CN113087508A - 适合工业化生产的无锆高白高透光瓷质砖及其制备方法 - Google Patents
适合工业化生产的无锆高白高透光瓷质砖及其制备方法 Download PDFInfo
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- CN113087508A CN113087508A CN202110297595.1A CN202110297595A CN113087508A CN 113087508 A CN113087508 A CN 113087508A CN 202110297595 A CN202110297595 A CN 202110297595A CN 113087508 A CN113087508 A CN 113087508A
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- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 3
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- GCLGEJMYGQKIIW-UHFFFAOYSA-H sodium hexametaphosphate Chemical compound [Na]OP1(=O)OP(=O)(O[Na])OP(=O)(O[Na])OP(=O)(O[Na])OP(=O)(O[Na])OP(=O)(O[Na])O1 GCLGEJMYGQKIIW-UHFFFAOYSA-H 0.000 claims description 3
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- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 3
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 2
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- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
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- 238000011161 development Methods 0.000 description 1
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- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
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- 239000012535 impurity Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
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- 238000010998 test method Methods 0.000 description 1
- 230000009974 thixotropic effect Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
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Abstract
本发明涉及一种适合工业化生产的无锆高白高透光瓷质砖,瓷质砖坯体按重量比例的组分材料包括如下:α‑氧化铝粉12‑18重量份;石英砂22‑28重量份;超白水洗球土12‑18重量份;烧滑石25‑45重量份;钠长石粉4‑10重量份;无机粘结剂2‑5重量份;增强剂0.2‑1重量份;解胶剂0.1‑0.5重量份。本发明还涉及该瓷质砖的制备方法。本发明形成的瓷质砖,成品白度在75度以上,体膨胀系数在220×10‑7以下,作为背景墙等装饰使用时,透过的光亮而不炫,搭配坯体表面的色彩纹理,整体效果丰富多变。
Description
技术领域
本发明属于瓷质砖技术领域,尤其涉及适合工业化生产的无锆高白高透光瓷质砖及其制备方法。
背景技术
随着社会发展和消费者物质文化生活水平的提高,传统的瓷砖由于主要注重常规理化性能,对坯体的白度、透光度等性能要求不高,已经不能满足消费者日益增长的审美需求;高白度、高透光的瓷砖坯体因为具有更好的表现瓷砖表面的色彩的呈现,深受广大消费者喜欢。
传统瓷砖基本不考虑瓷砖透光的性能,透光性可以使瓷砖的装饰效果得到极大丰富;此外,传统瓷砖主要是通过硅酸锆的添加来提升坯体白度,通常在55-65°左右,但添加过多的添加硅酸锆会给瓷砖带来放射性指数偏高的风险,存在安全隐患,且硅酸锆成本较高会造成生产成本的增加。
CN1286770C公布了一种超白瓷质砖,为了追求白度,其配方中熔剂类原料相对较低,配方的耐火度较高,逼近行业现有窑炉的温度上限,不适合工业化批量生产,且未体现透光特性。
因此,有必要对现有技术予以改良以克服现有技术中的所述缺陷。
发明内容
为了克服现有技术的不足,本发明的第一个目的是提供一种适合工业化生产的无锆高白高透光瓷质砖,所述瓷质砖坯体按重量比例的组分材料包括如下:
α-氧化铝粉12-18重量份;
石英砂22-28重量份;
超白水洗球土12-18重量份;
烧滑石25-45重量份;
钠长石粉4-10重量份;
无机粘结剂2-5重量份;
增强剂0.2-1重量份;
解胶剂0.1-0.5重量份。
优选地,所述无机粘结剂为高模数水玻璃、复配磷酸铝中的一种或两种的组合。
优选地,所述增强剂为增强木质素、聚乙烯醇、羟甲基纤维素、聚丙烯酰胺、改性淀粉中的至少一种。
优选地,所述解胶剂为三聚磷酸钠、偏硅酸钠、六偏磷酸钠、腐殖酸钠、聚丙烯酸钠中的至少一种。
本发明还涉及一种适合工业化生产的无锆高白高透光瓷质砖的制备方法,包括以下步骤:
S1:按瓷质砖坯体的组成配比称取原料;
S2:将S1中的原料混合后加入球磨机球磨,以得到浆料;
S3:对S2中的浆料过筛除铁后陈腐24小时以上;
S4:对S3中的浆料喷雾干燥以得到粉料,将所述粉料陈腐24小时以上;
S5:将S4中的粉料干压成型后,对坯体施釉;
S6:对施釉后的坯体烧成并对烧成后的坯体抛光。
优选地,S2中球磨时,混合后的原料、球磨石与水的质量比为1:1.2:0.5-0.8。
优选地,所述球磨石至少包括高铝球石。
优选地,S2中球磨后的浆料经细度为325目筛网筛余3%以下。
优选地,S4中喷雾干燥后粉料含水率为5.5-7.0%。
优选地,S6中烧成温度为1180-1260℃,烧成周期为50-90min。
相比现有技术,本发明的有益效果在于:
本发明涉及一种适合工业化生产的无锆高白高透光瓷质砖,瓷质砖坯体按重量比例的组分材料包括如下:α-氧化铝粉12-18重量份;石英砂22-28重量份;超白水洗球土12-18重量份;烧滑石25-45重量份;钠长石粉4-10重量份;无机粘结剂2-5重量份;增强剂0.2-1重量份;解胶剂0.1-0.5重量份。本发明还涉及该瓷质砖的制备方法。本发明形成的瓷质砖,成品白度在75度以上,体膨胀系数在220×10-7以下,作为背景墙等装饰使用时,透过的光亮而不炫,搭配坯体表面的色彩纹理,整体效果丰富多变。
上述说明仅是本发明技术方案的概述,为了能够更清楚了解本发明的技术手段,并可依照说明书的内容予以实施,以下以本发明的较佳实施例详细说明如后。本发明的具体实施方式由以下实施例详细给出。
具体实施方式
下面,结合具体实施方式,对本发明做进一步描述,需要说明的是,在不相冲突的前提下,以下描述的各实施例之间或各技术特征之间可以任意组合形成新的实施例。
本发明涉及一种适合工业化生产的无锆高白高透光瓷质砖,瓷质砖坯体按重量比例的组分材料包括如下:
本发明的无锆高白高透光瓷质砖坯体,在成分中无锆的前提下,成品白度在75度以上,体膨胀系数在220×10-7以下,作为背景墙等装饰使用时,透过的光亮而不炫,搭配坯体表面的色彩纹理,整体效果丰富多变。
本发明的石英砂粒径为60-100目之间,优选地,石英砂粒径为80目;在一些实施例中,石英砂可用石英粉替代。
本发明中的超白水洗球土为业内普遍叫法,一般白度要超过八九十度;应当理解,其不是以某一成分多少而定,通常是纯度高、杂质极少,才能达到该白度标准。
配方中由于黏土类原料较少,塑性和生坯强度很难满足生产线生产的要求,因此选择无机粘结剂进行增塑增强,保证生产线生产过程的顺利。进一步地,无机粘结剂为高模数水玻璃、复配磷酸铝中的一种或两种的组合。
进一步地,所述复配磷酸铝包括摩尔比为1:5~1:3的铬盐和磷酸铝;和/或所述复配磷酸铝包括摩尔比为1:5~1:3的氢氧化铝和磷酸铝。具体地,当无机粘结剂包括复配磷酸铝时,复配磷酸铝采用掺有铬盐和/或氢氧化铝的磷酸铝,得到的复配混合物,以提高无机粘结剂的粘结性能,加快无机粘结剂的固化速度。
进一步地,增强剂为增强木质素、聚乙烯醇、羟甲基纤维素、聚丙烯酰胺、改性淀粉中的至少一种。
进一步地,解胶剂为三聚磷酸钠、偏硅酸钠、六偏磷酸钠、腐殖酸钠、聚丙烯酸钠中的至少一种。
瓷质砖坯体配方中的铝主要来源于黏土类原料,但土类原料太多会使得坯体的透光度不够,为了得到透光性好的坯体同时补充配方中的硅铝含量,因此黏土类原料总量要控制在较低水平,选择煅烧氧化铝粉和石英砂;钠长石粉搭配烧滑石起到降低坯体耐火度的作用的同时保持坯体透光度。高温反应下,配方中的硅、铝反应形成莫来石晶相,同时和配方中的镁反应生成堇青石相。与传统瓷砖相比,坯体内更多的堇青石相提高了坯体的白度和韧性,同时降低坯体的热膨胀系数,使之能够更好的与釉面的膨胀系数相适应。此处,更多的堇青石相是相比普通的陶瓷坯体而言,普通陶瓷配方中镁含量通常为微量,通过生滑石引入,一般低于2%,在普通陶瓷配方中的作用通常主要是起到助熔、促进高温反应的作用。本发明通过科学配料,使得配料组成点落在堇青石的初晶区附近,根据相图原理,高温冷却过程中,液相析晶会对应生成更多的堇青石组分。
现有技术中有直接使用堇青石原料作为瓷质砖坯体,但堇青石原料的价格太高且耐火度较高,不适合在陶瓷生产中大量使用(一般也只是作为添加剂少量使用),直接使用堇青石,不符合陶瓷用料的原则;本发明使用其他价格低的原料引入镁元素,在高温烧结过程中,与其他硅酸盐矿物或化工料可通过高温反应得到堇青石,且该镁质原料还可兼顾其他生产用途。
一种适合工业化生产的无锆高白高透光瓷质砖的制备方法,包括以下步骤:
S1:按瓷质砖坯体的组成配比称取原料;按照瓷质砖坯体的配方配比逐一磅料,包括
烧滑石主要成分是偏滑石。
钠长石粉 4-10重量份;
钠长石的分子式为Na2O·Al2O3·6SiO2。
无机粘结剂 2-5重量份;
增强剂 0.2-1重量份;
解胶剂 0.1-0.5重量份。
S2:将S1中的原料混合后加入球磨机球磨,以得到浆料;
进一步地,S2中球磨时,混合后的原料、球磨石与水的质量比为1:1.2:0.5-0.8;在一些实施例中,称取混合后的原料100重量份、球磨石120重量份、水50重量份,使得坯体原料在球磨机中能够与球磨石充分地接触,从而能更好地粉碎原料,提升混合后的原料的质量。
进一步地,该球磨石至少包括高铝球石。在一些实施例中,球磨石为高铝球石,球磨机的转速为10-15rpm。
进一步地,高铝球石可为长轴为不同尺寸的椭圆形高铝球石,使得高铝球石实现了接触面积与力矩的平衡,保证椭圆形高铝球石与混合后的原料充分接触的同时能最大化地撞击在混合后的原料上。
进一步地,高铝球石中氧化铝含量为92%,保证了球磨石的高密度、高强度和高硬度等性能,提升了混合后的浆料的质量。
具体球磨时间根据抽样检测结果为准,检测标准为100g浆料中325目分析筛的筛余量;进一步地,S2中球磨后的浆料经细度为325目筛网筛余3%以下,以提升该浆料的质量。
S3:对S2中的浆料过筛除铁后陈腐24小时以上;
在一些实施例中,将S2中的浆料通过除铁机和磁选机进行除铁;在另一些实施例中,将S2中的浆料进行初次除铁后放入浆池,陈腐24h,而后通过除铁机和磁选机进行二次除铁;
本发明的瓷砖生产中泥浆水分含量约30-35%(水太多浪费制粉能源,太低则泥浆比重太高易触变或死浆影响喷雾制粉效果),除铁后的泥浆可直接进入S4步骤。
S4:对S3中的浆料喷雾干燥以得到粉料,将所述粉料陈腐24小时以上以使得粉料的含水率趋于一致;
进一步地,S4中喷雾干燥后粉料含水率为5.5-7.0%,出塔温度低于80℃,出塔后的粉料输送至料仓陈腐24小时以上。
S5:将S4中的粉料干压成型后,对坯体(即粉料干压成型后形成的坯体)施釉;
S5具体包括成型工艺以及施釉工艺:
成型工艺:
在一些实施例中,采用皮带式无模框压机或有模框式压机进行干压成型,其压制压力为340—350Kg/cm2;应当理解,也可采用其他的成型方式对粉料进行成型。
成型后将成型后的坯体输送至干燥窑进行干燥。
施釉工艺:
应当理解,底釉、面釉、喷墨、抛釉、保护釉、干粒等均属此工艺。
采用高压喷釉柜进行往返性喷水,喷枪数量为2-4支,喷水重量为80-100g/m2。
在一些实施例中,在喷墨后或印刷隔离釉,采用钟罩淋釉器或直线淋釉器进行抛釉料的装饰;该抛釉釉料的重量为500-600g/m2。
在一些实施例中,在瓷质砖生坯上施加面釉后进行喷墨印刷,然后再布施保护釉,施釉重量为120-250g/m2。
S6:对施釉后的坯体烧成并对烧成后的坯体抛光。
进一步地,S6中烧成温度为1180-1260℃,烧成周期为50-90min。相较于现有技术,本发明烧成时间大幅缩短,符合低温快烧、节能减排的原则。
在对烧成后的坯体进行抛光时,根据产品需要可选择全抛、柔抛、刷抛、不抛。
最后对抛光后的瓷质砖进行拣选、包装以得到最终的瓷质砖。
以下提供具体实施例,以对本发明进行进一步说明。
实施例1
S1:按瓷质砖坯体的组成配比称取原料;
原料包括:
S2:将S1中的原料混合后加入球磨机球磨,控制混合后的原料、球磨石与水的质量比为1:1.2:0.5,以得到浆料;控制100g浆料中325目分析筛的筛余量在3%以下;
S3:对S2中的浆料过筛除铁后陈腐24小时以上;
S4:对S3中的浆料喷雾干燥以得到粉料,粉料含水率为5.5-7.0%,将粉料陈腐24小时以上使含水率趋于一致;
S5:将S4中的粉料干压成型后,对坯体施釉;
S6:对施釉后的坯体烧成,烧成温度为1200℃,烧成周期为60min,并对烧成后的坯体抛光。
实施例2
S1:按瓷质砖坯体的组成配比称取原料;
原料包括:
S2:将S1中的原料混合后加入球磨机球磨,控制混合后的原料、球磨石与水的质量比为1:1.2:0.5,以得到浆料;控制100g浆料中325目分析筛的筛余量在3%以下;
S3:对S2中的浆料过筛除铁后陈腐24小时以上;
S4:对S3中的浆料喷雾干燥以得到粉料,粉料含水率为5.5-7.0%,将粉料陈腐24小时以上使含水率趋于一致;
S5:将S4中的粉料干压成型后,对坯体施釉;
S6:对施釉后的坯体烧成,烧成温度为1200℃,烧成周期为60min,并对烧成后的坯体抛光。
实施例3
S1:按瓷质砖坯体的组成配比称取原料;
原料包括:
S2:将S1中的原料混合后加入球磨机球磨,控制混合后的原料、球磨石与水的质量比为1:1.2:0.5,以得到浆料;控制100g浆料中325目分析筛的筛余量在3%以下;
S3:对S2中的浆料过筛除铁后陈腐24小时以上;
S4:对S3中的浆料喷雾干燥以得到粉料,粉料含水率为5.5-7.0%,将粉料陈腐24小时以上使含水率趋于一致;
S5:将S4中的粉料干压成型后,对坯体施釉;
S6:对施釉后的坯体烧成,烧成温度为1200℃,烧成周期为60min,并对烧成后的坯体抛光。
实施例4
S1:按瓷质砖坯体的组成配比称取原料;
原料包括:
S2:将S1中的原料混合后加入球磨机球磨,控制混合后的原料、球磨石与水的质量比为1:1.2:0.5,以得到浆料;控制100g浆料中325目分析筛的筛余量在3%以下;
S3:对S2中的浆料过筛除铁后陈腐24小时以上;
S4:对S3中的浆料喷雾干燥以得到粉料,粉料含水率为5.5-7.0%,将粉料陈腐24小时以上使含水率趋于一致;
S5:将S4中的粉料干压成型后,对坯体施釉;
S6:对施釉后的坯体烧成,烧成温度为1200℃,烧成周期为60min,并对烧成后的坯体抛光。
对比例1:
将实施例1中S1的原料替换为:
对比例2:
将实施例1中S1的原料替换为:
对比例3:
将实施例1中的泥料烧滑石30重量份替换为氢氧化镁30重量份。
对比例4:
市售普通黏土类瓷砖。
应当理解,不同实施例或对比例中的步骤S1-S6仅在相应实施例或对比例中作为区别标识,不同实施例或对比例中的步骤S1-S6不应被替换,同时也不应对此造成技术方案不清楚或技术内容不理解。
在相同条件下测试实施例1~实施例4与对比例1~4所得的瓷质砖产品,测试内容包括瓷质砖的白度、透光度、热膨胀系数。
测试方法:
白度:
观察瓷砖并对获得的瓷砖按照国家标准的检测方法进行白度测试,具体操作时,可使用WSD-III型全自动白度仪检测白度数据。
透光度:
本发明的透光度通过入射光透过率来表征。在一些实施例中,入射光透过率的测试方法为:入射光透过率检测采用LS117透光率测试仪,测试时使用380-760nm的白光作为光源,检测器检测入射光通量为Q1,然后将透光陶瓷砖放到光通路上盖住光源,检测仪在瓷砖透光区域检测到透过光通量Q2,则入射光透过率=Q2/Q1×100%。
体膨胀系数:
采用GB/T 3810.8-2016《线性热膨胀的测定》中的测试方法测试瓷质砖的线膨胀系数,该线膨胀系数的3倍为体膨胀系数,通过体膨胀系数表征瓷质砖的热膨胀系数。
对比如下表1所示,通过实施例1-4,对比例1-4处理得到的产品相较于市售普通黏土类瓷砖的白度高、入射光透过率高,同时降低坯体的热膨胀系数;通过实施例1-4以及对比例1可发现,直接使用堇青石作为原料成分时,得到的产品白度高、热膨胀系数低,但入射光透过率不好;通过实施例1-4以及对比例2可发现,当原料中缺乏钠长石粉以及烧滑石时,严重影响瓷质砖的透光度以及热膨胀系数;通过实施例1-4以及对比例3可发现,本发明中的烧滑石相较于其他镁源后形成的最终产品在白度、入射光透过率、热膨胀系数方面的性能均不佳。
表1
以上,仅为本发明的较佳实施例而已,并非对本发明作任何形式上的限制;凡本行业的普通技术人员均可按以上而顺畅地实施本发明;但是,凡熟悉本专业的技术人员在不脱离本发明技术方案范围内,利用以上所揭示的技术内容而做出的些许更动、修饰与演变的等同变化,均为本发明的等效实施例;同时,凡依据本发明的实质技术对以上实施例所作的任何等同变化的更动、修饰与演变等,均仍属于本发明的技术方案的保护范围之内。
Claims (10)
1.一种适合工业化生产的无锆高白高透光瓷质砖,其特征在于,所述瓷质砖坯体按重量比例的组分材料包括如下:
α-氧化铝粉12-18重量份;
石英砂22-28重量份;
超白水洗球土12-18重量份;
烧滑石25-45重量份;
钠长石粉4-10重量份;
无机粘结剂2-5重量份;
增强剂0.2-1重量份;
解胶剂0.1-0.5重量份。
2.如权利要求1所述的适合工业化生产的无锆高白高透光瓷质砖,其特征在于,所述无机粘结剂为高模数水玻璃、复配磷酸铝中的一种或两种的组合。
3.如权利要求1所述的适合工业化生产的无锆高白高透光瓷质砖,其特征在于,所述增强剂为增强木质素、聚乙烯醇、羟甲基纤维素、聚丙烯酰胺、改性淀粉中的至少一种。
4.如权利要求1所述的适合工业化生产的无锆高白高透光瓷质砖,其特征在于,所述解胶剂为三聚磷酸钠、偏硅酸钠、六偏磷酸钠、腐殖酸钠、聚丙烯酸钠中的至少一种。
5.如权利要求1所述的适合工业化生产的无锆高白高透光瓷质砖的制备方法,其特征在于,包括以下步骤:
S1:按瓷质砖坯体的组成配比称取原料;
S2:将S1中的原料混合后加入球磨机球磨,以得到浆料;
S3:对S2中的浆料过筛除铁后陈腐24小时以上;
S4:对S3中的浆料喷雾干燥以得到粉料,将所述粉料陈腐24小时以上;
S5:将S4中的粉料干压成型后,对坯体施釉;
S6:对施釉后的坯体烧成并对烧成后的坯体抛光。
6.如权利要求5所述的适合工业化生产的无锆高白高透光瓷质砖的制备方法,其特征在于,S2中球磨时,混合后的原料、球磨石与水的质量比为1:1.2:0.5-0.8。
7.如权利要求6所述的适合工业化生产的无锆高白高透光瓷质砖的制备方法,其特征在于,所述球磨石至少包括高铝球石。
8.如权利要求5或6所述的适合工业化生产的无锆高白高透光瓷质砖的制备方法,其特征在于,S2中球磨后的浆料经细度为325目筛网筛余3%以下。
9.如权利要求5所述的适合工业化生产的无锆高白高透光瓷质砖的制备方法,其特征在于,S4中喷雾干燥后粉料含水率为5.5-7.0%。
10.如权利要求5所述的适合工业化生产的无锆高白高透光瓷质砖的制备方法,其特征在于,S6中烧成温度为1180-1260℃,烧成周期为50-90min。
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