CN113169112B - 具有流路的板件 - Google Patents

具有流路的板件 Download PDF

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Publication number
CN113169112B
CN113169112B CN201980081476.3A CN201980081476A CN113169112B CN 113169112 B CN113169112 B CN 113169112B CN 201980081476 A CN201980081476 A CN 201980081476A CN 113169112 B CN113169112 B CN 113169112B
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CN
China
Prior art keywords
flow path
embedded
flow
main body
heat exchange
Prior art date
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Active
Application number
CN201980081476.3A
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English (en)
Chinese (zh)
Other versions
CN113169112A (zh
Inventor
荒木良仁
诸田修平
花待年彦
横山响
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NHK Spring Co Ltd
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NHK Spring Co Ltd
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Publication date
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Publication of CN113169112A publication Critical patent/CN113169112A/zh
Application granted granted Critical
Publication of CN113169112B publication Critical patent/CN113169112B/zh
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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D1/00Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
    • F28D1/02Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
    • F28D1/0246Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid heat-exchange elements having several adjacent conduits forming a whole, e.g. blocks
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04Apparatus for manufacture or treatment
    • H10P72/0431Apparatus for thermal treatment
    • H10P72/0434Apparatus for thermal treatment mainly by convection
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D1/00Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
    • F28D1/02Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
    • F28D1/0233Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with air flow channels
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D1/00Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
    • F28D1/02Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
    • F28D1/04Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits
    • F28D1/053Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being straight
    • F28D1/0535Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being straight the conduits having a non-circular cross-section
    • F28D1/05358Assemblies of conduits connected side by side or with individual headers, e.g. section type radiators
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00Tubular elements; Assemblies of tubular elements
    • F28F1/02Tubular elements of cross-section which is non-circular
    • F28F1/025Tubular elements of cross-section which is non-circular with variable shape, e.g. with modified tube ends, with different geometrical features
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00Tubular elements; Assemblies of tubular elements
    • F28F1/02Tubular elements of cross-section which is non-circular
    • F28F1/04Tubular elements of cross-section which is non-circular polygonal, e.g. rectangular
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/02Header boxes; End plates
    • F28F9/026Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits
    • F28F9/0282Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits by varying the geometry of conduit ends, e.g. by using inserts or attachments for modifying the pattern of flow at the conduit inlet or outlet
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • Drying Of Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
CN201980081476.3A 2018-12-14 2019-12-03 具有流路的板件 Active CN113169112B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2018234929 2018-12-14
JP2018-234929 2018-12-14
JP2019-184146 2019-10-04
JP2019184146 2019-10-04
PCT/JP2019/047274 WO2020121898A1 (ja) 2018-12-14 2019-12-03 流路付きプレート

Publications (2)

Publication Number Publication Date
CN113169112A CN113169112A (zh) 2021-07-23
CN113169112B true CN113169112B (zh) 2024-05-07

Family

ID=71075302

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980081476.3A Active CN113169112B (zh) 2018-12-14 2019-12-03 具有流路的板件

Country Status (7)

Country Link
US (1) US20220026151A1 (https=)
EP (1) EP3896722A4 (https=)
JP (1) JP7324230B2 (https=)
KR (1) KR102590641B1 (https=)
CN (1) CN113169112B (https=)
TW (1) TWI747100B (https=)
WO (1) WO2020121898A1 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102823387B1 (ko) 2021-09-07 2025-06-23 선문대학교 산학협력단 CYP154C3s 효소를 이용한 스테로이드의 하이드록시화 생물전환 방법
KR20230036346A (ko) 2021-09-07 2023-03-14 선문대학교 산학협력단 Cyp125a13 효소를 이용한 스테로이드의 히드록시화 생물전환 방법
KR20230036348A (ko) 2021-09-07 2023-03-14 선문대학교 산학협력단 7α-히드록시스테로이드 탈수소 효소를 이용한 스테로이드의 탈수소화 생물전환 방법
KR102638205B1 (ko) 2021-09-13 2024-02-20 선문대학교 산학협력단 Cyp105d18 효소를 이용한 이소퀴놀린 알칼로이드 화합물의 n-산화 생물전환 방법
KR102902633B1 (ko) * 2021-09-29 2025-12-22 삼성전자주식회사 복수의 전극을 포함하는 기판 처리 장치
CN118077045A (zh) * 2021-10-20 2024-05-24 日本特殊陶业株式会社 保持装置
CN118280801A (zh) * 2022-12-29 2024-07-02 中微半导体设备(上海)股份有限公司 一种多孔塞组件、静电吸盘及等离子体刻蚀装置
KR102721433B1 (ko) * 2023-02-27 2024-10-25 엔지케이 인슐레이터 엘티디 웨이퍼 적재대
KR102685150B1 (ko) * 2023-10-12 2024-07-16 주식회사 미코세라믹스 세라믹 서셉터 및 그 제조 방법
JP7784470B2 (ja) * 2024-04-08 2025-12-11 日本特殊陶業株式会社 保持装置
KR102823869B1 (ko) 2024-08-26 2025-06-23 주식회사 리더티앤디 Mdf용 분체 도장 자동화 시스템

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0577257U (ja) * 1992-03-31 1993-10-22 株式会社神戸製鋼所 真空アーク蒸着装置
JP2000315680A (ja) * 1999-04-30 2000-11-14 Ngk Insulators Ltd 半導体製造装置用のセラミックス製ガス供給構造
US6490145B1 (en) * 2001-07-18 2002-12-03 Applied Materials, Inc. Substrate support pedestal
JP2003338492A (ja) * 2002-05-21 2003-11-28 Tokyo Electron Ltd プラズマ処理装置
JP2006344766A (ja) * 2005-06-09 2006-12-21 Matsushita Electric Ind Co Ltd プラズマ処理装置
CN101533798A (zh) * 2008-03-11 2009-09-16 日本碍子株式会社 静电吸盘
JP3154629U (ja) * 2009-08-04 2009-10-22 日本碍子株式会社 静電チャック
JP2010123712A (ja) * 2008-11-19 2010-06-03 Nihon Ceratec Co Ltd 静電チャックおよびその製造方法
CN102216791A (zh) * 2008-11-26 2011-10-12 日本发条株式会社 探针单元用基座构件及探针单元
JP2016143744A (ja) * 2015-01-30 2016-08-08 日本特殊陶業株式会社 静電チャックおよびその製造方法
JP2016143743A (ja) * 2015-01-30 2016-08-08 日本特殊陶業株式会社 静電チャックおよびその製造方法
JP2017135351A (ja) * 2016-01-29 2017-08-03 日本特殊陶業株式会社 基板支持装置及びその製造方法
CN108649012A (zh) * 2018-05-11 2018-10-12 北京华卓精科科技股份有限公司 新型陶瓷塞及具有该新型陶瓷塞的静电卡盘装置

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US6108189A (en) * 1996-04-26 2000-08-22 Applied Materials, Inc. Electrostatic chuck having improved gas conduits
JP4590597B2 (ja) * 2008-03-12 2010-12-01 国立大学法人東北大学 シャワープレートの製造方法
JP5633766B2 (ja) 2013-03-29 2014-12-03 Toto株式会社 静電チャック

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0577257U (ja) * 1992-03-31 1993-10-22 株式会社神戸製鋼所 真空アーク蒸着装置
JP2000315680A (ja) * 1999-04-30 2000-11-14 Ngk Insulators Ltd 半導体製造装置用のセラミックス製ガス供給構造
US6490145B1 (en) * 2001-07-18 2002-12-03 Applied Materials, Inc. Substrate support pedestal
JP2003338492A (ja) * 2002-05-21 2003-11-28 Tokyo Electron Ltd プラズマ処理装置
JP2006344766A (ja) * 2005-06-09 2006-12-21 Matsushita Electric Ind Co Ltd プラズマ処理装置
CN101533798A (zh) * 2008-03-11 2009-09-16 日本碍子株式会社 静电吸盘
JP2010123712A (ja) * 2008-11-19 2010-06-03 Nihon Ceratec Co Ltd 静電チャックおよびその製造方法
CN102216791A (zh) * 2008-11-26 2011-10-12 日本发条株式会社 探针单元用基座构件及探针单元
JP3154629U (ja) * 2009-08-04 2009-10-22 日本碍子株式会社 静電チャック
JP2016143744A (ja) * 2015-01-30 2016-08-08 日本特殊陶業株式会社 静電チャックおよびその製造方法
JP2016143743A (ja) * 2015-01-30 2016-08-08 日本特殊陶業株式会社 静電チャックおよびその製造方法
JP2017135351A (ja) * 2016-01-29 2017-08-03 日本特殊陶業株式会社 基板支持装置及びその製造方法
CN108649012A (zh) * 2018-05-11 2018-10-12 北京华卓精科科技股份有限公司 新型陶瓷塞及具有该新型陶瓷塞的静电卡盘装置

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氧化铍陶瓷的应用综述;李文芳;黄小忠;杨兵初;杜作娟;唐明成;;轻金属;20100220(02);正文全文 *

Also Published As

Publication number Publication date
KR20210087536A (ko) 2021-07-12
TW202025414A (zh) 2020-07-01
JP7324230B2 (ja) 2023-08-09
CN113169112A (zh) 2021-07-23
KR102590641B1 (ko) 2023-10-17
JPWO2020121898A1 (ja) 2021-11-25
EP3896722A1 (en) 2021-10-20
US20220026151A1 (en) 2022-01-27
EP3896722A4 (en) 2022-08-24
WO2020121898A1 (ja) 2020-06-18
TWI747100B (zh) 2021-11-21

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