CN114393266A - Tin soldering method of laser circuit board tin paste welding machine - Google Patents
Tin soldering method of laser circuit board tin paste welding machine Download PDFInfo
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- CN114393266A CN114393266A CN202210152898.9A CN202210152898A CN114393266A CN 114393266 A CN114393266 A CN 114393266A CN 202210152898 A CN202210152898 A CN 202210152898A CN 114393266 A CN114393266 A CN 114393266A
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- small area
- pcb
- area unit
- circuit board
- laser
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- 238000003466 welding Methods 0.000 title claims abstract description 30
- 238000000034 method Methods 0.000 title claims abstract description 19
- 238000005476 soldering Methods 0.000 title claims abstract description 19
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 14
- 230000007246 mechanism Effects 0.000 claims abstract description 17
- 230000008859 change Effects 0.000 claims abstract description 5
- 229910000679 solder Inorganic materials 0.000 claims description 11
- 238000010586 diagram Methods 0.000 description 12
- 238000010438 heat treatment Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000006872 improvement Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000004093 laser heating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
- B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a tin soldering method of a laser circuit board tin paste welding machine, which comprises the following steps: firstly, taking a PCB (printed Circuit Board) to be welded, and controlling the power of a light source to be 30-100W; step two, dividing the welding surface of the PCB into a plurality of small area units in a system picture through a control program, and identifying the central point of each small area unit; step three, the control system controls a table driving mechanism fixed on the PCB to enable the table driving mechanism to drive the PCB to move and enable a central point in one small area unit to move to a vertical point of the laser head; fourthly, the control system controls the laser head to rotate along the R axis so as to change the direction of the laser beam, scan in the small area unit and complete welding; and step five, after one small area unit is welded, the control system controls the table board driving mechanism to move the PCB into the next small area unit. The invention can reduce the system error and improve the soldering accuracy.
Description
Technical Field
The invention relates to a soldering machine, in particular to a soldering method of a laser circuit board solder paste welding machine.
Background
At present, the known tin paste tinning process for producing and processing electronic circuit boards adopts a heating method, and the whole circuit board heating mode has high energy consumption and high temperature resistance requirement on component materials; the electrolytic capacitor can be seen from the market, and the price of the paster is 2-3 times that of the common electrolytic capacitor.
At present, a machine for welding a circuit board by using a solder wire by adopting a laser spot welding process is also available; the laser tube is similar to a laser metal spot welding machine, the power of the laser tube is about 200W generally, and the baking process of gluing and glue curing when components are fixed on a circuit board cannot be avoided in the production process; the comprehensive energy-saving effect is not ideal, and the production process is more complex.
The invention adopts the traditional solder paste welding, and only uses the laser fixed-point heating method to achieve the purpose of energy saving; a brand new development design is carried out on the corresponding production process flow.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide a soldering method of a laser circuit board solder paste welding machine, which aims to reduce the frequent movement of a left moving shaft and a right moving shaft of a platform surface, reduce the system error and improve the soldering accuracy.
In order to solve the technical problem, the invention is realized by the following scheme: the invention discloses a tin soldering method of a laser circuit board tin paste welding machine, which comprises the following steps:
firstly, taking a PCB (printed Circuit Board) to be welded, and controlling the power of a light source to be 30-100W;
step two, dividing the welding surface of the PCB into a plurality of small area units in a system picture through a control program, and identifying the central point of each small area unit;
step three, the control system controls a table driving mechanism fixed on the PCB to enable the table driving mechanism to drive the PCB to move and enable a central point in one small area unit to move to a vertical point of the laser head;
fourthly, the control system controls the laser head to rotate along the R axis so as to change the direction of the laser beam to scan in the small area unit and complete welding;
and step five, after one small area unit is welded, the control system controls the table board driving mechanism to move the PCB into the next small area unit, and the actions of the step three and the step four are repeated until all the small area units are welded.
Furthermore, the positions of the small area units are randomly arranged according to the welding point layout of the welding surface.
Furthermore, in the plurality of small area units, the boundaries have no overlapping or have overlapping areas or have independent boundaries and overlapping areas.
Compared with the prior art, the invention has the beneficial effects that:
1. the frequent movement of the table driving mechanism is reduced, the system error is reduced, and the accuracy is improved.
2. The small area unit can be set at will, the boundaries of the small area units can be independent boundaries, the boundaries of a plurality of small area units can also have overlapping areas, and the small area units are arranged in the proper small area units according to specific conditions of each welding point, so that the laser beam direction of the welding point can be selected more conveniently for heating.
3. The tin soldering control system is controlled in multiple system layers, and full-automatic work is completed through a communication system.
4. Each small area unit is relatively independent, and the working parameters can be set as constant data or can be freely set. The equipment has multiple processing functions, can be used for repairing and maintaining the high-precision circuit board, and can reset working parameters in the production process to improve the yield.
The working mode of the device of the invention is similar to that of a laser cutting machine. The power of the light source is controlled to be 30-100W, so that the tin soldering speed of the tin soldering machine can be ensured to be consistent with the speed of mounting of 1-2 chip mounters. The invention makes full use of the difference of absorption and reflection of light energy before and after melting of laser heating and solder paste, so that the invention is very convenient to use: the invention does not need preheating; the power of the light source is directly put in place in one step according to the melting point of the solder paste used.
Drawings
FIG. 1 is a schematic block diagram of a soldering method of the laser circuit board solder paste welding machine according to the present invention.
Fig. 2 is a structural diagram of a surface of a pre-soldered PCB board having components in embodiment 2 of the present invention.
Fig. 3 is a distribution diagram of the cells of each small area on the soldering surface of the pre-soldered PCB in embodiment 2 of the present invention.
Fig. 4 is a land structure diagram of the first small area unit 1 in fig. 3.
Fig. 5 is a land structure diagram of the second small area unit 2 in fig. 3.
Fig. 6 is a land structure diagram of the third small area unit 3 in fig. 3.
Fig. 7 is a land structure diagram of the fourth small area unit 4 in fig. 3.
Fig. 8 is a land structure diagram of the fifth small area unit 5 in fig. 3.
Fig. 9 is a land structure diagram of the sixth small area unit 6 in fig. 3.
Fig. 10 is a land structure diagram of the seventh small area unit 7 in fig. 3.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, and thus the protection scope of the present invention is more clearly and clearly defined. In addition, the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
Example 1: the concrete structure of the invention is as follows:
referring to fig. 1-3, the invention relates to a soldering method of a laser circuit board solder paste welding machine, which comprises the following steps:
firstly, taking a PCB (printed Circuit Board) to be welded, and controlling the power of a light source to be 30-100W;
step two, dividing the welding surface of the PCB into a plurality of small area units in a system picture through a control program, and identifying the central point of each small area unit;
step three, the control system controls a table driving mechanism fixed on the PCB to enable the table driving mechanism to drive the PCB to move and enable a central point in one small area unit to move to a vertical point of the laser head;
fourthly, the control system controls the laser head to rotate along the R axis so as to change the direction of the laser beam to scan in the small area unit and complete welding;
and step five, after one small area unit is welded, the control system controls the table board driving mechanism to move the PCB into the next small area unit, and the actions of the step three and the step four are repeated until all the small area units are welded.
A preferred technical solution of this embodiment: the positions of the small area units are randomly arranged according to the welding spot layout of the welding surface.
A preferred technical solution of this embodiment: in the small area units, the boundaries have no overlapping or overlapping areas or have independent boundaries and overlapping areas.
Example 2:
referring to fig. 1 to 10, fig. 1 is a structural diagram of a surface with components of a pre-soldered PCB in embodiment 2 of the present invention. Fig. 2 is a distribution diagram of the cells of each small area on the soldering surface of the pre-soldered PCB in embodiment 2 of the present invention.
In fig. 2, the PCB board soldering surface is divided into 7 small area units, wherein the first small area unit 1 and the second small area unit 2 have an overlapping area, the second small area unit 2 has an overlapping area with the sixth small area unit 6, the fifth small area unit 5 and the third small area unit 3, respectively, the sixth small area unit 6 and the fifth small area unit 5 have an overlapping area, the fifth small area unit 5 and the third small area unit 3 have an overlapping area, the fifth small area unit 5 and the fourth small area unit 4 have an overlapping area, and the third small area unit 3 and the seventh small area unit 7 have an overlapping area.
According to example 1 procedure:
firstly, taking a PCB (printed Circuit Board) to be welded, and controlling the power of a light source to be 30-100W;
step two, dividing the welding surface of the PCB into a plurality of small area units in a system picture through a control program, such as each small area unit in fig. 2, and identifying the central point of each small area unit;
step three, the control system controls a table driving mechanism fixed on the PCB to enable the table driving mechanism to drive the PCB to move and enable a central point in one small area unit to move to a vertical point of the laser head;
fourthly, the control system controls the laser head to rotate along the R axis so as to change the direction of the laser beam to scan in the small area unit and complete welding;
and step five, after one small area unit is welded, the control system controls the table board driving mechanism to move the PCB into the next small area unit, and the actions of the step three and the step four are repeated until all the small area units are welded.
The invention has the following changed time points:
the improvement is as follows: in order to reduce the frequent movement of the left and right moving shafts of the platform surface, reduce the system error and improve the accuracy, the invention decomposes the working area into a plurality of small area units. The table driving mechanism drives the center of the small area unit on the PCB to move to the vertical point of the laser head; and then scanning heating is carried out by changing the direction of the laser beam. The boundaries of the cells are manually set, which facilitates setting the position of the vertical point.
The second improvement is that: the small region units may be arbitrarily set, or may overlap each other. That is, each welding point can be arranged to the small area unit according to specific conditions; the advantage is that the laser beam direction of the spot heating can be chosen.
The improvement is that: and controlling at a multi-system level. The full-automatic work is completed through the communication system, and one person can operate a plurality of machines.
The improvement is four: each small area unit is relatively independent, and the working parameters are constant and can be freely set. The advantages are that: the machine has multiple functions of marking, photocuring, surface heat treatment, metal surface oxidation insulation treatment and the like; meanwhile, the method can be used for repairing and maintaining the high-precision circuit board, and the working parameters can be reset in the production process to improve the yield.
The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the present specification and the accompanying drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (3)
1. A tin soldering method of a laser circuit board tin paste welding machine is characterized by comprising the following steps:
firstly, taking a PCB (printed Circuit Board) to be welded, and controlling the power of a light source to be 30-100W;
step two, dividing the welding surface of the PCB into a plurality of small area units in a system picture through a control program, and identifying the central point of each small area unit;
step three, the control system controls a table driving mechanism fixed on the PCB to enable the table driving mechanism to drive the PCB to move and enable a central point in one small area unit to move to a vertical point of the laser head;
fourthly, the control system controls the laser head to rotate along the R axis so as to change the direction of the laser beam to scan in the small area unit and complete welding;
and step five, after one small area unit is welded, the control system controls the table board driving mechanism to move the PCB into the next small area unit, and the actions of the step three and the step four are repeated until all the small area units are welded.
2. A method as claimed in claim 1, wherein the locations of the small area units are arbitrarily set according to the solder joint layout of the solder surface.
3. A method for soldering a laser circuit board solder paste welder as recited in claim 1, wherein the plurality of small area units have no overlapping boundaries or have overlapping areas or have both independent boundaries and overlapping areas.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210152898.9A CN114393266A (en) | 2022-02-18 | 2022-02-18 | Tin soldering method of laser circuit board tin paste welding machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210152898.9A CN114393266A (en) | 2022-02-18 | 2022-02-18 | Tin soldering method of laser circuit board tin paste welding machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114393266A true CN114393266A (en) | 2022-04-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210152898.9A Pending CN114393266A (en) | 2022-02-18 | 2022-02-18 | Tin soldering method of laser circuit board tin paste welding machine |
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| CN (1) | CN114393266A (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101288921A (en) * | 2007-04-19 | 2008-10-22 | 深圳市大族激光科技股份有限公司 | Laser device for cutting |
| CN106944705A (en) * | 2017-04-07 | 2017-07-14 | 武汉比天科技有限责任公司 | A kind of visual identity closed loop control method of tin cream precision welding |
| CN108296640A (en) * | 2018-04-26 | 2018-07-20 | 大族激光科技产业集团股份有限公司 | Laser process equipment and method |
| CN110719696A (en) * | 2019-10-22 | 2020-01-21 | 东莞三润田智能科技股份有限公司 | PCB solder-resisting windowing method and PCB laser windowing machine |
| US20200047285A1 (en) * | 2016-05-24 | 2020-02-13 | GM Global Technology Operations LLC | Laser welding of coated steels assisted by the formation of at least one preliminary weld deposit |
| CN110899885A (en) * | 2018-09-18 | 2020-03-24 | 镭射希股份有限公司 | Laser reflow soldering device for electronic component having micron-sized thickness |
| CN111215713A (en) * | 2020-02-24 | 2020-06-02 | 深圳市华瀚激光科技有限公司 | Laser heating tin wire feeding drag welding process |
| US20200215633A1 (en) * | 2019-01-04 | 2020-07-09 | South China University Of Technology | Solder paste laser induced forward transfer device and method |
| CN113084288A (en) * | 2021-04-16 | 2021-07-09 | 王玲 | Laser circuit board tin cream welding machine |
| CN113113318A (en) * | 2018-03-23 | 2021-07-13 | 台湾积体电路制造股份有限公司 | Method and package for forming semiconductor device |
-
2022
- 2022-02-18 CN CN202210152898.9A patent/CN114393266A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101288921A (en) * | 2007-04-19 | 2008-10-22 | 深圳市大族激光科技股份有限公司 | Laser device for cutting |
| US20200047285A1 (en) * | 2016-05-24 | 2020-02-13 | GM Global Technology Operations LLC | Laser welding of coated steels assisted by the formation of at least one preliminary weld deposit |
| CN106944705A (en) * | 2017-04-07 | 2017-07-14 | 武汉比天科技有限责任公司 | A kind of visual identity closed loop control method of tin cream precision welding |
| CN113113318A (en) * | 2018-03-23 | 2021-07-13 | 台湾积体电路制造股份有限公司 | Method and package for forming semiconductor device |
| CN108296640A (en) * | 2018-04-26 | 2018-07-20 | 大族激光科技产业集团股份有限公司 | Laser process equipment and method |
| CN110899885A (en) * | 2018-09-18 | 2020-03-24 | 镭射希股份有限公司 | Laser reflow soldering device for electronic component having micron-sized thickness |
| US20200215633A1 (en) * | 2019-01-04 | 2020-07-09 | South China University Of Technology | Solder paste laser induced forward transfer device and method |
| CN110719696A (en) * | 2019-10-22 | 2020-01-21 | 东莞三润田智能科技股份有限公司 | PCB solder-resisting windowing method and PCB laser windowing machine |
| CN111215713A (en) * | 2020-02-24 | 2020-06-02 | 深圳市华瀚激光科技有限公司 | Laser heating tin wire feeding drag welding process |
| CN113084288A (en) * | 2021-04-16 | 2021-07-09 | 王玲 | Laser circuit board tin cream welding machine |
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Application publication date: 20220426 |