CN112955488A - 固化性树脂组合物、固化物及有机el显示元件 - Google Patents

固化性树脂组合物、固化物及有机el显示元件 Download PDF

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Publication number
CN112955488A
CN112955488A CN201980069039.XA CN201980069039A CN112955488A CN 112955488 A CN112955488 A CN 112955488A CN 201980069039 A CN201980069039 A CN 201980069039A CN 112955488 A CN112955488 A CN 112955488A
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CN
China
Prior art keywords
curable resin
resin composition
organic
present
cured product
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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CN201980069039.XA
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English (en)
Chinese (zh)
Inventor
西海由季
山本拓也
增井良平
金千鹤
笹野美香
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
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Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of CN112955488A publication Critical patent/CN112955488A/zh
Pending legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/06Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
    • C08G65/16Cyclic ethers having four or more ring atoms
    • C08G65/18Oxetanes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/02Details
    • H05B33/04Sealing arrangements, e.g. against humidity
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/873Encapsulations

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Polyethers (AREA)
  • Polymerisation Methods In General (AREA)
  • Epoxy Resins (AREA)
CN201980069039.XA 2018-11-28 2019-11-20 固化性树脂组合物、固化物及有机el显示元件 Pending CN112955488A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018-222735 2018-11-28
JP2018222735 2018-11-28
PCT/JP2019/045421 WO2020110859A1 (ja) 2018-11-28 2019-11-20 硬化性樹脂組成物、硬化物、及び、有機el表示素子

Publications (1)

Publication Number Publication Date
CN112955488A true CN112955488A (zh) 2021-06-11

Family

ID=70853204

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980069039.XA Pending CN112955488A (zh) 2018-11-28 2019-11-20 固化性树脂组合物、固化物及有机el显示元件

Country Status (4)

Country Link
JP (2) JPWO2020110859A1 (ko)
KR (1) KR20210098943A (ko)
CN (1) CN112955488A (ko)
WO (1) WO2020110859A1 (ko)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103154052A (zh) * 2010-10-06 2013-06-12 株式会社日本触媒 二烯系羧酸阴离子与其盐、及其聚合或固化性组合物
CN103777464A (zh) * 2012-10-18 2014-05-07 Jsr株式会社 固化性组合物、固化膜、显示元件以及干膜
JP2014225380A (ja) * 2013-05-16 2014-12-04 積水化学工業株式会社 有機エレクトロルミネッセンス表示素子用封止剤及び有機エレクトロルミネッセンス表示素子の製造方法
JP2015185272A (ja) * 2014-03-20 2015-10-22 積水化学工業株式会社 有機光デバイスの製造方法及び硬化性樹脂組成物
CN105026456A (zh) * 2013-08-26 2015-11-04 积水化学工业株式会社 光后固化性树脂组合物
CN105278247A (zh) * 2014-07-18 2016-01-27 株式会社日本触媒 固化性树脂组合物及其用途
JP2017228414A (ja) * 2016-06-22 2017-12-28 積水化学工業株式会社 有機エレクトロルミネッセンス表示素子用封止剤
WO2018030232A1 (ja) * 2016-08-08 2018-02-15 積水化学工業株式会社 硬化性樹脂組成物及び有機エレクトロルミネッセンス表示素子用封止剤

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101697892B1 (ko) 2013-06-10 2017-01-18 미쯔이가가꾸가부시끼가이샤 열경화성 조성물, 유기 el 소자용 면 밀봉제 및 그 경화물
JP6419213B2 (ja) 2014-12-09 2018-11-07 三井化学株式会社 有機el素子用の面封止材及びその硬化物
CN109076660B (zh) 2016-10-19 2021-10-29 积水化学工业株式会社 有机el显示元件用密封剂

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103154052A (zh) * 2010-10-06 2013-06-12 株式会社日本触媒 二烯系羧酸阴离子与其盐、及其聚合或固化性组合物
CN103777464A (zh) * 2012-10-18 2014-05-07 Jsr株式会社 固化性组合物、固化膜、显示元件以及干膜
JP2014225380A (ja) * 2013-05-16 2014-12-04 積水化学工業株式会社 有機エレクトロルミネッセンス表示素子用封止剤及び有機エレクトロルミネッセンス表示素子の製造方法
CN105026456A (zh) * 2013-08-26 2015-11-04 积水化学工业株式会社 光后固化性树脂组合物
JP2015185272A (ja) * 2014-03-20 2015-10-22 積水化学工業株式会社 有機光デバイスの製造方法及び硬化性樹脂組成物
CN105278247A (zh) * 2014-07-18 2016-01-27 株式会社日本触媒 固化性树脂组合物及其用途
JP2017228414A (ja) * 2016-06-22 2017-12-28 積水化学工業株式会社 有機エレクトロルミネッセンス表示素子用封止剤
WO2018030232A1 (ja) * 2016-08-08 2018-02-15 積水化学工業株式会社 硬化性樹脂組成物及び有機エレクトロルミネッセンス表示素子用封止剤

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WO2020110859A1 (ja) 2020-06-04
JPWO2020110859A1 (ja) 2021-10-07
KR20210098943A (ko) 2021-08-11
JP2024012375A (ja) 2024-01-30

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