CN1130601C - 通过反常色散改变折射率的底面抗反射涂层 - Google Patents
通过反常色散改变折射率的底面抗反射涂层 Download PDFInfo
- Publication number
- CN1130601C CN1130601C CN97192868A CN97192868A CN1130601C CN 1130601 C CN1130601 C CN 1130601C CN 97192868 A CN97192868 A CN 97192868A CN 97192868 A CN97192868 A CN 97192868A CN 1130601 C CN1130601 C CN 1130601C
- Authority
- CN
- China
- Prior art keywords
- refractive index
- reflective film
- photoresist film
- film
- real part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000006185 dispersion Substances 0.000 title abstract description 12
- 230000002547 anomalous effect Effects 0.000 title abstract description 10
- 239000006117 anti-reflective coating Substances 0.000 title description 8
- 238000012986 modification Methods 0.000 title description 3
- 230000004048 modification Effects 0.000 title description 3
- 230000003667 anti-reflective effect Effects 0.000 claims abstract description 27
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 238000000034 method Methods 0.000 claims abstract description 12
- 229920002120 photoresistant polymer Polymers 0.000 claims description 44
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- 239000011248 coating agent Substances 0.000 claims description 11
- 238000000576 coating method Methods 0.000 claims description 11
- 150000001875 compounds Chemical class 0.000 claims description 9
- 238000011161 development Methods 0.000 claims description 9
- URQUNWYOBNUYJQ-UHFFFAOYSA-N diazonaphthoquinone Chemical compound C1=CC=C2C(=O)C(=[N]=[N])C=CC2=C1 URQUNWYOBNUYJQ-UHFFFAOYSA-N 0.000 claims description 7
- 229920003986 novolac Polymers 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 239000004411 aluminium Substances 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 239000000377 silicon dioxide Substances 0.000 claims description 6
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 239000010703 silicon Substances 0.000 claims description 5
- 238000002835 absorbance Methods 0.000 claims description 4
- 239000007864 aqueous solution Substances 0.000 claims description 4
- 230000008033 biological extinction Effects 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 claims description 4
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 claims description 3
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 3
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 3
- 239000004811 fluoropolymer Substances 0.000 claims description 3
- 229920002313 fluoropolymer Polymers 0.000 claims description 3
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 3
- 229920005591 polysilicon Polymers 0.000 claims description 3
- -1 pottery Chemical compound 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 235000012239 silicon dioxide Nutrition 0.000 claims description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 3
- 229910052715 tantalum Inorganic materials 0.000 claims description 3
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 3
- 230000000295 complement effect Effects 0.000 claims description 2
- 239000000975 dye Substances 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000002310 reflectometry Methods 0.000 abstract description 23
- 238000010521 absorption reaction Methods 0.000 abstract description 14
- 230000000694 effects Effects 0.000 abstract description 4
- 230000001629 suppression Effects 0.000 abstract 1
- 230000003287 optical effect Effects 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 239000000049 pigment Substances 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 238000001228 spectrum Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 241000931526 Acer campestre Species 0.000 description 1
- 238000000862 absorption spectrum Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- JGIATAMCQXIDNZ-UHFFFAOYSA-N calcium sulfide Chemical compound [Ca]=S JGIATAMCQXIDNZ-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000013213 extrapolation Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000001393 microlithography Methods 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 238000002211 ultraviolet spectrum Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/091—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
Landscapes
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Materials For Photolithography (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
Description
Claims (10)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US1300996P | 1996-03-07 | 1996-03-07 | |
US60/013,009 | 1996-03-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1213437A CN1213437A (zh) | 1999-04-07 |
CN1130601C true CN1130601C (zh) | 2003-12-10 |
Family
ID=21757845
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN97192868A Expired - Lifetime CN1130601C (zh) | 1996-03-07 | 1997-03-06 | 通过反常色散改变折射率的底面抗反射涂层 |
Country Status (8)
Country | Link |
---|---|
US (1) | US6042992A (zh) |
EP (1) | EP0885407B1 (zh) |
JP (2) | JP3877776B2 (zh) |
KR (1) | KR100500499B1 (zh) |
CN (1) | CN1130601C (zh) |
DE (1) | DE69706288T2 (zh) |
TW (1) | TW394850B (zh) |
WO (1) | WO1997033201A1 (zh) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5733714A (en) * | 1996-09-30 | 1998-03-31 | Clariant Finance (Bvi) Limited | Antireflective coating for photoresist compositions |
US6274295B1 (en) * | 1997-03-06 | 2001-08-14 | Clariant Finance (Bvi) Limited | Light-absorbing antireflective layers with improved performance due to refractive index optimization |
US5994430A (en) * | 1997-04-30 | 1999-11-30 | Clariant Finance Bvi) Limited | Antireflective coating compositions for photoresist compositions and use thereof |
US5981145A (en) * | 1997-04-30 | 1999-11-09 | Clariant Finance (Bvi) Limited | Light absorbing polymers |
EP1016930A1 (en) * | 1998-12-28 | 2000-07-05 | Infineon Technologies North America Corp. | Bottom antireflective layer operating in destructive interference and absorption modes |
US6599682B2 (en) * | 2000-04-26 | 2003-07-29 | Tokyo Ohka Kogyo Co., Ltd. | Method for forming a finely patterned photoresist layer |
US7070914B2 (en) * | 2002-01-09 | 2006-07-04 | Az Electronic Materials Usa Corp. | Process for producing an image using a first minimum bottom antireflective coating composition |
US7009750B1 (en) * | 2002-10-25 | 2006-03-07 | Eclipse Energy Systems, Inc. | Apparatus and methods for modulating refractive index |
DE602006017047D1 (de) * | 2006-06-14 | 2010-11-04 | Eastman Kodak Co | Verfahren zur Verarbeitung von Fotopolymer-Druckplatten, die eine Deckschicht enthalten |
US7416834B2 (en) * | 2006-09-27 | 2008-08-26 | Az Electronic Materials Usa Corp. | Antireflective coating compositions |
US8221965B2 (en) * | 2008-07-08 | 2012-07-17 | Az Electronic Materials Usa Corp. | Antireflective coating compositions |
US8329387B2 (en) * | 2008-07-08 | 2012-12-11 | Az Electronic Materials Usa Corp. | Antireflective coating compositions |
US20100092894A1 (en) * | 2008-10-14 | 2010-04-15 | Weihong Liu | Bottom Antireflective Coating Compositions |
US8507192B2 (en) * | 2010-02-18 | 2013-08-13 | Az Electronic Materials Usa Corp. | Antireflective compositions and methods of using same |
US9170494B2 (en) | 2012-06-19 | 2015-10-27 | Az Electronic Materials (Luxembourg) S.A.R.L. | Antireflective compositions and methods of using same |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5851515A (ja) * | 1981-09-22 | 1983-03-26 | Fujitsu Ltd | レジスト膜の露光方法 |
DE3211400A1 (de) * | 1982-03-27 | 1983-09-29 | Basf Ag, 6700 Ludwigshafen | Polymere mit mesogenen gruppen und farbstoffresten in den seitenketten |
US4491628A (en) * | 1982-08-23 | 1985-01-01 | International Business Machines Corporation | Positive- and negative-working resist compositions with acid generating photoinitiator and polymer with acid labile groups pendant from polymer backbone |
US5207952A (en) * | 1986-10-10 | 1993-05-04 | University Of Southern Mississippi | Side chain liquid crystalline polymers as nonlinear optical materials |
JPS63202915A (ja) * | 1987-02-19 | 1988-08-22 | Oki Electric Ind Co Ltd | 半導体装置の製造方法 |
DE3817012A1 (de) * | 1988-05-19 | 1989-11-30 | Basf Ag | Positiv und negativ arbeitende strahlungsempfindliche gemische sowie verfahren zur herstellung von reliefmustern |
EP0440374B1 (en) * | 1990-01-30 | 1997-04-16 | Wako Pure Chemical Industries Ltd | Chemical amplified resist material |
FR2668158B1 (fr) * | 1990-10-22 | 1994-05-06 | Thomson Csf | Polymere reticulable pour applications en optique non lineaire. |
JP2643056B2 (ja) * | 1991-06-28 | 1997-08-20 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 表面反射防止コーティング形成組成物及びその使用 |
US5472827A (en) * | 1991-12-30 | 1995-12-05 | Sony Corporation | Method of forming a resist pattern using an anti-reflective layer |
JP2791525B2 (ja) * | 1992-04-16 | 1998-08-27 | 三菱電機株式会社 | 反射防止膜の選定方法およびその方法により選定された反射防止膜 |
US5294680A (en) * | 1992-07-24 | 1994-03-15 | International Business Machines Corporation | Polymeric dyes for antireflective coatings |
JP2829555B2 (ja) * | 1992-08-20 | 1998-11-25 | 三菱電機株式会社 | 微細レジストパターンの形成方法 |
DE4232394A1 (de) * | 1992-09-26 | 1994-03-31 | Basf Ag | Copolymerisate mit nichtlinear optischen Eigenschaften und deren Verwendung |
EP0671025B1 (en) * | 1992-11-25 | 1997-08-13 | Hoechst Celanese Corporation | Metal ion reduction in bottom anti-reflective coatings for photoresists |
US5656128A (en) * | 1993-03-26 | 1997-08-12 | Fujitsu Limited | Reduction of reflection by amorphous carbon |
FR2709755B1 (fr) * | 1993-09-06 | 1995-11-17 | France Telecom | Matériau polymère réticulable, utilisable en optique non linéaire, et son procédé d'obtention. |
JP3492375B2 (ja) * | 1993-10-12 | 2004-02-03 | エイチ・エヌ・エイ・ホールディングス・インコーポレイテッド | 改良されたフォトレジスト用水溶性反射防止塗料組成物およびその製造法 |
JP3334304B2 (ja) * | 1993-11-30 | 2002-10-15 | ソニー株式会社 | 半導体装置の製造方法 |
KR100366910B1 (ko) * | 1994-04-05 | 2003-03-04 | 소니 가부시끼 가이샤 | 반도체장치의제조방법 |
JP3248353B2 (ja) * | 1994-06-29 | 2002-01-21 | ソニー株式会社 | 反射防止膜の設計方法 |
US5525457A (en) * | 1994-12-09 | 1996-06-11 | Japan Synthetic Rubber Co., Ltd. | Reflection preventing film and process for forming resist pattern using the same |
WO1997033200A1 (en) * | 1996-03-07 | 1997-09-12 | Clariant International, Ltd. | Light-absorbing antireflective layers with improved performance due to refractive index optimization |
US5652317A (en) * | 1996-08-16 | 1997-07-29 | Hoechst Celanese Corporation | Antireflective coatings for photoresist compositions |
US5652297A (en) * | 1996-08-16 | 1997-07-29 | Hoechst Celanese Corporation | Aqueous antireflective coatings for photoresist compositions |
-
1997
- 1997-03-06 TW TW086102746A patent/TW394850B/zh not_active IP Right Cessation
- 1997-03-06 US US08/811,806 patent/US6042992A/en not_active Expired - Lifetime
- 1997-03-06 WO PCT/US1997/003835 patent/WO1997033201A1/en active IP Right Grant
- 1997-03-06 DE DE69706288T patent/DE69706288T2/de not_active Expired - Lifetime
- 1997-03-06 CN CN97192868A patent/CN1130601C/zh not_active Expired - Lifetime
- 1997-03-06 EP EP97915003A patent/EP0885407B1/en not_active Expired - Lifetime
- 1997-03-06 KR KR10-1998-0706195A patent/KR100500499B1/ko not_active IP Right Cessation
- 1997-03-06 JP JP53200997A patent/JP3877776B2/ja not_active Expired - Fee Related
-
2006
- 2006-05-08 JP JP2006129460A patent/JP4044118B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN1213437A (zh) | 1999-04-07 |
JP2000506288A (ja) | 2000-05-23 |
EP0885407A1 (en) | 1998-12-23 |
KR100500499B1 (ko) | 2005-12-30 |
DE69706288T2 (de) | 2002-05-16 |
DE69706288D1 (de) | 2001-09-27 |
JP4044118B2 (ja) | 2008-02-06 |
WO1997033201A1 (en) | 1997-09-12 |
TW394850B (en) | 2000-06-21 |
US6042992A (en) | 2000-03-28 |
EP0885407B1 (en) | 2001-08-22 |
JP3877776B2 (ja) | 2007-02-07 |
JP2006287243A (ja) | 2006-10-19 |
KR19990082462A (ko) | 1999-11-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN1130601C (zh) | 通过反常色散改变折射率的底面抗反射涂层 | |
EP1556896B1 (en) | Anti-reflective compositions comprising triazine compounds | |
EP0978015B1 (en) | Light absorbing polymers | |
KR102515849B1 (ko) | 용제현상용 실리콘함유 레지스트 하층막 형성 조성물을 이용한 반도체장치의 제조방법 | |
US8625096B2 (en) | Method and system for increasing alignment target contrast | |
CN102272675A (zh) | 使用双重构图的光致抗蚀剂成像方法 | |
CN1272864A (zh) | 抗反射涂层组合物 | |
WO2012063120A1 (en) | Underlayer developable coating compositions and processes thereof | |
JP2004102203A (ja) | 反射防止膜形成組成物 | |
Brunner et al. | High-NA lithographic imagery at Brewster's angle | |
TW201106418A (en) | Improving alignment target contrast in a lithographic double patterning process | |
US20020132171A1 (en) | Method of and system for improving stability of photomasks | |
US20120092633A1 (en) | Reflective film interface to restore transverse magnetic wave contrast in lithographic processing | |
WO2007007780A1 (ja) | 保護膜形成用材料およびこれを用いたホトレジストパターン形成方法 | |
TW200425269A (en) | A method of patterning photoresist on a wafer using an attenuated phase shift mask | |
JP2013530425A (ja) | 反射防止コーティング組成物及び微細電子デバイスを製造するための方法 | |
JP2005150450A (ja) | 露光方法 | |
Dunn et al. | Deep-UV photolithography linewidth variation from reflective substrates | |
US20050153235A1 (en) | Photosensitive material for immersion photolithography | |
JP3829914B2 (ja) | 反射防止膜材料及びパターン形成方法 | |
Nalamasu et al. | Single-layer resist design for 193nm lithography. | |
Ushida et al. | HOYA deep-UV EAPSM blanks development status | |
CN115873176A (zh) | 一种duv光刻用底部抗反射涂层及其制备方法和应用 | |
TW505982B (en) | Structure and manufacturing method of dual-layer bottom anti-reflection layer in ArF and F2 microlithography | |
Yin | Optimization of the lithographic performance for lift-off process using modeling techniques |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: AZ ELECTRONIC MATERIALS JAPAN Free format text: FORMER OWNER: CLARIANT INTERNATIONAL LTD. Effective date: 20050812 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20050812 Address after: Tokyo, Japan Patentee after: AZ Electronic Materials Japan Co., Ltd. Address before: Swiss Moose Patentee before: Keralyant International Co., Ltd. |
|
ASS | Succession or assignment of patent right |
Owner name: AZ ELECTRONIC MATERIALS IP CO., LTD. Free format text: FORMER OWNER: AZ ELECTRONIC MATERIALS JAPAN CO., LTD. Effective date: 20120926 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20120926 Address after: Tokyo, Japan Patentee after: AZ Electronic Materials IP Co., Ltd. Address before: Tokyo, Japan Patentee before: AZ Electronic Materials Japan Co., Ltd. |
|
ASS | Succession or assignment of patent right |
Owner name: MERCK PATENT GMBH Free format text: FORMER OWNER: AZ ELECTRONIC MATERIALS IP CO., LTD. Effective date: 20150414 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20150414 Address after: Darmstadt Patentee after: Merck Patent GmbH Address before: Tokyo, Japan Patentee before: AZ Electronic Materials IP Co., Ltd. |
|
CX01 | Expiry of patent term |
Granted publication date: 20031210 |
|
CX01 | Expiry of patent term |