JP2008066607A - Vacuum suction apparatus - Google Patents

Vacuum suction apparatus Download PDF

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Publication number
JP2008066607A
JP2008066607A JP2006244923A JP2006244923A JP2008066607A JP 2008066607 A JP2008066607 A JP 2008066607A JP 2006244923 A JP2006244923 A JP 2006244923A JP 2006244923 A JP2006244923 A JP 2006244923A JP 2008066607 A JP2008066607 A JP 2008066607A
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Japan
Prior art keywords
vacuum
substrate
suction
hole
mounting table
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Pending
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JP2006244923A
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Japanese (ja)
Inventor
Hidenori Miyamoto
英典 宮本
Yoshiaki Sho
芳明 升
Kenji Yoshizawa
健司 吉澤
Tsuneo Tanimoto
恒夫 谷本
Yasuhiro Sone
康博 曽根
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Tokyo Ohka Kogyo Co Ltd
Tatsumo KK
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Tokyo Ohka Kogyo Co Ltd
Tatsumo KK
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Application filed by Tokyo Ohka Kogyo Co Ltd, Tatsumo KK filed Critical Tokyo Ohka Kogyo Co Ltd
Priority to JP2006244923A priority Critical patent/JP2008066607A/en
Priority to KR1020070090720A priority patent/KR20080023642A/en
Priority to TW096133530A priority patent/TW200833579A/en
Priority to CNA2007101460977A priority patent/CN101145536A/en
Publication of JP2008066607A publication Critical patent/JP2008066607A/en
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/005—Vacuum work holders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
    • B25J19/02—Sensing devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Controlling Sheets Or Webs (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
  • Manipulator (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a vacuum suction apparatus capable of certainly detecting whether a substrate is suctioned by vacuum or not in short time. <P>SOLUTION: When partially having a portion which is not suctioned by vacuum, a substrate W is somewhat off from the upper surface of a substrate installation table 5 at this portion. When the substrate W is off therefrom, pressure detected in a vacuum detection hole 8 which opens at this portion or a portion which is individually adjacent to this portion becomes high because of the entrance of air from the outside. Thus, determination that the substrate W is certainly suctioned to the upper surface of the substrate installation table 5 can be made when all of a plurality of pressure sensors 11 provided sense vacuum. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は半導体ウェーハやガラス基板等の基板を真空吸着する装置に関する。   The present invention relates to an apparatus for vacuum-sucking a substrate such as a semiconductor wafer or a glass substrate.

例えば半導体ウェーハを薄くする研削中に半導体ウェーハを固定する装置として、或いは半導体ウェーハやガラス基板の表面に塗布液を塗布し、これを遠心力で回転して塗布液を均一に拡散せしめる際に半導体ウェーハやガラス基板を保持する装置として、特許文献１、２に開示される真空吸着装置が知られている。   For example, as a device for fixing a semiconductor wafer during grinding to thin the semiconductor wafer, or when applying a coating solution to the surface of a semiconductor wafer or glass substrate and rotating it with centrifugal force to disperse the coating solution uniformly As an apparatus for holding a wafer or a glass substrate, vacuum suction apparatuses disclosed in Patent Documents 1 and 2 are known.

特許文献１にはガラス基板を吸着する吸着テーブルとして、テーブルの上面外周部に溝を形成し、この溝内にキリ穴を開口させるとともにキリ穴に真空源につながる配管を接続した構成が開示されている。   Patent Document 1 discloses a structure in which a groove is formed in the outer peripheral portion of the upper surface of the table as a suction table for sucking a glass substrate, a drill hole is opened in the groove, and a pipe connected to a vacuum source is connected to the drill hole. ing.

特許文献２には、テーブルに開口した真空吸着穴につながる真空源として、真空ポンプと真空エジェクタを用意し、電源が正常な場合は真空ポンプを電源が使えない場合は真空エジェクタを用いる真空吸着装置が開示されている。   In Patent Document 2, a vacuum pump and a vacuum ejector are prepared as a vacuum source connected to a vacuum suction hole opened in a table, and the vacuum pump uses a vacuum ejector when the power source is normal and the power source cannot be used. Is disclosed.

特開２００３−１４５４７２号公報JP 2003-145472 A 特開２００４−２００４４０号公報JP 2004-200440 A

特許文献１のように、全周に亘って吸着溝を形成した場合には、キリ穴の開口面積が溝の開口面積に広がることになるので、吸着力が低下する。一方、特許文献２のように吸着穴を直接テーブル上面に開口せしめた場合には、吸着力の低下はないが以下に述べる課題がある。   When the suction groove is formed over the entire circumference as in Patent Document 1, the opening area of the drill hole is spread over the opening area of the groove, so that the suction force is reduced. On the other hand, when the suction holes are directly opened on the upper surface of the table as in Patent Document 2, there is a problem described below although the suction force is not reduced.

図３は従来の真空吸着装置の断面図であり、基板載置テーブル１００の厚み方向に吸引穴１０１が貫通して形成され、この吸引穴１０１の上端は基板載置テーブル１００の上面に開口し、吸引穴１０１の下端には真空源につながる配管１０２が接続され、更に配管１０２の途中に圧力センサ１０３を取り付けている。   FIG. 3 is a cross-sectional view of a conventional vacuum suction apparatus. A suction hole 101 is formed through the substrate mounting table 100 in the thickness direction, and the upper end of the suction hole 101 opens on the upper surface of the substrate mounting table 100. A pipe 102 connected to a vacuum source is connected to the lower end of the suction hole 101, and a pressure sensor 103 is attached in the middle of the pipe 102.

このように、真空源につながる配管１０２に圧力センサ１０３を取り付けることは合理的であるが、誤作動を起こすことがある。即ち、圧力センサ１０３から離れた箇所の配管内が所定の圧力まで低下していなくても、圧力センサ１０３に近い箇所の配管内の圧力が所定値に達すると、真空吸着がなされたと判断してしまう。その結果、一部が吸着されていない状態、例えば基板の一部が浮いた状態で処理を開始してしまい、ノズル下端と基板とが衝突する破損することがある。   Thus, although it is reasonable to attach the pressure sensor 103 to the pipe 102 connected to the vacuum source, malfunction may occur. That is, even if the pressure in the pipe away from the pressure sensor 103 does not decrease to a predetermined pressure, it is determined that vacuum suction has been performed when the pressure in the pipe near the pressure sensor 103 reaches a predetermined value. End up. As a result, the processing may be started in a state where a part of the substrate is not adsorbed, for example, a part of the substrate is lifted, and the lower end of the nozzle may collide with the substrate.

上記課題を解決するため本発明に係る真空吸着装置は、基板載置テーブルに吸引穴を形成し、この吸引穴の一端を基板載置テーブルの上面に開口させ、吸引穴の他端に真空源につながる配管を接続した真空吸着装置において、前記吸引穴とは別に真空検知穴を形成し、この真空検知穴の一端を基板載置テーブルの上面に開口させ、真空検知穴の他端を圧力センサを取り付けた検知用配管につなげた構成とした。   In order to solve the above problems, a vacuum suction apparatus according to the present invention forms a suction hole in a substrate mounting table, opens one end of the suction hole on the upper surface of the substrate mounting table, and supplies a vacuum source to the other end of the suction hole. In the vacuum suction device connected to the pipe, a vacuum detection hole is formed separately from the suction hole, one end of the vacuum detection hole is opened on the upper surface of the substrate mounting table, and the other end of the vacuum detection hole is a pressure sensor. And connected to the detection pipe.

真空検知穴は基板載置テーブルの上面に均等に配置するか、真空になりにくい傾向にある箇所、例えば真空ポンプからの配管の距離が遠い箇所に設けることが好ましい。また、吸着されているか否かを個々の場所ごとに正確に検知するには、真空検知穴ごとに独立して圧力センサを取り付けた検知用配管が設けることが好ましい。   The vacuum detection holes are preferably arranged evenly on the upper surface of the substrate mounting table, or provided at a location that tends not to be evacuated, for example, at a location where the distance from the vacuum pump is long. Further, in order to accurately detect whether or not the material is adsorbed for each location, it is preferable to provide a detection pipe with a pressure sensor independently attached to each vacuum detection hole.

本発明によれば、半導体ウェーハやガラス基板が載置テーブル上面に確実に真空吸着されているか否かを正確に知ることができる。したがって、例えばスリットノズルを移動させて塗布する際に、基板の一部が浮いた状態となって、ノズルと基板とが衝突するような不具合が発生することがない。   According to the present invention, it is possible to accurately know whether a semiconductor wafer or a glass substrate is reliably vacuum-sucked on the mounting table upper surface. Therefore, for example, when applying by moving the slit nozzle, there is no problem that a part of the substrate is in a floating state and the nozzle collides with the substrate.

以下に本発明の実施の形態を添付図面に基づいて説明する。図１は本発明に係る真空吸着装置の断面図、図２は同吸着装置の平面図である。   Embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 1 is a sectional view of a vacuum suction device according to the present invention, and FIG. 2 is a plan view of the suction device.

図中１，２，３，４は平面視で環状をなすように配置された吸引用配管であり、これら吸引用配管１，２，３，４は独立した配管１ａ，２ａ，３ａ，４ａを介して真空源につながっている。   In the figure, 1, 2, 3 and 4 are suction pipes arranged in a ring shape in plan view, and these suction pipes 1, 2, 3 and 4 are independent pipes 1a, 2a, 3a and 4a. Via a vacuum source.

前記吸引用配管１，２，３，４は基板載置テーブル５の下面側に配置され、基板載置テーブル５には吸引穴６…が厚み方向に貫通して形成され、吸引穴６の上端は基板載置テーブル５の上面に開口し、下端はジョイント７を介して前記吸引用配管１，２，３，４のいずれかにつながっている。   The suction pipes 1, 2, 3, 4 are arranged on the lower surface side of the substrate mounting table 5, and suction holes 6 are formed in the substrate mounting table 5 so as to penetrate in the thickness direction. Is opened on the upper surface of the substrate mounting table 5, and the lower end is connected to one of the suction pipes 1, 2, 3, 4 via a joint 7.

このように、吸引用配管１，２，３，４を環状に配置するとともにそれぞれを独立して真空源につなげることで、基板Ｗの寸法に合せて使用する吸引用配管と使用しない吸引用配管とを分けることができ、無駄な電力の消費を抑えることができる。   In this way, the suction pipes 1, 2, 3, and 4 are arranged in an annular shape, and each is independently connected to a vacuum source, so that the suction pipe used according to the dimensions of the substrate W and the suction pipe not used are used. And wasteful power consumption can be suppressed.

一方、基板載置テーブル５の厚み方向には前記吸引穴６とは別に真空検知穴８を貫通して形成している。この真空検知穴８の上端は基板載置テーブル５の上面に開口し、下端はジョイント９を介して検知用配管１０につながり、この検知用配管１０には圧力センサ１１が取り付けられ、この圧力センサ１１によって基板Ｗと真空検知穴８直上との間の圧力を測定するようにしている。   On the other hand, a vacuum detection hole 8 is formed in the thickness direction of the substrate mounting table 5 separately from the suction hole 6. The upper end of the vacuum detection hole 8 opens on the upper surface of the substrate mounting table 5, and the lower end is connected to a detection pipe 10 via a joint 9, and a pressure sensor 11 is attached to the detection pipe 10. 11, the pressure between the substrate W and the vacuum detection hole 8 is measured.

上記圧力検出の機構においては、真空検知穴８と検知用配管１０と圧力センサ１１とが１セットになっている。即ち、１本の検知用配管１０には１つの真空検知穴８のみが対応し、個々の圧力検出の機構は独立している。このようにすることで、仮に真空吸着されない事態が生じても、どの箇所で真空吸着されていないかを直ちに知ることができる。   In the pressure detection mechanism, the vacuum detection hole 8, the detection pipe 10, and the pressure sensor 11 are in one set. That is, only one vacuum detection hole 8 corresponds to one detection pipe 10, and each pressure detection mechanism is independent. By doing in this way, even if a situation where vacuum suction does not occur occurs, it is possible to immediately know where the vacuum suction is not performed.

また、実施例の基板載置テーブル５は水平度調整機構２０を備えている。この水平度調整機構２０はベース２１上にボールネジ機構２２によって進退する楔部材２３を設け、一方基板載置テーブル５の下面を支える脚部２４には前記楔部材２３の上面の傾斜面に当接する傾斜面を設け、ボールネジ機構２２によって楔部材２３を水平方向にスライド移動させることで、基板載置テーブル５が部分的に昇降し、これによって水平度を調整する。   In addition, the substrate mounting table 5 of the embodiment includes a leveling adjustment mechanism 20. The leveling adjustment mechanism 20 is provided with a wedge member 23 that moves forward and backward by a ball screw mechanism 22 on a base 21, while the leg portion 24 that supports the lower surface of the substrate mounting table 5 abuts on the inclined surface of the upper surface of the wedge member 23. By providing an inclined surface and sliding the wedge member 23 in the horizontal direction by the ball screw mechanism 22, the substrate mounting table 5 partially moves up and down, thereby adjusting the level.

以上において、基板載置テーブル５の上面に基板Ｗを載置し、吸引用配管１，２，３，４及び吸引穴６…を介して吸引固定する際に、真空吸着されている箇所にあっては、基板Ｗと真空検知穴８直上との間は極めて小さくなり当該真空検知穴８に近い吸引穴６の圧力を圧力センサ１１によって検出することになる。この場合には正常に吸着されていると判断できる。   In the above, when the substrate W is placed on the upper surface of the substrate placing table 5 and is sucked and fixed through the suction pipes 1, 2, 3, 4 and the suction holes 6,. Thus, the space between the substrate W and the vacuum detection hole 8 is extremely small, and the pressure of the suction hole 6 close to the vacuum detection hole 8 is detected by the pressure sensor 11. In this case, it can be judged that it is normally adsorbed.

一方、一部に真空吸着されていない箇所があると、当該箇所において基板Ｗが基板載置テーブル５の上面から若干浮き上がることになる。そして、基板Ｗが浮き上がると当該箇所または個々に近接する箇所に開口する真空検知穴８で検出する圧力も外部から空気が入り込むため高くなる。したがって、複数設けた圧力センサ１１の全てが真空を感知した時点で、基板Ｗは確実に基板載置テーブル５の上面に吸着されたと判断できる。   On the other hand, if there is a portion that is not vacuum-sucked in part, the substrate W slightly floats from the upper surface of the substrate mounting table 5 at that portion. When the substrate W is lifted, the pressure detected by the vacuum detection hole 8 opened at the location or a location close to each other also increases because air enters from the outside. Therefore, it can be determined that the substrate W is reliably adsorbed on the upper surface of the substrate mounting table 5 when all of the plurality of pressure sensors 11 sense a vacuum.

本発明の真空吸着装置は、例えば、半導体ウェーハの厚みを薄くする研削工程で半導体ウェーハを固定する装置として、半導体ウェーハやガラス基板の表面に塗布液を塗布する工程で半導体ウェーハやガラス基板を固定する装置として利用することができる。   The vacuum suction apparatus of the present invention, for example, as a device for fixing a semiconductor wafer in a grinding process for reducing the thickness of the semiconductor wafer, fixes the semiconductor wafer or the glass substrate in a process of applying a coating solution to the surface of the semiconductor wafer or the glass substrate. It can be used as a device to perform.

本発明に係る真空吸着装置の断面図Sectional view of the vacuum suction device according to the present invention 同吸着装置の平面図Top view of the adsorption device 従来の吸着装置の問題点を指摘した断面図Cross-sectional view that points out the problems of conventional adsorption equipment

符号の説明Explanation of symbols

１，２，３，４，１ａ，２ａ，３ａ，４ａ…吸引用配管、５…基板載置テーブル、６…吸引穴、７…ジョイント、８…真空検知穴、９…ジョイント、１０…検知用配管、１１…圧力センサ、２０…水平度調整機構、２１…ベース、２２…ボールネジ機構、２３…楔部材、２４…脚部、Ｗ…基板。

1, 2, 3, 4, 1a, 2a, 3a, 4a ... suction piping, 5 ... substrate mounting table, 6 ... suction hole, 7 ... joint, 8 ... vacuum detection hole, 9 ... joint, 10 ... for detection Piping, 11 ... pressure sensor, 20 ... leveling adjustment mechanism, 21 ... base, 22 ... ball screw mechanism, 23 ... wedge member, 24 ... leg, W ... substrate.

Claims (2)

基板載置テーブルに吸引穴を形成し、この吸引穴の一端を基板載置テーブルの上面に開口させ、吸引穴の他端に真空源につながる配管を接続した真空吸着装置において、前記吸引穴とは別に真空検知穴を形成し、この真空検知穴の一端を基板載置テーブルの上面に開口させ、真空検知穴の他端を圧力センサを取り付けた検知用配管につなげたことを特徴とする真空吸着装置。 In the vacuum suction apparatus in which a suction hole is formed in the substrate mounting table, one end of the suction hole is opened on the upper surface of the substrate mounting table, and a pipe connected to a vacuum source is connected to the other end of the suction hole. Separately, a vacuum detection hole is formed, one end of this vacuum detection hole is opened on the upper surface of the substrate mounting table, and the other end of the vacuum detection hole is connected to a detection pipe to which a pressure sensor is attached. Adsorption device. 請求項１に記載の真空吸着装置において、前記真空検知穴ごとに独立して圧力センサを取り付けた検知用配管が設けられていることを特徴とする真空吸着装置。 2. The vacuum suction device according to claim 1, wherein a detection pipe having a pressure sensor attached independently for each vacuum detection hole is provided.
JP2006244923A 2006-09-11 2006-09-11 Vacuum suction apparatus Pending JP2008066607A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2006244923A JP2008066607A (en) 2006-09-11 2006-09-11 Vacuum suction apparatus
KR1020070090720A KR20080023642A (en) 2006-09-11 2007-09-07 Vacuum suction apparatus
TW096133530A TW200833579A (en) 2006-09-11 2007-09-07 Vacuum suction apparatus
CNA2007101460977A CN101145536A (en) 2006-09-11 2007-09-10 Vacuum absorption device

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JP2006244923A JP2008066607A (en) 2006-09-11 2006-09-11 Vacuum suction apparatus

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JP2008066607A true JP2008066607A (en) 2008-03-21

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KR (1) KR20080023642A (en)
CN (1) CN101145536A (en)
TW (1) TW200833579A (en)

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