CN112951781B - Power semiconductor module cooling device and power semiconductor module - Google Patents
Power semiconductor module cooling device and power semiconductor module Download PDFInfo
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- CN112951781B CN112951781B CN202110353293.1A CN202110353293A CN112951781B CN 112951781 B CN112951781 B CN 112951781B CN 202110353293 A CN202110353293 A CN 202110353293A CN 112951781 B CN112951781 B CN 112951781B
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- heat exchange
- rear side
- plate
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- 238000001816 cooling Methods 0.000 title claims abstract description 81
- 239000004065 semiconductor Substances 0.000 title claims abstract description 59
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 63
- 238000000034 method Methods 0.000 claims abstract description 10
- 230000017525 heat dissipation Effects 0.000 claims description 58
- 239000000758 substrate Substances 0.000 claims description 28
- 239000000919 ceramic Substances 0.000 claims description 16
- 238000003466 welding Methods 0.000 claims description 15
- 239000002826 coolant Substances 0.000 claims description 8
- 238000009434 installation Methods 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 230000000694 effects Effects 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a power semiconductor module cooling device and a power semiconductor module, wherein the power semiconductor module cooling device comprises: a cooling shell with a heat exchange cavity, a front side radiating plate and a rear side radiating plate which are arranged at the front side and the rear side of the cooling shell and form the side wall of the heat exchange cavity; the cooling shell is also provided with a water inlet channel and a water outlet channel which are communicated with the cooling cavity; the front side cooling plate and the cooling shell are welded integrally, and the rear side cooling plate and the cooling shell are welded integrally. The invention reduces auxiliary fittings, simplifies the assembly process, reduces failure points and can more stably radiate heat for the semiconductor power assembly.
Description
Technical Field
The invention relates to the technical field of new energy automobiles, in particular to a power semiconductor module cooling device and a power semiconductor module.
Background
With the continuous improvement of people's awareness of environmental protection, energy saving and emission reduction, new energy automobiles have become hot spots for the development of various large automobile enterprises and related institutions in the world. The power semiconductor module in the electric automobile controller is used as one of key parts of the new energy automobile, and a large amount of heat can be generated in the working process, so that how to effectively radiate the power semiconductor module influences the running performance of the power semiconductor module.
The power semiconductor module cooling device in the prior art is complex in structure, more parts are needed, and complicated in assembly process is caused, so that the production efficiency is reduced, and more failure points are caused due to errors or assembly reasons in the process of mutual association among the parts, so that the cooling effect is reduced.
Therefore, it is necessary to provide a cooling device that has a simple structure and can stably cool down the power semiconductor module.
Disclosure of Invention
The invention aims to provide a power semiconductor module cooling device which solves the defects in the prior art, can reduce auxiliary accessories, is simple in assembly process, reduces failure points and can more stably dissipate heat of a semiconductor power assembly.
The invention provides a power semiconductor module cooling device, comprising: a cooling shell with a heat exchange cavity, a front side radiating plate and a rear side radiating plate which are arranged at the front side and the rear side of the cooling shell and form the side wall of the heat exchange cavity; the cooling shell is also provided with a water inlet channel and a water outlet channel which are communicated with the cooling cavity; the front side cooling plate and the cooling shell are welded integrally, and the rear side cooling plate and the cooling shell are welded integrally.
In the power semiconductor module cooling device described above, it is preferable that the integral welding is friction welding.
The power semiconductor module cooling apparatus as described above, wherein preferably the cooling case includes a body, a penetration hole penetrating the body in a front-rear direction, a front-side opening provided on a front side wall of the body, and a rear-side opening provided on a rear side wall of the body; the front side heat dissipation plate is fixedly arranged on the body and used for covering the front side opening, and the rear side heat dissipation plate is fixedly arranged on the body and used for covering the rear side opening.
In the power semiconductor module cooling device described above, it is preferable that the body further has a front positioning groove for positioning the front heat dissipation plate.
In the power semiconductor module cooling device as described above, it is preferable that the water inlet passage and the water outlet passage are provided on opposite sides of the heat exchange chamber in a horizontal direction, and the water inlet passage is provided on an upper side of the water outlet passage in a vertical direction.
In the power semiconductor module cooling device as described above, it is preferable that the front side heat dissipation plate and the rear side heat dissipation plate are each provided with a heat dissipation substrate and a heat dissipation fin protruding from the heat dissipation substrate into the heat exchange cavity, the heat dissipation fin has a pin-tooth structure, and the heat dissipation substrate is fixedly connected with the cooling housing; the radiating fins on the front radiating plate and the radiating fins on the rear radiating plate are mutually crossed and form a fin array in the heat exchange cavity.
In the power semiconductor module cooling device as described above, it is preferable that a flow guiding space is formed between the upper side of the fin array and the upper side wall of the heat exchange chamber, one end of the flow guiding space extends to the water inlet channel, and the upper side wall of the heat exchange chamber gradually decreases in height in a direction away from the water inlet channel so that the flow guiding space gradually contracts in a direction away from the water inlet channel.
In the power semiconductor module cooling device as described above, it is preferable that a drainage space is formed between the lower side of the fin array and the lower side wall of the heat exchange chamber, one end of the drainage space extends to the water outlet passage, and the lower side walls of the heat exchangers are inclined in the direction of the water outlet passage so that the drainage space gradually increases in the direction of approaching the water outlet passage.
In the power semiconductor module cooling device, preferably, one end of the water inlet channel away from the heat exchange cavity is a rectangular hole, and one end of the water outlet channel away from the heat exchange cavity is a rectangular hole.
The power semiconductor module comprises a power semiconductor module cooling device, a semiconductor power component and a copper-clad ceramic substrate, wherein the semiconductor power component is fixed on the copper-clad ceramic substrate, and the copper-clad ceramic substrate is attached to the front side heat dissipation plate and/or the rear side heat dissipation plate.
Compared with the prior art, the front side radiating plate and the rear side radiating plate are fixedly connected with the cooling shell to achieve installation, the semiconductor power assembly is attached to the front side radiating plate or the rear side radiating plate through the copper-clad ceramic substrate, the structure is more simplified, and the assembly efficiency of the whole equipment is improved. Compared with the traditional module, the auxiliary accessories are reduced, the assembly process is simple, the failure points are reduced, and the heat dissipation for the semiconductor power assembly can be more stable.
Drawings
Fig. 1 is an exploded view of a power semiconductor module cooling apparatus disclosed in an embodiment of the present invention;
Fig. 2 is a schematic view of a cooling housing in a cooling device for a power semiconductor module according to an embodiment of the present invention;
FIG. 3 is a bottom view of FIG. 2;
fig. 4 is a schematic view illustrating an internal structure of a power semiconductor module according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a power semiconductor module according to an embodiment of the present invention.
Reference numerals illustrate:
1-cooling shell, 10-heat exchange cavity, 11-water inlet channel, 12-water outlet channel, 13-body, 130-front side positioning groove, 131-front side opening, 132-rear side opening, 14-diversion space, 15-diversion space,
2-Front side heat dissipation plate, 21-heat dissipation substrate, 22-heat dissipation fin, 3-rear side heat dissipation plate,
100-Semiconductor module cooling device, 200-semiconductor power assembly, 300-copper-clad ceramic substrate.
Detailed Description
The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the invention.
Embodiments of the invention: as shown in fig. 1 to 4, there is disclosed a power semiconductor module cooling apparatus comprising: a cooling housing 1 having a heat exchange chamber 10, and a front side heat dissipation plate 2 and a rear side heat dissipation plate 3 provided at both front and rear sides of the cooling housing 1 and forming side walls of the heat exchange chamber 10. The cooling shell 1 is also provided with a water inlet channel 11 and a water outlet channel 12 which are communicated with the cooling cavity 10; the front side heat dissipation plate 2 is tightly connected with the cooling shell 1 through integral welding, and the rear side heat dissipation plate 3 is tightly connected with the cooling shell 1 through integral welding.
In this embodiment, the water inlet channel 11, the heat exchange cavity 10 and the water outlet channel 12 form a circulation channel of a cooling medium, and the cooling medium exchanges heat with the front side heat dissipation plate 2 and the rear side heat dissipation plate 3 in the heat exchange cavity 10 during the circulation process in the circulation channel, so as to conduct heat on the front side heat dissipation plate 2 and the rear side heat dissipation plate 3. The semiconductor power assembly 200 can be mounted and fixed on the front side heat dissipation plate 2 and the rear side heat dissipation plate 3, and the specific semiconductor power assembly 200 can be attached to the front side heat dissipation plate 2 and/or the rear side heat dissipation plate 3 through the copper-clad ceramic substrate 300, so that heat dissipation of the semiconductor power assembly 200 is realized.
In this embodiment, the front side heat dissipation plate 2 and the rear side heat dissipation plate 3 are connected and fixed with the cooling shell 1 to achieve installation, and the semiconductor power assembly 200 is attached to the front side heat dissipation plate 2 or the rear side heat dissipation plate 3 through the copper-clad ceramic substrate 300, so that the structure is more simplified, and the assembly efficiency of the whole equipment is improved. Compared with the traditional module, the auxiliary fittings are reduced, the assembly process is simple, the failure points are reduced, and the heat dissipation of the semiconductor power assembly 200 can be performed more stably.
In addition, the integral welding disclosed by the embodiment of the invention is friction welding. The integral welding is a mode in which a seal is directly formed between the two after welding to avoid a gap between the two, thereby integrating the two. In this embodiment, friction welding is preferably used for connection and fixation, and the friction welding can be used for sealing the heat exchange cavity 10, so that the sealing performance is better and the reliability is higher. Compared with the traditional heat exchange cavity sealed by the clamp for the module, the sealing effectiveness of the heat exchange cavity is effectively improved, in addition, the clamping force of the clamp in the traditional structure is difficult to control, the excessive clamping force can cause damage to parts such as the heat exchange cavity, the heat exchange cavity and the like, the heat exchange cavity cannot be sealed due to the excessive clamping force, and important failure points are avoided.
Meanwhile, the pressure resistance of the integrated welding heat exchange cavity 10 is improved from original 0.2mpa to 0.5mpa, so that the heat exchange cavity 10 can meet wider flow requirements, and the cooling effect of the cooling device is improved.
Specifically, the cooling case 1 includes a body 13, a through hole penetrating the body 13 in the front-rear direction, a front-side opening 131 provided on the front side wall of the body 13, and a rear-side opening 132 provided on the rear side wall of the body 13; the front side heat dissipation plate 2 is mounted and fixed on the body 1 and used for covering the front side opening 131, and the rear side heat dissipation plate 3 is mounted and fixed on the body 1 and used for covering the rear side opening 132.
In order to facilitate the installation and fixation of the body 13 and the front and rear heat dissipation plates 2 and 3, the body 13 is further provided with a front positioning groove 130 for positioning the front heat dissipation plate 2 and a rear positioning groove for positioning the rear heat dissipation plate 3. The front side cooling plate 2 is positioned in the front side positioning groove 130 and then is connected with the body 13 through friction welding, and the front side positioning groove 130 can play a role in avoiding when being positioned, so that the outer surface of the welded front side cooling plate 2 does not exceed the front side surface of the body 13, and the outer surface of the welded rear side cooling plate 3 does not exceed the rear side surface of the body 13.
The water inlet channel 11 and the water outlet channel 12 are arranged on two opposite sides of the heat exchange cavity 10 in a horizontal direction, and the water inlet channel 11 is arranged on the upper side of the water outlet channel 12 in a vertical direction. The arrangement of the structure enables the water inlet channel 11 and the water outlet channel 12 to be arranged at a relatively long distance, so that the flowing distance of the cooling medium in the circulating channel can be increased, and heat exchange can be better realized.
As a further improvement, the front side heat dissipation plate 2 and the rear side heat dissipation plate 3 are respectively provided with a heat dissipation substrate 21 and heat dissipation fins 22 protruding from the heat dissipation substrate 21 into the heat exchange cavity 10, the heat dissipation fins 22 have a pin-tooth structure, a plurality of the heat dissipation fins 22 are uniformly distributed on the heat dissipation substrate 21 at intervals, and the heat dissipation substrate 21 is fixedly connected with the cooling shell 1; the heat radiating fins on the front side heat radiating plate 2 and the heat radiating fins on the rear side heat radiating plate 3 are arranged to intersect each other and form a fin array in the heat exchange chamber 10. By adopting the pin-tooth type radiator, the cooling effect can be effectively improved, meanwhile, the problem that the traditional fin type radiator is blocked due to cleanliness can be avoided, and the heat dissipation efficiency is influenced after the blockage. The fin array formed by the plurality of pin-tooth type radiators forms different circulation channels in the heat exchange cavity 10, so that a plurality of loops can be arranged between the water inlet channel 11 and the water outlet channel 12, and the flowing process of the cooling medium flowing in the heat exchange cavity 10 is more disturbed, so that the flowing time of the cooling medium in the heat exchange cavity 10 is prolonged, and the cooling efficiency can be better improved.
Further, a diversion space 14 is formed between the upper side of the fin array and the upper side wall of the heat exchange cavity 10, one end of the diversion space 14 extends to the water inlet channel 11, and the height of the upper side wall of the heat exchange cavity 10 gradually decreases in a direction away from the water inlet channel 11, so that the diversion space 14 gradually contracts in a direction away from the water inlet channel 11. The above arrangement makes the space of the diversion space 14 larger at the position close to the water inlet channel 11, and gradually reduces as the space of the diversion space 14 extends into the heat exchange cavity 10. It should be noted that there are no heat dissipating fins in the diversion space 14. The purpose of the diversion space 14 is to avoid the situation that the backflow from the water inlet channel 11 is easy to occur due to the influence of the heat dissipation fins on the flow of the heat dissipation medium caused by the arrangement of the heat dissipation fins at the inlet of the water inlet channel 11, but the diversion space 14 can effectively avoid the backflow of the cooling medium from the water inlet channel 11.
Further, a drainage space 15 is formed between the lower side of the fin array and the lower side wall of the heat exchange cavity 10, one end of the drainage space 15 extends to the water outlet channel 12, and the lower side walls of the two heat exchangers 10 incline towards the water outlet channel 12 so that the drainage space 15 gradually increases towards the direction close to the water outlet channel 12. The position department of drainage space 15 also does not set up radiating fin, and the setting of above-mentioned structure can effectually guide fluid to flow from play water channel 12, can increase the play water area and reduce the normal that goes out the water reflux and guarantee to go out, cooperates needle tooth formula radiator structure simultaneously and makes rivers pressure drop obviously can satisfy bigger flow requirement.
Referring to fig. 3, in this embodiment, a rectangular hole is formed at an end of the water inlet channel 11 away from the heat exchange chamber 10, and a rectangular hole is formed at an end of the water outlet channel 12 away from the heat exchange chamber 10. The inlet and the outlet are both rectangular, so that the water flow vortex of the old traditional circular inlet or outlet can be effectively reduced, the formation of dead zones of water flow is avoided, and the smoothness of the water flow is ensured.
It should be noted that in this embodiment, the heat dissipation substrate 21 and the heat dissipation fins 22 are integrally formed, and both are made of aluminum, and the cooling housing 1 is made of aluminum alloy, so that the heat conduction efficiency can be improved and the cooling device is durable and stable.
As shown in fig. 5, another embodiment of the present invention further discloses a power semiconductor module, which includes the power semiconductor module cooling device 100, the semiconductor power assembly 200, and the copper-clad ceramic substrate 300, wherein the semiconductor power assembly 200 is fixed on the copper-clad ceramic substrate 300, and the copper-clad ceramic substrate 300 is attached to the front side heat dissipation plate 2 and/or the rear side heat dissipation plate 3. Wherein the copper-clad ceramic substrate 300 is a DBC copper-clad ceramic substrate. The above structure can effectively dissipate heat of the semiconductor power assembly 200.
While the foregoing is directed to embodiments of the present invention, other and further embodiments of the invention may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.
Claims (3)
1. A power semiconductor module cooling apparatus, comprising:
A cooling shell with a heat exchange cavity, a front side radiating plate and a rear side radiating plate which are arranged at the front side and the rear side of the cooling shell and form the side wall of the heat exchange cavity;
the cooling shell is also provided with a water inlet channel and a water outlet channel which are communicated with the heat exchange cavity;
The front side radiating plate and the cooling shell are welded integrally, and the rear side radiating plate and the cooling shell are welded integrally;
The integral welding is friction welding;
The water inlet channel, the heat exchange cavity and the water outlet channel form a circulation channel of cooling medium, and the cooling medium exchanges heat with the front side cooling plate and the rear side cooling plate in the heat exchange cavity in the circulation process in the circulation channel, so that heat on the front side cooling plate and the rear side cooling plate is conducted;
The front side radiating plate and the rear side radiating plate are provided with and fixed with semiconductor power components, and the semiconductor power components are attached to the front side radiating plate and/or the rear side radiating plate through copper-clad ceramic substrates, so that the heat dissipation of the semiconductor power components is realized;
the cooling shell comprises a body, a through hole penetrating the body along the front-back direction, a front opening arranged on the front side wall of the body and a rear opening arranged on the rear side wall of the body; the front side radiating plate is fixedly arranged on the body and used for covering the front side opening, and the rear side radiating plate is fixedly arranged on the body and used for covering the rear side opening;
In order to conveniently realize the installation and fixation of the body, the front side radiating plate and the rear side radiating plate, the body is also provided with a front side positioning groove for positioning the front side radiating plate and a rear side positioning groove for positioning the rear side radiating plate;
The front side cooling plate is positioned in the front side positioning groove and then is connected with the body through friction welding, and the front side positioning groove can play a role in avoiding when being positioned, so that the outer surface of the welded front side cooling plate does not exceed the front side surface of the body, and the outer surface of the welded rear side cooling plate does not exceed the rear side surface of the body;
the water inlet channel and the water outlet channel are oppositely arranged on two opposite sides of the heat exchange cavity in the horizontal direction, and the water inlet channel is arranged on the upper side of the water outlet channel in the vertical direction;
The front side radiating plate and the rear side radiating plate are respectively provided with a radiating substrate and radiating fins protruding into the heat exchange cavity from the radiating substrate, the radiating fins are provided with pin-tooth structures, and the radiating substrate is fixedly connected with the cooling shell; the radiating fins on the front radiating plate and the radiating fins on the rear radiating plate are arranged in a mutually crossing manner and form a fin array in the heat exchange cavity;
A diversion space is formed between the upper side of the fin array and the upper side wall of the heat exchange cavity, one end of the diversion space extends to the water inlet channel, and the height of the upper side wall of the heat exchange cavity is gradually reduced in the direction away from the water inlet channel so that the diversion space is gradually contracted in the direction away from the water inlet channel;
And a drainage space is formed between the lower side of the fin array and the lower side wall of the heat exchange cavity, one end of the drainage space extends to the water outlet channel, and the lower side wall of the heat exchange cavity inclines towards the direction of the water outlet channel so that the drainage space gradually increases towards the direction close to the water outlet channel.
2. The power semiconductor module cooling apparatus according to claim 1, wherein: the water inlet channel is provided with a rectangular hole at one end far away from the heat exchange cavity, and the water outlet channel is provided with a rectangular hole at one end far away from the heat exchange cavity.
3. A power semiconductor module, characterized by: a power semiconductor module cooling apparatus, a semiconductor power assembly, and a copper-clad ceramic substrate including the power semiconductor module cooling apparatus, the semiconductor power assembly being fixed to the copper-clad ceramic substrate, the copper-clad ceramic substrate being bonded to the front side heat dissipation plate and/or the rear side heat dissipation plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110353293.1A CN112951781B (en) | 2021-04-01 | 2021-04-01 | Power semiconductor module cooling device and power semiconductor module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110353293.1A CN112951781B (en) | 2021-04-01 | 2021-04-01 | Power semiconductor module cooling device and power semiconductor module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112951781A CN112951781A (en) | 2021-06-11 |
| CN112951781B true CN112951781B (en) | 2024-05-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110353293.1A Active CN112951781B (en) | 2021-04-01 | 2021-04-01 | Power semiconductor module cooling device and power semiconductor module |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103025134A (en) * | 2012-12-21 | 2013-04-03 | 中国北车集团大连机车研究所有限公司 | Double-wall efficient water-cooling base plate |
| CN108766946A (en) * | 2018-07-24 | 2018-11-06 | 苏州汇川联合动力系统有限公司 | Liquid-cooling heat radiator and electric machine controller |
| CN109979901A (en) * | 2017-12-28 | 2019-07-05 | 上海大郡动力控制技术有限公司 | Two-side water cooling device for power electronic semiconductor |
| CN110416172A (en) * | 2018-04-28 | 2019-11-05 | 深圳市智通电子有限公司 | Liquid-cooling heat radiator and its processing method |
| CN110610910A (en) * | 2019-09-16 | 2019-12-24 | 安徽祥博传热科技有限公司 | Turbulent flow type liquid cooling heat dissipation device and processing method thereof |
| CN111937141A (en) * | 2018-10-03 | 2020-11-13 | 富士电机株式会社 | Semiconductor device with a plurality of semiconductor chips |
-
2021
- 2021-04-01 CN CN202110353293.1A patent/CN112951781B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103025134A (en) * | 2012-12-21 | 2013-04-03 | 中国北车集团大连机车研究所有限公司 | Double-wall efficient water-cooling base plate |
| CN109979901A (en) * | 2017-12-28 | 2019-07-05 | 上海大郡动力控制技术有限公司 | Two-side water cooling device for power electronic semiconductor |
| CN110416172A (en) * | 2018-04-28 | 2019-11-05 | 深圳市智通电子有限公司 | Liquid-cooling heat radiator and its processing method |
| CN108766946A (en) * | 2018-07-24 | 2018-11-06 | 苏州汇川联合动力系统有限公司 | Liquid-cooling heat radiator and electric machine controller |
| CN111937141A (en) * | 2018-10-03 | 2020-11-13 | 富士电机株式会社 | Semiconductor device with a plurality of semiconductor chips |
| CN110610910A (en) * | 2019-09-16 | 2019-12-24 | 安徽祥博传热科技有限公司 | Turbulent flow type liquid cooling heat dissipation device and processing method thereof |
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| CN112951781A (en) | 2021-06-11 |
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