CN113084288A - Laser circuit board tin cream welding machine - Google Patents
Laser circuit board tin cream welding machine Download PDFInfo
- Publication number
- CN113084288A CN113084288A CN202110412012.5A CN202110412012A CN113084288A CN 113084288 A CN113084288 A CN 113084288A CN 202110412012 A CN202110412012 A CN 202110412012A CN 113084288 A CN113084288 A CN 113084288A
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- China
- Prior art keywords
- circuit board
- welding machine
- laser
- swinging plate
- longitudinal
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
- B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
Abstract
The invention discloses a laser circuit board solder paste welding machine which comprises a rack and a solder mechanism arranged on the rack, wherein the solder mechanism is provided with a crystal vibration and oscillation device which is connected with a laser head in a driving way and can drive the laser head to move front and back and left and right; the crystal oscillation shaking device comprises a fixed seat, a longitudinal swinging plate and a transverse swinging plate. The fixed seat is rotatably provided with a longitudinal swing plate, and the longitudinal swing plate is rotatably provided with a transverse swing plate. The laser circuit board solder paste welding machine has high processing accuracy, and the size of the welding disc can be designed to be smaller than that required by the prior art, so that resources can be saved, the efficiency can be improved, and the laser circuit board solder paste welding machine does not need a dispensing process.
Description
Technical Field
The invention relates to the technical field of electronics, machinery and automation control, in particular to a laser circuit board solder paste welding machine.
Background
At present, the known tin paste tinning process for producing and processing electronic circuit boards adopts a heating method, and the whole circuit board heating mode has high energy consumption and high temperature resistance requirement on component materials; the electrolytic capacitor with the same type can be seen from the market, and the price of the patch is 2-3 times that of the common patch.
At present, in the prior art, a machine for welding a circuit board by using a solder wire through a laser spot welding process is also used; the laser welding machine is similar to a laser metal spot welding machine, the power of a laser tube is about 200W generally, and the machine avoids the baking process of gluing and glue curing when components are fixed on a circuit board in the production process; the comprehensive energy-saving effect is not ideal, and the production process is more complex.
Disclosure of Invention
Aiming at the defects in the prior art, the laser circuit board solder paste welding machine is provided, and the purpose of the laser circuit board solder paste welding machine is designed as follows: firstly, preheating is not needed, and secondly, the power of the light source is directly put in place in one step according to the melting point of the used solder paste.
In order to solve the technical problem, the invention is realized by the following scheme: the invention discloses a laser circuit board solder paste welding machine which comprises a rack and a solder mechanism arranged on the rack, wherein the solder mechanism is provided with a crystal vibration and oscillation device which is connected with a laser head in a driving way and can drive the laser head to move front and back and left and right;
the crystal oscillation and vibration device comprises:
the fixing seat is of a circular ring structure with a first middle hole, the first middle hole is used as the center, two first lugs are symmetrically arranged on the ring surface of the fixing seat, the opposite surfaces of the two first lugs are provided with first shaft holes, and a second crystal oscillator and a second spring piece are respectively arranged at two positions on the ring surface of the fixing seat, which are separated from the two first lugs by 90 degrees;
the longitudinal swinging plate is of a circular ring structure with a second middle hole, the second middle hole is used as a center, two longitudinal swinging shafts are symmetrically arranged on opposite sides of the longitudinal swinging plate, the two longitudinal swinging shafts are inserted into the two corresponding first shaft holes, the longitudinal swinging plate can swing through the two longitudinal swinging shafts, two second convex blocks are arranged on the longitudinal swinging plate, the longitudinal swinging plate deviates from the ring surface of the fixed seat, the two longitudinal swinging shafts rotate 90 degrees, the opposite surfaces of the two second convex blocks are provided with second shaft holes, the second crystal oscillator and the second spring piece are both arranged at a gap between the longitudinal swinging plate and the fixed seat, and a first crystal oscillator and a first spring piece are respectively arranged on the ring surface of the longitudinal swinging plate and at two positions which are 90 degrees away from the two second convex blocks;
the main body part of the transverse swinging plate is a disc body, two protruding plates extending outwards and two transverse swinging shafts extending outwards are respectively arranged on the quartering line of the disc body, the two transverse swinging shafts are inserted into the two corresponding second shaft holes, the two protruding plates are symmetrical with the disc body, and the two gaps between the two protruding plates and the longitudinal swinging plate are respectively the first crystal oscillator and the first spring piece.
Furthermore, the soldering mechanism further comprises a light source, and the light source is an LED light source with adjustable focal length through an optical lens.
Furthermore, the light beam of the LED light source with the adjustable focal length through the optical lens is converged within the range of 0.1-0.2 mm.
Furthermore, the crystal oscillation shaking and swinging device is provided with 2 groups, and the 2 groups of crystal oscillation shaking and swinging devices are respectively arranged on two sides of the light source.
Furthermore, the oscillation amplitude of the crystal oscillation and oscillation device is respectively as follows: the maximum jitter amplitude is reduced by 0.2mm in the scanning amplitude of the size of a bonding pad required by 0805 component packaging, and the minimum jitter amplitude is reduced by 0.2mm in the scanning amplitude of the size of a bonding pad required by 0201 component packaging.
Compared with the prior art, the invention has the beneficial effects that: the invention adopts a solder paste laser welding mode to weld the electronic circuit board; the working mode of the laser circuit board solder paste welding machine is similar to that of a laser cutting machine. The light source can adopt an LED and an optical lens, and the welding speed of the light source can be ensured to be consistent with the speed of the chip mounting of 1-2 chip mounters by controlling the power of the light source to be 30-100W. The laser circuit board solder paste welding machine fully utilizes the difference of absorption and reflection of light energy before and after melting of laser heating and solder paste, and is very convenient to use.
The method has the following advantages: the computer can identify and judge the models of the input or produced products, so that products of a plurality of models can be produced simultaneously, and seamless connection can be realized for production of conversion products.
The second benefit: because the processing accuracy is high, the size of the bonding pad can be designed to be smaller than that required by the existing process, so that resources can be saved, and the efficiency can be improved.
The benefits are three: dispensing processes are not required.
Drawings
Fig. 1 is an exploded view of a crystal oscillating device according to the present invention.
Fig. 2 is an assembly diagram of the crystal oscillating device of the present invention.
Fig. 3 is a side view of the crystal oscillating device of the present invention.
Fig. 4 is a distribution diagram of the bonding pads and the laser scanning area on the wiring board of the present invention.
Fig. 5 is a schematic diagram of a laser head moving path and a laser scanning area according to the present invention.
Reference designations in the drawings: pad 101, laser scanning area 102.
The drive train controls the laser head movement path 201 and the laser scanning area 202.
The device comprises a transverse swinging plate 1, a transverse swinging shaft 2, a first spring piece 3, a first crystal oscillator 4, a longitudinal swinging shaft 5, a longitudinal swinging plate 6, a second spring piece 7 and a fixed seat 9.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, and thus the protection scope of the present invention is more clearly and clearly defined. It should be apparent that the described embodiments of the present invention are only some embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; the two elements may be directly connected or indirectly connected through an intermediate medium, or may be communicated with each other inside the two elements, or may be wirelessly connected or wired connected. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In addition, the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
Example 1: the concrete structure of the invention is as follows:
referring to the attached drawings 1-3, the laser circuit board solder paste welding machine comprises a rack and a solder mechanism arranged on the rack, wherein the solder mechanism is provided with a crystal vibration and oscillation device which is in driving connection with a laser head and can drive the laser head to move front and back and left and right;
the crystal oscillation and vibration device comprises:
the fixing seat 9 is a circular ring structure with a first middle hole, the first middle hole is used as a center, two first lugs 91 are symmetrically arranged on the ring surface of the fixing seat 9, the opposite surfaces of the two first lugs 91 are provided with first axial holes, and a second crystal oscillator 8 and a second spring piece 7 are respectively arranged at two positions on the ring surface of the fixing seat 9, which are separated from the two first lugs 91 by an angle of 90 degrees;
a longitudinal swinging plate 6 which is a circular ring structure with a second middle hole and takes the second middle hole as a center, two longitudinal swinging shafts 5 are symmetrically arranged on the opposite sides of the longitudinal swinging plate 6, the two longitudinal oscillating shafts 5 are inserted into the corresponding two first shaft holes, the longitudinal oscillating plate 6 can oscillate through the two longitudinal oscillating shafts 5, the longitudinal oscillating plate 6, two second lugs 61 are arranged on the ring surface deviating from the fixed seat 9 and at the position where the two longitudinal swinging shafts 5 rotate 90 degrees, the opposite surfaces of the two second lugs 61 are provided with second shaft holes, the second crystal oscillator 8 and the second spring piece 7 are arranged at the gap between the longitudinal swinging plate 6 and the fixed seat 9, a first crystal oscillator 4 and a first spring piece 3 are respectively arranged at two positions on the ring surface of the longitudinal swinging plate 6 and at a distance of 90 degrees from the two second lugs 61;
the transverse swinging plate 1 has a main body part which is a disc body, two protruding plates extending outwards and two transverse swinging shafts 2 extending outwards are respectively arranged on the quartering line of the disc body, the two transverse swinging shafts 2 are inserted into the two corresponding second shaft holes, the two protruding plates are symmetrical with the disc body, and the two gaps between the two protruding plates and the longitudinal swinging plate 6 are respectively the first crystal oscillator 4 and the first spring piece 3.
A preferred technical solution of this embodiment: the soldering tin mechanism further comprises a light source which is an LED light source with the adjustable focal length through an optical lens.
A preferred technical solution of this embodiment: the light beam of the LED light source with the adjustable focal length through the optical lens is converged within the range of 0.1-0.2 mm.
A preferred technical solution of this embodiment: the crystal oscillation shaking and swinging device is provided with 2 groups, and the 2 groups of crystal oscillation shaking and swinging devices are respectively arranged on two sides of the light source.
A preferred technical solution of this embodiment: the crystal oscillation and oscillation device comprises the oscillation amplitude degrees as follows: the maximum jitter amplitude is reduced by 0.2mm in the scanning amplitude of the size of a bonding pad required by 0805 component packaging, and the minimum jitter amplitude is reduced by 0.2mm in the scanning amplitude of the size of a bonding pad required by 0201 component packaging.
Example 2:
the implementation method comprises the following steps: the high-power laser tube is changed into a light source of an LED and an optical lens. The service life is prolonged and the cost is reduced. And then, by means of adjusting an optical lens, the light beam is focused within the range of 0.1-0.2 mm.
The implementation method II comprises the following steps: two crystal vibration devices are additionally arranged on two sides of the light source. The shaking amplitude of the crystal shaking device is as follows: the maximum jitter amplitude is reduced by 0.2mm in the scanning amplitude of the size of a bonding pad required by 0805 component packaging, the minimum jitter amplitude is reduced by 0.2mm in the scanning amplitude of the size of the bonding pad required by 0201 component packaging, and the rest larger bonding pads are integrally moved and scanned by a laser head, so that the device is equivalent to a plurality of combinations. The laser scanning time and power were set at 0805 demand, and there was an excess of the rest. Since most of the light energy is reflected after the tin paste is melted into tin, the process quality is not affected. That is to say, most of the bonding pads on the circuit board can be completed in one step in a short time. Thus, no actuator is used to move back and forth over a small pad.
The third implementation method comprises the following steps: each bonding pad is regarded as a point taking the center of the bonding pad as a coordinate in the positioning and laser scanning processes, the transmission system only controls the dwell time (0.4 second) of the point taking the center of the bonding pad as the coordinate in the scanning process, and the laser scanning of the bonding pad is completed by additionally arranging two crystal vibration devices on two sides of a light source.
The implementation method four comprises the following steps: the oscillation frequency and amplitude of the two crystal oscillation and oscillation devices are respectively controlled, and due to the fact that the frequency is higher, when the crystal oscillation and oscillation devices are linked with the transmission device, the crystal oscillation and oscillation devices equivalently thicken the scanned laser beams, and work efficiency is improved.
The implementation method five: adding an imaging recognition system and automatically aligning reference points; manual positioning is not needed, and the automation degree is higher.
Example 3:
as shown in FIG. 4, the laser scanning area 102 is smaller than the area of the solder paste coating 101; the purpose of this is two: 1. the circuit board is prevented from being burnt by laser caused by system errors; 2. it is judged whether the solder paste is completely melted (no solder paste remains outside).
As shown in fig. 5, to realize laser scanning of the laser scanning area 202, the laser head moves back and forth and left and right, which are all completed by the crystal oscillator shaking device, and the transmission system only needs to stay for 0.4-0.6 second at each point, so that the transmission system controls the laser head moving route 201 (the dotted line is a fast moving line, and the solid line is a moving route controlled by the transmission system after the laser is opened), which becomes simple and fast.
The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the present specification and the accompanying drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (5)
1. A laser circuit board solder paste welding machine comprises a rack and a solder mechanism arranged on the rack, and is characterized in that the solder mechanism is provided with a crystal vibration and oscillation device which is connected with a laser head in a driving way and can drive the laser head to move left and right back and forth;
the crystal oscillation and vibration device comprises:
the fixing seat (9) is of a circular ring structure with a first middle hole, the first middle hole is used as the center, two first convex blocks (91) are symmetrically arranged on the ring surface of the fixing seat (9), the opposite surfaces of the two first convex blocks (91) are provided with first shaft holes, and a second crystal oscillator (8) and a second spring piece (7) are respectively arranged at two positions which are 90 degrees away from the two first convex blocks (91) on the ring surface of the fixing seat (9);
the longitudinal swinging plate (6) is of a circular ring structure with a second middle hole, the second middle hole is used as a center, two longitudinal swinging shafts (5) are symmetrically arranged on opposite sides of the longitudinal swinging plate (6), the two longitudinal swinging shafts (5) are inserted into the two corresponding first shaft holes, the longitudinal swinging plate (6) can swing through the two longitudinal swinging shafts (5), the longitudinal swinging plate (6) deviates from the ring surface of the fixed seat (9) and the positions of the two longitudinal swinging shafts (5) rotating 90 degrees are provided with two second convex blocks (61), the opposite surfaces of the two second convex blocks (61) are provided with second shaft holes, the second crystal oscillator (8) and the second spring pieces (7) are arranged at the gap between the longitudinal swinging plate (6) and the fixed seat (9), and two positions of the longitudinal swinging plate (6) on the ring surface and at a 90-degree angle with the two second convex blocks (61), a first crystal oscillator (4) and a first spring piece (3) are respectively arranged;
the transverse swinging plate (1) is characterized in that a main body part is a disc body, two protruding plates extending outwards and two transverse swinging shafts (2) extending outwards are respectively arranged on the quartering line of the disc body, the two transverse swinging shafts (2) are inserted into the two corresponding second shaft holes, the two protruding plates are symmetrical with the disc body, and two gaps between the two protruding plates and the longitudinal swinging plate (6) are respectively a first crystal oscillator (4) and a first spring piece (3).
2. The laser circuit board solder paste welding machine of claim 1, wherein said solder mechanism further comprises a light source, said light source is an LED light source with adjustable focal length through an optical lens.
3. The laser circuit board solder paste welding machine according to claim 2, wherein the light beam of the LED light source with adjustable focal length through the optical lens is focused within the range of 0.1-0.2 mm.
4. The laser circuit board solder paste welding machine according to claim 2, wherein the crystal oscillator oscillating device is provided with 2 groups, and the 2 groups of crystal oscillator oscillating devices are respectively arranged on two sides of the light source.
5. The solder paste welding machine of claim 4, wherein the vibration amplitude of the crystal vibration device is respectively as follows: the maximum jitter amplitude is reduced by 0.2mm in the scanning amplitude of the size of a bonding pad required by 0805 component packaging, and the minimum jitter amplitude is reduced by 0.2mm in the scanning amplitude of the size of a bonding pad required by 0201 component packaging.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110412012.5A CN113084288A (en) | 2021-04-16 | 2021-04-16 | Laser circuit board tin cream welding machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110412012.5A CN113084288A (en) | 2021-04-16 | 2021-04-16 | Laser circuit board tin cream welding machine |
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| Publication Number | Publication Date |
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| CN113084288A true CN113084288A (en) | 2021-07-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110412012.5A Pending CN113084288A (en) | 2021-04-16 | 2021-04-16 | Laser circuit board tin cream welding machine |
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| CN (1) | CN113084288A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114393266A (en) * | 2022-02-18 | 2022-04-26 | 惠州一非智能科技有限公司 | Tin soldering method of laser circuit board tin paste welding machine |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105299114A (en) * | 2015-11-02 | 2016-02-03 | 西安电子科技大学 | Four-freedom-degree parallel-connection oscillation reduction device for crystal oscillator and oscillation reduction method |
| CN106597660A (en) * | 2017-01-04 | 2017-04-26 | 华南师范大学 | Stepping scanning control device and control method for electro-thermal micromirror for opto-acoustic scanning |
| CN109676255A (en) * | 2019-02-27 | 2019-04-26 | 深圳市鑫德赢科技有限公司 | A kind of method for laser welding and a kind of crystal oscillator of crystal oscillator |
| KR102039139B1 (en) * | 2019-09-09 | 2019-10-31 | 이신행 | Apparatus of manufacturing stencil bended mask |
| CN211377997U (en) * | 2019-09-07 | 2020-08-28 | 无锡上频高新科技有限公司 | Anti-vibration crystal oscillator |
| CN111716016A (en) * | 2020-06-12 | 2020-09-29 | 大族激光科技产业集团股份有限公司 | Laser head control method, laser processing method and laser head control system |
| CN212398494U (en) * | 2020-06-11 | 2021-01-26 | 东莞南冠自动化科技有限公司 | Reciprocating type automatic tin soldering device for PCB |
| CN112453619A (en) * | 2020-12-02 | 2021-03-09 | 深圳市科昭科技有限公司 | Automatic chip laser welding dispensing equipment |
| CN112518117A (en) * | 2020-11-02 | 2021-03-19 | 深圳泰德激光科技有限公司 | Welding equipment |
-
2021
- 2021-04-16 CN CN202110412012.5A patent/CN113084288A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105299114A (en) * | 2015-11-02 | 2016-02-03 | 西安电子科技大学 | Four-freedom-degree parallel-connection oscillation reduction device for crystal oscillator and oscillation reduction method |
| CN106597660A (en) * | 2017-01-04 | 2017-04-26 | 华南师范大学 | Stepping scanning control device and control method for electro-thermal micromirror for opto-acoustic scanning |
| CN109676255A (en) * | 2019-02-27 | 2019-04-26 | 深圳市鑫德赢科技有限公司 | A kind of method for laser welding and a kind of crystal oscillator of crystal oscillator |
| CN211377997U (en) * | 2019-09-07 | 2020-08-28 | 无锡上频高新科技有限公司 | Anti-vibration crystal oscillator |
| KR102039139B1 (en) * | 2019-09-09 | 2019-10-31 | 이신행 | Apparatus of manufacturing stencil bended mask |
| CN212398494U (en) * | 2020-06-11 | 2021-01-26 | 东莞南冠自动化科技有限公司 | Reciprocating type automatic tin soldering device for PCB |
| CN111716016A (en) * | 2020-06-12 | 2020-09-29 | 大族激光科技产业集团股份有限公司 | Laser head control method, laser processing method and laser head control system |
| CN112518117A (en) * | 2020-11-02 | 2021-03-19 | 深圳泰德激光科技有限公司 | Welding equipment |
| CN112453619A (en) * | 2020-12-02 | 2021-03-09 | 深圳市科昭科技有限公司 | Automatic chip laser welding dispensing equipment |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114393266A (en) * | 2022-02-18 | 2022-04-26 | 惠州一非智能科技有限公司 | Tin soldering method of laser circuit board tin paste welding machine |
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Application publication date: 20210709 |
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