CN1131759C - 套料和冲击组合的激光钻削 - Google Patents
套料和冲击组合的激光钻削 Download PDFInfo
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- CN1131759C CN1131759C CN988131137A CN98813113A CN1131759C CN 1131759 C CN1131759 C CN 1131759C CN 988131137 A CN988131137 A CN 988131137A CN 98813113 A CN98813113 A CN 98813113A CN 1131759 C CN1131759 C CN 1131759C
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/001—Turbines
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Abstract
一种在超耐热合金构件上以激光钻削相对大而深之孔的方法,此方法先用冲击激光钻削在该构件上钻制一个其孔径比预定直径小的中央孔,然后环绕该中央孔进行套料激光钻削,从而将该孔直径扩大到预定直径。
Description
技术领域
本发明涉及在构件上的激光钻削,尤其是涉及在超耐热合金构件上,尤其是在如涡轮叶片和叶轮那样的燃气轮机构件上的相对较大且较深孔的激光钻削。
背景技术
在一段时间以来,在燃气轮机构件如涡轮叶片和叶轮上用激光钻削如冷却孔那样的孔是已公知的技术。激光加工处理材料的工艺即是在工件的表面上聚焦一高功率的激光束。该激光束的一部分被吸收,其吸收量与该材料的种类及工件表面的条件有关。通过吸收高功率(例如250瓦)并被聚焦到0.10mm-0.20mm(即0.004至0.008英寸)直径的激光束所产生的高密度能量(例如107瓦/cm2量级),可使表面材料加热、融化和汽化。
据大多数记录,激光钻削能产生小的直径(例如0.10mm,即0.004英寸)的小孔,该小孔具有大的深度对直径比率(即纵横比率>10∶1);以及从表面起有小角度(10°)的孔,这类孔都是在最坚硬的航空合金上加工出的。
现有两种激光钻削方法:冲击钻削和套料钻削。冲击激光钻削通常用来钻削叶片和喷嘴导向叶轮上的冷却孔。此方法包括一用来穿透该件材之厚度的固定光束和一个或多个脉冲。就冲击激光钻孔而言,该孔的孔径是由该光束直径及功率大小来确定的。
套料激光钻孔涉及用仿形切削加工孔。此方法是沿着一圆形轨道移动该激光束而产生一个其直径比一固定聚焦光束(亦即如冲击钻削那样的)所钻出的孔要大的孔。一种高压惰性气体或氧化气体流动通过一适合于激光束的喷嘴,从而提供为除去被激光融化的金属所需要的机械能。就套料激光加工而言,所加工的孔径只受到该运动系统之行迹的限制。
在用来钻削相对大(例如至少为0.762mm,即0.030英寸)和深(例如至少7.62mm,即0.30英寸)的孔,尤其是涉及在Ni和Co基的超耐热合金上钻孔时,此类冲击钻削和套料加工方法都受到阻止。由于渣料堆积会堵塞所钻的孔,此冲击方法受到限制。在孔直径为约0.762mm(即0.030英寸)时,其能够有效地钻制孔的深度与直径(纵横)之(最大)比率为约10∶1。而且,在用冲击钻削大而深的孔时,所形成的孔被检测到有锥度,即在孔的底部孔径较小。在孔钻得太深之前,渣料趋于积累在孔中和激光能量被与继续钻孔相干扰的基体所吸收,故套料法钻制大而深的孔也是低效率的。
发明内容
本发明的目的是提供一种在超耐热合金构件上用激光钻削大而深之孔的方法。
简言之,本发明提供一种在镍和/或钴基之超耐热合金构件上用激光钻制孔的方法,所述孔具有一预定的孔径至少为约0.762mm(即0.03英寸),其深度与孔径之比率至少约10∶1。包括:先用冲击激光在该耐热合金构件上钻制一个其直径小于该预定直径的中央孔,然后用套料激光环绕该中央孔钻孔,从而使该中央孔的直径扩大到预定的直径。这些步骤在该孔钻制过程中按需要被重复进行,以便完成形成一个均匀的孔。
具体实施方式
激光钻孔通常用由CNC(计算机数字控制)控制的YAG脉冲式激光机进行。该激光机一般产生其直径为约0.10mm-0.20mm(即0.004-0.008英寸)的光束,其平均能量约250瓦。配置一光学系统,此系统具有一使激光束在待钻孔之构件表面上聚焦的透镜。该构件是一种镍和/或钴基的超耐热合金材料。典型的超耐热合金包括Mar-M509、IN-738、CMSX-4、IN-792、U520及X-40。该构件可以是燃气涡轮构件,如涡轮叶片和叶轮,该钻孔是为了薄膜冷却之目的。待钻制的预定孔径至少为约0.762mm(0.030英寸),其深度与直径之比率至少是约10∶1。最好是孔径约为(0.762-2.54)mm(即0.030-0.10英寸)时,其深度与直径的比率约为20-30∶1。该孔的深度大体上在约10.16mm-38.1mm(即0.4-1.5英寸)之范围内。
此方法的第一步骤是在该超耐热的合金构件上用冲击(激光)钻制一个其直径比想要的(预定)直径小的中央孔。由冲击钻孔制出的中央孔直径可达约0.508mm(即0.02英寸),最好为0.254mm-0.508mm(即0.01-0.02英寸)。可以在冲击钻削中央孔时使用一203.2mm(即8英寸)焦距的透镜。在冲击激光钻孔期间,通常使用4-8个激光脉冲/秒。该中央孔的直径要便于除去渣料,因而可使后继的套料加工能有效地进行。
在冲击钻孔之后进行套料激光钻孔而将中央孔扩大至预定的直径。套料加工就是使激光追随一圆形轨道钻出一连串小圆孔,从而产生一个有预定直径的孔。在套料作业时为产生所述套料圆孔,可以采用一个152.4mm(即6英寸)焦距的透镜。在套料作业期间,一般采用10-15个激光脉冲/秒。激光束相对构件的运动可通过采用本领域公知的方法使激光束和/或构件运动来实现。在套料作业期间如果有渣料积聚而影响钻孔,即就要再重复进行冲击钻削,然后再接着进行套料作业步骤。重复这两个操作步骤,一直到在超耐合金构件整个厚度上均匀地钻制出该预定直径的孔为止。
在此激光钻孔作业期间,该孔的后部要保持清洁,从而允许渣料在套料作业期间从中央孔排出。因而,不用阻挡料(如树脂)置于邻近该孔的排出口。但是可用防护阻挡料来防止在该孔之排出口相反端处的构件壁的烧蚀。一种防护阻挡料(例如树脂)可以用在相对该孔之排出口为相反端处的构件壁上,以便保护构件上处于激光束轨道内的这些表面被加工或损伤。
例子
一种M34聚焦能量CNC(计算机数控)脉冲式YAG激光机用来在一种MAR M509超耐热合金工业透平叶轮构件的22。86mm(即0.9英寸)厚壁上制作一直径为1.143mm(即0.045英寸)的通孔。
采用一个八英寸焦距的透镜,及用一为6个脉冲/秒的激光脉冲频率在该构件上冲击钻制一种0.381mm-0.508mm(即0.015至0.020英寸)的中央孔。用一个152.4mm(即6英寸)焦距的透镜及一个为12个脉冲/秒的激光脉冲频率环绕每个中央孔进行套料激光钻制一系列圆孔,从而产生一直径为1.143mm(即0.045英寸)的孔。在套料作业期间,随着渣料积累而将中央孔堵塞时,再进行所述冲击钻削来使该中央孔畅通。随后,又进行套料作业。这些步骤要一再重复进行,直到1.143mm(即0.045英寸)直径的孔及穿过22.86mm(即0.9英寸)的深度被实现为止。这样制出的孔有均匀的直径,其锥度也最小。
Claims (11)
1.一种用激光钻削在镍基、钴基或镍和钴基之超耐热合金构件上加工一孔的方法,该孔具有一至少为0.762mm的预定直径,其孔深至少为10.16mm,其孔深与孔径之比率至少为10∶1,该方法包括:
先在该构件上用冲击激光钻制一其直径比该预定直径小的中央孔;
然后环绕该中央孔进行套料激光钻削,以使其孔径扩大到该预定的直径,并且轮流进行上述的冲击激光钻削和套料激光钻削步骤而钻出所述的孔。
2.如权利要求1所述的方法,其特征在于,该中央孔具有一直径为0.51mm。
3.如权利要求2所述的方法,其特征在于,所述孔的孔深与直径的比率为20∶1至30∶1。
4.如权利要求3所述的方法,其特征在于,该预定直径为0.762mm-2.54mm。
5.如权利要求3所述的方法,其特征在于,该孔深为10.16mm-38.1mm。
6.如权利要求1所述的方法,其特征在于,不使用阻挡料置于该孔的排出口附近。
7.如权利要求6所述的方法,其特征在于,采用一防护材料在与所述孔的排出口相反的端处的构件壁上。
8.如权利要求6所述的方法,其特征在于,该构件是一种燃气轮机构件。
9.如权利要求7所述的方法,其特征在于,所述孔为冷却孔。
10.如权利要求1所述的方法,其特征在于,该冲击激光钻削和套料激光钻削是采用计算机数字控制来进行的。
11.如权利要求10所述的方法,其特征在于,冲击激光钻削以频率为4-8个激光脉冲/秒进行,套料激光钻削则以频率为10-15个激光脉冲/秒进行。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US09/008,092 | 1998-01-16 | ||
US09/008,092 US5837964A (en) | 1998-01-16 | 1998-01-16 | Laser drilling holes in components by combined percussion and trepan drilling |
Publications (2)
Publication Number | Publication Date |
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CN1285774A CN1285774A (zh) | 2001-02-28 |
CN1131759C true CN1131759C (zh) | 2003-12-24 |
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CN988131137A Expired - Lifetime CN1131759C (zh) | 1998-01-16 | 1998-11-03 | 套料和冲击组合的激光钻削 |
Country Status (11)
Country | Link |
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US (1) | US5837964A (zh) |
EP (1) | EP1062070B1 (zh) |
JP (1) | JP4142252B2 (zh) |
KR (1) | KR100552128B1 (zh) |
CN (1) | CN1131759C (zh) |
AU (1) | AU1376399A (zh) |
CA (1) | CA2317601C (zh) |
DE (1) | DE69830807T2 (zh) |
IL (1) | IL137252A0 (zh) |
NO (1) | NO319668B1 (zh) |
WO (1) | WO1999036221A1 (zh) |
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US5166493A (en) * | 1989-01-10 | 1992-11-24 | Canon Kabushiki Kaisha | Apparatus and method of boring using laser |
GB8921040D0 (en) * | 1989-09-16 | 1989-11-01 | Rolls Royce Plc | Laser barrier material |
US5140127A (en) * | 1989-09-20 | 1992-08-18 | Rolls-Royce Plc | Laser barrier material |
DE3934587C2 (de) * | 1989-10-17 | 1998-11-19 | Bosch Gmbh Robert | Verfahren zum Herstellen von mittels Laserstrahlung erzeugter, hochpräziser Durchgangsbohrungen in Werkstücken |
GB2243320B (en) * | 1990-04-26 | 1993-08-25 | Ae Turbine Components | Laser drilling |
JPH0433788A (ja) * | 1990-05-25 | 1992-02-05 | Mitsubishi Electric Corp | レーザ穴明け方法 |
GB2249279B (en) * | 1990-10-17 | 1994-01-05 | Rolls Royce Plc | Improvements in or relating to drilling turbine blades |
US5223692A (en) * | 1991-09-23 | 1993-06-29 | General Electric Company | Method and apparatus for laser trepanning |
FR2699844B1 (fr) * | 1992-12-30 | 1995-02-03 | Snecma | Procédé et dispositif d'usinage par faisceau laser. |
JP3162255B2 (ja) * | 1994-02-24 | 2001-04-25 | 三菱電機株式会社 | レーザ加工方法及びその装置 |
US5593606A (en) * | 1994-07-18 | 1997-01-14 | Electro Scientific Industries, Inc. | Ultraviolet laser system and method for forming vias in multi-layered targets |
US5609779A (en) * | 1996-05-15 | 1997-03-11 | General Electric Company | Laser drilling of non-circular apertures |
-
1998
- 1998-01-16 US US09/008,092 patent/US5837964A/en not_active Expired - Lifetime
- 1998-11-03 DE DE69830807T patent/DE69830807T2/de not_active Expired - Fee Related
- 1998-11-03 CN CN988131137A patent/CN1131759C/zh not_active Expired - Lifetime
- 1998-11-03 AU AU13763/99A patent/AU1376399A/en not_active Abandoned
- 1998-11-03 WO PCT/US1998/023364 patent/WO1999036221A1/en active IP Right Grant
- 1998-11-03 IL IL13725298A patent/IL137252A0/xx not_active IP Right Cessation
- 1998-11-03 KR KR1020007007703A patent/KR100552128B1/ko active IP Right Grant
- 1998-11-03 CA CA002317601A patent/CA2317601C/en not_active Expired - Lifetime
- 1998-11-03 JP JP2000539969A patent/JP4142252B2/ja not_active Expired - Lifetime
- 1998-11-03 EP EP98957524A patent/EP1062070B1/en not_active Expired - Lifetime
-
2000
- 2000-07-17 NO NO20003656A patent/NO319668B1/no not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US5837964A (en) | 1998-11-17 |
DE69830807T2 (de) | 2006-04-27 |
AU1376399A (en) | 1999-08-02 |
CA2317601C (en) | 2007-01-23 |
KR100552128B1 (ko) | 2006-02-14 |
CN1285774A (zh) | 2001-02-28 |
JP2002509033A (ja) | 2002-03-26 |
JP4142252B2 (ja) | 2008-09-03 |
EP1062070A1 (en) | 2000-12-27 |
EP1062070B1 (en) | 2005-07-06 |
WO1999036221A1 (en) | 1999-07-22 |
CA2317601A1 (en) | 1999-07-22 |
NO20003656D0 (no) | 2000-07-17 |
DE69830807D1 (de) | 2005-08-11 |
NO20003656L (no) | 2000-07-17 |
KR20010034093A (ko) | 2001-04-25 |
IL137252A0 (en) | 2001-07-24 |
EP1062070A4 (en) | 2003-04-09 |
NO319668B1 (no) | 2005-09-05 |
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