CN113168971B - Electrical contact and method of making same - Google Patents
Electrical contact and method of making same Download PDFInfo
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- CN113168971B CN113168971B CN201880099744.XA CN201880099744A CN113168971B CN 113168971 B CN113168971 B CN 113168971B CN 201880099744 A CN201880099744 A CN 201880099744A CN 113168971 B CN113168971 B CN 113168971B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/06—Contacts characterised by the shape or structure of the contact-making surface, e.g. grooved
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
- H01H11/04—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts
- H01H11/06—Fixing of contacts to carrier ; Fixing of contacts to insulating carrier
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- Manufacturing & Machinery (AREA)
- Contacts (AREA)
- Manufacture Of Switches (AREA)
Abstract
An electric contact capable of suppressing deterioration of the joint between the contact and the base metal is obtained. The electrical contact has: a base metal formed in a plate shape and having a through-hole formed in a plate thickness direction; a bonding material provided on the 1 st surface of the base metal; a contact bonded to the base metal via a bonding material; and a rivet having a 1 st flange portion, a leg portion, and a 2 nd flange portion, the 1 st flange portion facing the 1 st surface and being disposed inside the joining material, the leg portion being formed integrally with the 1 st flange portion and being inserted into the through hole, the 2 nd flange portion being formed integrally with the leg portion and facing the 2 nd surface of the base metal, the joining material being pressed by the 1 st surface by the rivet.
Description
Technical Field
The invention relates to an electrical contact with a contact point joined to a base metal and a method for manufacturing the same.
Background
Conventionally, there is known an electrical contact having: a base metal; a bonding material provided to the base metal; and a contact bonded to the base metal via a bonding material (see, for example, patent document 1). Further, there is known an electrical contact having: a base metal having a through-hole formed in a plate thickness direction; a bonding material provided to the base metal; a rivet having a flange portion joined to the base metal via a leg portion inserted into the through hole and the joining material; and a contact provided on a flange portion of the rivet (see, for example, patent document 2).
Patent document 1: japanese patent laid-open No. 2014-232617
Patent document 2: japanese patent laid-open publication No. 2016-207380
Disclosure of Invention
However, in the electrical contact described in patent document 1, since the electrical contact is used, the peripheral edge portion of the bonding material may be peeled off from the base metal. In this case, there is a problem that the bonding between the contact and the base metal is deteriorated. In the electrical contact described in patent document 2, since the electrical contact is used, the peripheral edge portion of the contact may be peeled off from the flange portion of the rivet. In this case, there is a problem that the joint between the contact and the base metal via the rivet deteriorates.
The present invention has been made to solve the above-described problems, and an object thereof is to provide an electrical contact and a manufacturing method thereof, which can suppress deterioration of the joint between the contact and the base metal.
The present invention relates to an electrical contact comprising: a base metal formed in a plate shape and having a through hole formed in a plate thickness direction; a bonding material provided on the 1 st surface of the base metal; a contact bonded to the base metal via a bonding material; and a rivet having a 1 st flange portion, a leg portion, and a 2 nd flange portion, the 1 st flange portion facing the 1 st surface and being provided inside the joining material, the leg portion being formed integrally with the 1 st flange portion and being inserted into the through hole, the 2 nd flange portion being formed integrally with the leg portion and facing the 2 nd surface of the base metal, the joining material being pressed by the 1 st surface by the rivet.
The method for manufacturing an electrical contact according to the present invention includes: a 1 st bonding material application step of applying a 1 st bonding material to a 1 st surface of a plate-shaped base metal; a rivet leg insertion step of inserting the leg of the rivet into the through hole formed in the base metal after the 1 st joining material application step, and superimposing the 1 st flange portion of the rivet on the 1 st joining material; a 2 nd bonding material applying step of applying a 2 nd bonding material to the 1 st flange portion and the 1 st bonding material after the rivet leg portion inserting step, and disposing the 1 st flange portion between the 1 st bonding material and the 2 nd bonding material; a contact bonding step of, after the 2 nd bonding material application step, superimposing a contact on the 2 nd bonding material, compressing and heating the contact, the 1 st bonding material, and the 2 nd bonding material in a lamination direction, and bonding the contact, the rivet, and the base metal to each other via the bonding material composed of the 1 st bonding material and the 2 nd bonding material; and a leg portion deforming step of deforming the leg portion after the contact joining step to form a 2 nd flange portion facing the 2 nd surface of the base metal on the rivet, wherein in the leg portion deforming step, the joining material is pressed by the 1 st surface by the rivet.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the electrical contact and the method for manufacturing the same of the present invention, deterioration of the joint between the contact and the base metal can be suppressed.
Drawings
Fig. 1 is a cross-sectional view showing an electrical contact according to embodiment 1 of the present invention.
Fig. 2 is an enlarged view showing a portion a of fig. 1.
Fig. 3 is a flow chart illustrating a method of manufacturing the electrical contact of fig. 1.
Fig. 4 is a view showing the 1 st bonding material application step in fig. 3.
Fig. 5 is a view showing a rivet leg portion inserting step in fig. 3.
Fig. 6 is a view showing the bonding material application step 2 in fig. 3.
Fig. 7 is a diagram illustrating the contact bonding process of fig. 3.
Fig. 8 is a diagram illustrating a foot deformation step of fig. 3.
Fig. 9 is a cross-sectional view showing an electrical contact according to embodiment 3 of the present invention.
Fig. 10 is a cross-sectional view showing an electrical contact according to embodiment 4 of the present invention.
Fig. 11 is a cross-sectional view showing an electrical contact according to embodiment 5 of the present invention.
Fig. 12 is a cross-sectional view showing a modification of the electrical contact of fig. 11.
Fig. 13 is a cross-sectional view showing a modification of the electrical contact of fig. 11.
Detailed Description
Fig. 1 is a cross-sectional view showing an electrical contact according to embodiment 1 of the present invention. Fig. 2 is an enlarged view showing a portion a of fig. 1. An electrical contact according to embodiment 1 of the present invention includes: a base metal 1; a bonding material 2 provided on the base metal 1; a rivet 3 joined to the base metal 1 via the joining material 2; and a contact 4 bonded to the base metal 1 via the bonding material 2.
The base metal 1 is made of a copper alloy containing Cu (copper) as a main component. The base metal 1 is formed in a plate shape. The base metal 1 is formed with a through hole 11 penetrating in the thickness direction of the base metal 1. One surface of the base metal 1 is a 1 st surface 12, and the other surface is a 2 nd surface 13.
The bonding material 2 is superimposed on the 1 st surface 12 of the base metal 1. As the bonding material 2, a sintered silver bonding material paste containing Ag nanoparticles, which are Ag (silver) microparticles, is used. The Ag fine particles are contained in the metal fine particles. The center particle diameter of Ag nanoparticles became 50 nm.
The rivet 3 has: a 1 st flange portion 31 provided inside the bonding material 2 so as to face the 1 st surface 12; a leg portion 32 formed integrally with the 1 st flange portion 31 and inserted into the through hole 11; and a 2 nd flange portion 33 formed integrally with the leg portion 32 and facing the 2 nd surface 13. When viewed in the thickness direction of the base metal 1, the area of the 1 st flange 31 is larger than the area of the through-hole 11. Therefore, the 1 st flange 31 cannot be inserted into the through hole 11. When viewed in the thickness direction of the base metal 1, the area of the 2 nd flange 33 is larger than the area of the through-hole 11. Therefore, the 2 nd flange 33 cannot be inserted into the through hole 11.
The 2 nd flange 33 presses the base metal 1 toward the bonding material 2. Thereby, a compressive force P acts on the joining material 2. In other words, the joining material 2 is pressed by the 1 st surface 12 through the rivet 3.
The contact 4 contains a main component and an additive. The main component of the contact 4 is Ag. The additives of the contact 4 are In (indium) oxide and Sn (tin) oxide. The In oxide and Sn oxide In the contact 4 contain about 1 to 30 wt%.
Next, a method of manufacturing the electrical contact will be explained. Fig. 3 is a flow chart illustrating a method of manufacturing the electrical contact of fig. 1. First, in step S1, the 1 st bonding material application step is performed. Fig. 4 is a view showing the bonding material application step 1 in fig. 3. In the 1 st bonding material application step, the 1 st bonding material 21 is applied to the 1 st surface 12 of the base metal 1 and around the through-hole 11.
The 1 st bonding material 21 is a part of the bonding material 2. The amount of the 1 st bonding material 21 becomes 1/3 which is the amount of the bonding material 2. The dimension of the 1 st bonding material 21 in the thickness direction is about 50 μm.
In the first bonding material application step 1, a screen printer and a screen printing mask are used. The 1 st bonding material 21 is applied only to a predetermined region of the base metal 1 by using a screen printer and a screen printing mask.
As shown in fig. 3, after step S1, in step S2, the 1 st thermal drying step is performed. In the 1 st thermal drying step, the organic solvent contained in the 1 st bonding material 21 is removed. In addition, in the case where the dimension of the 1 st bonding material 21 in the thickness direction is small, the 1 st thermal drying step may be omitted.
After step S2, in step S3, a rivet leg insertion step is performed. Fig. 5 is a view showing a rivet leg portion inserting step in fig. 3. In the rivet leg insertion step, the leg 32 of the rivet 3 is inserted into the through hole 11 of the base metal 1 from the 1 st surface 12 side, and the 1 st flange 31 of the rivet 3 is superposed on the 1 st joining material 21. In the rivet leg insertion step, a part of the leg 32 of the rivet 3 is projected in a direction away from the 1 st surface 12 with respect to the 2 nd surface 13. In the 1 st heat drying step, the organic solvent contained in the 1 st bonding material 21 is removed, and therefore, in the rivet leg portion inserting step, the 1 st bonding material 21 is suppressed from being crushed between the 1 st flange portion 31 of the rivet 3 and the base metal 1.
As shown in fig. 3, after step S3, in step S4, the 2 nd bonding material application step is performed. Fig. 6 is a view showing the bonding material application step 2 in fig. 3. In the 2 nd bonding material application step, the 2 nd bonding material 22 is applied to the 1 st flange portion 31 and the 1 st bonding material 21, and the 1 st flange portion 31 is disposed between the 1 st bonding material 21 and the 2 nd bonding material 22.
The 2 nd bonding material 22 is a part of the bonding material 2. The amount of the 2 nd bonding material 22 becomes 2/3 which is the amount of the bonding material 2. In other words, the 2 nd bonding material 22 is a portion other than the 1 st bonding material 21 among the bonding materials 2. In the 2 nd bonding material application step, a screen printer and a screen printing mask are used in the same manner as in the 1 st bonding material application step. Thereby, the 2 nd bonding material 22 is applied only to the set region of each of the 1 st flange portion 31 and the 1 st bonding material 21. The amount of application of the 2 nd bonding material 22 is changed by changing the plate thickness of the screen printing plate.
As shown in fig. 3, after step S4, in step S5, the 2 nd thermal drying process is performed. In the 2 nd thermal drying step, the organic solvent contained in the bonding material 2 is removed. In the 2 nd thermal drying step, the bonding material 2 was heated to 80 ℃ for 30 minutes.
After step S5, in step S6, a contact bonding process is performed. Fig. 7 is a view showing the contact bonding step of fig. 3. In the contact bonding step, the contact 4 is superimposed on the 2 nd bonding material 22, and the contact 4, the 1 st bonding material 21, and the 2 nd bonding material 22 are compressed in the lamination direction and heated to bond the bonding material 2 made of the 1 st bonding material 21 and the 2 nd bonding material 22 to the contact 4.
The operation of superimposing the contact 4 on the 2 nd bonding material 22 is automatically performed by a mounting apparatus having a registration camera and a mounting chuck. The mounting apparatus determines the position of the contact 4 to be superimposed on the 2 nd bonding material 22 by specifying the position of the contact 4 and the position of the 2 nd bonding material 22 using the image captured by the alignment camera.
In addition, in the work of superimposing the contact 4 on the 2 nd bonding material 22, the mounting apparatus heats the mounting chuck holding the contact 4 to about 150 ℃, and presses the contact 4 against the 2 nd bonding material 22 with a pressure of about 500 Pa. Thereby, the bonding solvent contained in the 2 nd bonding material 22 is volatilized, and the contact 4 and the 2 nd bonding material 22 are bonded to each other.
The work of compressing and heating the contact 4, the 1 st bonding material 21, and the 2 nd bonding material 22 in the stacking direction is performed by the pair of bonding chucks 5. In the operation of compressing and heating the contact 4, the 1 st bonding material 21, and the 2 nd bonding material 22 in the stacking direction, one of the joining chucks 5 is brought into contact with the contact 4, and the other joining chuck 5 is brought into contact with the leg portion 32. In the operation of compressing and heating the contact 4, the 1 st bonding material 21, and the 2 nd bonding material 22 in the lamination direction, the contact 4 and the leg portion 32 are compressed in the lamination direction for 10 minutes at a pressure of 10MPa using the bonding collet 5 while heating the bonding collet 5 to 250 ℃. Thereby, the 1 st bonding material 21 and the 2 nd bonding material 22 are integrated, and the contact 4 and the bonding material 2 are bonded to each other.
As shown in fig. 3, after step S6, in step S7, a foot deforming step is performed. Fig. 8 is a view showing a foot deforming step of fig. 3. In the foot deforming step, the foot 32 is deformed to form the 2 nd flange 33 facing the 2 nd surface 13 in the rivet 3. Thereby, the rivet 3 is fixed to the base metal 1 by caulking. In this example, the leg 32 is compressed in the stacking direction, and the 2 nd flange 33 facing the 2 nd surface 13 is formed on the rivet 3. In the leg deforming step, the contact 4 and the leg 32 are compressed in the stacking direction at a pressure of 30MPa for 10 minutes by using the pair of joining chucks 5. In the above manner, the electrical contact is manufactured.
The 2 nd flange portion 33 is formed on the rivet 3 by the leg portion deforming step. As a result, as shown in fig. 2, a compressive force P acting on the portion of the bonding material 2 that is superimposed on the peripheral edge portion of the contact 4 remains. In other words, the portion of the bonding material 2 that overlaps the peripheral edge of the contact 4 is pressed by the 1 st surface 12. Therefore, the bonding strength between the contact 4 and the bonding material 2 is improved, and the separation of the contact 4 from the base metal 1 is suppressed. As a result, the reliability life of the electrical contact is increased.
Next, a further effect obtained by disposing the 1 st flange portion 31 of the rivet 3 inside the joining material 2 will be described. When the 1 st flange 31 is not disposed inside the bonding material 2, the contact 4 is bonded to the base metal 1 via the bonding material 2. Therefore, diffusion bonding is formed at the interface between the contact 4 and the bonding material 2. The bonding force between the contact 4 and the bonding material 2 is determined by a mechanical stress and a heating temperature applied from the outside when the contact 4 and the bonding material 2 are bonded. Therefore, as the electrical contact is used, the bonding force between the contact 4 and the bonding material 2 gradually decreases. Among the bonding forces between the contact 4 and the bonding material 2, the bonding force between the peripheral edge portion of the contact 4 and the portion of the bonding material 2 superimposed on the peripheral edge portion of the contact 4 is the weakest, and therefore, a peeling phenomenon is likely to occur between the peripheral edge portion of the contact 4 and the portion of the bonding material 2 superimposed on the peripheral edge portion of the contact 4.
On the other hand, when the 1 st flange portion 31 is disposed inside the joining material 2, a force for releasing the stress generated in the rivet 3 by the compressive deformation of the rivet 3 acts on the rivet 3. Therefore, a force that presses the bonding material 2 toward the contact 4 acts on the 1 st flange portion 31. The force with which the joining material 2 is pressed toward the contact 4 by the peripheral edge portion of the 1 st flange portion 31 is larger than the force with which the joining material 2 is pressed toward the contact 4 by the central portion of the 1 st flange portion 31. Therefore, the peripheral edge portion of the bonding material 2 is pressed toward the contact 4 by a stronger force than the central portion of the bonding material 2.
After the contact bonding process, mechanical stress and heat from the outside are also applied to the bonding material 2 and the contact 4, whereby diffusion bonding at the interface between the bonding material 2 and the contact 4 proceeds, and the bonding strength between the bonding material 2 and the contact 4 is improved. Therefore, diffusion bonding between the bonding material 2 and the contact 4 is performed by the force acting from the rivet 3 to the contact 4. As a result, the bonding strength between the bonding material 2 and the contact 4 increases as the electrical contact is used. As described above, the joining strength between the peripheral edge portion of the contact 4 and the portion of the joining material 2 superposed on the peripheral edge portion of the contact 4 is improved as compared with the case where the 1 st flange portion 31 of the rivet 3 is not disposed inside the joining material 2.
As described above, the electrical contact according to embodiment 1 of the present invention includes the contact 4 and the rivet 3 joined to the base metal 1 via the joining material 2. The rivet 3 has: a 1 st flange portion 31 which is provided inside the bonding material 2 so as to face the 1 st surface 12; a leg portion 32 formed integrally with the 1 st flange portion 31 and inserted into the through hole 11; and a 2 nd flange portion 33 formed integrally with the leg portion 32 and facing the 2 nd surface 13 of the base metal 1. The joining material 2 is pressed by the 1 st surface 12 through the rivet 3. This suppresses peeling of the peripheral edge portion of the bonding material 2 from the base metal 1. As a result, deterioration of the joint between the contact 4 and the base metal 1 can be suppressed.
Further, the portion of the joining material 2 superposed on the peripheral edge of the contact 4 is pressed by the 1 st surface 12 via the rivet 3. Since the electrical contact is used, a force acts on the peripheral edge portion of the contact 4 in a direction of separation from the joining material 2. The portion of the bonding material 2 overlapping the peripheral edge portion of the contact 4 is pressed by the 1 st surface 12 by the rivet 3, thereby preventing the portion of the bonding material 2 overlapping the peripheral edge portion of the contact 4 from separating from the base metal 1. As a result, deterioration of the joint between the contact 4 and the base metal 1 can be suppressed.
Further, the peripheral edge portion of the 1 st flange portion 31 presses the bonding material 2 toward the contact 4. Therefore, the bonding strength between the peripheral edge portion of the contact 4 and the portion of the bonding material 2 superposed on the peripheral edge portion of the contact 4 can be improved.
According to the method of manufacturing an electrical contact according to embodiment 1 of the present invention, the method includes a step of deforming the leg 32 to form the 2 nd flange 33 facing the 2 nd surface 13 of the base metal 1 on the rivet 3, and in the step of deforming the leg, the joining material 2 is pressed against the 1 st surface 12 by the rivet 3. This suppresses the peeling of the peripheral edge of the bonding material 2 from the base metal 1. As a result, deterioration of the joint between the contact 4 and the base metal 1 can be suppressed.
In embodiment 1, the bonding material 2 contains Ag fine particles. In embodiment 1, the contact 4 contains Ag as a main component, and the additives of the contact 4 include an oxide of In and an oxide of Sn. On the other hand, in embodiment 2, the bonding material 2 contains Cu nanoparticles, which are Cu microparticles. The Cu microparticles are contained in the metal microparticles. The main component of the contact 4 is Cu, and the additive of the contact 4 is W (tungsten). W in the contact 4 contains about 1 to 40 wt%. The other structure is the same as embodiment 1.
In embodiment 1, in the contact bonding step, the contact 4 and the leg portion 32 are compressed in the stacking direction at a pressure of 10MPa for 10 minutes by using the bonding collet 5 while heating the bonding collet 5 to 250 ℃. On the other hand, in embodiment 2, in the contact bonding step, the contact 4 and the leg portion 32 are compressed in the lamination direction for 10 minutes at a pressure of 20MPa using the bonding collet 5 while heating the bonding collet 5 to 280 ℃. The other methods of manufacturing the electrical contact are the same as those of embodiment 1.
As described above, according to the electrical contact according to embodiment 2 of the present invention, the contact 4 and the rivet 3 joined to the base metal 1 via the joining material 2 are provided. The rivet 3 has: a 1 st flange portion 31 provided inside the bonding material 2 so as to face the 1 st surface 12; a leg portion 32 formed integrally with the 1 st flange portion 31 and inserted into the through hole 11; and a 2 nd flange portion 33 formed integrally with the leg portion 32 and facing the 2 nd surface 13 of the base metal 1. The joining material 2 is pressed by the 1 st surface 12 through the rivet 3. This suppresses peeling of the peripheral edge portion of the bonding material 2 from the base metal 1. As a result, deterioration of the joint between the contact 4 and the base metal 1 can be suppressed.
Fig. 9 is a cross-sectional view showing an electrical contact according to embodiment 3 of the present invention. A surface of the 1 st flange portion 31 of the rivet 3 facing the contact 4 is formed with a concave-convex portion 34. Thereby, the contact area with respect to the joining material 2 in the 1 st flange portion 31 of the rivet 3 is increased. Therefore, the joining strength between the 1 st flange portion 31 of the rivet 3 and the joining material 2 is improved. The other structure is the same as embodiment 1. Other configurations may be the same as embodiment 2.
As described above, according to the electric contact according to embodiment 2 of the present invention, the uneven portion 34 is formed on the surface of the 1 st flange portion 31 facing the contact 4. This can improve the joining strength between the 1 st flange portion 31 of the rivet 3 and the joining material 2.
Fig. 10 is a cross-sectional view showing an electrical contact according to embodiment 4 of the present invention. An uneven portion 35 is formed on the surface of the first flange portion 31 of the rivet 3 facing the base metal 1. Thereby, the contact area with respect to the joining material 2 in the 1 st flange portion 31 of the rivet 3 is increased. Therefore, the joining strength between the 1 st flange portion 31 of the rivet 3 and the joining material 2 is improved.
The contact 4 has a concave-convex portion 41 formed on a surface thereof facing the base metal 1. Thereby, the contact area with respect to the bonding material 2 in the contact 4 is increased. Therefore, the bonding strength between the contact 4 and the bonding material 2 is improved. The other structure is the same as embodiment 3.
As described above, according to the electrical contact according to embodiment 4 of the present invention, the uneven portion 35 is formed on the surface of the 1 st flange portion 31 of the rivet 3 that faces the base metal 1. This can improve the joining strength between the 1 st flange portion 31 of the rivet 3 and the joining material 2.
In addition, the contact 4 has a concave-convex portion 41 formed on a surface facing the base metal 1. This can improve the bonding strength between the contact 4 and the bonding material 2.
Fig. 11 is a cross-sectional view showing an electrical contact according to embodiment 5 of the present invention. A recess 42 is formed in a surface of the peripheral edge portion of the contact 4 facing the base metal 1. Thereby, the contact area with respect to the bonding material 2 in the peripheral edge portion of the contact 4 is increased. Therefore, the bonding strength between the peripheral edge portion of the contact 4 and the bonding material 2 is improved. The other structure is the same as embodiment 4.
As described above, according to the electrical contact according to embodiment 5 of the present invention, the recessed portion 42 is formed on the surface of the peripheral edge portion of the contact 4 that faces the base metal 1. This can improve the bonding strength between the peripheral edge of the contact 4 and the bonding material 2.
In embodiment 5, the uneven portion 34 is formed on the surface of the 1 st flange portion 31 facing the contact 4, and the uneven portion 35 is formed on the surface of the 1 st flange portion 31 facing the base metal 1. However, the present invention is not limited to this, and as shown in fig. 12, a concave portion 36 may be formed on a surface of the peripheral edge portion of the 1 st flange portion 31 facing the contact 4. This can improve the bonding strength between the peripheral edge portion of the 1 st flange portion 31 and the bonding material 2. As shown in fig. 13, a recess 37 may be formed in the surface of the peripheral edge portion of the 1 st flange 31 facing the base metal 1. This can improve the bonding strength between the peripheral edge portion of the 1 st flange portion 31 and the bonding material 2.
Description of the reference symbols
1 base metal, 2 joining material, 3 rivet, 4 contact, 5 joining clip, 11 through hole, 12 st surface, 1 nd surface, 13 nd surface, 2 nd surface, 21 st joining material, 22 nd joining material, 1 st flange portion, 32 foot portion, 33 nd 2 flange portion, 34 uneven portion, 35 uneven portion, 36 concave portion, 37 concave portion, 41 uneven portion, 42 concave portion.
Claims (8)
1. An electrical contact, comprising:
a base metal formed in a plate shape and having a through-hole formed in a plate thickness direction;
a bonding material provided on the 1 st surface of the base metal;
a contact bonded to the base metal via the bonding material; and
a rivet having a 1 st flange portion, a leg portion and a 2 nd flange portion, the 1 st flange portion facing the 1 st surface and being provided inside the joining material, the leg portion being formed integrally with the 1 st flange portion and being inserted into the through hole, the 2 nd flange portion being formed integrally with the leg portion and facing the 2 nd surface of the base metal,
the 1 st flange portion is not present at a portion of the joining material between the peripheral edge portion of the contact and the base metal,
the joining material is pushed by the 1 st face through the rivet.
2. The electrical contact of claim 1,
the 1 st surface presses a portion of the joining material that is superimposed on the peripheral edge portion of the contact with the rivet.
3. The electrical contact of claim 1 or 2,
at least one of a surface of the 1 st flange portion facing the contact and a surface of the 1 st flange portion facing the base metal is formed with a concave-convex portion.
4. The electrical contact of claim 1 or 2,
a recess is formed in at least one of a surface of the 1 st flange portion that faces the contact and a surface of the 1 st flange portion that faces the base metal.
5. The electrical contact of claim 3,
a recess is formed in at least one of a surface of the 1 st flange portion that faces the contact and a surface of the 1 st flange portion that faces the base metal.
6. A method of manufacturing an electrical contact, comprising:
a 1 st bonding material application step of applying a 1 st bonding material to a 1 st surface of a plate-shaped base metal;
a rivet leg portion inserting step of inserting a leg portion of a rivet into a through hole formed in the base metal after the 1 st bonding material applying step, and superimposing a 1 st flange portion of the rivet on the 1 st bonding material;
a 2 nd bonding material applying step of applying a 2 nd bonding material to the 1 st flange portion and the 1 st bonding material after the rivet leg portion inserting step, and disposing the 1 st flange portion between the 1 st bonding material and the 2 nd bonding material;
a contact joining step of overlapping a contact with the 2 nd joining material after the 2 nd joining material applying step, compressing and heating the contact, the 1 st joining material, and the 2 nd joining material in a lamination direction, and joining the contact, the rivet, and the base metal to each other via a joining material composed of the 1 st joining material and the 2 nd joining material; and
a leg portion deforming step of deforming the leg portion after the contact joining step to form a 2 nd flange portion facing a 2 nd surface of the base metal on the rivet,
in the foot portion deforming step, the joining material is pressed by the 1 st surface via the rivet.
7. The method of manufacturing an electrical contact according to claim 6,
the 1 st bonding material and the 2 nd bonding material contain fine metal particles.
8. The method of manufacturing an electrical contact according to claim 7,
the metal fine particles are Ag fine particles or Cu fine particles.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2018/044211 WO2020110295A1 (en) | 2018-11-30 | 2018-11-30 | Electric contactor and method of manufacturing same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113168971A CN113168971A (en) | 2021-07-23 |
| CN113168971B true CN113168971B (en) | 2022-07-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201880099744.XA Active CN113168971B (en) | 2018-11-30 | 2018-11-30 | Electrical contact and method of making same |
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| Country | Link |
|---|---|
| JP (1) | JP6580290B1 (en) |
| CN (1) | CN113168971B (en) |
| WO (1) | WO2020110295A1 (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB910859A (en) * | 1959-12-01 | 1962-11-21 | Gibson Electric Company | Method of making composite electrical contact bodies |
| US3562467A (en) * | 1969-06-04 | 1971-02-09 | Engelhard Min & Chem | Electrical contact |
| JPS57107519A (en) * | 1980-12-25 | 1982-07-05 | Tanaka Precious Metal Ind | Method of produding composite electric contact |
| JPH02227919A (en) * | 1989-03-01 | 1990-09-11 | Tanaka Kikinzoku Kogyo Kk | Rivet type contact |
| JPH06111671A (en) * | 1992-09-28 | 1994-04-22 | Mitsubishi Electric Corp | Electrode for switch and its manufacture |
| JP2014232617A (en) * | 2013-05-29 | 2014-12-11 | 三菱電機株式会社 | Electric contact for breaker, and manufacturing method thereof |
| CN104871273A (en) * | 2012-12-14 | 2015-08-26 | 田中贵金属工业株式会社 | Rivet contact and method for manufacturing same |
| CN105164778A (en) * | 2013-05-02 | 2015-12-16 | 田中贵金属工业株式会社 | Rivet contact and method for producing same |
| CN105453206A (en) * | 2013-08-06 | 2016-03-30 | 株式会社德力本店 | Electric contact point and contact element |
| JP2016207380A (en) * | 2015-04-20 | 2016-12-08 | 三菱電機株式会社 | Electric contactor and manufacturing method thereof |
-
2018
- 2018-11-30 CN CN201880099744.XA patent/CN113168971B/en active Active
- 2018-11-30 WO PCT/JP2018/044211 patent/WO2020110295A1/en active Application Filing
- 2018-11-30 JP JP2019517441A patent/JP6580290B1/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB910859A (en) * | 1959-12-01 | 1962-11-21 | Gibson Electric Company | Method of making composite electrical contact bodies |
| US3562467A (en) * | 1969-06-04 | 1971-02-09 | Engelhard Min & Chem | Electrical contact |
| JPS57107519A (en) * | 1980-12-25 | 1982-07-05 | Tanaka Precious Metal Ind | Method of produding composite electric contact |
| JPH02227919A (en) * | 1989-03-01 | 1990-09-11 | Tanaka Kikinzoku Kogyo Kk | Rivet type contact |
| JPH06111671A (en) * | 1992-09-28 | 1994-04-22 | Mitsubishi Electric Corp | Electrode for switch and its manufacture |
| CN104871273A (en) * | 2012-12-14 | 2015-08-26 | 田中贵金属工业株式会社 | Rivet contact and method for manufacturing same |
| CN105164778A (en) * | 2013-05-02 | 2015-12-16 | 田中贵金属工业株式会社 | Rivet contact and method for producing same |
| JP2014232617A (en) * | 2013-05-29 | 2014-12-11 | 三菱電機株式会社 | Electric contact for breaker, and manufacturing method thereof |
| CN105453206A (en) * | 2013-08-06 | 2016-03-30 | 株式会社德力本店 | Electric contact point and contact element |
| JP2016207380A (en) * | 2015-04-20 | 2016-12-08 | 三菱電機株式会社 | Electric contactor and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2020110295A1 (en) | 2021-02-15 |
| WO2020110295A1 (en) | 2020-06-04 |
| JP6580290B1 (en) | 2019-09-25 |
| CN113168971A (en) | 2021-07-23 |
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