CN102686031B - 一种带埋盲孔的高密度互连pcb板的预开窗工艺 - Google Patents
一种带埋盲孔的高密度互连pcb板的预开窗工艺 Download PDFInfo
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- CN102686031B CN102686031B CN201210165057.8A CN201210165057A CN102686031B CN 102686031 B CN102686031 B CN 102686031B CN 201210165057 A CN201210165057 A CN 201210165057A CN 102686031 B CN102686031 B CN 102686031B
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- central layer
- windowing process
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- pcb board
- high density
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- 238000000034 method Methods 0.000 title claims abstract description 57
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 34
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 18
- 239000011248 coating agent Substances 0.000 claims abstract description 11
- 238000000576 coating method Methods 0.000 claims abstract description 11
- 238000005553 drilling Methods 0.000 claims abstract description 11
- 238000001035 drying Methods 0.000 claims abstract description 7
- 239000007921 spray Substances 0.000 claims description 27
- 239000002313 adhesive film Substances 0.000 claims description 15
- 230000007704 transition Effects 0.000 claims description 10
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims 3
- 238000005530 etching Methods 0.000 abstract description 6
- 238000004140 cleaning Methods 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 229910052782 aluminium Inorganic materials 0.000 abstract 3
- 238000009713 electroplating Methods 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 26
- 239000010949 copper Substances 0.000 description 26
- 229910052802 copper Inorganic materials 0.000 description 26
- 238000005516 engineering process Methods 0.000 description 16
- 239000011347 resin Substances 0.000 description 13
- 229920005989 resin Polymers 0.000 description 13
- 229920000139 polyethylene terephthalate Polymers 0.000 description 8
- 239000005020 polyethylene terephthalate Substances 0.000 description 8
- 238000007747 plating Methods 0.000 description 5
- 230000002378 acidificating effect Effects 0.000 description 4
- 238000007605 air drying Methods 0.000 description 4
- 238000013532 laser treatment Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 238000010420 art technique Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- -1 polyethylene terephthalate Polymers 0.000 description 3
- 238000003754 machining Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000004304 visual acuity Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000002427 irreversible effect Effects 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
- ing And Chemical Polishing (AREA)
- Materials For Photolithography (AREA)
- Laminated Bodies (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
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CN201210165057.8A CN102686031B (zh) | 2012-05-25 | 2012-05-25 | 一种带埋盲孔的高密度互连pcb板的预开窗工艺 |
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CN201210165057.8A CN102686031B (zh) | 2012-05-25 | 2012-05-25 | 一种带埋盲孔的高密度互连pcb板的预开窗工艺 |
Publications (2)
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CN102686031A CN102686031A (zh) | 2012-09-19 |
CN102686031B true CN102686031B (zh) | 2015-06-24 |
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CN201210165057.8A Active CN102686031B (zh) | 2012-05-25 | 2012-05-25 | 一种带埋盲孔的高密度互连pcb板的预开窗工艺 |
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CN (1) | CN102686031B (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN105101623B (zh) * | 2015-08-27 | 2018-12-11 | 高德(无锡)电子有限公司 | 超薄介质层的电路板及其制作工艺 |
CN106170183A (zh) * | 2016-08-24 | 2016-11-30 | 山东蓝色电子科技有限公司 | 一种单面板高精度开窗方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101232782A (zh) * | 2007-01-23 | 2008-07-30 | 李东明 | 印刷电路板掩膜露孔电镀成型工艺 |
CN101990374A (zh) * | 2010-08-03 | 2011-03-23 | 广东达进电子科技有限公司 | 一种陶瓷基刚性电路板的制造方法 |
CN102209438A (zh) * | 2010-10-29 | 2011-10-05 | 博罗县精汇电子科技有限公司 | 高密度柔性线路板及其制作方法 |
CN102378499A (zh) * | 2011-10-18 | 2012-03-14 | 东莞生益电子有限公司 | Pcb板阻焊两面开窗塞孔的制作方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007048963A (ja) * | 2005-08-10 | 2007-02-22 | Sharp Corp | プリント配線板の製造方法、プリント配線板用フォトマスク、およびフォトマスク作成プログラム |
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2012
- 2012-05-25 CN CN201210165057.8A patent/CN102686031B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101232782A (zh) * | 2007-01-23 | 2008-07-30 | 李东明 | 印刷电路板掩膜露孔电镀成型工艺 |
CN101990374A (zh) * | 2010-08-03 | 2011-03-23 | 广东达进电子科技有限公司 | 一种陶瓷基刚性电路板的制造方法 |
CN102209438A (zh) * | 2010-10-29 | 2011-10-05 | 博罗县精汇电子科技有限公司 | 高密度柔性线路板及其制作方法 |
CN102378499A (zh) * | 2011-10-18 | 2012-03-14 | 东莞生益电子有限公司 | Pcb板阻焊两面开窗塞孔的制作方法 |
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CN102686031A (zh) | 2012-09-19 |
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