CN112775543A - Polygon scanning galvanometer device for ultrahigh-speed laser processing - Google Patents
Polygon scanning galvanometer device for ultrahigh-speed laser processing Download PDFInfo
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- CN112775543A CN112775543A CN202110233321.6A CN202110233321A CN112775543A CN 112775543 A CN112775543 A CN 112775543A CN 202110233321 A CN202110233321 A CN 202110233321A CN 112775543 A CN112775543 A CN 112775543A
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- galvanometer
- polygonal
- reflection
- controller
- polygon
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
- B23K26/0821—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head using multifaceted mirrors, e.g. polygonal mirror
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Mechanical Optical Scanning Systems (AREA)
Abstract
The invention relates to a polygonal scanning galvanometer device for ultrahigh-speed laser processing, which comprises a controller, an ultrashort pulse laser, a two-dimensional galvanometer component and an f-theta lens, wherein the ultrashort pulse laser, the two-dimensional galvanometer component and the f-theta lens are respectively controlled by the controller, the polygonal galvanometer device also comprises a polygonal galvanometer and a polygonal galvanometer rotating device connected with the controller, the polygonal galvanometer is provided with two multi-surface reflecting base stations which are symmetrical up and down, and the included angle of a reflecting surface between the two multi-surface reflecting base stations is 90 degrees. The invention can reflect the light beam emitted by the ultrashort pulse through the polygonal vibrating mirror and the two-dimensional vibrating mirror, and uniformly act the light beam on the surface of the co-construction through the f-theta lens, thereby realizing the work of ultrahigh-speed laser drilling, cutting and the like.
Description
Technical Field
The invention relates to the technical field of ultrahigh-speed laser processing, in particular to a polygon scanning galvanometer device for ultrahigh-speed laser processing.
Background
The laser ultra-high speed processing technology has the advantages of high coherence, small heat influence, high processing efficiency, high precision and repetition rate, no selectivity to materials, flexible and various processing modes, low cost and the like, and has important application prospects in the fields of semiconductor material processing, micro-optical element manufacturing, printed circuit boards and the like.
Aiming at researching and developing a high-precision polygon scanning system in typical industries, the accuracy and repeatable deflection and positioning of laser beams are improved, an intelligent equipment system suitable for laser ultra-high speed processing is built, and laser ultra-high speed processing is realized.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a polygonal scanning galvanometer device for ultrahigh-speed laser processing, which has the advantages of simple and compact structure, small focal length, high scanning precision, lower processing cost, uniform illumination distribution on an image surface, high energy concentration, small relative distortion and the like.
The invention is realized by the following technical scheme:
the utility model provides a hypervelocity laser machining is with polygon scanning mirror device that shakes, including the controller to and by the ultrashort pulse laser ware, two-dimentional mirror subassembly and the f-theta lens that shake of controller control respectively, still include the polygon mirror that shakes to and the polygon mirror rotating device that shakes that is connected with the controller, the polygon mirror that shakes is equipped with two multiaspect reflection base stations of longitudinal symmetry, and the plane of reflection contained angle between two multiaspect reflection base stations is 90.
The polygon mirror oscillator is used for separating high-frequency pulse high pulses to avoid overlapping of a plurality of pulses on a workpiece, the polygon scanning mirror oscillator device for ultra-high speed laser processing outputs pulse laser corresponding to processing technological parameters through the polygon scanning mirror oscillator device based on preset laser processing technological parameters, and ultra-high speed processing of the workpiece is achieved.
The included angle of the reflecting surfaces between the two multi-surface reflecting base stations is 90 degrees, and the beam mirrors emitted by the ultrashort pulse laser form parallel light paths after being reflected by the reflecting surfaces on the upper multi-surface emitting base station and the lower multi-surface emitting base station, so that the light path adjustment is facilitated, and the structural layout space of light path devices is saved.
Furthermore, each multi-surface reflection base station is provided with at least three reflection surfaces, and the reflection surfaces are distributed based on the polygonal galvanometer central shaft array.
The polygon galvanometer can reflect laser beams by means of a plurality of reflecting surfaces in the rotating process, and each reflecting surface is distributed based on the central shaft array of the polygon galvanometer, so that the reflecting surfaces are uniform and stable in reflection.
The invention has the beneficial effects that:
the light beam emitted by the ultrashort pulse is reflected by the rotary polygonal vibrating mirror and the swinging two-dimensional vibrating mirror, and the light beam is uniformly acted on the co-construction surface through the f-theta lens, so that the light beam reflected by the polygonal vibrating mirror can keep a stable straight line for processing a workpiece in cooperation with the light beam emitted by the swinging two-dimensional vibrating mirror through the f-theta lens without bending, the processing effect is ensured, the difference of the punching quality is small, and the basic consistency of the punching hole pattern and the punching size is ensured.
The device has the advantages of simple and compact structure, small focal length, high scanning precision, lower processing cost, uniform illumination distribution on an image surface, high energy concentration, small relative distortion and the like.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic structural diagram of a polygonal galvanometer in accordance with the present invention;
fig. 3 is a perspective view of fig. 1.
Shown in the figure:
1. the device comprises an ultrashort pulse laser 2, a rotating device 3, a polygonal vibrating mirror 4, a two-dimensional vibrating mirror 5, an f-theta lens 6, a workpiece 7, a multi-surface reflection base station 8 and a reflection surface.
Detailed Description
In order to clearly illustrate the technical features of the present solution, the present solution is explained below by way of specific embodiments.
As shown in fig. 1, a polygon scanning galvanometer device for ultra-high speed laser processing comprises a controller, an ultra-short pulse laser 1, a two-dimensional galvanometer component and an f-theta lens 5 which are respectively controlled by the controller, and further comprises a polygon galvanometer 3 and a polygon galvanometer rotating device 2 connected with the controller, wherein the polygon galvanometer 3 is provided with two multi-surface reflecting base platforms 7 which are symmetrical up and down, and an included angle of a reflecting surface 8 between the two multi-surface reflecting base platforms 7 is 90 degrees, as shown in fig. 2. The two-dimensional galvanometer component comprises a two-dimensional galvanometer 4 and a driving device for driving the two-dimensional galvanometer 4 to swing, and the two-dimensional galvanometer component and the driving device both belong to the prior art and are not described herein.
Each multi-surface reflection base 7 has not less than three reflection surfaces 8, and each reflection surface 8 is distributed based on the central axis array of the polygonal galvanometer 3. As shown in fig. 2, in the present embodiment, the polygon mirror base 7 has eight reflecting surfaces 8, and the eight reflecting surfaces 8 have the same size and are arranged in an array based on the central axis of the polygon mirror 3.
When the invention works: the ultra-short pulse laser 1 is controlled by a controller to emit laser beams by presetting main system processing parameters such as laser frequency division coefficient, laser Q signal pulse width, line repetition times, Z-axis line distance, processing line number, main shaft rotating speed and the like, a polygonal vibrating mirror 3 is driven by a rotating device 2 to rotate around a central shaft of the polygonal vibrating mirror to separate high-frequency pulse high pulses, the laser beams enter a two-dimensional vibrating mirror 4 after being emitted by reflecting surfaces 8 on an upper multi-surface emitting base station 7 and a lower multi-surface emitting base station 7, and are emitted to the surface of a workpiece 6 after being adjusted by an f-theta lens 5, the control of scanning beams is realized by controlling the change of the deflection angle of the two-dimensional vibrating mirror 4 through the controller, and the beams are in line from points so as to realize the processing of uniform linear slotting. When the invention is processed, the pulse laser corresponding to the processing technological parameter is output through the polygon scanning galvanometer device based on the preset laser processing technological parameter, thereby realizing the ultra-high speed processing of the workpiece.
Of course, the above description is not limited to the above examples, and the undescribed technical features of the present invention can be implemented by or using the prior art, and will not be described herein again; while the present invention has been described in detail with reference to the preferred embodiments, it will be understood by those skilled in the art that various changes, modifications, additions and substitutions can be made therein without departing from the spirit and scope of the invention as defined in the accompanying claims.
Claims (2)
1. The utility model provides a polygon scanning mirror device that shakes for hypervelocity laser processing, includes the controller to and by ultrashort pulse laser, two-dimentional mirror subassembly and the f-theta lens of controller control respectively, its characterized in that: the polygon mirror that shakes is equipped with two multiaspect reflection base stations of longitudinal symmetry, and the plane of reflection contained angle between two multiaspect reflection base stations is 90.
2. The polygon scanning mirror apparatus for ultra high speed laser processing according to claim 1, wherein: each multi-surface reflection base station is provided with at least three reflection surfaces, and each reflection surface is distributed based on the polygonal galvanometer central shaft array.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110233321.6A CN112775543A (en) | 2021-03-03 | 2021-03-03 | Polygon scanning galvanometer device for ultrahigh-speed laser processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110233321.6A CN112775543A (en) | 2021-03-03 | 2021-03-03 | Polygon scanning galvanometer device for ultrahigh-speed laser processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112775543A true CN112775543A (en) | 2021-05-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110233321.6A Pending CN112775543A (en) | 2021-03-03 | 2021-03-03 | Polygon scanning galvanometer device for ultrahigh-speed laser processing |
Country Status (1)
| Country | Link |
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| CN (1) | CN112775543A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113523577A (en) * | 2021-07-09 | 2021-10-22 | 济南森峰激光科技股份有限公司 | PERC battery piece high-speed laser grooving method and device based on rotating mirror and PERC battery piece |
-
2021
- 2021-03-03 CN CN202110233321.6A patent/CN112775543A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113523577A (en) * | 2021-07-09 | 2021-10-22 | 济南森峰激光科技股份有限公司 | PERC battery piece high-speed laser grooving method and device based on rotating mirror and PERC battery piece |
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