TWI792559B - Grinding tool capable of sensing grinding status and grinding system comprising the same - Google Patents

Grinding tool capable of sensing grinding status and grinding system comprising the same Download PDF

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TWI792559B
TWI792559B TW110134111A TW110134111A TWI792559B TW I792559 B TWI792559 B TW I792559B TW 110134111 A TW110134111 A TW 110134111A TW 110134111 A TW110134111 A TW 110134111A TW I792559 B TWI792559 B TW I792559B
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grinding
sensor
base
sensing
state
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TW202310978A (en
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謝榮哲
陳泰甲
何嘉哲
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中國砂輪企業股份有限公司
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Abstract

Provided are a grinding tool capable of sensing grinding status and a grinding system comprising the same. The grinding tool comprises: a base, an abrasive layer and a sensor. The base has a linking surface; the abrasive layer is disposed on the linking surface of the base, and the abrasive layer has a working surface away from the linking surface; the sensor is disposed on the base or the abrasive layer. The grinding system comprises a grinding machine, the grinding tool assembled to the grinding machine, and a data acquisition unit. The data acquisition unit accepts signal information transmitted from the sensor of the grinding tool capable of sensing grinding status.

Description

可感測研磨狀態的研磨工具及包含其的研磨系統Grinding tool capable of sensing grinding state and grinding system including same

本發明係有關於一種研磨工具及包含其的研磨系統。The invention relates to a grinding tool and a grinding system comprising it.

研磨工具一般是利用結合劑將磨料固結成不同的形狀,以廣泛地應用在工件的研磨、切斷、拋光等加工處理。隨著精密機械產業和半導體產業的多元發展,各元件需要愈來愈高的精度和生產速率,因此研磨工具的規格日趨繁雜。此外,為了使研磨工具在加工中始終保持良好的磨削狀態,本領域技術人員皆知須對研磨工具進行修整,因此,研磨工具何時須使用何種修整條件亦是重要的關鍵技術。然而,由於研磨工具的表面形貌會一直不斷改變,若要確保維持穩定且良好的研磨加工品質,就須倚賴經驗豐富的操作人員,在研磨加工的過程中不斷地確認研磨工具的狀態。Abrasive tools generally use bonding agents to consolidate abrasives into different shapes, so as to be widely used in grinding, cutting, polishing and other processing of workpieces. With the diversified development of the precision machinery industry and the semiconductor industry, each component requires higher and higher precision and production speed, so the specifications of grinding tools are becoming more and more complicated. In addition, in order to keep the grinding tool in a good grinding state during processing, those skilled in the art know that the grinding tool needs to be trimmed. Therefore, when and what dressing conditions must be used for the grinding tool is also an important key technology. However, since the surface morphology of the grinding tool is constantly changing, it is necessary to rely on experienced operators to constantly check the state of the grinding tool during the grinding process in order to ensure stable and good grinding quality.

為了嘗試解決以上問題,中華民國發明專利第I722478號提供一種砂輪加工地圖的最佳化方法,其利用磨床之控制器先從資料平台取得砂輪之參考加工地圖,再利用控制器包含的最佳化模組運算生成一縮放倍率值以形成最佳化的一加工地圖。雖然前述方法可降低對操作人員經驗的依賴程度,然而當使用沒有現成參考加工地圖之砂輪時仍會存在原先問題,且即便有最佳化的加工地圖,操作人員仍需常常中斷研磨加工的製程以確認研磨工具當下的狀態。In order to try to solve the above problems, the Republic of China Invention Patent No. I722478 provides a method for optimizing the grinding wheel processing map. It uses the controller of the grinding machine to first obtain the reference processing map of the grinding wheel from the data platform, and then uses the optimization included in the controller. The module operation generates a magnification value to form an optimized processing map. Although the aforementioned method can reduce the reliance on the operator's experience, the original problem still exists when using a grinding wheel without a ready-made reference processing map, and even with an optimized processing map, the operator still needs to frequently interrupt the grinding process. To confirm the current state of the grinding tool.

另外,中華民國發明專利第I624741號則提供一種自動化偵測磨削之智慧型磨床設備,其先採用智慧編碼器編輯加工系統整體的加工順序或參數設定程式,再於該平面磨床機之磨削單元處設有一研磨檢知單元,故能於加工過程中自動化偵測到各種工件物整體外觀輪廓,當砂輪單元對工件物進行平面研磨加工時所產生的負載力及切削力參數至一預定參數時,會由該智慧編碼器自動執行其所編輯的順序或參數設定程式並傳遞指令控制該平面磨床機之整體運作,產生出一最佳研磨路徑,從而實現縮短研磨行程距離而提升加工效率。然而,若欲採用此技術僅能購置昂貴之特定研磨設備,無法有效降低製造成本;此外,由於所述研磨檢知單元設置於平面磨床機中,故僅能間接取得加工訊號,無法廣泛應用於各技術領域。In addition, the Republic of China Invention Patent No. I624741 provides an intelligent grinding machine equipment for automatic detection and grinding. It first uses an intelligent encoder to edit the overall processing sequence or parameter setting program of the processing system, and then grinds on the surface grinder. The unit is equipped with a grinding detection unit, so it can automatically detect the overall appearance of various workpieces during the processing process. When the grinding wheel unit performs plane grinding on the workpiece, the load force and cutting force parameters generated by the grinding wheel unit reach a predetermined parameter. , the smart encoder will automatically execute the edited sequence or parameter setting program and transmit instructions to control the overall operation of the surface grinder to generate an optimal grinding path, thereby shortening the grinding stroke distance and improving processing efficiency. However, if you want to use this technology, you can only purchase expensive specific grinding equipment, which cannot effectively reduce the manufacturing cost; in addition, because the grinding detection unit is installed in the surface grinder, it can only obtain processing signals indirectly and cannot be widely used. various technical fields.

有鑑於此,本發明之目的在於提供一種研磨工具,於加工過程中可即時了解研磨工具當下的狀態,有助於維持穩定的研磨加工品質。In view of this, the object of the present invention is to provide a grinding tool, which can know the current state of the grinding tool in real time during the processing, and helps to maintain stable grinding processing quality.

本發明之另一目的在於提供一種研磨工具,不須限定研磨系統中的磨床規格或搭配複雜、昂貴的設備,故能降低整體加工製程的成本,進而更具商業競爭力。Another object of the present invention is to provide a grinding tool that does not need to limit the specifications of the grinding machine in the grinding system or configure complicated and expensive equipment, so that the cost of the overall processing process can be reduced, and thus it is more commercially competitive.

為達成前述目的,本發明提供一種可感測研磨狀態的研磨工具。該可感測研磨狀態的研磨工具包括:一基座、一研磨層、以及一感測器(sensor)。該基座具有一連結表面,該研磨層設置於該基座的該連結表面上,該研磨層具有一遠離該連結表面的工作表面;該感測器設置於該基座或該研磨層。To achieve the foregoing objectives, the present invention provides a grinding tool capable of sensing the grinding state. The grinding tool capable of sensing the grinding state includes: a base, a grinding layer, and a sensor. The base has a connecting surface, the grinding layer is arranged on the connecting surface of the base, and the grinding layer has a working surface away from the connecting surface; the sensor is arranged on the base or the grinding layer.

本發明藉由直接在研磨工具上設置一可感測研磨狀態的感測器,因此,只要搭配可接收該感測器所發出的訊號的資料擷取元件,即能讓加工應用業者的操作人員在研磨加工製程中即時了解研磨工具當下的狀態而不需中斷前述製程,不僅有助於維持穩定的研磨加工品質,還可提升整體加工效率。再者,由於感測器直接設置於研磨工具上,故能以多元且直接的感測方式反應加工狀態,且加工應用業者不須特別購置或重新購置昂貴的設備,進而可降低整體加工製程的成本。The present invention directly arranges a sensor capable of sensing the grinding state on the grinding tool. Therefore, as long as it is equipped with a data acquisition device that can receive the signal sent by the sensor, the operator of the processing application company can Knowing the current state of the grinding tool in real time during the grinding process without interrupting the aforementioned process will not only help maintain stable grinding quality, but also improve the overall processing efficiency. Furthermore, since the sensor is directly installed on the grinding tool, it can reflect the processing status in a multiple and direct sensing manner, and the processing application industry does not need to purchase or re-purchase expensive equipment, thereby reducing the cost of the overall processing process. cost.

依據本發明,該可感測研磨狀態的研磨工具的基座之材料種類並無特別限制,只要可用於支撐該研磨層即可。具體而言,該基座的材料可包含一金屬或一合金(例如不銹鋼或鋁合金等),一樹脂(例如環氧樹脂等),或是一陶瓷材料,但不限於此。According to the present invention, the material of the base of the grinding tool capable of sensing the grinding state is not particularly limited, as long as it can be used to support the grinding layer. Specifically, the material of the base may include a metal or an alloy (such as stainless steel or aluminum alloy, etc.), a resin (such as epoxy resin, etc.), or a ceramic material, but not limited thereto.

依據本發明,該研磨層的工作表面(即遠離該基座的一側)是與待研磨之工件接觸的表面,該工作表面可對工件進行研磨、拋光或切割等加工作業。該研磨層包含的材料種類並無特別限制,只要能實現上述加工作業所需之功能即可。一般而言,該研磨層包括一結合劑以及複數分散在該結合劑中的磨料,且至少一部分之所述磨料需露出該研磨層的工作表面。舉例而言,該結合劑的材料包含一金屬材料、一陶瓷材料或一樹脂材料(例如酚醛樹脂、環氧樹脂、聚醯亞胺(polyimide,PI)樹脂等),但不限於此。該磨料的材料包含天然鑽石、人造鑽石、立方氮化硼(cubic boron nitride,CBN)、氧化鋁、碳化矽或其組合。另外,該研磨層的材料亦可包含適量的輔劑,例如:橡膠、矽氧烷類化合物、二氧化矽、奈米碳管(CNT)、纖維素奈米纖維(CNF)、石墨烯、銅錫合金、鎳、銅、或壓克力樹脂等,但不限於此。According to the present invention, the working surface of the grinding layer (that is, the side away from the base) is the surface in contact with the workpiece to be ground, and the working surface can perform grinding, polishing or cutting operations on the workpiece. The type of material contained in the grinding layer is not particularly limited, as long as it can realize the functions required by the above-mentioned processing operations. Generally speaking, the grinding layer includes a bonding agent and a plurality of abrasives dispersed in the bonding agent, and at least a part of the abrasives should be exposed on the working surface of the grinding layer. For example, the material of the bonding agent includes a metal material, a ceramic material or a resin material (such as phenolic resin, epoxy resin, polyimide (PI) resin, etc.), but not limited thereto. The material of the abrasive includes natural diamond, artificial diamond, cubic boron nitride (CBN), aluminum oxide, silicon carbide or a combination thereof. In addition, the material of the abrasive layer may also contain an appropriate amount of auxiliary agents, such as rubber, siloxane compounds, silicon dioxide, carbon nanotubes (CNT), cellulose nanofibers (CNF), graphene, copper Tin alloy, nickel, copper, or acrylic resin, etc., but not limited thereto.

依據本發明,於該研磨工具的外表面的整體中,除了前述工作表面之外,該研磨工具的外表面的其餘部分,例如該基座中除了連結表面外的其餘表面,或該研磨層中除了工作表面之外的其餘表面等,皆不會與待研磨之工件接觸,故又稱為該研磨工具的非工作表面。According to the present invention, in the entirety of the outer surface of the grinding tool, except for the aforementioned working surface, the rest of the outer surface of the grinding tool, such as the remaining surface of the base except the connecting surface, or in the grinding layer Except for the working surface, the rest of the surface will not be in contact with the workpiece to be ground, so it is also called the non-working surface of the grinding tool.

依據本發明,該感測器的類型並無特別限制,只要能用於感測並反應研磨加工製程中的研磨工具和/或研磨加工製程之當下狀態即可。一般而言,所述感測器主要是包含一感測單元、一轉換單元和一訊號傳輸單元,在一些實施態樣中,該感測器還包含一電源,但不限於此。簡單來說,該感測單元用以量測欲感測物件之物理量或化學量,例如震動、壓力、聲音、溫度等,具體而言,該感測器可以是一震動感測器、一壓力感測器、一聲音感測器、一溫度感測器或其組合;另外,還可使用其他已知的感測器,例如色彩感測器、速度感測器、pH感測器等,但不限於此。該轉換單元係用以將前述物理量或化學量轉換成可傳遞的訊號,例如電訊號、電磁波訊號等;該訊號傳輸單元則是將前述轉換單元產出的訊號傳遞至相對應的資料擷取元件。前述感測器中,所述溫度感測器可於研磨加工過程中與待磨之工件接觸以測量待磨之工件的溫度,亦可於研磨加工過程中不與待磨之工件接觸,即所述溫度感測器用以反應所述研磨工具之溫度。另外,所述震動感測器、所述壓力感測器和所述聲音感測器等其餘感測器於研磨加工過程中可不與待磨之工件接觸。較佳的,所述感測器還可包含訊號儲存單元,也就是說,該感測器還可具有儲存訊號功能,如此一來,該感測器還能將所測得的資訊再輸出至一資料庫保存,以利後續應用。According to the present invention, the type of the sensor is not particularly limited, as long as it can be used to sense and respond to the grinding tool in the grinding process and/or the current state of the grinding process. Generally speaking, the sensor mainly includes a sensing unit, a conversion unit and a signal transmission unit. In some implementations, the sensor further includes a power supply, but is not limited thereto. In simple terms, the sensing unit is used to measure the physical or chemical quantity of the object to be sensed, such as vibration, pressure, sound, temperature, etc. Specifically, the sensor can be a vibration sensor, a pressure sensor sensor, a sound sensor, a temperature sensor or a combination thereof; in addition, other known sensors such as color sensors, speed sensors, pH sensors, etc. can also be used, but Not limited to this. The conversion unit is used to convert the aforementioned physical or chemical quantities into transmissible signals, such as electrical signals, electromagnetic wave signals, etc.; the signal transmission unit transmits the signals produced by the aforementioned conversion unit to corresponding data acquisition components . Among the aforementioned sensors, the temperature sensor can be in contact with the workpiece to be ground during the grinding process to measure the temperature of the workpiece to be ground, or it can not be in contact with the workpiece to be ground during the grinding process, that is, the The temperature sensor is used to reflect the temperature of the grinding tool. In addition, other sensors such as the vibration sensor, the pressure sensor and the sound sensor may not be in contact with the workpiece to be ground during the grinding process. Preferably, the sensor can also include a signal storage unit, that is to say, the sensor can also have a signal storage function, so that the sensor can also output the measured information to It is stored in a database for subsequent application.

該震動感測器係用以感測在研磨加工的過程中,所述研磨工具承受的三軸加速度。具體而言,三軸係指相互垂直的X軸、Y軸及Z軸;通常來說,將待磨之工件與所述研磨工具接觸的表面之平行面定義為X-Y平面。較佳的,該震動感測器可為或包含一具有量測範圍為1單位加速度(g,1g為9.81 m/s 2)至500 g的震動感測器。該震動感測器可為壓電式(piezoelectric)加速規感測器或電容式(capacitive)加速規感測器,但不限於此。在一些實施態樣中,當該震動感測器為壓電式加速規感測器時,其靈敏度可為5毫伏特/每單位加速度(mV/g)至100 mV/g,但不限於此。 The vibration sensor is used for sensing the three-axis acceleration suffered by the grinding tool during the grinding process. Specifically, three axes refer to the mutually perpendicular X-axis, Y-axis and Z-axis; generally speaking, the plane parallel to the surface of the workpiece to be ground and the grinding tool is defined as the XY plane. Preferably, the shock sensor can be or include a shock sensor with a measurement range of 1 unit acceleration (g, 1g is 9.81 m/s 2 ) to 500 g. The vibration sensor may be a piezoelectric accelerometer sensor or a capacitive accelerometer sensor, but is not limited thereto. In some embodiments, when the shock sensor is a piezoelectric accelerometer sensor, its sensitivity may range from 5 millivolts per unit acceleration (mV/g) to 100 mV/g, but is not limited thereto .

該壓力感測器係用以感測在研磨加工的過程中,所述研磨工具承受的三軸研磨力。具體而言,三軸係指相互垂直的X軸、Y軸及Z軸;通常來說,將待磨之工件與所述研磨工具接觸的表面之平行面定義為X-Y平面。較佳的,該壓力感測器可為或包含一具有量測範圍為0.1牛頓力(N)至1000 N的壓力感測器,但不限於此。該壓力感測器可為壓阻式壓力感測器、壓電式壓力感測器或電容式壓力感測器,但不限於此。The pressure sensor is used to sense the three-axis grinding force that the grinding tool bears during the grinding process. Specifically, three axes refer to mutually perpendicular X-axis, Y-axis and Z-axis; generally speaking, the parallel plane of the workpiece to be ground and the surface in contact with the grinding tool is defined as the X-Y plane. Preferably, the pressure sensor can be or include a pressure sensor with a measuring range of 0.1 Newton (N) to 1000 N, but not limited thereto. The pressure sensor may be a piezoresistive pressure sensor, a piezoelectric pressure sensor or a capacitive pressure sensor, but is not limited thereto.

該聲音感測器係用以感測待磨之工件與該研磨工具在接觸且發生相對運動時所發出的研磨聲音之頻率。較佳的,該聲音感測器可為或包含一具有量測範圍為100赫茲(Hz)至20000 Hz的聲音感測器;具體而言,聲波最大取樣率可為1000千Hz;另外,該聲音感測器可為或包含一具有聲級量測範圍為50分貝(dB)至120 dB的聲音感測器,但不限於此。The sound sensor is used for sensing the frequency of the grinding sound produced when the workpiece to be ground contacts and moves relative to the grinding tool. Preferably, the sound sensor can be or include a sound sensor with a measurement range of 100 hertz (Hz) to 20000 Hz; specifically, the maximum sampling rate of sound waves can be 1000 kHz; in addition, the The sound sensor can be or include a sound sensor with a sound level measurement range of 50 decibels (dB) to 120 dB, but is not limited thereto.

具體而言,該溫度感測器可用以感測該研磨工具的研磨層之工作表面在研磨加工製程中的溫度,或是用以感測所述待磨之工件於研磨加工製程中的溫度。較佳的,該溫度感測器可為或包含一具有量測範圍為-150°C至2000°C的溫度感測器,但不限於此。在一些實施態樣中,該溫度感測器具有一本體和一探頭,該本體設置於該基座中,該探頭可突出於該研磨層的工作表面,如此一來,該溫度感測器可即時反應所述待磨之工件的接觸面的溫度。Specifically, the temperature sensor can be used to sense the temperature of the working surface of the grinding layer of the grinding tool during the grinding process, or to sense the temperature of the workpiece to be ground during the grinding process. Preferably, the temperature sensor may be or include a temperature sensor with a measurement range of -150°C to 2000°C, but not limited thereto. In some embodiments, the temperature sensor has a body and a probe, the body is arranged in the base, and the probe can protrude from the working surface of the grinding layer, so that the temperature sensor can be real-time It reflects the temperature of the contact surface of the workpiece to be ground.

在一些實施態樣中,該可感測研磨狀態的研磨工具可具有複數個感測器,例如一可感測研磨狀態的研磨工具具有2個感測器,但不限於此。具體而言,該複數個感測器可為不同種類,例如1個震動感測器和1個溫度感測器之組合,或者,該複數個感測器可為相同種類,例如2個壓力感測器;其中,該2個壓力感測器可完全相同,而該2個壓力感測器設置於所述研磨工具的不同位置上;另外,該2個壓力感測器亦可具有不同量測範圍,可用以增加所述研磨工具可測得之整體量測範圍。In some embodiments, the grinding tool capable of sensing the grinding state may have a plurality of sensors, for example, a grinding tool capable of sensing the grinding state has 2 sensors, but is not limited thereto. Specifically, the plurality of sensors can be of different types, such as a combination of a vibration sensor and a temperature sensor, or the plurality of sensors can be of the same type, such as two pressure sensors measuring device; wherein, the 2 pressure sensors can be identical, and the 2 pressure sensors are arranged on different positions of the grinding tool; in addition, the 2 pressure sensors can also have different measurement Range, which can be used to increase the overall measurement range that the abrasive tool can measure.

較佳的,該感測器可以是以黏貼法、鑲埋(insert)法、鑲嵌法(embedded)或鎖附法設置於該基座或該研磨層,但不限於此。對於黏貼法而言,所述黏貼法可以採用市售接著劑將該感測器黏在該基座或該研磨層的表面上,尤其是將該感測器黏附至該研磨工具的所述非工作表面上。對於鑲埋法而言,其係指將該感測器凹設該研磨工具的基座或研磨層中,該感測器可以完全不顯露於該研磨工具的外表面,且可額外使用外蓋或是灌膠將感測器固定於基座或研磨層中。對於鑲嵌法而言,其係指將該感測器凹設於該研磨工具的基座或研磨層的表面中,藉由相互卡合的構型固定該感測器;該感測器的外表面可以與該研磨工具的基座或研磨層的表面齊平或可以突出於該研磨工具的外表面。對於鎖附法而言,其係指透過一組或多組鎖固元件將該感測器鎖固於該研磨工具的基座或研磨層的外表面,尤其是可將該感測器鎖附至該研磨工具的所述非工作表面上。Preferably, the sensor can be disposed on the base or the grinding layer by sticking, inserting, embedded or locking, but not limited thereto. For the pasting method, the pasting method can use commercially available adhesives to stick the sensor to the surface of the base or the grinding layer, especially to stick the sensor to the non-contact surface of the grinding tool. on the work surface. For the embedding method, it means that the sensor is recessed in the base or grinding layer of the grinding tool, the sensor can not be exposed on the outer surface of the grinding tool at all, and an outer cover can be used additionally Or potting glue to fix the sensor in the base or grinding layer. For the mosaic method, it means that the sensor is recessed in the base of the grinding tool or the surface of the grinding layer, and the sensor is fixed by a mutual engagement configuration; the outer surface of the sensor The surface may be flush with the surface of the base or abrasive layer of the abrasive tool or may protrude beyond the outer surface of the abrasive tool. For the locking method, it refers to locking the sensor on the base of the grinding tool or the outer surface of the grinding layer through one or more sets of locking elements, especially the sensor can be locked onto said non-working surface of the abrasive tool.

依據本發明,該可感測研磨狀態的研磨工具的幾何結構並無特別限制,主要隨著該基座的幾何結構不同而有多元化的幾何結構。一般常見的基座之型態包含一圓盤狀、一空心圓柱體、一帶柄棒體、或一多面體等,但不限於此。According to the present invention, the geometric structure of the grinding tool capable of sensing the grinding state is not particularly limited, and there are various geometric structures mainly depending on the geometric structure of the base. Common forms of the base include a disc, a hollow cylinder, a rod with a handle, or a polyhedron, but are not limited thereto.

在一些實施態樣中,該基座是一圓盤,該基座包含相對的一第一表面和一第二表面,該連結表面由該第一表面和該第二表面之周圍環繞成型,並且位於該第一表面和該第二表面之間,也就是說,該連結表面是該圓盤的外周面,該外周面之直徑係該圓盤之外徑;較佳的,該基座更包括一貫通該第一表面和該第二表面的軸孔,該軸孔孔壁之直徑則為該圓盤的孔徑。其中,當該感測器為該震動感測器、該壓力感測器、該聲音感測器或其組合時,前述感測器可設置於該基座的該第一表面或該第二表面上;當該感測器為該溫度感測器時,該溫度感測器係以鑲埋法設置於該基座和該研磨層中,即溫度感測器的本體位於該第一表面和該第二表面之間,該溫度感測器延伸至以其探頭突出於該研磨層的工作表面。In some embodiments, the base is a disc, the base includes a first surface and a second surface opposite to each other, the connecting surface is formed around the first surface and the second surface, and Located between the first surface and the second surface, that is to say, the connecting surface is the outer peripheral surface of the disc, and the diameter of the outer peripheral surface is the outer diameter of the disc; preferably, the base further includes A shaft hole runs through the first surface and the second surface, and the diameter of the shaft hole wall is the diameter of the disk. Wherein, when the sensor is the vibration sensor, the pressure sensor, the sound sensor or a combination thereof, the aforementioned sensor can be arranged on the first surface or the second surface of the base above; when the sensor is the temperature sensor, the temperature sensor is embedded in the base and the grinding layer, that is, the body of the temperature sensor is located between the first surface and the Between the second surface, the temperature sensor extends to the working surface with its probe protruding from the grinding layer.

或者,在另一些實施態樣中,該基座是一圓盤,該基座更包含相連接的一第一表面和一第二表面,該連結表面和該第二表面相對,該第一表面由該連結表面和該第二表面之外周圍環繞成型,並且位於該連結表面和該第二表面之間,也就是說,該第一表面是該圓盤的外周面;較佳的,該基座更包括一貫通該第一表面和該第二表面的軸孔,該軸孔孔壁之直徑則為該圓盤的孔徑。較佳的,當該感測器為該震動感測器、該壓力感測器、該聲音感測器或其組合時,前述感測器可設置於該基座的該第一表面或該第二表面上;當該感測器為該溫度感測器時,該溫度感測器係以鑲埋法設置於該基座和該研磨層中,即溫度感測器的本體位於該連結表面和該第二表面之間,且該溫度感測器延伸至以其探頭突出於該研磨層的工作表面。Or, in other embodiments, the base is a disc, and the base further includes a first surface and a second surface connected, the connecting surface is opposite to the second surface, and the first surface It is surrounded by the connecting surface and the second surface, and is located between the connecting surface and the second surface, that is to say, the first surface is the outer peripheral surface of the disc; preferably, the base The seat further includes a shaft hole passing through the first surface and the second surface, and the diameter of the shaft hole wall is the diameter of the disk. Preferably, when the sensor is the vibration sensor, the pressure sensor, the sound sensor or a combination thereof, the aforementioned sensor can be arranged on the first surface of the base or the second On two surfaces; when the sensor is the temperature sensor, the temperature sensor is embedded in the base and the grinding layer, that is, the body of the temperature sensor is located between the connecting surface and the grinding layer. between the second surfaces, and the temperature sensor extends to the working surface with its probe protruding from the grinding layer.

較佳的,該基座係一空心圓柱體。在一些實施態樣中,該基座包含相對的一空心之第一表面和一空心之第二表面,該連結表面由該第一表面和該第二表面之外周環繞成型,並且位於該第一表面和該第二表面之間;該基座更包含一第三表面,該第三表面與該第一表面和該第二表面相連接,該第三表面環繞形成該第一表面之空心和該第二表面之空心,且與該連結表面相對。也就是說,該連結表面係該空心圓柱體的外周面,該外周面之直徑係該空心圓柱體之外徑;該第三表面係該空心圓柱體的內周面,該內周面之直徑係該空心圓柱體之內徑。較佳的,當該感測器為該震動感測器、該壓力感測器、該聲音感測器或其組合時,前述感測器可設置於該基座的該第一表面、該第二表面或該第三表面上;當該感測器為該溫度感測器時,該溫度感測器係以鑲埋法設置於該基座和該研磨層中,即溫度感測器的本體位於該連結表面和該第三表面之間,且該溫度感測器延伸至以其探頭突出於該研磨層的工作表面。Preferably, the base is a hollow cylinder. In some embodiments, the base includes a hollow first surface and a hollow second surface opposite to each other, the connecting surface is formed around the first surface and the second surface, and is located on the first between the surface and the second surface; the base further includes a third surface, the third surface is connected to the first surface and the second surface, and the third surface surrounds the hollow forming the first surface and the The second surface is hollow and opposite to the connecting surface. That is to say, the connecting surface is the outer peripheral surface of the hollow cylinder, and the diameter of the outer peripheral surface is the outer diameter of the hollow cylinder; the third surface is the inner peripheral surface of the hollow cylinder, and the diameter of the inner peripheral surface is is the inner diameter of the hollow cylinder. Preferably, when the sensor is the vibration sensor, the pressure sensor, the sound sensor or a combination thereof, the aforementioned sensor can be arranged on the first surface of the base, the second On the second surface or the third surface; when the sensor is the temperature sensor, the temperature sensor is embedded in the base and the grinding layer, that is, the body of the temperature sensor The temperature sensor is located between the connecting surface and the third surface, and the temperature sensor extends to the working surface with its probe protruding from the grinding layer.

在一實施態樣中,該基座為一帶柄棒體。該基座包含由一工作部和由該工作部延伸的一柄部,該工作部為一球體、一圓盤體、一圓柱體或一錐體;該工作部的外表面包含該連結表面;較佳的,工作部的外表面為該連結表面,因此,該研磨層完整包覆該工作部的外表面,該感測器則可設置於該柄部或該工作部的內部,但不限於此。In one embodiment, the base is a rod with a handle. The base includes a working part and a handle extending from the working part, the working part is a sphere, a disk, a cylinder or a cone; the outer surface of the working part includes the connecting surface; Preferably, the outer surface of the working part is the connecting surface, therefore, the abrasive layer completely covers the outer surface of the working part, and the sensor can be arranged inside the handle or the working part, but is not limited to this.

依據本發明,該感測器設置於該基座或該研磨層的位置只要不影響該研磨工具的運轉即可。較佳的,該感測器設置的位置愈靠近該研磨層的工作表面愈佳。According to the present invention, the sensor is disposed at the position of the base or the grinding layer as long as it does not affect the operation of the grinding tool. Preferably, the closer the sensor is located to the working surface of the grinding layer, the better.

本發明另提供一種研磨系統。該研磨系統包括:一磨床機、一如前述之可感測研磨狀態的研磨工具,以及一資料擷取元件。該磨床機包含一研磨部,其係用於安裝該可感測研磨狀態的研磨工具,該可感測研磨狀態的研磨工具用以研磨一待磨的工件,且該可感測研磨狀態的研磨工具的感測器用以感測該可感測研磨狀態的研磨工具的研磨狀態,並傳遞一訊號資料;該資料擷取元件係用以接收該可感測研磨狀態的研磨工具的感測器所傳遞的訊號資料,以供操作人員參考。The invention further provides a grinding system. The grinding system includes: a grinding machine, a grinding tool capable of sensing the grinding state as mentioned above, and a data acquisition component. The grinding machine includes a grinding part, which is used to install the grinding tool which can sense the grinding state. The grinding tool which can sense the grinding state is used to grind a workpiece to be ground, and the grinding tool which can sense the grinding state The sensor of the tool is used to sense the grinding state of the grinding tool that can sense the grinding state, and transmit a signal data; the data acquisition element is used to receive the sensor of the grinding tool that can sense the grinding state The transmitted signal information is for the operator's reference.

依據本發明,該磨床機的種類並無特別限制,主要可因應不同的工件及加工方式設計以及所使用的砂輪做對應選擇。舉例而言,該磨床機的可為一平面磨床機、一立式磨床機、一外圓磨床機或一內圓磨床機,但不限於此。According to the present invention, the type of the grinding machine is not particularly limited, and it can be selected according to different workpieces and processing methods, as well as the used grinding wheel. For example, the grinding machine can be a surface grinding machine, a vertical grinding machine, an external cylindrical grinding machine or an internal cylindrical grinding machine, but not limited thereto.

依據本發明,該資料擷取元件的種類並無特別限制,主要需能與該可感測研磨狀態的研磨工具的感測器搭配使用,用於接收該感測器所傳遞的訊號資料。舉例而言,該資料擷取元件可選用有線或無線的方式接收該感測器所傳遞的訊號資料。在一些實施態樣中,該資料擷取元件可直接將所接收到的訊號資料呈現予操作人員;在另一些實施態樣中,該資料擷取元件進一步將所接收到的訊號資料儲存下來;在又另一些實施態樣中,該資料擷取元件進一步將所接收到的訊號資料傳輸至一雲端資料庫。另外,該資料擷取元件可進一步分析所接收到的訊號資料。According to the present invention, the type of the data acquisition element is not particularly limited, and it mainly needs to be used in conjunction with the sensor of the grinding tool capable of sensing the grinding state to receive the signal data transmitted by the sensor. For example, the data acquisition component can receive the signal data transmitted by the sensor in a wired or wireless manner. In some implementations, the data acquisition component can directly present the received signal data to the operator; in other implementations, the data acquisition component further stores the received signal data; In still other implementation aspects, the data acquisition component further transmits the received signal data to a cloud database. In addition, the data acquisition component can further analyze the received signal data.

在第一實施態樣中,該資料擷取元件可以是一嵌入式裝置,其需安裝至該磨床機上;在第二實施態樣中,該資料擷取元件可以是一獨立式裝置,即不須安裝至該磨床機中。在第三實施態樣中,該資料擷取元件可以是一安裝有可讀取資料擷取元件所接收的訊號資料之應用程式的行動裝置。或者,在另一些實施方案中,無論是第一實施態樣或第二實施態樣的資料擷取元件,皆可另外與一安裝有可讀取資料擷取元件所接收的訊號資料之應用程式的行動裝置相連接。所述行動裝置可為一智慧型手機(smart phone)、一平板電腦(tablet PC)、或一筆記型電腦(laptop)等,但不限於此。In the first embodiment, the data acquisition device may be an embedded device, which needs to be installed on the grinding machine; in the second embodiment, the data acquisition device may be a stand-alone device, namely It does not have to be installed into the grinder machine. In the third embodiment, the data capture component may be a mobile device installed with an application program capable of reading the signal data received by the data capture component. Or, in some other implementation solutions, no matter the data acquisition component of the first implementation mode or the second implementation mode, it can be additionally installed with an application program that can read the signal data received by the data acquisition unit mobile device connected. The mobile device can be a smart phone (smart phone), a tablet PC (tablet PC), or a notebook computer (laptop), etc., but not limited thereto.

較佳的,該研磨系統更包括一控制器,該控制器分別與該資料擷取元件和該磨床機以電性連接。在一些實施態樣中,該控制器可以是獨立的一裝置;在另一些實施態樣中,該控制器亦可以設置於該磨床機中所包含的控制部。Preferably, the grinding system further includes a controller, which is electrically connected to the data acquisition device and the grinding machine respectively. In some implementations, the controller can be an independent device; in other implementations, the controller can also be set in the control part included in the grinding machine.

較佳的,所述控制器可包括程式化處理單元等,但不限於此。較佳的,該控制器為一智慧化加工控制器,其包含電腦數值控制(Computer Numerical Control,CNC)模組。較佳的,該智慧化加工控制器系統可更包含一數據處理模組;當該研磨系統進行一研磨加工製程時,該智慧化加工控制器將該資料擷取元件所接收到的訊號資料與該數據處理模組中的參考加工資料進行比對,並利用該智慧化加工控制器以即時調整所述該研磨系統的加工參數,例如,可透過前述CNC模組調整該研磨加工製程的加工條件,不僅實現即時觀測研磨加工製程的過程,同時能即時給予反饋,更進一步提升加工品質。其中,所述數據處理模組包括一線下資料庫(即該智慧化加工控制器中儲存的既有資料)或經由網際網路連接一雲端資料庫(cloud database)以獲取所述參考加工資料,但不限於此。Preferably, the controller may include a programmed processing unit, etc., but is not limited thereto. Preferably, the controller is an intelligent processing controller, which includes a computer numerical control (Computer Numerical Control, CNC) module. Preferably, the intelligent processing controller system may further include a data processing module; when the grinding system performs a grinding process, the intelligent processing controller combines the signal data received by the data acquisition element with the The reference processing data in the data processing module is compared, and the intelligent processing controller is used to adjust the processing parameters of the grinding system in real time. For example, the processing conditions of the grinding process can be adjusted through the aforementioned CNC module , not only to realize real-time observation of the grinding process, but also to give real-time feedback to further improve the processing quality. Wherein, the data processing module includes an offline database (that is, the existing data stored in the intelligent processing controller) or connects to a cloud database (cloud database) via the Internet to obtain the reference processing data, But not limited to this.

在另一些實施態樣中,一操作人員可先透過該資料擷取元件呈現該研磨工具之即時研磨加工狀態,再自行設定該磨床機運作所需的加工條件。In some other implementations, an operator can display the real-time grinding processing status of the grinding tool through the data acquisition device, and then set the processing conditions required for the operation of the grinding machine.

在下文中,本領域技術人員可從以下實施例很輕易地理解本發明所能達到的優點及效果。因此,應當理解本文提出的敘述僅僅用於說明優選的實施方式而不是用於侷限本發明的範圍,在不悖離本發明的精神和範圍的情況下,可以進行各種修飾、變更以便實施或應用本發明之內容。Hereinafter, those skilled in the art can easily understand the advantages and effects of the present invention from the following examples. Therefore, it should be understood that the descriptions presented herein are only for illustrating the preferred embodiments and not for limiting the scope of the present invention, and that various modifications and changes may be made for implementation or application without departing from the spirit and scope of the present invention Contents of the present invention.

實施例Example 11 之可感測研磨狀態的研磨工具A grinding tool that can sense the grinding state

請參閱圖1,本實施例係以一圓盤狀的砂輪作為可感測研磨狀態的研磨工具之實例進行說明。Please refer to FIG. 1 , this embodiment is described by taking a disc-shaped grinding wheel as an example of a grinding tool capable of sensing the grinding state.

該可感測研磨狀態的研磨工具10包括一基座11、一研磨層12以及一壓力感測器13a。其中,該基座11具有一連結表面11a;該研磨層12設置於該基座11的連結表面11a上,且該研磨層12具有一遠離該連結表面11a的工作表面12a,該壓力感測器13a設置於該基座11上。The grinding tool 10 capable of sensing the grinding state includes a base 11 , a grinding layer 12 and a pressure sensor 13 a. Wherein, the base 11 has a connecting surface 11a; the grinding layer 12 is disposed on the connecting surface 11a of the base 11, and the grinding layer 12 has a working surface 12a away from the connecting surface 11a, the pressure sensor 13a is disposed on the base 11 .

更進一步來說,該基座11係一圓盤,於本實施例中,該連結表面11a為所述圓盤的外周面,該可感測研磨狀態的研磨工具10包含相對之一第一表面111(所述圓盤的一圓形側面)、一第二表面112(所述圓盤的另一圓形側面),該連結表面11a係由該第一表面111和該第二表面112之外周圍環繞成型,並且位於該第一表面111和該第二表面112之間。此外,該基座11更具有貫通該第一表面111和該第二表面112的軸孔113。在本實施例中,由於本實施例之可感測研磨狀態的研磨工具10的研磨層12環繞設置於該連結表面11a上,因此,該可感測研磨狀態的研磨工具10的幾何結構為一與該基座11呈同心圓的大圓盤,而該研磨層12的工作表面12a係該大圓盤的外周面,該大圓盤具有之相對的兩圓形側面即屬於該可感測研磨狀態的研磨工具10的非工作表面。Furthermore, the base 11 is a disk, and in this embodiment, the connecting surface 11a is the outer peripheral surface of the disk, and the grinding tool 10 that can sense the grinding state includes an opposite first surface 111 (a circular side of the disc), a second surface 112 (another circular side of the disc), the joint surface 11a is formed from the first surface 111 and the second surface 112 It is formed around and located between the first surface 111 and the second surface 112 . In addition, the base 11 further has a shaft hole 113 passing through the first surface 111 and the second surface 112 . In this embodiment, since the grinding layer 12 of the grinding tool 10 capable of sensing the grinding state of this embodiment is disposed around the connecting surface 11a, the geometric structure of the grinding tool 10 capable of sensing the grinding state is a A large disk concentric with the base 11, and the working surface 12a of the abrasive layer 12 is the outer peripheral surface of the large disk, and the two opposite circular sides of the large disk belong to the sensory grinding The state of the non-working surface of the grinding tool 10.

本實施例中,該基座11的材質為鋁合金。該研磨層12包括一結合劑以及複數顆分散在該結合劑中的磨料,且至少一部分之所述磨料露出該研磨層12的工作表面12a。其中,該結合劑的材料可包含銅錫合金、鎳金屬、陶瓷材料或樹脂(例如酚醛樹脂、環氧樹脂、聚醯亞胺樹脂等);該磨料的材料可包含鑽石、CBN、氧化鋁或碳化矽。In this embodiment, the base 11 is made of aluminum alloy. The grinding layer 12 includes a bonding agent and a plurality of abrasive particles dispersed in the bonding agent, and at least a part of the abrasive materials is exposed from the working surface 12 a of the grinding layer 12 . Wherein, the material of this bonding agent can comprise copper-tin alloy, nickel metal, ceramic material or resin (such as phenolic resin, epoxy resin, polyimide resin etc.); The material of this abrasive material can comprise diamond, CBN, aluminum oxide or silicon carbide.

於本實施例中,該壓力感測器13a係採用市售接著劑以黏貼法黏附於該第一表面111上;另外,於其他實施方案中,該壓力感測器13a亦可選擇以鑲埋法、鑲嵌法或鎖附法等方式設置於該基座11(例如於該第一表面111上或該第二表面112)上。In this embodiment, the pressure sensor 13a is adhered on the first surface 111 by using a commercially available adhesive; in addition, in other embodiments, the pressure sensor 13a can also be embedded It is disposed on the base 11 (for example, on the first surface 111 or the second surface 112 ) by means of method, mosaic method or locking method.

實施例Example 22 之可感測研磨狀態的研磨工具A grinding tool that can sense the grinding state

請參閱圖2,本實施例之可感測研磨狀態資訊的研磨工具10與實施例1之可感測研磨狀態的研磨工具10具有相同的幾何結構,且基座11和研磨層12之材質亦相同,兩者主要差異在於本實施例之研磨層12和震動感測器13b設置於該基座11的表面位置和方式與實施例1之研磨層12和壓力感測器13a不同。Please refer to Fig. 2, the grinding tool 10 of the present embodiment that can sense the grinding state information has the same geometric structure as the grinding tool 10 of the embodiment 1 that can sense the grinding state, and the materials of the base 11 and the grinding layer 12 are also the same. The same, the main difference between the two is that the location and method of the abrasive layer 12 and the vibration sensor 13b in the present embodiment on the surface of the base 11 are different from the abrasive layer 12 and the pressure sensor 13a in the first embodiment.

具體而言,該基座11係一圓盤,除了該連結表面11a,該基座11同時還包含一第一表面111、一第二表面112和一貫通該連結表面11a和該第二表面112的軸孔113。於本實施例中,該連結表面11a為圓盤的頂面,該連結表面11a和該第二表面112(即圓盤的底面)相對,該第一表面111由該連結表面11a和該第二表面112之外周圍環繞成型,並且位於該連結表面11a和該第二表面112之間,即圓盤的外周面。也就是說,由於本實施例之可感測研磨狀態的研磨工具10的研磨層12疊設於該連結表面11a上,因此,該可感測研磨狀態的研磨工具10的幾何結構為一與該基座11具有相同直徑但厚度更厚的厚圓盤,而該研磨層12的工作表面12a係該厚圓盤的一圓形頂面,該厚圓盤具有與工作表面12a相對的另一圓形側面(即該第二表面112)和該厚圓盤的外圓周面皆屬於該可感測研磨狀態的研磨工具10的非工作表面。Specifically, the base 11 is a disc, except for the connecting surface 11a, the base 11 also includes a first surface 111, a second surface 112 and a connecting surface 11a and the second surface 112. The shaft hole 113. In this embodiment, the connecting surface 11a is the top surface of the disk, the connecting surface 11a is opposite to the second surface 112 (i.e. the bottom surface of the disk), and the first surface 111 is formed by the connecting surface 11a and the second surface. The surface 112 is formed around the outside and is located between the connecting surface 11 a and the second surface 112 , that is, the outer peripheral surface of the disc. That is to say, since the abrasive layer 12 of the grinding tool 10 capable of sensing the grinding state of the present embodiment is stacked on the connecting surface 11a, the geometric structure of the grinding tool 10 capable of sensing the grinding state is one and the same as the The base 11 has a thicker disc with the same diameter but thicker, and the working surface 12a of the abrasive layer 12 is a circular top surface of the thick disc, which has another circular disc opposite to the working surface 12a. Both the shaped side (ie the second surface 112 ) and the outer peripheral surface of the thick disc belong to the non-working surface of the grinding tool 10 which can sense the grinding state.

於本實施例中,該震動感測器13b係採用鎖附法以一組鎖固元件131將該震動感測器13b固定於該第二表面112上;另外,於其他實施方案中,該震動感測器13b亦可選擇以鑲埋法、鑲嵌法或黏貼法等方式設置於該基座11(例如於該第二表面112上或該第一表面111)上。In this embodiment, the vibration sensor 13b is fixed on the second surface 112 with a set of locking elements 131 by locking method; in addition, in other embodiments, the vibration The sensor 13b can also be disposed on the base 11 (for example, on the second surface 112 or the first surface 111 ) by embedding, inlaying or sticking.

實施例Example 33 之可感測研磨狀態的研磨工具A grinding tool that can sense the grinding state

請參閱圖3,本實施例之可感測研磨狀態資訊的研磨工具10與實施例1之可感測研磨狀態的研磨工具10具有相同的幾何結構,且基座11和研磨層12之材質亦相同,兩者主要差異在於本實施例之溫度感測器13c設置於該基座11的位置和方式與實施例1之壓力感測器13a不同。Please refer to FIG. 3 , the grinding tool 10 capable of sensing grinding state information in this embodiment has the same geometric structure as the grinding tool 10 capable of sensing grinding state information in Embodiment 1, and the materials of the base 11 and the grinding layer 12 are also the same. The same, the main difference between the two is that the temperature sensor 13c of this embodiment is arranged on the base 11 in a different position and manner than the pressure sensor 13a of the first embodiment.

於本實施例中,該溫度感測器13c係以鑲埋法設置於該基座11和該研磨層12的內部,即位於該第一表面111和該第二表面112之間;該溫度感測器13c具有一本體和一探頭132,且該溫度感測器13c從基座11內部延伸至該研磨層12的工作表面12a,並以其探頭132突出該工作表面12a。也就是說,除了該溫度感測器13c的探頭132之外,該溫度感測器13c的其餘部分並未顯露或超出該可感測研磨狀態的研磨工具10的外表面(例如第一表面111和第二表面112)。In this embodiment, the temperature sensor 13c is embedded in the base 11 and the abrasive layer 12, that is, between the first surface 111 and the second surface 112; the temperature sensor The detector 13c has a body and a probe 132, and the temperature sensor 13c extends from the inside of the base 11 to the working surface 12a of the grinding layer 12, and protrudes from the working surface 12a with its probe 132. That is to say, except the probe 132 of the temperature sensor 13c, the rest of the temperature sensor 13c does not expose or exceed the outer surface of the grinding tool 10 (such as the first surface 111) which can sense the grinding state. and second surface 112).

實施例Example 44 之可感測研磨狀態的研磨工具A grinding tool that can sense the grinding state

請參閱圖4,本實施例之可感測研磨狀態資訊的研磨工具10與實施例1之可感測研磨狀態的研磨工具10具有相同的幾何結構,且基座11和研磨層12之材質亦相同,兩者主要差異在於本實施例之震動感測器13b和聲音感測器13d設置於該基座11的位置和方式與實施例1之壓力感測器13a不同。Please refer to FIG. 4 , the grinding tool 10 capable of sensing grinding state information in this embodiment has the same geometric structure as the grinding tool 10 capable of sensing grinding state information in Embodiment 1, and the materials of the base 11 and the grinding layer 12 are also the same. The same, the main difference between the two is that the position and method of the vibration sensor 13b and the sound sensor 13d in this embodiment are arranged on the base 11 are different from the pressure sensor 13a in the first embodiment.

於本實施例中,該震動感測器13b係採用鎖附法以一組鎖固元件131將該震動感測器13b固定於該第一表面111上;另外,該聲音感測器13d係採用鑲嵌法將該聲音感測器13d凹設於該第一表面111,且該聲音感測器13d的外表面與該第一表面111齊平。於其他實施方案中,該震動感測器13b或該聲音感測器13d亦可選擇黏貼法等方式設置於該第二表面112上或該第一表面111上。In this embodiment, the vibration sensor 13b is fixed on the first surface 111 with a set of locking elements 131 by locking method; in addition, the sound sensor 13d is fixed on the first surface 111; The acoustic sensor 13d is recessed on the first surface 111 by the mosaic method, and the outer surface of the acoustic sensor 13d is flush with the first surface 111 . In other embodiments, the vibration sensor 13b or the sound sensor 13d can also be disposed on the second surface 112 or the first surface 111 by means of sticking or the like.

應用例Application example 11 之研磨系統grinding system

請參閱圖5,本應用例之研磨系統1係採用一臥軸式平面磨床機且搭配一鑽石砂輪(即上述實施例1之可感測研磨狀態的研磨工具10)之實例進行說明。在另一些實施例中,本應用例之研磨系統1亦可搭配上述實施例3或4之可感測研磨狀態的研磨工具10,但不限於此。Please refer to FIG. 5 , the grinding system 1 of this application example uses a horizontal-axis surface grinder and a diamond grinding wheel (that is, the grinding tool 10 of the above-mentioned embodiment 1 that can sense the grinding state) for illustration. In some other embodiments, the grinding system 1 of this application example can also be used with the grinding tool 10 of the above-mentioned embodiment 3 or 4 that can sense the grinding state, but it is not limited thereto.

該研磨系統1包括一磨床機20、一可感測研磨狀態的研磨工具10、一資料擷取元件30和一控制器40。其中,該磨床機20包含一研磨部21,該可感測研磨狀態的研磨工具10係安裝於該研磨部21。該可感測研磨狀態的研磨工具10係可用以研磨一待磨的工件,且該可感測研磨狀態的研磨工具10的感測器用以感測該可感測研磨狀態的研磨工具10的研磨狀態,並傳遞一訊號資料,該資料擷取元件30以無線的方式接收該訊號資料;此外,該控制器40分別與該資料擷取元件30和該磨床機20以電性連接。The grinding system 1 includes a grinding machine 20 , a grinding tool 10 capable of sensing the grinding state, a data acquisition unit 30 and a controller 40 . Wherein, the grinding machine 20 includes a grinding part 21 , and the grinding tool 10 capable of sensing the grinding state is mounted on the grinding part 21 . The grinding tool 10 that can sense the grinding state can be used to grind a workpiece to be ground, and the sensor of the grinding tool 10 that can sense the grinding state is used to sense the grinding of the grinding tool 10 that can sense the grinding state State, and transmit a signal data, the data acquisition unit 30 receives the signal data wirelessly; in addition, the controller 40 is electrically connected with the data acquisition unit 30 and the grinding machine 20 respectively.

於本應用例中,該控制器40為一智慧化加工控制器,其包含一CNC模組和一數據處理模組。當該研磨系統1進行一研磨加工製程時,該控制器40將該資料擷取元件30從該可感測研磨狀態資訊的研磨工具10的感測器接收到的訊號資料與該數據處理模組中的參考加工資料進行比對,該控制器40不僅透過一顯示裝置將接收到的訊號資料呈現予一操作人員以即時了解該可感測研磨狀態資訊的研磨工具10和該研磨加工製程當下的狀態,同時透過該智慧化加工控制器中的CNC模組再發送對應之電訊號至磨床機20,以即時調整該研磨系統1的加工參數,可自動控制所述研磨加工製程;其中,所述數據處理模組可包括一線下資料庫或經由網際網路連接一雲端資料庫以獲取所述參考加工資料。當然,操作人員亦可再自行調整該磨床機20運作所需的加工條件。In this application example, the controller 40 is an intelligent processing controller, which includes a CNC module and a data processing module. When the grinding system 1 performs a grinding process, the controller 40 shares the signal data received by the data acquisition unit 30 from the sensor of the grinding tool 10 capable of sensing grinding status information with the data processing module The controller 40 not only presents the received signal data to an operator through a display device, so as to know the grinding tool 10 that can sense the grinding state information and the current grinding process of the grinding process in real time. status, and at the same time send the corresponding electric signal to the grinding machine 20 through the CNC module in the intelligent processing controller, so as to adjust the processing parameters of the grinding system 1 in real time, and automatically control the grinding process; wherein, the The data processing module may include an offline database or connect to a cloud database via the Internet to obtain the reference processing data. Of course, the operator can also adjust the processing conditions required for the operation of the grinding machine 20 by himself.

綜上,與習知的智慧化研磨系統相比,由於本發明的研磨系統使用本發明的可感測研磨狀態的研磨工具,而其包含的感測器和資料擷取元件之搭配係採用成熟的資料傳輸技術,因此可讓操作人員很便利地於研磨加工製程的過程中,即時獲得該研磨工具當下的研磨狀態,有助於維持穩定的研磨加工品質,從而提升整體加工效率和良率;再者,本發明的研磨系統不需限定研磨系統中的磨床規格或搭配複雜、昂貴的設備,確實能降低整體加工製程的成本。To sum up, compared with the conventional intelligent grinding system, since the grinding system of the present invention uses the grinding tool of the present invention that can sense the grinding state, the combination of sensors and data acquisition components included in it adopts mature The advanced data transmission technology allows the operator to easily obtain the current grinding status of the grinding tool during the grinding process, which helps to maintain stable grinding quality, thereby improving the overall processing efficiency and yield; and Furthermore, the grinding system of the present invention does not need to limit the specifications of the grinding machine in the grinding system or to be equipped with complex and expensive equipment, which can indeed reduce the cost of the overall processing process.

儘管前述說明已闡述本發明的諸多特徵、優點及本發明的構成與特徵細節,然而這僅屬於示例性的說明。全部在本發明之申請專利範圍的一般涵義所表示範圍內,依據本發明原則所作的細節變化尤其是指形狀、尺寸和元件設置的改變,均仍屬於本發明的範圍內。Although the foregoing descriptions have set forth many features and advantages of the present invention, as well as details of the constitution and features of the present invention, these are only exemplary descriptions. All within the scope indicated by the general meaning of the patent scope of the present invention, the detailed changes made according to the principles of the present invention, especially the changes in shape, size and component arrangement, all still belong to the scope of the present invention.

1:研磨系統 10:可感測研磨狀態的研磨工具 11:基座 11a:連結表面 111:第一表面 112:第二表面 113:軸孔 12:研磨層 12a:工作表面 13a:壓力感測器 13b:震動感測器 13c:溫度感測器 13d:聲音感測器 131:鎖固元件 132:探頭 20:磨床機 21:研磨部 30:資料擷取元件 40:控制器 1: Grinding system 10: A grinding tool that can sense the grinding state 11: Base 11a: Bonding surfaces 111: first surface 112: second surface 113: shaft hole 12: Grinding layer 12a: Working surface 13a: Pressure sensor 13b: Vibration sensor 13c: temperature sensor 13d: Sound sensor 131: locking element 132: Probe 20: Grinder machine 21: Grinding department 30: Data acquisition component 40: Controller

圖1係實施例1之可感測研磨狀態的研磨工具的立體示意圖。 圖2係實施例2之可感測研磨狀態的研磨工具的立體示意圖。 圖3係實施例3之可感測研磨狀態的研磨工具的立體示意圖。 圖4係實施例4之可感測研磨狀態的研磨工具的立體示意圖。 圖5係應用例1之研磨系統的方塊示意圖。 FIG. 1 is a three-dimensional schematic diagram of a grinding tool capable of sensing a grinding state according to Embodiment 1. FIG. FIG. 2 is a three-dimensional schematic diagram of a grinding tool capable of sensing a grinding state according to Embodiment 2. FIG. FIG. 3 is a three-dimensional schematic diagram of a grinding tool capable of sensing a grinding state according to Embodiment 3. FIG. FIG. 4 is a three-dimensional schematic diagram of a grinding tool capable of sensing a grinding state according to Embodiment 4. FIG. FIG. 5 is a schematic block diagram of the grinding system of Application Example 1. FIG.

none

10:可感測研磨狀態的研磨工具 10: A grinding tool that can sense the grinding state

11:基座 11: base

11a:連結表面 11a: Bonding surfaces

111:第一表面 111: first surface

112:第二表面 112: second surface

113:軸孔 113: shaft hole

12:研磨層 12: Grinding layer

12a:工作表面 12a: Working surface

13a:壓力感測器 13a: Pressure sensor

Claims (11)

一種可感測研磨狀態的研磨工具,其包括:一基座;一研磨層;以及一感測器;其中,該可感測研磨狀態的研磨工具為一可感測研磨狀態的砂輪;該基座具有一連結表面;該研磨層設置於該基座的該連結表面上,該研磨層具有一遠離該連結表面的工作表面;該感測器設置於該基座或該研磨層。 A grinding tool capable of sensing a grinding state, comprising: a base; a grinding layer; and a sensor; wherein, the grinding tool capable of sensing a grinding state is a grinding wheel capable of sensing a grinding state; the base The seat has a connecting surface; the grinding layer is arranged on the connecting surface of the base, and the grinding layer has a working surface away from the connecting surface; the sensor is arranged on the base or the grinding layer. 如請求項1所述之可感測研磨狀態的研磨工具,其中,該感測器包含一震動感測器、一壓力感測器、一聲音感測器、一溫度感測器或其組合。 The grinding tool capable of sensing the grinding state according to claim 1, wherein the sensor includes a vibration sensor, a pressure sensor, a sound sensor, a temperature sensor or a combination thereof. 如請求項1所述之可感測研磨狀態的研磨工具,其中,該感測器具有儲存訊號功能。 The grinding tool capable of sensing the grinding state according to claim 1, wherein the sensor has the function of storing signals. 如請求項1所述之可感測研磨狀態的研磨工具,其中,該感測器係以黏貼法、鑲埋法、鑲嵌法或鎖附法設置於該基座或該研磨層。 The grinding tool capable of sensing the grinding state as described in Claim 1, wherein the sensor is disposed on the base or the grinding layer by sticking, embedding, embedding or locking. 如請求項2所述之可感測研磨狀態的研磨工具,其中,該感測器包含該溫度感測器,且該溫度感測器具有一本體和一探頭,該本體設置於該基座中,該探頭突出於該研磨層的工作表面。 The grinding tool capable of sensing the grinding state as described in claim 2, wherein the sensor includes the temperature sensor, and the temperature sensor has a body and a probe, and the body is arranged in the base, The probe protrudes from the working surface of the abrasive layer. 如請求項1至4中任一項所述之可感測研磨狀態的研磨工具,其中,該基座係一圓盤,該基座更包含相對的一第一表面和一第二表面,該連結表面由該第一表面和該第二表面之周圍環繞成型,並且位於該第一表面和該第二表面之間;該感測器設置於該基座的該第一表面或該第二表面上。 The grinding tool capable of sensing the grinding state as described in any one of Claims 1 to 4, wherein the base is a disk, and the base further includes a first surface and a second surface opposite to each other, the base The connecting surface is surrounded by the first surface and the second surface and is located between the first surface and the second surface; the sensor is arranged on the first surface or the second surface of the base superior. 如請求項1至4中任一項所述之可感測研磨狀態的研磨工具,其中,該基座係一圓盤,該基座更包含相連接的一第一表面和一第二表面,該 連結表面和該第二表面相對,該第一表面由該連結表面和該第二表面之周圍環繞成型,並且位於該連結表面和該第二表面之間;該感測器設置於該基座的該第一表面或該第二表面上。 The grinding tool capable of sensing the grinding state as described in any one of claims 1 to 4, wherein the base is a disk, and the base further includes a first surface and a second surface connected, Should The connection surface is opposite to the second surface, the first surface is surrounded by the connection surface and the second surface, and is located between the connection surface and the second surface; the sensor is arranged on the base on the first surface or the second surface. 如請求項5所述之可感測研磨狀態的研磨工具,其中,該基座係一圓盤,該基座更包含相對的一第一表面和一第二表面,該連結表面由該第一表面和該第二表面之周圍環繞成型,並且位於該第一表面和該第二表面之間;該溫度感測器係以鑲埋法設置於該基座和該研磨層中,該溫度感測器的該本體位於該第一表面和該第二表面之間,且該溫度感測器的該探頭突出於該研磨層的工作表面。 The grinding tool capable of sensing the grinding state as described in claim 5, wherein the base is a disk, and the base further includes a first surface and a second surface opposite to each other, and the connecting surface is formed by the first The surface and the second surface are surrounded by molding, and are located between the first surface and the second surface; the temperature sensor is embedded in the base and the grinding layer, and the temperature sensor The body of the sensor is located between the first surface and the second surface, and the probe of the temperature sensor protrudes from the working surface of the grinding layer. 一種研磨系統,其包括:一如請求項1至8中任一項所述之可感測研磨狀態的研磨工具;一磨床機,該磨床機包含一研磨部;以及一資料擷取元件;其中,該可感測研磨狀態的研磨工具係安裝於該研磨部,用以研磨一待磨的工件,且該可感測研磨狀態的研磨工具的感測器用以感測該可感測研磨狀態的研磨工具的研磨狀態,並傳遞一訊號資料;該資料擷取元件用以接收該可感測研磨狀態的研磨工具的感測器所傳遞的訊號資料。 A grinding system, comprising: a grinding tool capable of sensing the grinding state as described in any one of Claims 1 to 8; a grinding machine, which includes a grinding part; and a data acquisition element; wherein , the grinding tool capable of sensing the grinding state is mounted on the grinding part for grinding a workpiece to be ground, and the sensor of the grinding tool capable of sensing the grinding state is used to sense the sensor of the grinding state The grinding state of the grinding tool, and transmit a signal data; the data acquisition element is used to receive the signal data transmitted by the sensor of the grinding tool which can sense the grinding state. 如請求項9所述之研磨系統,其中,該研磨系統更包括一控制器,該控制器分別與該資料擷取元件和該磨床機以電性連接。 The grinding system as described in claim 9, wherein the grinding system further includes a controller, and the controller is electrically connected to the data acquisition device and the grinding machine respectively. 如請求項10所述之研磨系統,其中,該控制器為一智慧化加工控制器,該智慧化加工控制器包含一數據處理模組;當該研磨系統進行一研磨加工製程時,該智慧化加工控制器將該資料擷取元件所接收到的訊號資料與該數據處理模組中的參考加工資料進行比對,並利用該智慧化加工控制器即時 調整所述該研磨系統的加工參數;其中,所述數據處理模組包括一線下資料庫或經由網際網路連接一雲端資料庫以獲取所述參考加工資料。 The grinding system as described in claim 10, wherein the controller is an intelligent processing controller, and the intelligent processing controller includes a data processing module; when the grinding system performs a grinding process, the intelligent processing The processing controller compares the signal data received by the data acquisition device with the reference processing data in the data processing module, and uses the intelligent processing controller to real-time Adjust the processing parameters of the grinding system; wherein, the data processing module includes an offline database or connects to a cloud database via the Internet to obtain the reference processing data.
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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201929088A (en) * 2014-10-09 2019-07-16 美商應用材料股份有限公司 Chemical mechanical polishing pad with internal channels
TW202114814A (en) * 2019-10-04 2021-04-16 日商荏原製作所股份有限公司 Polishing device, information processing system, information processing method, and program

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201929088A (en) * 2014-10-09 2019-07-16 美商應用材料股份有限公司 Chemical mechanical polishing pad with internal channels
TW202114814A (en) * 2019-10-04 2021-04-16 日商荏原製作所股份有限公司 Polishing device, information processing system, information processing method, and program

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