
In general, in the preparation process, the measurement device of the specified impedance can be obtained by adjusting the distance between the first high-speed transmission line and the second high-speed transmission line.
The measuring device of the embodiment is mainly used for realizing the connection between the high-speed signal wire to be measured and the measuring instrument, and in the signal transmission process, the impedance of the high-speed signal wire to be measured, the impedance of the high-speed transmission line and the impedance of the cable are basically consistent, and the measuring accuracy is guaranteed.
The high-speed signal line to be measured and the high-speed transmission line of the embodiment are both made of the same material and are both transmission lines capable of transmitting high-speed signals.
Example two
An embodiment of the present invention further provides a system for measuring impedance of a high-speed signal line in an optical module, as shown in fig. 6 and 7, including: a master/meter and a measuring apparatus for measuring impedance of a high speed signal line in an optical module as described in any of the above embodiments, the master communicating with the high speed signal line in the optical module to be measured by means of the measuring apparatus.
The main equipment is an impedance instrument such as a network analyzer or an impedance tester, and the high-speed signal line to be tested is a single-ended high-speed signal line or a differential high-speed signal line. If the signal line to be tested is the signal line to be tested of the PCB, the test result is impedance information of the signal line to be tested; if the high-speed signal line to be tested is the high-speed signal line to be tested of the PCBA, power needs to be supplied to the PCBA in the test, and the test result is impedance information of the high-speed signal line to be tested and the pin correspondingly connected with the signal line.
In the measurement system of the embodiment, the compatibility of the measurement device and the main equipment is good, the measurement device can be matched with the main equipment of the network branch and the main equipment of the TDR module, and the test method is simple to operate and quick to test.
EXAMPLE III
The embodiment of the invention also provides a measuring method adopting the measuring system, which is characterized by comprising the following steps:
101. judging whether each high-speed signal line to be measured has a disconnection area or not aiming at the high-speed signal line to be measured in the optical module;
102. if so, a coupling capacitance (e.g., coupling capacitance 19 in fig. 7) is soldered for the disconnected region of each high-speed signal line to be measured.
For example, the coupling capacitance can be 0.01uF to 0.1 uF;
103. correspondingly connecting each port of the joint assembly in the measuring device with a specified test point of the high-speed signal line to be measured;
104. and starting the main equipment of the measuring system to obtain the test result of the high-speed signal wire to be measured.
In practical application, before step 101, it is further required to determine whether the surface of the high-speed signal line to be measured is covered with a protective layer;
if the protective layer exists, removing the protective layer of the specified test point of the high-speed signal line to be tested;
and supplying power to the circuit board in the optical module with the protective layer removed by the test board, and further performing corresponding connection of each port of the connector assembly in the measuring device and the designated test point of the high-speed signal line to be measured.
In the test method, because each port in the connector assembly is independent, the connector assembly can be conveniently loaded at any specified position of a high-speed signal line to be tested, and the accuracy and the flexibility of a high-speed link in the test optical module are ensured.
Taking a test scene of a high-speed signal line to be tested in a PCB of an optical module as an example for explanation:
the first step is as follows: selecting a pair of high-speed differential lines between the DSP and the TIA as high-speed signal lines to be measured;
the second step is that: welding the coupling capacitor on the high-speed differential line; connecting each port of a connector assembly in the measuring device with the starting end of the high-speed differential wire to be measured, and welding the ports together by using an iron; connecting a Mini-SMP connector in the measuring device with a radio frequency cable and connecting the Mini-SMP connector to the main equipment;
the third step: and opening the main equipment, setting an excitation signal, clicking to operate, testing the S parameter or the TDR curve of the high-speed differential line to be tested, and identifying whether the impedance control of the high-speed signal line of a supplier (a PCB factory) meets the requirement or not according to the test result.
Taking a test scene of a high-speed signal line to be tested in a PCBA of an optical module as an example for explanation:
because the PCB becomes the PCBA after being pasted with the tin paste, three places are arranged on a typical optical module high-speed signal line, and because the solder pad has the impedance characteristics of the tin paste and the element pin, compared with the PCB state, the impedance changes, and the impedance of the three places is also a point of important attention of optical module manufacturers.
Firstly, removing a capacitor welded in an original PCBA from the PCBA, scraping green oil, and exposing a copper sheet to form a G-S-S-G structure;
secondly, butting and welding a G-S-S-G interface of a joint assembly in the measuring device and a G-S-S-G structure on the PCBA;
and thirdly, inserting the PCBA to be tested on the test board, connecting a Mini-SMP connector in the measuring device with the radio frequency cable and connecting the Mini-SMP connector to the main device, starting the power supply of the main device and the test board, starting the test, acquiring a test result, and performing impedance analysis.
The test board of the embodiment mainly supplies power to the PCBA of the optical module, and then obtains the impedance of the high-speed transmission line to be tested on the PCBA and the corresponding pin of the high-speed transmission line. The testing method is simple, and the corresponding measuring device can be selected to realize the test according to the requirement before the test.
It should be noted that in the claims, any reference signs placed between parentheses shall not be construed as limiting the claim. The word "comprising" does not exclude the presence of elements or steps not listed in a claim. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. The invention may be implemented by means of hardware comprising several distinct elements, and by means of a suitably programmed computer. In the claims enumerating several means, several of these means may be embodied by one and the same item of hardware. The use of the terms first, second, third and the like are for convenience only and do not denote any order. These words are to be understood as part of the name of the component.
Furthermore, it should be noted that in the description of the present specification, the description of the term "one embodiment", "some embodiments", "examples", "specific examples" or "some examples", etc., means that a specific feature, structure, material or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, the claims should be construed to include preferred embodiments and all changes and modifications that fall within the scope of the invention.
It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention should also include such modifications and variations.
Claims (9)
1. A measuring apparatus for measuring impedance of a high speed signal line in an optical module, wherein the high speed signal line to be measured in the optical module is connected to a measuring instrument by means of the measuring apparatus, the measuring apparatus comprising:
the fixture comprises a Mini-SMP connector, a connector assembly and a fixture body, wherein the Mini-SMP connector is used for being connected with the measuring instrument, the connector assembly is used for being connected with a high-speed signal line to be measured, and the fixture body is used for connecting and supporting the Mini-SMP connector and the connector assembly;
the joint assembly includes: the signal line comprises a first ground port (G1), a first signal line port (S1), a second signal line port (S2) and a second ground port (G2) which are sequentially arranged at intervals;
the clamp body includes: a first high-speed transmission line and a second high-speed transmission line which are parallel; the bearing structure is positioned below the first high-speed transmission line and the second high-speed transmission line and used for supporting the reference ground layer, the first high-speed transmission line, the second high-speed transmission line and the Mini-SMP connector; the first high-speed transmission line, the second high-speed transmission line, the reference stratum and the bearing structure are insulated from each other;
the first signal line port (S1) is communicated with the first signal line port of the Mini-SMP connector through a first high-speed transmission line;
the second signal line port (S2) is communicated with the second signal line port of the Mini-SMP connector through a second high-speed transmission line;
the first ground port (G1) and the second ground port (G2) are respectively communicated with the ground interface of the Mini-SMP connector through a reference ground layer.
2. The measurement device of claim 1, wherein the load bearing structure comprises: a carrier and an extension supporting the Mini-SMP connector;
the extension includes: a reinforcing plate made of an insulating material; the bearing part includes: a flexible board made of insulating material.
3. A measuring device according to claim 1 or 2, characterized in that the reference formation is a formation formed by a solid copper skin;
and/or the presence of a gas in the gas,
the clamp body further comprises a protective layer which is integrally formed and protects the first high-speed transmission line, the second high-speed transmission line and the reference stratum;
and/or the presence of a gas in the gas,
the measuring device is of a Y-shaped structure, the Mini-SMP connector is arranged at the top end of the Y-shaped structure, and the joint assembly is arranged at the bottom end of the Y-shaped structure.
4. A measuring device according to claim 1 or 2,
each port in the fitting assembly is a female port; the structure of each port and the corresponding connection in the clamp body is integrally formed;
or each port in the joint component is a crescent-shaped port, and each port and the corresponding connected structure in the clamp body are integrally formed.
5. A measuring device according to claim 1 or 2,
one end of the first high-speed transmission line, which is connected with the Mini-SMP connector, is of a sheet structure, and the edge of the sheet structure, which faces the Mini-SMP connector, is flush with the edge of the reference stratum in the clamp body;
the second high-speed transmission line has the same structure as the first high-speed transmission line.
6. A measurement system for measuring impedance of a high speed signal line in an optical module, comprising: a measuring instrument and a measuring device for measuring impedance of a high speed signal line in an optical module according to any of claims 1 to 5, wherein the measuring instrument is connected to the high speed signal line in the optical module to be measured by the measuring device.
7. A measuring method using the measuring system according to claim 6, comprising:
judging whether each high-speed signal line to be measured has a disconnection area or not aiming at the high-speed signal line to be measured in the optical module;
if the high-speed signal line exists, welding a coupling capacitor aiming at the disconnection area of each high-speed signal line to be measured;
correspondingly connecting each port of the joint assembly in the measuring device with a specified test point of the high-speed signal line to be measured;
and starting a measuring instrument of the measuring system to obtain a test result of the high-speed signal wire to be tested.
8. The method of claim 7, wherein before connecting each port of the connector assembly of the measuring apparatus to a designated test point of the high-speed signal line to be measured, the method further comprises:
judging whether the surface of the high-speed signal line to be measured is covered with a protective layer;
if the protective layer exists, removing the protective layer of the specified test point of the high-speed signal line to be tested;
and supplying power to the circuit board in the optical module with the protective layer removed by the test board, and further performing corresponding connection of each port of the connector assembly in the measuring device and the designated test point of the high-speed signal line to be measured.
9. The measuring method according to claim 7 or 8,
the coupling capacitance is 0.01-0.1 uF;
the measuring instrument is an impedance instrument, and the high-speed signal line to be measured is a single-ended high-speed signal line or a differential high-speed signal line.
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