CN113097342A - 一种太阳能电池、其AlOx镀膜方法、电池背钝化结构及方法 - Google Patents

一种太阳能电池、其AlOx镀膜方法、电池背钝化结构及方法 Download PDF

Info

Publication number
CN113097342A
CN113097342A CN202110346301.XA CN202110346301A CN113097342A CN 113097342 A CN113097342 A CN 113097342A CN 202110346301 A CN202110346301 A CN 202110346301A CN 113097342 A CN113097342 A CN 113097342A
Authority
CN
China
Prior art keywords
alox
film
layer
passivation
solar cell
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202110346301.XA
Other languages
English (en)
Other versions
CN113097342B (zh
Inventor
黄智�
张�林
张鹏
杨东
徐涛
翟绪锦
谢泰宏
萧圣义
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tongwei Solar Hefei Co Ltd
Tongwei Solar Jintang Co Ltd
Original Assignee
Tongwei Solar Hefei Co Ltd
Tongwei Solar Jintang Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tongwei Solar Hefei Co Ltd, Tongwei Solar Jintang Co Ltd filed Critical Tongwei Solar Hefei Co Ltd
Priority to CN202110346301.XA priority Critical patent/CN113097342B/zh
Publication of CN113097342A publication Critical patent/CN113097342A/zh
Priority to AU2022247854A priority patent/AU2022247854A1/en
Priority to PCT/CN2022/083882 priority patent/WO2022206789A1/zh
Priority to US18/251,014 priority patent/US20230378380A1/en
Priority to EP22778971.6A priority patent/EP4220741A1/en
Application granted granted Critical
Publication of CN113097342B publication Critical patent/CN113097342B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02107Forming insulating materials on a substrate
    • H01L21/02109Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02123Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
    • H01L21/02164Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon oxide, e.g. SiO2
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1804Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic System
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02107Forming insulating materials on a substrate
    • H01L21/02109Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02123Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
    • H01L21/0217Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon nitride not containing oxygen, e.g. SixNy or SixByNz
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02107Forming insulating materials on a substrate
    • H01L21/02109Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02172Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides
    • H01L21/02175Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal
    • H01L21/02178Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal the material containing aluminium, e.g. Al2O3
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02107Forming insulating materials on a substrate
    • H01L21/02109Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/022Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being a laminate, i.e. composed of sublayers, e.g. stacks of alternating high-k metal oxides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02107Forming insulating materials on a substrate
    • H01L21/02225Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/02227Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
    • H01L21/0223Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate
    • H01L21/02233Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer
    • H01L21/02236Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer group IV semiconductor
    • H01L21/02238Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer group IV semiconductor silicon in uncombined form, i.e. pure silicon
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02107Forming insulating materials on a substrate
    • H01L21/02225Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/02227Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
    • H01L21/02255Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by thermal treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02107Forming insulating materials on a substrate
    • H01L21/02225Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02263Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
    • H01L21/02271Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
    • H01L21/02274Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02107Forming insulating materials on a substrate
    • H01L21/02296Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
    • H01L21/02318Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment
    • H01L21/02337Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment treatment by exposure to a gas or vapour
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02107Forming insulating materials on a substrate
    • H01L21/02296Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
    • H01L21/02318Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment
    • H01L21/02337Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment treatment by exposure to a gas or vapour
    • H01L21/0234Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment treatment by exposure to a gas or vapour treatment by exposure to a plasma
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02Details
    • H01L31/0216Coatings
    • H01L31/02161Coatings for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/02167Coatings for devices characterised by at least one potential jump barrier or surface barrier for solar cells
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/06Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier
    • H01L31/068Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/186Particular post-treatment for the devices, e.g. annealing, impurity gettering, short-circuit elimination, recrystallisation
    • H01L31/1864Annealing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/186Particular post-treatment for the devices, e.g. annealing, impurity gettering, short-circuit elimination, recrystallisation
    • H01L31/1868Passivation
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/547Monocrystalline silicon PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Abstract

本发明公开了一种太阳能电池、其AlOx镀膜方法、电池背钝化结构及方法,属于太阳能电池制备技术领域。本发明将经热氧化退火后的硅片置入管式PECVD设备中,将腔体抽真空到100‑2000mtorr的压强下,并将腔体温度加热到300‑400℃后,通入笑气和TMA的反应气体,打开射频电源制备AlOx钝化膜,所述AlOx钝化膜采用两层、三层或多层膜的结构。本发明采用AlOx多层膜,对每层AlOx膜采用NH3和N2O其进行处理,从而整体增加AlOx膜的钝化效果。同时,底层通过低沉积速率和高氧含量的工艺条件,进一步增加了AlOx的负电荷密度,提高了硅片背表面的场钝化效果;外层采用高沉积速率工艺,确保整体工艺时间不受影响。通过本发明提供的技术路线制备的太阳能电池片,转换效率可以提升0.05‑0.10%。

Description

一种太阳能电池、其AlOx镀膜方法、电池背钝化结构及方法
技术领域
本发明涉及太阳能电池制备技术领域,更具体地说,涉及一种太阳能电池、其AlOx镀膜方法、电池背钝化结构及方法。
背景技术
晶硅太阳能电池是一种利用PN结的光生伏特效应将光能转换成电能的器件,其中PERC(Passivated Emitter and Rear Cell)太阳能电池最早起源于上世纪八十年代,由澳洲新南威尔士大学的Martin Green研究组开发而成。有别于常规太阳能电池,其在电池背表面采用了介质膜钝化和局域金属接触的技术,使得背表复合速率显著降低、增加电池的背反射,从而大幅提升了电池的长波效应。本世纪初,用于P型PERC电池背面的AlOx介质膜的钝化作用的发现及研究,使得PERC电池的产业化逐步成为可能。随后随着沉积AlOx产业化制备技术和设备的成熟,加上激光技术的引入,PERC技术开始逐步走向产业化。由于工艺简单、成本较低,2017年以后,PERC电池已逐步发展成市场上主流的高效太阳能电池产品和技术。
目前,AlOx钝化层的制备方式主要有原子层沉积(ALD)、等离子体增强原子层沉积(PEALD)、等离子体增强化学气相沉积(PECVD)的方式,物理气相沉积(PVD)用的较少。其中,ALD和PEALD制备原理是先后将氧化铝的前驱体及氧化剂前驱体通入反应腔体,然后通过前驱体在硅片表面上的吸附、反应完成一层原子层尺度的AlOx层制备,如此循环不同次数制备出设定厚度的AlOx钝化层,此处得到的AlOx钝化层是采用同一工艺条件来制备的,所以通常统一称为单层膜。每次循环及一种前驱体吸附后,均需吹扫腔体,去除反应物和多余前驱体。PECVD是一种用等离子体激活反应气体,促进在基体表面或近表面空间进行化学反应,生成固态膜的技术。其基本原理是在高频或直流电场作用下,源气体电离形成等离子体,利用低温等离子体作为能量源,使得AlOx的几种反应气体激活并实现化学气相沉积。
由于管式PECVD技术具备成膜速率高,易维护,Uptime高、工艺灵活以及和氮化硅膜可实现同机台同管制备等特点,具有显著的综合成本优势,逐步成为电池厂商的首选。但是,目前采用PECVD制备AlOx膜的工艺,AlOx膜均为单层膜(ALD、PEALD等方式也一样)。其制备的AlOx膜在表面化学钝化和场钝化的钝化效果方面还存在提升空间,且PECVD制备钝化膜时,对硅片基体存在等离子体的轰击损伤,也破坏了硅片表面的化学钝化效果。所以,如何缩小钝化方面的差异,提高PECVD方式制备的PERC电池片转换效率仍是需要持续改进的问题。
针对PECVD方式制备的AlOx膜在表面化学钝化和场钝化的钝化效果方面存在的问题,专利公布号CN 110767757 A公开了一种高效PERC电池背面氧化铝膜及其制备方法,该申请案公开了一种管式PECVD工艺,包括:(1)采用TMA与N2O在硅片背面进行PECVD沉积,形成氧化铝层;(2)通入NH3引入氢源,进入氧化铝层以及P型硅表层,在P型硅背表面形成高氢介质膜;(3)通入N2O,将未反应的TMA充分反应。该申请案在AlOx膜和SiNx膜之间分步引入NH3和N2O,分别提供H钝化和对未反应完全的TMA进行处理,从而提升整个钝化效果。
专利公布号CN 111192935 A公开了一种管式PERC太阳能电池背钝化结构及其制备方法;该申请案首先在太阳能电池片背面形成氧化铝层;然后在管式PECVD设备中通入含氧混合气体,并采用所述含氧混合气体形成的等离子体对所述氧化铝层进行处理,以提升所述氧化铝层的负电荷密度;最后,在氧化铝层上形成至少一层氮化硅层。该申请案通过采用含氧混合气体对氧化铝钝化层进行处理,提升AlOx膜的负电荷密度从而提升场钝化效果。
上述申请案虽均能在一定程度上提升AlOx膜的场钝化效果,但均存在进一步改善空间。
发明内容
1.发明要解决的技术问题
本发明的目的在于克服现有技术的不足,提供了一种太阳能电池、其AlOx镀膜方法、电池背钝化结构及方法,本发明采用AlOx多层膜,对每层AlOx膜采用NH3和N2O进行处理,从而整体增加AlOx膜的钝化效果。同时,底层通过低沉积速率和高氧含量的工艺条件,进一步增加了AlOx的负电荷密度,提高了硅片背表面的场钝化效果;外层采用高沉积速率工艺,确保整体工艺时间不受影响。通过本发明提供的技术路线制备的太阳能电池片,转换效率可以提升0.05-0.10%。
2.技术方案
为达到上述目的,本发明提供的技术方案为:
本发明的一种太阳能电池的AlOx镀膜方法,将经热氧化退火后的硅片置入管式PECVD设备中,将腔体抽真空到100-2000mtorr的压强下,并将腔体温度加热到300-400℃后,通入笑气和TMA的反应气体,打开射频电源制备AlOx钝化膜,所述AlOx钝化膜采用两层、三层或多层膜结构,且采用NH3和N2O对每层AlOx膜进行处理。
更进一步地,所述AlOx钝化膜采用两层膜结构且两层膜采用不同沉积速率的工艺条件,具体如下:
底层AlOx膜工艺条件为:笑气流量:3500-4500sccm,TMA流量:30-60sccm;射频功率:4000-6000W;脉冲开关比20:(1000-1500);工艺时间40-80s;
顶层AlOx膜工艺条件为:笑气流量:2500-3500sccm,TMA流量:50-100sccm;射频功率:6000-8000W;脉冲开关比20:(800-1200);工艺时间80-150s。
本发明的一种太阳能电池的背钝化方法,其步骤为:
步骤一、采用单插(双面长氧化硅)、正靠正(背面朝外)或背靠背加大氧流量工艺,在硅片基体上制备氧化硅层;
步骤二、采用所述的底层AlOx膜工艺条件制备底层AlOx膜;
步骤三、去除步骤二残余气体后,通入NH3和N2O,对底层AlOx膜进行H钝化和氧化处理;
步骤四、去除步骤三残余气体后,采用所述的顶层AlOx膜工艺条件制备顶层AlOx膜;
步骤五、去除步骤四残余气体后,进行升温同时通入NH3和N2O,对顶层AlOx膜进行H钝化和氧化处理;
步骤六、在腔体升温到400-550℃时,制备氮化硅膜,或氮化硅与氮氧化硅、氧化硅中的一种或多种的复合膜。
更进一步地,步骤一采用背靠背方式,热氧化工艺条件为:温度650-750℃,氧气流量2500-4000sccm,时间20-40min。
更进一步地,步骤三、步骤五所述的对AlOx膜进行H钝化和氧化处理的工艺条件为:NH3和N2O的流量控制在1000-4000sccm,真空压强500-2000mtorr,射频功率:2500-5000W,脉冲开关比30:(100-500),工艺时间100-300s。
更进一步地,步骤三-步骤五均通过设定0-100mtorr的压强,抽真空20-60s去除残余气体。
本发明的一种太阳能电池的背钝化结构,包括硅片基体、氧化硅层,所述的氧化硅层设置在硅片基体上,所述的氧化硅层上设置AlOx层,该AlOx层采用两层、三层或多层膜的结构。
更进一步地,所述AlOx层优选两层膜结构,其AlOx底层、AlOx顶层采用所述的底层AlOx膜工艺条件、顶层AlOx膜工艺条件制备。
本发明的一种太阳能电池的背钝化结构,该背钝化结构采用所述的背钝化方法制得。
本发明的一种太阳能电池,包括所述的背钝化结构。
3.有益效果
采用本发明提供的技术方案,与已有的公知技术相比,具有如下显著效果:
(1)本发明鉴于现有工艺制备得到的AlOx膜均为较厚的单层膜,对AlOx膜进行处理的深度不够,将AlOx膜拆分为多层膜结构,并在每层AlOx膜后均采用NH3和N2O同时对AlOx膜进行氢化和氧化处理,增加了AlOx膜整体的H钝化效果和负电荷密度引起的场钝化效果。
(2)本发明在镀AlOx钝化膜之前,通过热氧化退火工艺,增加了硅片背面氧化硅的厚度和致密性;同时,AlOx钝化膜采用多层膜方式,底层采用低功率和脉冲开关比工艺,降低了对硅片表面氧化硅的破坏,提升了背面钝化层的表面化学钝化效果。
(3)本发明采用AlOx多层膜,底层通过低沉积速率和高氧含量的工艺条件,增加了AlOx的负电荷密度,提高了硅片背表面的场钝化效果。同时,外层采用高沉积速率工艺,确保了整体工艺时间不受影响。
(4)通过本发明提供的技术路线制备的太阳能电池片,转换效率可以提升0.05-0.10%。
附图说明
图1为本发明的太阳能电池的结构切面图。
示意图中的标号说明:
1、硅片基体;2、氧化硅层;3、AlOx底层;4、AlOx顶层;5、氮化硅复合层。
具体实施方式
为进一步了解本发明的内容,结合附图和实施例对本发明作详细描述。
实施例1
结合图1,本实施例的一种太阳能电池的背钝化结构,包括硅片基体1、氧化硅层2、AlOx层和氮化硅复合层4,所述的氧化硅层2设置在硅片基体1背面,氧化硅层2上设置AlOx层,该AlOx层可采用两层、三层或多层膜结构。各层镀膜工艺条件可以采用一致或不同沉积速率的工艺。
本实施例优选两层膜结构且两层不同沉积速率的工艺条件,具体工艺如下:
将经过热氧化退火后的硅片置入管式PECVD设备中,将腔体抽真空到100mtorr的压强下并将腔体温度加热到300℃后,通入笑气和TMA的反应气体,打开射频电源制备AlOx钝化膜。
其中,底层(接近硅片表面)AlOx膜工艺条件为:笑气流量:3500sccm,TMA流量:30sccm;射频功率:4000W;脉冲开关比20:1000;工艺时间40s;
顶层(远离硅片表面)AlOx膜工艺条件为:笑气流量:2500sccm,TMA流量:50sccm;射频功率:6000W;脉冲开关比20:800;工艺时间80s。
实施例2
本实施例的一种太阳能电池的背钝化结构,基本同实施例1,其不同之处在于:本实施例的AlOx镀膜工艺条件,如下:
将经过热氧化退火后的硅片置入管式PECVD设备中,将腔体抽真空到2000mtorr的压强下并将腔体温度加热到400℃后,通入笑气和TMA的反应气体,打开射频电源制备AlOx钝化膜。
其中,底层(接近硅片表面)AlOx膜工艺条件为:笑气流量:4500sccm,TMA流量:60sccm;射频功率:6000W;脉冲开关比20:1500;工艺时间80s;
顶层(远离硅片表面)AlOx膜工艺条件为:笑气流量:3500sccm,TMA流量:100sccm;射频功率:8000W;脉冲开关比20:1200;工艺时间150s。
实施例3
本实施例的一种太阳能电池的背钝化结构,基本同实施例1,其不同之处在于:本实施例的AlOx镀膜工艺条件,如下:
将经过热氧化退火后的硅片置入管式PECVD设备中,将腔体抽真空到1000mtorr的压强下并将腔体温度加热到340℃后,通入笑气和TMA的反应气体,打开射频电源制备AlOx钝化膜。
其中,底层(接近硅片表面)AlOx膜工艺条件为:笑气流量:4000sccm,TMA流量:50sccm;射频功率:5000W;脉冲开关比20:1200;工艺时间60s;
顶层(远离硅片表面)AlOx膜工艺条件为:笑气流量:3000sccm,TMA流量:80sccm;射频功率:7000W;脉冲开关比20:1000;工艺时间120s。
实施例4
本实施例的一种太阳能电池的背钝化结构,基本同实施例1,其不同之处在于:本实施例太阳能电池的背钝化过程如下:
1.热氧化退火
采用单插(双面长氧化硅)方式,在碱抛工艺后的硅片上双面制备氧化硅,热氧化工艺在700℃下,氧气流量3000sccm,时间25min。
2.底层AlOx膜制备
将经过热氧化退火后的硅片置入管式PECVD设备中,将腔体抽真空到1000mtorr的压强下并将腔体温度加热到350℃后,制备底层AlOx,工艺条件为:笑气流量4000sccm,TMA流量50sccm,射频功率5000W,脉冲开关比20:1400,工艺时间60s。
3.抽真空
完成底层AlOx膜制备后,设定100mtorr的压强,抽真空60s去除残余气体。
4.底层AlOx膜氢化和氧化处理
完成残余气体去除后,通入NH3流量3000sccm和N2O流量3000sccm,真空压强1000mtorr,射频功率:4000W,脉冲开关比30:200,工艺时间250s。对底层AlOx膜进行H钝化和氧化处理。
5.抽真空
完成底层AlOx膜氢化和氧化处理,设定100mtorr的压强,抽真空60s去除残余气体。
6.顶层AlOx制备
完成以上步骤后,制备顶层AlOx膜,工艺条件为:笑气流量3000sccm,TMA流量80sccm,射频功率7000W,脉冲开关比20:1000,工艺时间100s;
7.抽真空
完成顶层AlOx膜氢化和氧化处理,设定100mtorr的压强,抽真空60s去除残余气体。
8.顶层AlOx膜氢化和氧化处理
完成残余气体去除后,通入NH3流量3000sccm和N2O流量3000sccm,真空压强1000mtorr,射频功率:4000W,脉冲开关比30:200,工艺时间250s。对顶层AlOx膜进行H钝化和氧化处理。
9.氮化硅复合膜
在腔体升温到480℃时,制备氮化硅或氮化硅膜,与氮氧化硅、氧化硅中的一种或多种的复合膜。
实施例5
本实施例的多层AlOx背钝化工艺,具体如下:
1.热氧化退火:采用背靠背加大氧流量工艺,增加硅片背面氧化硅的厚度和致密性。热氧化采用650℃,氧气流量2500sccm,时间20min。
2.底层AlOx膜:采用实施例2所述PECVD方式制备底层AlOx的钝化膜,其中底层采用低功率,低脉冲开关比的底沉积速率镀膜工艺条件。
3.抽真空:完成底层AlOx膜制备后,设定50mtorr的压强,抽真空20s去除残余气体。
4.底层AlOx膜氢化和氧化处理:完成残余气体去除后,同时通入NH3和N2O,流量在1000sccm,真空压强500mtorr,射频功率:2500W,脉冲开关比30:100-500,工艺时间100s。对底层AlOx膜进行H钝化和氧化处理。
5.抽真空:完成对底层AlOx膜氢化和氧化处理后,设定50mtorr的压强,抽真空20s去除残余气体。
6.顶层AlOx膜:采用实施例2所述PECVD方式制备顶层AlOx的钝化膜,其中顶层采用高功率,高脉冲开关比的高沉积速率镀膜工艺条件。
7.抽真空:完成对顶层AlOx膜制备后,设定50mtorr的压强,抽真空20s去除残余气体。同时进行升温。
8.顶层AlOx膜氢化和氧化处理:完成残余气体去除后,同时通入NH3和N2O,流量在1000sccm,真空压强500mtorr,射频功率:2500W,脉冲开关比30:100,工艺时间100s。对顶层AlOx膜进行H钝化和氧化处理。
9.氮化硅复合膜:在腔体升温到400℃时,制备氮化硅膜,或氮化硅与氮氧化硅、氧化硅中的一种或多种的复合膜。
实施例6
本实施例的太阳能电池,其可采用如实施例1-5任一的背钝化结构。
实施例1-6所述的方案,鉴于现有工艺制备得到的AlOx膜均为较厚的单层膜,对AlOx膜进行处理的深度不够,将AlOx膜拆分为多层膜结构,并在每层AlOx膜后均采用NH3和N2O同时对AlOx膜进行氢化和氧化处理,增加了AlOx膜整体的H钝化效果和负电荷密度引起的场钝化效果。采用AlOx多层膜,底层通过低沉积速率和高氧含量的工艺条件,增加了AlOx的负电荷密度,提高了硅片背表面的场钝化效果。同时,外层采用高沉积速率工艺,确保了整体工艺时间不受影响。在镀AlOx钝化膜之前,通过热氧化退火工艺,增加了硅片背面氧化硅的厚度和致密性;同时,AlOx钝化膜底层采用低功率和脉冲开关比工艺,降低了对硅片表面氧化硅的破坏,提升了背面钝化层的表面化学钝化效果。PERC电池片转换效率可以提升0.05-0.10%。
以上示意性的对本发明及其实施方式进行了描述,该描述没有限制性,附图中所示的也只是本发明的实施方式之一,实际的结构并不局限于此。所以,如果本领域的普通技术人员受其启示,在不脱离本发明创造宗旨的情况下,不经创造性的设计出与该技术方案相似的结构方式及实施例,均应属于本发明的保护范围。

Claims (10)

1.一种太阳能电池的AlOx镀膜方法,其特征在于:将经热氧化退火后的硅片置入管式PECVD设备中,将腔体抽真空到100-2000mtorr的压强下,并将腔体温度加热到300-400℃后,通入笑气和TMA的反应气体,打开射频电源制备AlOx钝化膜,所述AlOx钝化膜采用两层、三层或多层膜结构,且采用NH3和N2O对每层AlOx膜进行处理。
2.根据权利要求1所述的一种太阳能电池的AlOx镀膜方法,其特征在于:所述AlOx钝化膜采用两层膜结构且两层膜采用不同沉积速率的工艺条件,具体如下:
底层AlOx膜工艺条件为:笑气流量:3500-4500sccm,TMA流量:30-60sccm;射频功率:4000-6000W;脉冲开关比20:(1000-1500);工艺时间40-80s;
顶层AlOx膜工艺条件为:笑气流量:2500-3500sccm,TMA流量:50-100sccm;射频功率:6000-8000W;脉冲开关比20:(800-1200);工艺时间80-150s。
3.一种太阳能电池的背钝化方法,其特征在于,其步骤为:
步骤一、采用单插、正靠正或背靠背加大氧流量工艺,在硅片基体上制备氧化硅层;
步骤二、采用如权利要求2所述的底层AlOx膜工艺条件制备底层AlOx膜;
步骤三、去除步骤二残余气体后,通入NH3和N2O,对底层AlOx膜进行H钝化和氧化处理;
步骤四、去除步骤三残余气体后,采用如权利要求2所述的顶层AlOx膜工艺条件制备顶层AlOx膜;
步骤五、去除步骤四残余气体后,进行升温同时通入NH3和N2O,对顶层AlOx膜进行H钝化和氧化处理;
步骤六、在腔体升温到400-550℃时,制备氮化硅膜,或氮化硅与氮氧化硅、氧化硅中的一种或多种的复合膜。
4.根据权利要求3所述的一种太阳能电池的背钝化方法,其特征在于:步骤一采用背靠背方式,热氧化工艺条件为:温度650-750℃,氧气流量2500-4000sccm,时间20-40min。
5.根据权利要求3或4所述的一种太阳能电池的背钝化方法,其特征在于:步骤三、步骤五所述的对AlOx膜进行H钝化和氧化处理的工艺条件为:NH3和N2O的流量控制在1000-4000sccm,真空压强500-2000mtorr,射频功率:2500-5000W,脉冲开关比30:(100-500),工艺时间100-300s。
6.根据权利要求5所述的一种太阳能电池的背钝化方法,其特征在于:步骤三-步骤五均通过设定0-100mtorr的压强,抽真空20-60s去除残余气体。
7.一种太阳能电池的背钝化结构,包括硅片基体(1)、氧化硅层(2),所述的氧化硅层(2)设置在硅片基体(1)上,其特征在于:所述的氧化硅层(2)上设置AlOx层,该AlOx层采用两层、三层或多层膜的结构。
8.根据权利要求7所述的一种太阳能电池的背钝化结构,其特征在于:所述AlOx层优选两层膜结构,其AlOx底层(3)、AlOx顶层(4)采用如权利要求2所述的工艺条件制备。
9.一种太阳能电池的背钝化结构,其特征在于:该背钝化结构采用如权利要求3-6任一项所述的背钝化方法制得。
10.一种太阳能电池,其特征在于:包括如权利要求7-9任一项所述的背钝化结构。
CN202110346301.XA 2021-03-31 2021-03-31 一种太阳能电池、其AlOx镀膜方法、电池背钝化结构及方法 Active CN113097342B (zh)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN202110346301.XA CN113097342B (zh) 2021-03-31 2021-03-31 一种太阳能电池、其AlOx镀膜方法、电池背钝化结构及方法
AU2022247854A AU2022247854A1 (en) 2021-03-31 2022-03-30 Solar cell, alox coating method therefor, cell back surface passivation structure, and method
PCT/CN2022/083882 WO2022206789A1 (zh) 2021-03-31 2022-03-30 一种太阳能电池、其AlOx镀膜方法、电池背钝化结构及方法
US18/251,014 US20230378380A1 (en) 2021-03-31 2022-03-30 Solar Cell, ALOx Depositing Method Therefor, and Cell Back Passivation Structure and Method
EP22778971.6A EP4220741A1 (en) 2021-03-31 2022-03-30 Solar cell, alox coating method therefor, cell back surface passivation structure, and method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110346301.XA CN113097342B (zh) 2021-03-31 2021-03-31 一种太阳能电池、其AlOx镀膜方法、电池背钝化结构及方法

Publications (2)

Publication Number Publication Date
CN113097342A true CN113097342A (zh) 2021-07-09
CN113097342B CN113097342B (zh) 2023-06-23

Family

ID=76671484

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110346301.XA Active CN113097342B (zh) 2021-03-31 2021-03-31 一种太阳能电池、其AlOx镀膜方法、电池背钝化结构及方法

Country Status (5)

Country Link
US (1) US20230378380A1 (zh)
EP (1) EP4220741A1 (zh)
CN (1) CN113097342B (zh)
AU (1) AU2022247854A1 (zh)
WO (1) WO2022206789A1 (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114765234A (zh) * 2022-03-23 2022-07-19 山西潞安太阳能科技有限责任公司 一种p型晶硅双面电池退火增强背钝化方法
WO2022206789A1 (zh) * 2021-03-31 2022-10-06 通威太阳能(安徽)有限公司 一种太阳能电池、其AlOx镀膜方法、电池背钝化结构及方法
CN117497633A (zh) * 2023-04-12 2024-02-02 天合光能股份有限公司 薄膜制备方法、太阳能电池、光伏组件和光伏系统

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1501455A (zh) * 2002-10-31 2004-06-02 ��ʽ���������Ƽ� 半导体器件的制造方法
EP2484801A1 (en) * 2011-02-07 2012-08-08 L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Method of deposition of Al2O3/SiO2 stacks, from TMA or TEA and silicon precursors
CN107731935A (zh) * 2017-09-11 2018-02-23 中节能太阳能科技(镇江)有限公司 一种背钝化晶硅太阳能电池及其背钝化膜层的制备方法
CN108630764A (zh) * 2018-06-22 2018-10-09 通威太阳能(安徽)有限公司 一种提升perc电池背面转换效率的背面膜层结构以及制备方法
CN109802007A (zh) * 2019-01-02 2019-05-24 中国科学院宁波材料技术与工程研究所 管式pecvd制备多晶硅钝化接触结构的方法
CN110735130A (zh) * 2019-11-13 2020-01-31 湖南红太阳光电科技有限公司 制备背面钝化膜的管式pecvd设备及方法
CN111192935A (zh) * 2019-12-25 2020-05-22 广东爱旭科技有限公司 一种管式perc太阳能电池背钝化结构及其制备方法
CN111628010A (zh) * 2020-06-09 2020-09-04 山西潞安太阳能科技有限责任公司 一种晶硅电池背钝化叠层结构及制备工艺

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140213016A1 (en) * 2013-01-30 2014-07-31 Applied Materials, Inc. In situ silicon surface pre-clean for high performance passivation of silicon solar cells
US20190259905A1 (en) * 2016-09-16 2019-08-22 centrotherm international AG Method For Passivating A Surface Of A Semiconductor Material And Semiconductor Substrate
CN109728104A (zh) * 2018-12-19 2019-05-07 盐城阿特斯协鑫阳光电力科技有限公司 电池片钝化层中间体、太阳能电池片及其制备方法
CN110491949A (zh) * 2019-07-02 2019-11-22 商先创国际股份有限公司 一种太阳能电池叠层钝化结构及其制备方法和电池
CN110767757B (zh) 2019-09-18 2022-02-08 广东爱旭科技有限公司 一种高效perc电池背面氧化铝膜及其制备方法
CN112117188A (zh) * 2020-08-17 2020-12-22 无锡赛瑞达科技有限公司 一种三合一硅片镀膜工艺
CN113097342B (zh) * 2021-03-31 2023-06-23 通威太阳能(安徽)有限公司 一种太阳能电池、其AlOx镀膜方法、电池背钝化结构及方法
CN113097341B (zh) * 2021-03-31 2023-10-31 通威太阳能(安徽)有限公司 一种PERC电池、其AlOx镀膜工艺、多层AlOx背钝化结构及方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1501455A (zh) * 2002-10-31 2004-06-02 ��ʽ���������Ƽ� 半导体器件的制造方法
EP2484801A1 (en) * 2011-02-07 2012-08-08 L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Method of deposition of Al2O3/SiO2 stacks, from TMA or TEA and silicon precursors
CN107731935A (zh) * 2017-09-11 2018-02-23 中节能太阳能科技(镇江)有限公司 一种背钝化晶硅太阳能电池及其背钝化膜层的制备方法
CN108630764A (zh) * 2018-06-22 2018-10-09 通威太阳能(安徽)有限公司 一种提升perc电池背面转换效率的背面膜层结构以及制备方法
CN109802007A (zh) * 2019-01-02 2019-05-24 中国科学院宁波材料技术与工程研究所 管式pecvd制备多晶硅钝化接触结构的方法
CN110735130A (zh) * 2019-11-13 2020-01-31 湖南红太阳光电科技有限公司 制备背面钝化膜的管式pecvd设备及方法
CN111192935A (zh) * 2019-12-25 2020-05-22 广东爱旭科技有限公司 一种管式perc太阳能电池背钝化结构及其制备方法
CN111628010A (zh) * 2020-06-09 2020-09-04 山西潞安太阳能科技有限责任公司 一种晶硅电池背钝化叠层结构及制备工艺

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022206789A1 (zh) * 2021-03-31 2022-10-06 通威太阳能(安徽)有限公司 一种太阳能电池、其AlOx镀膜方法、电池背钝化结构及方法
CN114765234A (zh) * 2022-03-23 2022-07-19 山西潞安太阳能科技有限责任公司 一种p型晶硅双面电池退火增强背钝化方法
CN114765234B (zh) * 2022-03-23 2024-04-02 山西潞安太阳能科技有限责任公司 一种p型晶硅双面电池退火增强背钝化方法
CN117497633A (zh) * 2023-04-12 2024-02-02 天合光能股份有限公司 薄膜制备方法、太阳能电池、光伏组件和光伏系统

Also Published As

Publication number Publication date
US20230378380A1 (en) 2023-11-23
AU2022247854A1 (en) 2023-06-08
CN113097342B (zh) 2023-06-23
WO2022206789A1 (zh) 2022-10-06
EP4220741A1 (en) 2023-08-02

Similar Documents

Publication Publication Date Title
CN113097342A (zh) 一种太阳能电池、其AlOx镀膜方法、电池背钝化结构及方法
CN109244184B (zh) 一种双面氧化铝结构的perc双面电池及其制备方法
CN111192935B (zh) 一种管式perc太阳能电池背钝化结构及其制备方法
US20090199901A1 (en) Photovoltaic device comprising a sputter deposited passivation layer as well as a method and apparatus for producing such a device
TW200933917A (en) Plasma treatment between deposition processes
CN112159973A (zh) 一种制备Topcon电池钝化膜层的装置及其工艺流程
CN110106493B (zh) 利用管式pecvd设备制备背面钝化膜的方法
CN103160803A (zh) 石墨舟预处理方法
CN112838143A (zh) 一种perc电池中氧化铝膜的沉积方法
CN113097341B (zh) 一种PERC电池、其AlOx镀膜工艺、多层AlOx背钝化结构及方法
CN102154708A (zh) 一种太阳能电池薄膜的生长方法
CN115000246B (zh) P型钝化接触电池制备方法及钝化接触电池
CN102199760A (zh) 一种双层氮化硅减反膜的制作方法
CN109004038A (zh) 太阳能电池及其制备方法和光伏组件
CN106435522A (zh) 晶硅太阳电池氧化铝钝化膜的pecvd沉积工艺
CN113097346A (zh) 一种适用于硅电池背面叠层膜钝化结构
WO2012061436A4 (en) Dry etching method of surface texture formation on silicon wafer
CN113445050B (zh) 一种制备Topcon太阳能电池的设备
CN108470800B (zh) 一种降低pecvd机台tma耗量的方法
CN111564530B (zh) 一种新型晶硅perc电池前氧化层制备工艺
CN104091839B (zh) 一种用于太阳能电池片的减反射膜的制造方法
CN116613244A (zh) 太阳能电池钝化层的制备方法和太阳能电池
CN103066150A (zh) 一次扩散法制备选择性发射极电池的方法
CN213357746U (zh) 一种制备Topcon电池钝化膜层的装置
CN113571602B (zh) 一种二次扩散的选择性发射极及其制备方法和应用

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant