CN112969290B - Pcb上孔的制造工艺 - Google Patents
Pcb上孔的制造工艺 Download PDFInfo
- Publication number
- CN112969290B CN112969290B CN202110142020.2A CN202110142020A CN112969290B CN 112969290 B CN112969290 B CN 112969290B CN 202110142020 A CN202110142020 A CN 202110142020A CN 112969290 B CN112969290 B CN 112969290B
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- CN
- China
- Prior art keywords
- hole
- pcb
- metallized
- plate body
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0221—Perforating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/025—Abrading, e.g. grinding or sand blasting
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110142020.2A CN112969290B (zh) | 2021-02-02 | 2021-02-02 | Pcb上孔的制造工艺 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110142020.2A CN112969290B (zh) | 2021-02-02 | 2021-02-02 | Pcb上孔的制造工艺 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN112969290A CN112969290A (zh) | 2021-06-15 |
CN112969290B true CN112969290B (zh) | 2023-01-03 |
Family
ID=76272361
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202110142020.2A Active CN112969290B (zh) | 2021-02-02 | 2021-02-02 | Pcb上孔的制造工艺 |
Country Status (1)
Country | Link |
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CN (1) | CN112969290B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113891568B (zh) * | 2021-10-27 | 2024-05-17 | 高德(江苏)电子科技股份有限公司 | 一种改善印刷线路板反蚀刻干膜孔破的加工工艺 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103369852A (zh) * | 2013-05-08 | 2013-10-23 | 无锡江南计算技术研究所 | 含金属化盲槽镀金板表层图形制作方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001011931A1 (es) * | 1999-08-06 | 2001-02-15 | Lear Automotive (Eeds) Spain, S.L. | Disposicion y metodo de conexion, en posicion ortogonal, de una placa auxiliar a una placa base de circuito impreso, de doble cara o multicapa |
CN105722326B (zh) * | 2016-03-25 | 2018-11-13 | 东莞美维电路有限公司 | Pcb树脂塞孔工艺 |
CN106686903B (zh) * | 2017-01-19 | 2020-02-07 | 广州美维电子有限公司 | 一种pth孔板的处理工艺 |
CN108551731B (zh) * | 2018-03-09 | 2020-03-24 | 江门崇达电路技术有限公司 | 一种线路板上孔口无基材裸露的非金属化孔的制作方法 |
CN108901135B (zh) * | 2018-07-13 | 2020-12-11 | 深圳市景旺电子股份有限公司 | 一种非金属化大孔的制作方法 |
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2021
- 2021-02-02 CN CN202110142020.2A patent/CN112969290B/zh active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103369852A (zh) * | 2013-05-08 | 2013-10-23 | 无锡江南计算技术研究所 | 含金属化盲槽镀金板表层图形制作方法 |
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Publication number | Publication date |
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CN112969290A (zh) | 2021-06-15 |
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Legal Events
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PB01 | Publication | ||
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CB02 | Change of applicant information |
Address after: No.1, Fushan Third Road, Fushan Industrial Park, Qianwu Town, Doumen District, Zhuhai City, Guangdong Province 519170 Applicant after: ZHUHAI GCI SCIENCE & TECHNOLOGY Co.,Ltd. Applicant after: CLP Science and Technology Co.,Ltd. Address before: No.1, Fushan Third Road, Fushan Industrial Park, Qianwu Town, Doumen District, Zhuhai City, Guangdong Province 519170 Applicant before: ZHUHAI GCI SCIENCE & TECHNOLOGY Co.,Ltd. Applicant before: GCI SCIENCE & TECHNOLOGY Co.,Ltd. |
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CB02 | Change of applicant information | ||
CB03 | Change of inventor or designer information |
Inventor after: Qi Guodong Inventor after: Zhao Ganghui Inventor after: Zhang Liangchang Inventor after: Li Wangde Inventor before: Zhao Ganghui Inventor before: Zhang Liangchang Inventor before: Li Wangde Inventor before: Qi Guodong |
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CB03 | Change of inventor or designer information | ||
GR01 | Patent grant | ||
GR01 | Patent grant |