CN113211316B - Wireless detection platform and detection method for semiconductor wafer self-rotation grinding - Google Patents
Wireless detection platform and detection method for semiconductor wafer self-rotation grinding Download PDFInfo
- Publication number
- CN113211316B CN113211316B CN202110565515.6A CN202110565515A CN113211316B CN 113211316 B CN113211316 B CN 113211316B CN 202110565515 A CN202110565515 A CN 202110565515A CN 113211316 B CN113211316 B CN 113211316B
- Authority
- CN
- China
- Prior art keywords
- vacuum adsorption
- semiconductor wafer
- porous ceramic
- grinding
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000227 grinding Methods 0.000 title claims abstract description 75
- 239000004065 semiconductor Substances 0.000 title claims abstract description 67
- 238000001514 detection method Methods 0.000 title claims abstract description 61
- 238000001179 sorption measurement Methods 0.000 claims abstract description 115
- 239000000919 ceramic Substances 0.000 claims abstract description 105
- 238000012545 processing Methods 0.000 claims abstract description 31
- 238000000034 method Methods 0.000 claims abstract description 23
- 230000008569 process Effects 0.000 claims abstract description 20
- 238000012544 monitoring process Methods 0.000 claims abstract description 9
- 239000013078 crystal Substances 0.000 claims abstract description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 62
- 230000005540 biological transmission Effects 0.000 claims description 39
- 238000007789 sealing Methods 0.000 claims description 19
- 230000007704 transition Effects 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 11
- 238000000605 extraction Methods 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 claims 13
- 238000007689 inspection Methods 0.000 claims 2
- 238000003776 cleavage reaction Methods 0.000 abstract description 3
- 238000003754 machining Methods 0.000 abstract description 3
- 238000005498 polishing Methods 0.000 abstract description 3
- 230000007017 scission Effects 0.000 abstract description 3
- 230000007246 mechanism Effects 0.000 abstract description 2
- 230000009466 transformation Effects 0.000 abstract description 2
- 239000000243 solution Substances 0.000 description 7
- 238000005259 measurement Methods 0.000 description 6
- 229910010293 ceramic material Inorganic materials 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 241001391944 Commicarpus scandens Species 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000010485 coping Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 241000252254 Catostomidae Species 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000011001 backwashing Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000004078 waterproofing Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
- B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
- B24B49/045—Specially adapted gauging instruments
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/068—Table-like supports for panels, sheets or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/226—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain in which the tool is supported by the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
The invention provides a wireless detection platform and a detection method for self-rotation grinding of a semiconductor wafer. The semiconductor wafer polishing device comprises a semiconductor wafer, a repairable porous ceramic disc, a detection module, a vacuum adsorption module, a bottom table and a rotary worktable, wherein the semiconductor wafer is fixed on the upper surface of the repairable porous ceramic disc in a vacuum adsorption mode, the vacuum adsorption module is connected to the bottom table, the bottom table is connected to the rotary worktable, the rotary worktable is installed on a grinding machine, and the detection module is installed in the repairable porous ceramic disc and is used for carrying out online monitoring on various machining indexes of the semiconductor wafer in different crystal directions and radial directions. The detection platform provided by the invention can be used for efficiently and stably monitoring the processing state of the semiconductor wafer in the self-rotating grinding process on line, and has important significance in aspects of brittle-plastic transformation mechanism, obtaining critical cleavage conditions of the semiconductor wafer, improving surface integrity, controlling sub-surface damage and the like in the grinding process.
Description
Technical Field
The invention relates to the technical field of semiconductor wafer processing and detection, in particular to a wireless detection platform and a detection method for semiconductor wafer self-rotation grinding.
Background
The main processing mode of the semiconductor wafer is ultra-precision grinding processing based on the workpiece self-rotation principle, and the semiconductor wafer can be quickly thinned to the required thickness through the self-rotation grinding processing, so that the subsequent polishing time is reduced, the production efficiency is improved, and the production cost is reduced. However, since the essence of grinding is that the abrasive particles are cut into the workpiece under the action of the machine and then the material is removed by the additive effect of the abrasive particles, various problems inevitably occur in the process, such as heat accumulation caused by friction between a large amount of abrasive particles and the workpiece, vibration caused by a machine tool-grinding wheel-workpiece system, mechanical force under different process parameters, and influence on material characteristics due to machining damage, which may cause significant defects on the machined surface/sub-surface of the semiconductor wafer, and seriously affect the service performance of the semiconductor wafer and the service life of the packaged device. In addition, due to the particularity of ultra-precision grinding based on the workpiece self-rotation principle, the processing states of each crystal phase and the radial direction on the wafer are different in the self-rotation process. Therefore, the processing states of all crystal phases and radial directions of the semiconductor wafer can be effectively obtained in real time aiming at the processing indexes such as grinding heat, system vibration, grinding force and the like generated in the multi-point measurement and control in the self-rotation process of the wafer and on-line monitoring and grinding process, so that the overall stability of the processing process is ensured, and the method has important significance for the aspects of plastic domain grinding, critical cleavage condition obtaining, surface integrity improving, subsurface damage controlling and the like of the semiconductor wafer.
At present, aiming at the fact that the published literature of the self-rotating grinding detection platform is less, the patent published by Beijing university of industry with publication No. CN1093333600A and the article entitled "measurement of grinding force during silicon wafer self-rotating grinding", and "In-process measurement of the grinding force In silicon wafer self-rotating grinding process" describe an online measurement device and method for wafer thinning grinding force, and the device has some problems as follows: the semiconductor wafer is connected with the working table through the back adhesive, the diameter-thickness ratio of the semiconductor wafer is large, the wafer is difficult to completely take down from the working table after the processing is finished through an adhesive connection mode, the bonding force is large, the thickness of the wafer is small, the semiconductor wafer is easy to break in the taking-down process, and the processing efficiency is low and the resources are wasted. Meanwhile, the thinned wafer is easy to warp and bend by using the gum, and the subsequent processing requirements cannot be met; 2. the film pressure sensor has poor reliability and low detection precision, the film pressure sensor is easy to break down due to the direct contact with the wafer and the self-rotating grinding dynamic force detection environment, and the film pressure sensor needs to be checked every time of replacement, so that the detection precision is affected due to the complex process. Meanwhile, the film pressure sensor has single detection index, only detects the normal force, and has larger detection limitation. The thickness of the film pressure sensor is larger than the thickness of the gum by 3-10 mu m, and the film pressure sensor is thicker than the gum, so that local unevenness occurs after the whole wafer is bonded and covered, stress concentration is easy to occur in the grinding process, adverse effects are generated on the wafer processing, and the grinding force detection is inaccurate. 4. The wireless receiving modules in the data acquisition and wireless transmission module are dispersedly arranged in the cavity of the device, and are very easy to be damaged in the high-speed rotation of the rotary table and are not subjected to independent waterproof treatment. Meanwhile, the integrity of the device is damaged due to the external arrangement of the data transmission antenna, the data transmission is easily interfered by the external environment, and the possibility of water inlet of the device is increased due to the holes formed in the outer wall.
Disclosure of Invention
In order to solve the problems, the invention provides a wireless detection platform for self-rotation grinding of a semiconductor wafer and a detection method thereof. The platform is provided with a plurality of measurement and control sites on a ceramic disc capable of being polished, a plurality of sensors are used, a semiconductor wafer is fixedly processed in a vacuum adsorption mode, the sensors transmit acquired multi-channel signals to a wireless data acquisition and transmission module in a space in a bottom platform through internal wiring, and then data are transmitted to an external computer through a built-in antenna to realize wireless acquisition transmission and real-time monitoring of multiple processing indexes. The technical means adopted by the invention are as follows:
a wireless detection platform for self-rotation grinding of semiconductor wafer comprises a semiconductor wafer, a porous ceramic disc capable of being polished, a detection module, a vacuum adsorption module, a wireless data acquisition transmission module, a bottom table and a rotary table, the semiconductor wafer is fixed on the upper surface of the porous ceramic disc which can be polished in a vacuum adsorption mode, the vacuum adsorption module is connected on the bottom table, the wireless data acquisition transmission module is arranged in the bottom table, the bottom table is connected to the rotary worktable which is arranged on the grinding machine, the detection module is arranged in the porous ceramic disc which can be ground, it is used for on-line monitoring of various processing indexes of different crystal directions and radial directions of a semiconductor wafer, and meanwhile, the detected information is transmitted to the wireless data acquisition and transmission module, and the information is wirelessly transmitted to an external computer through the wireless data acquisition and transmission module.
The repairable porous ceramic disc comprises a porous ceramic disc and a porous ceramic assembly ring, the porous ceramic disc is arranged in the porous ceramic assembly ring, the upper surfaces of the porous ceramic disc and the porous ceramic assembly ring are flush, the repairable porous ceramic disc is assembled with the vacuum adsorption module in a mode that bolts are uniformly distributed in the circumferential direction, sensing head positioning hole assembly holes used for installing the detection module are formed in the porous ceramic disc, and the lower surface of the porous ceramic disc is in contact with the vacuum adsorption module.
Furthermore, the detection module comprises a sensor, a sensing head and a sensing head positioning ring, wherein a sensing head positioning hole is formed in the sensing head positioning ring, the sensing head positioning hole is assembled with the sensing head, the upper surface of the sensing head positioning ring is flush with the upper surface of the sensing head, the sensing head positioning ring is externally installed in a porous ceramic disc capable of being polished, and the upper surface of the sensing head positioning ring is flush with the upper surface of the porous ceramic disc.
Furthermore, the vacuum adsorption module comprises a ceramic sucker, the ceramic sucker is provided with a sensor installation groove for installing a sensor, and the sensor is connected with the wireless data acquisition and transmission module; the vacuum adsorption transition water channel is arranged on the mounting contact surface of the ceramic sucker and the base platform, and an inner sealing channel and an outer sealing channel are arranged on the inner ring and the outer ring of the vacuum adsorption transition water channel.
Furthermore, the wireless data acquisition transmission module comprises a signal acquisition module, a power supply module and a built-in antenna, and all the modules are integrated in the shell of the wireless data acquisition transmission module.
Further, an inner sealing ring and an outer sealing ring are respectively arranged in the inner sealing channel and the outer sealing channel.
Further, the inside bottom platform space, vacuum adsorption water course chamber, surrounding type vacuum adsorption water course and the vacuum adsorption water course mouth of being provided with of bottom platform, surrounding type vacuum adsorption water course with the vacuum adsorption water course net in the ceramic sucking disc passes through the vacuum adsorption transition water course is connected, the vacuum adsorption water course mouth is surrounding type vacuum adsorption water course is connected the initial position in vacuum adsorption water course chamber just corresponds with every surrounding type vacuum adsorption water course, vacuum adsorption water course chamber with workstation vacuum adsorption water course chamber on the rotary worktable contacts, workstation vacuum adsorption water course chamber is connected with the inside vacuum adsorption equipment of grinding machine, surrounding type vacuum adsorption water course equipartition is in ceramic sucking disc with inside the outer wall of bottom platform.
Furthermore, a plurality of connected water channels are regularly distributed in the non-sensor mounting groove area on the upper surface of the ceramic sucker to form the vacuum adsorption water channel net, and the cross section of the vacuum adsorption water channel net is semicircular, so that backwash water can directly enter the porous ceramic plate through the vacuum adsorption water channel net.
Furthermore, a plurality of material reducing grooves used for reducing the overall mass and the local thickness of the ceramic sucker are formed in the lower bottom surface of the ceramic sucker.
The invention also discloses a detection method of the wireless detection platform for the self-rotation grinding of the semiconductor wafer, which comprises the following steps:
and 3, grinding, wherein the grinding state of the semiconductor wafer is transmitted to the sensor through the sensing head along with the continuous downward feeding of the grinding wheel in the grinding process, different types of sensors generate different signals to the wireless data acquisition transmission module, and the signals are transmitted to the computer through the built-in antenna, so that the processing state of the semiconductor wafer is monitored in real time through the computer.
The invention has the following advantages:
the detection platform and the detection method provided by the invention can be used for efficiently and stably monitoring various processing indexes in the self-rotating grinding process of the semiconductor wafer on line, and have important significance on the aspects of a brittle-plastic transformation mechanism, the critical cleavage condition of the semiconductor wafer, the improvement of surface integrity, the control of subsurface damage and the like in the grinding process. In addition, the invention can be applied to the on-line monitoring in a semiconductor wafer grinding processing production line by matching with an industrial manipulator. The invention also has the following advantages: the platform fixes the semiconductor wafer in a vacuum adsorption mode, and the vacuum adsorption device is used for transferring adsorption force to the upper surface of the detection platform, so that the safe and quick assembly and disassembly of the wafer can be realized; multiple processing indexes of different crystal directions and radial directions of a semiconductor wafer can be monitored simultaneously by arranging a plurality of measurement and control sites and using a multi-class sensor; the designed porous ceramic disc structure capable of being polished can realize a fixing mode of vacuum adsorption of a semiconductor wafer, and can also immediately polish the surface of the platform to ensure absolute smoothness of the surface of the processing platform so as to realize high-precision grinding of the semiconductor wafer; the high integration, built-in power supply, internal wiring, built-in antenna, multilayer water proofing and the like of the wireless data acquisition transmission module avoid wire winding and ensure the integrity, safety and data transmission stability of the platform.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is an exploded view of the present invention.
Fig. 2 is a top view of the overall structure of the present invention.
Fig. 3 is a sectional view a-a of fig. 2.
Fig. 4 is a sectional view B-B of fig. 2.
FIG. 5 is a schematic diagram of the top surface structure of the ceramic chuck in an embodiment of the present invention.
In the figure: 1. a semiconductor wafer; 21. a porous ceramic disk assembly ring; 22. a porous ceramic disk; 23. a positioning ring assembly hole; 31. a sensing head positioning hole; 32. a sensing head positioning ring; 33. a sensing head; 34. a sensor; 41. a ceramic chuck; 42. vacuum adsorption water channel net; 43. a sensor mounting groove; 44. a surrounding type vacuum adsorption water channel; 45. a material reducing tank; 46. a sensor wiring hole; 51. a base table; 52. an outer sealing ring; 53. an inner seal ring; 54. a bottom stage inner space; 55. a wireless data acquisition transmission module; 56. vacuum adsorption of transition water channels; 57. sealing the channel externally; 58. an inner sealing channel; 61. a rotary table; 62. a vacuum adsorption water channel cavity; 63. and (5) vacuum adsorption water channel openings.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in FIGS. 1-5, the embodiment of the invention discloses a wireless detection platform for semiconductor wafer self-rotation grinding, comprising a semiconductor wafer 1, a porous ceramic disc capable of being polished, a detection module, a vacuum adsorption module, a wireless data acquisition transmission module, a bottom platform and a rotary worktable, the semiconductor wafer is fixed on the upper surface of the porous ceramic disc which can be polished in a vacuum adsorption mode, the vacuum adsorption module is connected on the bottom table, the wireless data acquisition transmission module is arranged in the bottom table, the bottom table is connected to the rotary worktable 61, the rotary worktable is arranged on a grinding machine, the detection module is arranged in a porous ceramic disc which can be ground, it is used for on-line monitoring of various processing indexes of different crystal directions and radial directions of a semiconductor wafer, and meanwhile, the detected information is transmitted to the wireless data acquisition and transmission module, and the information is wirelessly transmitted to an external computer through the wireless data acquisition and transmission module. The repairable porous ceramic disc comprises a porous ceramic disc 22 and a porous ceramic assembling ring 21, and the porous ceramic disc and the porous ceramic assembling ring are assembled in a bonding mode. The porous ceramic disc is arranged in the porous ceramic assembly ring, the upper surfaces of the porous ceramic disc and the porous ceramic assembly ring are flush, the porous ceramic disc capable of being polished is assembled with the vacuum adsorption module in a mode that bolts are uniformly distributed in the circumferential direction, a sensing head positioning hole assembly hole used for installing the detection module is formed in the porous ceramic disc, and the lower surface of the porous ceramic disc is in contact with the vacuum adsorption module.
The detection module comprises a sensor, a sensing head and a sensing head positioning ring, wherein a sensing head positioning hole 31 is arranged in the sensing head positioning ring 32, the outer surface of the sensing head positioning ring is assembled with a positioning ring assembling hole 23 on the porous ceramic disc in a bonding mode, the sensing head positioning ring is assembled with the sensing head 33, the upper surface of the sensing head positioning ring is flush with the upper surface of the sensing head, the sensing head positioning ring is installed in the repairable porous ceramic disc, and the upper surface of the sensing head positioning ring is flush with the upper surface of the porous ceramic disc. The sensing head is connected with the sensor through threads.
The vacuum adsorption module comprises a ceramic sucker 41, a sensor mounting groove 43 for mounting the sensor 34 is formed in the ceramic sucker, and the lower bottom surface of the sensor is fixed with a sensor mounting position in the sensor mounting groove through a bolt. A sensor wiring hole 46 is formed in the side surface of the sensor mounting groove, and a wire of the sensor is connected to the wireless data acquisition transmission module 55 through the sensor wiring hole; be provided with vacuum adsorption water course net 42 in the ceramic sucking disc, with bottom surface contact under the porous ceramic dish, many continuous water courses of arranging are constituteed by multistage endocentric circular arc water course to the regional rule of ceramic sucking disc upper surface non-sensor mounting groove the vacuum adsorption water course net, in this embodiment, vacuum adsorption water course net comprises multistage endocentric circular arc water course, for guaranteeing porous ceramic dish adsorption on a large scale, concentric circular arc preferred is the major arc that is close whole circle, and simultaneously, links to each other through many sharp water courses between each circular arc water course, when guaranteeing to adsorb on a large scale, the increase is intake/is gone out water efficiency, in this embodiment vacuum adsorption water course net closes sensor mounting groove design, under the normal work of noninterference sensor, furthest's assurance integrated device volume reduce and adsorption affinity as strong as far as possible. The ceramic suckers are uniformly connected with the base platform in the circumferential direction through a plurality of bolts. And a vacuum adsorption transition water channel 56 is arranged at the mounting contact surface of the ceramic sucker and the bottom platform, and an inner sealing channel 58 and an outer sealing channel 57 are arranged on the inner ring and the outer ring of the vacuum adsorption transition water channel.
The wireless data acquisition transmission module comprises a signal acquisition module, a power supply module and a built-in antenna, all the modules are integrated in a shell of the wireless data acquisition transmission module, so that the module is hidden in fig. 3 and 4, and specifically, the wireless data acquisition transmission module can be selected or customized according to detection indexes, the number and types of sensors, an NI9629DeVKit bare board, an NI6252 multi-channel voltage acquisition module, a built-in battery, a built-in antenna and the like are selected in the embodiment, then, the accessories are integrated and a waterproof shell, a waterproof connector and the like are customized, the whole wireless data acquisition transmission module is integrally installed in the space in the base station, and therefore, the stability of signal acquisition and data transmission is guaranteed, and the overall safety of the structure of the wireless data acquisition transmission module is guaranteed. In this embodiment, the wireless data acquisition and transmission module transmits data through a wifi protocol.
An inner sealing ring 53 and an outer sealing ring 52 are respectively arranged in the inner sealing channel and the outer sealing channel, and the sealing channel and the sealing ring disclosed by the embodiment have two beneficial effects, one is that the waterproof performance of the contact surface of the ceramic sucker and the bottom platform is ensured, and cooling liquid is prevented from entering the platform through the contact surface; and secondly, the tightness of the vacuum adsorption transition water channel is ensured, and liquid leakage or air leakage in the processes of injecting backflushing water and extracting vacuum is avoided.
A bottom stage inner space 54,The vacuum adsorption water channel comprises a vacuum adsorption water channel cavity, an encircling vacuum adsorption water channel 44 and a vacuum adsorption water channel port, wherein the encircling vacuum adsorption water channel is connected with a vacuum adsorption water channel net in the ceramic sucker through the vacuum adsorption transition water channel, the vacuum adsorption water channel port 63 is formed in a way that the encircling vacuum adsorption water channel is connected with the initial position of the vacuum adsorption water channel cavity and is connected with each encircling vacuum adsorption water channel, the vacuum adsorption water channel cavity is in contact with a workbench vacuum adsorption water channel cavity 62 on the rotary workbench, and the workbench vacuum adsorption water channel cavity is connected with a vacuum adsorption device inside the grinding machine. The surrounding vacuum adsorption water channels are uniformly distributed in the ceramic sucker and the outer wall of the bottom platform,the structure improves the defect of internal arrangement of the water channel of the traditional sucking disc, and can save the internal space of the ceramic sucking disc and the bottom table And conditions are created for the placing space of the wireless data acquisition transmission module.
The lower bottom surface of the ceramic sucker is provided with a plurality of material reducing grooves 45 used for reducing the overall mass and the local thickness of the ceramic sucker, and as an optimal implementation mode, on the premise of ensuring the overall strength and the function of the ceramic sucker, the material reducing grooves are larger and better.
The invention also discloses a detection method of the wireless detection platform for the self-rotation grinding of the semiconductor wafer, wherein the fixing mode of the semiconductor wafer before processing is mainly completed through vacuum adsorption, and the detection method comprises the following steps:
after the whole detection platform is installed, the vacuum adsorption device inside the grinding machine is enabled to upwards inject backwash water through the control panel of the grinding machine, the backwash water enters the vacuum adsorption water channel cavity and the vacuum adsorption water channel cavity of the workbench, then the backwash water enters the plurality of surrounding vacuum adsorption water channels in the bottom platform through the vacuum adsorption water channel opening, the backwash water continuously upwards enters the vacuum adsorption transition water channel, the backwash water enters the vacuum adsorption water channel network through the plurality of surrounding vacuum adsorption water channels arranged in the ceramic sucker along with the gradual increase of water pressure, then the backwash water is continuously injected, the backwash water is gathered on the upper surface of the detection platform through the porous ceramic disc, then the backwash water injection is stopped, the semiconductor wafer is fixed to a proper position and then is vacuumized through the control panel, at the moment, all the surrounding vacuum adsorption water channels in the platform are in a vacuum pumping state, and the semiconductor wafer is firmly adsorbed on the upper surface of the detection platform, fixing the semiconductor wafer before processing;
after the semiconductor wafer is fixed in a vacuum adsorption mode, grinding processing can be carried out on the semiconductor wafer, the processing state of the semiconductor wafer is transmitted to the sensor through the sensing head along with continuous feeding of the grinding wheel in the grinding process, different types of sensors generate different signals to the wireless data acquisition transmission module, and then the signals are transmitted to the computer through the built-in antenna, so that the processing state of the semiconductor wafer is monitored in real time through the computer.
The coping porous ceramic disc has three characteristics. Firstly, the hardness of the ceramic material cannot be greater than that of the grinding material of the grinding wheel, and the grinding wheel can be used for flattening the upper surface of the ceramic material, so that the flatness of the wafer mounting surface is ensured; secondly, the porous ceramic plate must be made of porous ceramic materials, and the inside of the porous ceramic plate is of a porous structure so as to ensure the smoothness of the backwashing water and vacuum extraction process. The porous ceramic disc assembling ring is made of the same material as the ceramic sucking disc, and can be flattened by using a grinding wheel; thirdly, the coping porous ceramic disc and the ceramic sucker cannot block the transmission of electromagnetic waves so as to ensure the stability of wireless signal transmission.
The detection module comprises a sensor, a sensing head and a sensing head positioning ring, wherein the sensing head positioning ring is made of the same material as the ceramic sucker, and can be flattened by using a grinding wheel. The sensors are selected or customized according to the machining state indexes, such as a vibration sensor, a thermocouple sensor and a force sensor, which respectively detect vibration, grinding heat and grinding force generated in the grinding process. Force transducer is used as an example in this embodiment, in order to guarantee the accuracy that grinding force detected in the grinding process, can select for use high performance piezoelectric type or strain formula three-way force transducer, detect a plurality of position normal directions, tangential and radial grinding force simultaneously, high performance three-way force transducer's use has increased the variety of detection index and the accuracy of dynamometry, combines the direct contact of sensor and work piece material can be avoided to the sense head, improves the life of sensor. The sensing head needs to be customized according to the type selection and the working environment of the sensor, and the polishing can be carried out on the premise that the upper surface of the sensing head is enabled to be flush with the upper surfaces of the sensing head positioning ring and the porous ceramic disc capable of being polished.
The arrangement mode of the sensors in the detection module is uniformly distributed along the radius direction, the purpose is to detect the processing states of different crystal orientations of the semiconductor wafer under different radii.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (8)
1. A wireless detection platform for semiconductor wafer self-rotation grinding is characterized by comprising a semiconductor wafer, a porous ceramic disc capable of being polished, a detection module, a vacuum adsorption module, a wireless data acquisition transmission module, a bottom table and a rotary worktable, the semiconductor wafer is fixed on the upper surface of the porous ceramic disc which can be polished in a vacuum adsorption mode, the vacuum adsorption module is connected on the bottom table, the wireless data acquisition transmission module is arranged in the bottom table, the bottom table is connected to the rotary worktable which is arranged on the grinding machine, the detection module is arranged in the porous ceramic disc which can be ground, it is used for on-line monitoring of various processing indexes of different crystal directions and radial directions of a semiconductor wafer, meanwhile, the detected information is transmitted to the wireless data acquisition and transmission module, and the information is wirelessly transmitted to an external computer through the wireless data acquisition and transmission module;
the vacuum adsorption module comprises a ceramic sucker, the ceramic sucker is provided with a sensor installation groove for installing a sensor, and the sensor is connected with the wireless data acquisition and transmission module; a vacuum adsorption transition water channel is arranged at the mounting contact surface of the ceramic sucker and the base platform, and an inner sealing channel and an outer sealing channel are arranged on the inner ring and the outer ring of the vacuum adsorption transition water channel;
the utility model discloses a grinding machine, including base frame, vacuum adsorption water course, surrounding type vacuum adsorption water course and grinding machine, the inside base frame inner space, vacuum adsorption water course chamber, surrounding type vacuum adsorption water course and the vacuum adsorption water course mouth of being provided with of base frame, the surrounding type vacuum adsorption water course with vacuum adsorption water course net in the ceramic sucking disc passes through the vacuum adsorption transition water course is connected, the vacuum adsorption water course mouth is surrounding type vacuum adsorption water course connects the initial position in vacuum adsorption water course chamber and corresponding with every surrounding type vacuum adsorption water course, vacuum adsorption water course chamber with workstation vacuum adsorption water course chamber on the rotary worktable contacts, workstation vacuum adsorption water course chamber is connected with the inside vacuum adsorption equipment of grinding machine, surrounding type vacuum adsorption water course equipartition is in the ceramic sucking disc with inside the outer wall of base frame.
2. The wireless detection platform for self-rotation grinding of semiconductor wafers as claimed in claim 1, wherein the repairable porous ceramic disk comprises a porous ceramic disk and a porous ceramic assembly ring, the porous ceramic disk is arranged in the porous ceramic assembly ring, the upper surfaces of the porous ceramic disk and the porous ceramic assembly ring are flush, the repairable porous ceramic disk is assembled with the vacuum adsorption module through circumferentially and uniformly distributed bolts, a sensing head positioning hole assembly hole for installing the detection module is formed in the porous ceramic disk, and the lower surface of the porous ceramic disk is in contact with the vacuum adsorption module.
3. The wireless detection platform for self-rotation grinding of semiconductor wafers as claimed in claim 1, wherein the detection module comprises a sensor, a sensing head and a sensing head positioning ring, the sensing head positioning ring is internally provided with a sensing head positioning hole, assembled with the sensing head and an upper surface of the sensing head positioning ring is flush with an upper surface of the sensing head, the sensing head positioning ring is externally mounted in a repairable porous ceramic disc, and the upper surface of the sensing head positioning ring is flush with the upper surface of the porous ceramic disc.
4. The wireless inspection platform of claim 1, wherein the wireless data acquisition and transmission module comprises a signal acquisition module, a power supply module and a built-in antenna, and each module is integrated inside a wireless data acquisition and transmission module housing.
5. The wireless detection platform for self-rotation grinding of semiconductor wafers as claimed in claim 1, wherein an inner seal ring and an outer seal ring are respectively disposed in the inner seal channel and the outer seal channel.
6. The wireless detection platform for self-rotation grinding of a semiconductor wafer as claimed in claim 1, wherein the vacuum adsorption water channel net is formed by regularly arranging a plurality of connected water channels in a non-sensor mounting groove region on the upper surface of the ceramic chuck, and the cross section of the vacuum adsorption water channel net is semicircular, so that the backwash water can directly enter the porous ceramic disk through the vacuum adsorption water channel net.
7. The wireless inspection platform of claim 1, wherein the lower bottom surface of the ceramic chuck is configured with a plurality of material reduction grooves for reducing the overall mass and local thickness of the ceramic chuck.
8. The detection method of the wireless detection platform according to any one of claims 1 to 7, characterized by comprising the following steps:
step 1, injecting backwash water upwards by a vacuum adsorption device in a grinding machine through a control panel of the grinding machine, sequentially filling each water channel after the backwash water enters a vacuum adsorption water channel cavity of a workbench until the backwash water is gathered on the upper surface of a detection platform through a porous ceramic disc, and then stopping injecting the backwash water;
step 2, fixing the semiconductor wafer on the porous ceramic disc, starting to extract vacuum through the control panel, wherein all the surrounding vacuum adsorption water channels in the platform are in a vacuum extraction state, and the semiconductor wafer is firmly adsorbed on the upper surface of the detection platform to complete the fixation of the semiconductor wafer before processing;
and 3, grinding, wherein the grinding state of the semiconductor wafer is transmitted to the sensor through the sensing head along with the continuous downward feeding of the grinding wheel in the grinding process, different types of sensors generate different signals to the wireless data acquisition transmission module, and the signals are transmitted to the computer through the built-in antenna, so that the processing state of the semiconductor wafer is monitored in real time through the computer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110565515.6A CN113211316B (en) | 2021-05-24 | 2021-05-24 | Wireless detection platform and detection method for semiconductor wafer self-rotation grinding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110565515.6A CN113211316B (en) | 2021-05-24 | 2021-05-24 | Wireless detection platform and detection method for semiconductor wafer self-rotation grinding |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113211316A CN113211316A (en) | 2021-08-06 |
| CN113211316B true CN113211316B (en) | 2022-03-11 |
Family
ID=77098073
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110565515.6A Active CN113211316B (en) | 2021-05-24 | 2021-05-24 | Wireless detection platform and detection method for semiconductor wafer self-rotation grinding |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113211316B (en) |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4755746A (en) * | 1985-04-24 | 1988-07-05 | Prometrix Corporation | Apparatus and methods for semiconductor wafer testing |
| JP3601910B2 (en) * | 1995-07-20 | 2004-12-15 | 株式会社荏原製作所 | Polishing apparatus and method |
| JPH10284580A (en) * | 1997-04-11 | 1998-10-23 | Mecs:Kk | Semiconductor wafer position detecting equipment |
| US6635512B1 (en) * | 1999-11-04 | 2003-10-21 | Rohm Co., Ltd. | Method of producing a semiconductor device by dividing a semiconductor wafer into separate pieces of semiconductor chips |
| JP2001287161A (en) * | 2000-04-07 | 2001-10-16 | Seiko Epson Corp | Retainer for substrate-to-be-polished and cmp apparatus equipped therewith |
| TW442363B (en) * | 2000-06-12 | 2001-06-23 | United Microelectronics Corp | Device and method of the end point detector for the CMP |
| JP2005011977A (en) * | 2003-06-18 | 2005-01-13 | Ebara Corp | Device and method for substrate polishing |
| JP2008066607A (en) * | 2006-09-11 | 2008-03-21 | Tokyo Ohka Kogyo Co Ltd | Vacuum suction apparatus |
| KR101166430B1 (en) * | 2010-12-20 | 2012-07-19 | 쿠어스텍아시아 유한회사 | A porous chuck of fixing semiconductor wafer with vacuum suction |
-
2021
- 2021-05-24 CN CN202110565515.6A patent/CN113211316B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN113211316A (en) | 2021-08-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102560691B1 (en) | Polishing apparatus and polishing method | |
| TWI720443B (en) | Retaining ring for chemical mechanical polishing and carrier head including the same | |
| US8968052B2 (en) | Systems and methods of wafer grinding | |
| TWI822712B (en) | Polishing apparatus and polishing method | |
| KR102564376B1 (en) | Chemical mechanical polishing smart ring | |
| CN110549507B (en) | Scribing machine height measurement method, height measurement device and scribing machine | |
| CN201940657U (en) | Clamp for hub inflation and deflation dowelling jig | |
| CN109333360B (en) | Online measuring device and method for wafer thinning grinding force | |
| CN113211316B (en) | Wireless detection platform and detection method for semiconductor wafer self-rotation grinding | |
| CN109848892A (en) | A kind of fixture unit and operating method clamping thin-walled parts | |
| CN107253146A (en) | A kind of robot polishing system of multifunctional polishing head assembly and its composition | |
| CN105058225A (en) | Grinding pad fixing device and chemical machinery grinder | |
| CN103639888B (en) | Retainer ring and rubbing head | |
| CN108393793B (en) | Air-suction type bonding-free workpiece bearing device for single-side grinding and polishing | |
| CN114454024A (en) | Wafer processing equipment | |
| JP7244250B2 (en) | Magnetic element and eddy current sensor using it | |
| CN110153859A (en) | A kind of Full-automatic grinder | |
| CN110174128A (en) | Encoder and standby current abnormality judgment method | |
| CN103831710B (en) | Grinding head with wafer detecting apparatus | |
| CN112247836A (en) | Novel adjustable gasbag instrument head can be monitored to state | |
| CN110487151B (en) | Dicing saw, contact height measuring device of dicing saw and height measuring method of dicing saw | |
| CN219696438U (en) | Rotating assembly and wafer notch detection device | |
| TWI792559B (en) | Grinding tool capable of sensing grinding status and grinding system comprising the same | |
| CN218190674U (en) | Four-axis dispensing detection equipment | |
| EP4227121A1 (en) | Threaded fixing structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |