CN113097102A - 一种半导体集成电路器件晶圆智能加工装置 - Google Patents
一种半导体集成电路器件晶圆智能加工装置 Download PDFInfo
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- CN113097102A CN113097102A CN202110306858.0A CN202110306858A CN113097102A CN 113097102 A CN113097102 A CN 113097102A CN 202110306858 A CN202110306858 A CN 202110306858A CN 113097102 A CN113097102 A CN 113097102A
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- wafer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
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Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110306858.0A CN113097102B (zh) | 2021-03-23 | 2021-03-23 | 一种半导体集成电路器件晶圆智能加工装置 |
Applications Claiming Priority (1)
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CN202110306858.0A CN113097102B (zh) | 2021-03-23 | 2021-03-23 | 一种半导体集成电路器件晶圆智能加工装置 |
Publications (2)
Publication Number | Publication Date |
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CN113097102A true CN113097102A (zh) | 2021-07-09 |
CN113097102B CN113097102B (zh) | 2023-09-08 |
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CN202110306858.0A Active CN113097102B (zh) | 2021-03-23 | 2021-03-23 | 一种半导体集成电路器件晶圆智能加工装置 |
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CN (1) | CN113097102B (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113945072A (zh) * | 2021-10-18 | 2022-01-18 | 北京烁科精微电子装备有限公司 | 一种干燥系统及干燥方法 |
CN114843212A (zh) * | 2022-04-29 | 2022-08-02 | 浙江晶睿电子科技有限公司 | 一种多功能用半导体腔式处理设备 |
CN115519431A (zh) * | 2022-03-29 | 2022-12-27 | 何兴彪 | 一种半导体晶圆表面自动化加工系统 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001198824A (ja) * | 2000-01-14 | 2001-07-24 | Sumitomo Metal Ind Ltd | 研磨装置の洗浄方法及び研磨装置 |
JP2009054708A (ja) * | 2007-08-24 | 2009-03-12 | Tokyo Seimitsu Co Ltd | 面取り機能つき洗浄装置 |
JP2009147073A (ja) * | 2007-12-13 | 2009-07-02 | Disco Abrasive Syst Ltd | ウェーハ加工装置 |
TW201145366A (en) * | 2010-06-02 | 2011-12-16 | United Microelectronics Corp | Wafer side edge cleaning apparatus |
CN109643681A (zh) * | 2016-08-09 | 2019-04-16 | 近藤工业株式会社 | 半导体制造装置 |
-
2021
- 2021-03-23 CN CN202110306858.0A patent/CN113097102B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001198824A (ja) * | 2000-01-14 | 2001-07-24 | Sumitomo Metal Ind Ltd | 研磨装置の洗浄方法及び研磨装置 |
JP2009054708A (ja) * | 2007-08-24 | 2009-03-12 | Tokyo Seimitsu Co Ltd | 面取り機能つき洗浄装置 |
JP2009147073A (ja) * | 2007-12-13 | 2009-07-02 | Disco Abrasive Syst Ltd | ウェーハ加工装置 |
TW201145366A (en) * | 2010-06-02 | 2011-12-16 | United Microelectronics Corp | Wafer side edge cleaning apparatus |
CN109643681A (zh) * | 2016-08-09 | 2019-04-16 | 近藤工业株式会社 | 半导体制造装置 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113945072A (zh) * | 2021-10-18 | 2022-01-18 | 北京烁科精微电子装备有限公司 | 一种干燥系统及干燥方法 |
CN113945072B (zh) * | 2021-10-18 | 2022-11-29 | 北京烁科精微电子装备有限公司 | 一种干燥系统及干燥方法 |
CN115519431A (zh) * | 2022-03-29 | 2022-12-27 | 何兴彪 | 一种半导体晶圆表面自动化加工系统 |
CN114843212A (zh) * | 2022-04-29 | 2022-08-02 | 浙江晶睿电子科技有限公司 | 一种多功能用半导体腔式处理设备 |
CN114843212B (zh) * | 2022-04-29 | 2023-01-24 | 浙江晶睿电子科技有限公司 | 一种多功能用半导体腔式处理设备 |
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Address after: 650000 room 2307, 23 / F, building 2, cuihai Yazhu garden, No. 88, Chunyu Road, Xishan District, Kunming, Yunnan Province Applicant after: Ji Hong Address before: Building 5, yasongju, capital city, 600 Shengzhi street, Ronghua North Road, Wuhou District, Chengdu, Sichuan 610000 Applicant before: Ji Hong |
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Effective date of registration: 20230814 Address after: 644000 No.7, north section of Yibin Port Road, shaping street, Lingang Economic Development Zone, Yibin City, Sichuan Province Applicant after: Yibin Zhuobong Technology Co.,Ltd. Address before: 650000 room 2307, 23 / F, building 2, cuihai Yazhu garden, No. 88, Chunyu Road, Xishan District, Kunming, Yunnan Province Applicant before: Ji Hong |
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