CN108184305B

CN108184305B - Liquid cooling heat exchange device with embedded runner of printed circuit board

Info

Publication number: CN108184305B
Application number: CN201711459277.0A
Authority: CN
Inventors: 徐道际; 张建波; 张成文; 邓书醒; 肖杰
Original assignee: Anhui Hongshi Optoelectronic High Tech Co ltd
Current assignee: Anhui Hongshi Optoelectronic High Tech Co ltd
Priority date: 2017-12-28
Filing date: 2017-12-28
Publication date: 2020-04-03
Anticipated expiration: 2037-12-28
Also published as: CN108184305A

Abstract

The invention discloses a liquid cooling heat exchange device with an embedded runner of a printed circuit board, which comprises a circuit board middle layer, wherein the upper side wall and the lower side wall of the circuit board middle layer are respectively provided with a circuit board upper layer and a circuit board lower layer, the outer walls of the circuit board middle layer, the circuit board upper layer and the circuit board lower layer are provided with polyethylene layers, the upper side wall of the circuit board upper layer is provided with a water inlet and a water outlet, the upper side wall of the circuit board upper layer is also provided with a welding port, a heating element is arranged in the welding port, the side walls of the two sides of the circuit board middle layer are respectively provided with a plurality of ventilation ports, and the cooling device comprises a. The liquid cooling heat exchange device is arranged in the printed circuit board, so that the problem that the working temperature of the device reduces the power additional efficiency of the device and even fails is solved, the normal work of the printed circuit board is ensured, and the liquid cooling heat exchange device is convenient, practical and high in popularization.

Description

Liquid cooling heat exchange device with embedded runner of printed circuit board

Technical Field

The invention relates to the technical field of printed circuit boards, in particular to a liquid cooling heat exchange device with a flow passage embedded in a printed circuit board.

Background

The printed circuit board, also called printed circuit board, is the provider of electrical connection of electronic components, its development has been over 100 years old, its design is mainly the territory design, the main advantage of adopting the circuit board is that it greatly reduces the mistake of wiring and assembly, has improved automation level and production labor rate.

The circuit board can be divided into a single-sided board, a double-sided board, a four-layer board, a six-layer board and other multi-layer circuit boards according to the number of the layers of the circuit board. Printed circuit boards have evolved from single-layer to double-sided, multi-layer and flex boards, and have continued to evolve toward high precision, high density and high reliability. The size is continuously reduced, the cost is reduced, and the performance is improved, so that the printed circuit board still keeps strong vitality in the development process of future electronic products.

Depending on mature and advanced integrated circuit technology, the high-power electronic components have higher and higher integration level and smaller sizes. However, the increase of the integration level of the device prevents the heat generated inside from being dissipated in time, which leads to a sudden increase of the local temperature of the chip and a sharp decrease of the working performance and the service life of the device. For example, if most of the monolithic integrated power amplifiers generate heat in a continuous wave working state, the heat flux density of the monolithic integrated power amplifiers reaches hundreds of watts per square centimeter, the eutectic soldering and sintering technology adopting direct heat conduction for heat exchange cannot meet the requirements, and the higher working temperature of the device can reduce the power additional efficiency of the device and even cause failure.

Disclosure of Invention

The invention aims to solve the problem that the higher working temperature of a device in the prior art causes the power additional efficiency of the device to be reduced and even causes failure, and provides a liquid cooling heat exchange device with a flow passage embedded in a printed circuit board.

In order to achieve the purpose, the invention adopts the following technical scheme:

the liquid cooling heat exchange device with the embedded runner of the printed circuit board comprises a circuit board middle layer, wherein the upper side wall and the lower side wall of the circuit board middle layer are respectively provided with a circuit board upper layer and a circuit board lower layer, the outer walls of the circuit board middle layer, the circuit board upper layer and the circuit board lower layer are provided with polyethylene layers, the upper side wall of the circuit board upper layer is provided with a water inlet and a water outlet, the upper side wall of the circuit board upper layer is also provided with a welding port, a heating element is arranged in the welding port, the side walls of the two sides of the circuit board middle layer are respectively provided with a plurality of ventilation ports, the cooling device is arranged and comprises a heat exchanger, a water inlet pipe, a water outlet pipe, a heat dissipation row and a cooling pipe, the heat exchanger and the heat dissipation row are both fixedly connected with the upper side wall, the through hole is matched with the water inlet pipe and the water outlet pipe in size, the cooling pipe is composed of multiple sections of continuous heat absorbing pipes, two ends of the cooling pipe are respectively connected with one ends of the water inlet pipe and the water outlet pipe away from the heat exchanger, the cooling pipe is positioned under the heating element, U-shaped fixing clamps are inserted on the water inlet pipe, the water outlet pipe and the cooling pipe, the size of the notch of each U-shaped fixing clamp is matched with the diameter of the water inlet pipe, the water outlet pipe and the cooling pipe, the middle layer of the circuit board and the lower layer of the circuit board are respectively provided with a socket with a matched size and position, bayonets are respectively arranged on the inner walls at two sides of the socket on the lower layer of the circuit board, the lower ends of two protruding ends of each U-shaped fixing clamp are respectively provided with a fixed block with a matched size with the socket, the side walls at two sides of, every the spacing inslot all is equipped with two loop bars, every all be equipped with the elastic rod in the fixed slot, every the one end that the fixed slot was kept away from to the elastic rod is equipped with the arc head, every all be connected with the slide on the one end both sides lateral wall that the elastic rod is located the fixed slot, every the slide all overlaps establish on two loop bars and with loop bar sliding connection.

Preferably, the outer wall of the heating element is provided with a vertical outward flange, and the flange is positioned between the lower side wall of the upper layer of the circuit board and the upper side wall of the middle layer of the circuit board.

Preferably, the inner walls of the water inlet and the water outlet are provided with sealing elements.

Preferably, the water inlet pipe and the water outlet pipe are respectively connected with a first communicating pipe and a second communicating pipe, and two ends of the first communicating pipe and the second communicating pipe are respectively communicated with the water inlet and the water outlet and the interior of the water inlet pipe and the interior of the water outlet pipe.

Preferably, an upward protrusion is arranged on the inner wall of the lower side of each heat absorption pipe, and a plurality of blocking teeth are arranged on one side of each protrusion, which is close to the inside of each heat absorption pipe.

Preferably, a flow channel matched with the water inlet pipe, the water outlet pipe and the cooling pipe is formed in the middle layer of the circuit board, and the water inlet pipe, the water outlet pipe and the cooling pipe are installed in the flow channel.

Preferably, a plurality of heat dissipation ports are formed in the lower layer of the circuit board.

Preferably, the circuit board, the upper layer of the circuit board and the lower layer of the circuit board are connected through an adhesive.

In the invention, the water inlet pipe and the water outlet pipe are laid in a flow channel together with the cooling pipe after penetrating through the heat dissipation row, the U-shaped fixing clamp is arranged on the water inlet pipe, the water outlet pipe and the cooling pipe, the fixing block is inserted into the socket, the elastic rod slides on the loop bar through the sliding plate and is clamped in the socket to fix the fixing clamp, so that the water inlet pipe, the water outlet pipe and the cooling pipe are clamped, the middle layer of the circuit board, the upper layer of the circuit board and the lower layer of the circuit board are bonded together through the adhesive to finish fixing, water flow is injected through the water inlet, then the water inlet and the water outlet are sealed through the sealing element, the water flow flows in the water inlet pipe, the water outlet pipe and the cooling pipe, and because the specific heat capacity of water is overlarge, a large amount of heat can be absorbed to keep the temperature from changing obviously, the temperature of the heating element is, the surface area of the heat exchanger is large, the ventilation opening and the communication between the ventilation opening and the outside are combined, and meanwhile, the heat dissipation row absorbs partial heat of water in the water inlet pipe and the water outlet pipe and blows out the water through air flow, so that the heat dissipation efficiency is optimal. The liquid cooling heat exchange device is arranged in the printed circuit board, so that the problem that the working temperature of the device reduces the power additional efficiency of the device and even fails is solved, the normal work of the printed circuit board is ensured, and the liquid cooling heat exchange device is convenient, practical and high in popularization.

Drawings

Fig. 1 is a schematic structural diagram of a main view of a liquid-cooled heat exchange device with a flow channel embedded in a printed circuit board according to the present invention;

FIG. 2 is a schematic structural diagram of a middle layer of a printed circuit board embedded with a runner liquid-cooled heat exchange device circuit board according to the present invention;

FIG. 3 is a schematic structural diagram of a side view of a cooling tube of a liquid-cooled heat exchange device with a flow channel embedded in a printed circuit board according to the present invention;

FIG. 4 is a schematic view of a lower layer of a circuit board of the embedded channel liquid-cooled heat exchange device of the printed circuit board according to the present invention;

FIG. 5 is a schematic structural diagram of a side view of a fixing clip of a liquid-cooled heat exchange device with an embedded runner of a printed circuit board according to the present invention;

FIG. 6 is an enlarged schematic structural view of a part A of the liquid-cooled heat exchange device with a flow channel embedded in a printed circuit board according to the present invention;

fig. 7 is a schematic structural diagram of a heating element of the liquid-cooled heat exchange device with a flow channel embedded in a printed circuit board according to the invention.

In the figure: the heat exchanger comprises a circuit board middle layer 1, a circuit board upper layer 2, a circuit board lower layer 3, a polyethylene layer 4, a water inlet 5, a water outlet 6, a welding port 7, a heating element 8, a ventilation opening 9, a heat exchanger 10, a notch 11, a first communicating pipe 12, a second communicating pipe 13, a water inlet pipe 14, a water outlet pipe 15, a heat dissipation row 16, a cooling pipe 17, a U-shaped fixing clamp 18, a protrusion 19, a blocking tooth 20, a bonding agent 21, a heat dissipation port 22, a socket 23, a limiting groove 24, a fixing block 25, a fixing groove 26, an elastic rod 27, a loop rod 28, a sliding plate 29 and a flanging 30.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.

A liquid cooling heat exchange device with a flow passage embedded in a printed circuit board comprises a circuit board middle layer 1, wherein the upper side wall and the lower side wall of the circuit board middle layer 1 are respectively provided with a circuit board upper layer 2 and a circuit board lower layer 3, the circuit board 1, the circuit board upper layer 2 and the circuit board lower layer 3 are connected through an adhesive 21 and are fixed through the adhesive 21, the operation is simple and convenient, the fixity is good, polyethylene layers 4 are arranged on the outer walls of the circuit board middle layer 1, the circuit board upper layer 2 and the circuit board lower layer 3, the outer wall of the printed circuit board is protected through the polyethylene layers, the influence of external vibration or impact on the printed circuit board is reduced, a water inlet 5 and a water outlet 6 are formed in the upper side wall of the circuit board upper layer 2, sealing elements are arranged on the inner walls of the water inlet 5 and the water outlet 6, the upper side wall of the upper layer 2 of the circuit board is also provided with a welding port 7, a heating element 8 is arranged in the welding port 7, the outer wall of the heating element 8 is provided with a vertical outward flange 30, the flange 30 is positioned between the lower side wall of the upper layer 2 of the circuit board and the upper side wall of the middle layer 1 of the circuit board, the side wall of the heating element 8 is provided with the flange 30 for welding, the condition that soldering tin flows into the printed circuit board through the inner walls of the heating element 8 and the welding port 7 during welding is avoided, the condition that the soldering tin blocks the inside of the printed circuit board is reduced, the applicability is wider, the side walls on the two sides of the middle layer 1 of the circuit board are respectively provided with a plurality of ventilation openings 9, a cooling device is arranged, the cooling device comprises a heat exchanger 10, a water inlet pipe 14, a water outlet pipe 15, a heat dissipation row 16 and a cooling pipe 17, the heat exchanger 10 and the heat dissipation row 16 are both fixedly, the water inlet pipe 14 and the water outlet pipe 15 are respectively connected with a first communicating pipe 12 and a second communicating pipe 13, two ends of the first communicating pipe 12 and the second communicating pipe 13 are respectively communicated with the water inlet 5 and the water outlet 6, the water inlet pipe 14 and the water outlet pipe 15, the heat dissipation row 16 is provided with a through hole, the through hole is matched with the sizes of the water inlet pipe 14 and the water outlet pipe 15, the cooling pipe 17 is composed of multiple sections and continuous heat absorption pipes, the multiple sections can continuously obtain better heat absorption efficiency of the heat absorption pipes, the circuit board middle layer 1 is provided with a flow passage matched with the water inlet pipe 14, the water outlet pipe 15 and the cooling pipe 17, the water inlet pipe 14, the water outlet pipe 15 and the cooling pipe 17 are arranged in the flow passage, the lower inner wall of each heat absorption pipe is provided with an upward bulge 19, one side of each bulge 19, which is close to the inside of, the heat of the heating element 8 can be effectively absorbed, two ends of the cooling pipe 17 are respectively connected with one ends of the water inlet pipe 14 and the water outlet pipe 15, which are far away from the heat exchanger 10, the cooling pipe 17 is positioned under the heating element 8, the U-shaped fixing clamps 18 are respectively inserted on the water inlet pipe 14, the water outlet pipe 15 and the cooling pipe 17, the size of the notch 11 of each U-shaped fixing clamp 18 is matched with the diameters of the water inlet pipe 14, the water outlet pipe 15 and the cooling pipe 17, a plurality of heat dissipation ports 22 are arranged on the lower layer 3 of the circuit board, water flow is injected through the water inlet 5, then the water inlet 5 and the water outlet 6 are sealed through the sealing element, the water flow flows in the water inlet pipe 14, the water outlet pipe 15 and the cooling pipe 16, due to the specific heat capacity of water, a large amount of heat can be absorbed by overlarge capacity, the temperature of the heating element 8 can be well controlled, and sudden, because the surface area of the heat exchanger 10 is very large, the ventilation opening 9 and the ventilation opening 22 are combined to be communicated with the outside, meanwhile, the heat dissipation row 16 absorbs partial heat of water in the water inlet pipe 14 and the water outlet pipe 15, the heat dissipation efficiency is optimal through blowing out air flow, the middle layer 1 of the circuit board and the lower layer 3 of the circuit board are both provided with the sockets 23 with matched sizes and positions, the inner walls of the two sides of the socket 23 on the lower layer 3 of the circuit board are both provided with bayonets, the lower ends of the two protruding ends of each U-shaped fixing clamp 18 are both provided with the fixing blocks 25 with matched sizes with the sockets 23, the side walls of the two sides of each fixing block 25 are both provided with the fixing grooves 26, the inner walls of the two sides of each fixing groove 26 are both provided with limiting grooves, two loop bars 28 are arranged in each limiting groove, each fixing groove 26, every elastic rod 27 all is connected with slide 29 on the one end both sides lateral wall that is located fixed slot 26, every slide 29 all overlaps and establishes on two loop bars 28 and with loop bar 28 sliding connection, install U type fixation clamp 18 on inlet tube 14, outlet pipe 15 and cooling tube 17, fixed block 25 inserts in socket 23, elastic rod 27 passes through slide 29 and slides on loop bar 28, elastic rod 27 card carries out fixation of fixation clamp 18 in socket 23, thereby press from both sides tight inlet tube 14, outlet pipe 15 and cooling tube 17, can accomplish inlet tube 14, outlet pipe 15 and cooling tube 17's the work of laying.

In the invention, the water inlet pipe 14 and the water outlet pipe 15 pass through the heat dissipation row 16 and then are laid in a flow channel together with the cooling pipe 17, the U-shaped fixing clamp 18 is arranged on the water inlet pipe 14, the water outlet pipe 15 and the cooling pipe 17, the fixing block 25 is inserted into the socket 23, the elastic rod 27 slides on the loop bar 28 through the sliding plate 29, the elastic rod 27 is clamped in the socket 23 to fix the fixing clamp 18, thereby clamping the water inlet pipe 14, the water outlet pipe 15 and the cooling pipe 17, then the circuit board middle layer 1, the circuit board upper layer 2 and the circuit board lower layer 3 are bonded together through the adhesive 21 to finish the fixation, water flow is injected through the water inlet 5, then the water inlet 5 and the water outlet 6 are sealed through the sealing element, the water flow flows through the water inlet pipe 14, the water outlet pipe 15 and the cooling pipe 17, and because of the specific heat capacity of water, a large, the temperature of the heating element 8 can be well controlled, sudden operation can not cause instantaneous and large change of the internal temperature of the heating element 8, and the heat dissipation efficiency is optimal because the surface area of the heat exchanger 10 is large and the heat dissipation row 16 absorbs partial heat of water in the water inlet pipe 14 and the water outlet pipe 15 by combining the communication between the ventilation opening 9 and the ventilation opening 22 and the outside and blows out the water through wind current.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.

Claims

1. Embedded runner liquid cooling heat transfer device of printed circuit board, including circuit board middle level (1), its characterized in that, the upper and lower lateral wall in circuit board middle level (1) is equipped with circuit board upper strata (2) and circuit board lower floor (3) respectively, be equipped with polyethylene layer (4) on the outer wall of circuit board middle level (1), circuit board upper strata (2) and circuit board lower floor (3), water inlet (5) and delivery port (6) have been seted up to the last lateral wall on circuit board upper strata (2), welding mouth (7) have still been seted up to the last lateral wall on circuit board upper strata (2), be equipped with heating element (8) in welding mouth (7), a plurality of vents (9) have all been seted up on the both sides lateral wall in circuit board middle level (1), circuit board middle level (1) is embedded to have cooling device, cooling device includes heat exchanger (10), inlet tube (, The heat-radiating type LED lamp is characterized by comprising a water outlet pipe (15), a heat-radiating row (16) and a cooling pipe (17), wherein the heat exchanger (10) and the heat-radiating row (16) are fixedly connected with the upper side wall of a middle layer (1) of the circuit board, the water inlet pipe (14) and the water outlet pipe (15) are respectively positioned at two sides of the heat exchanger (10) and communicated with the inside of the heat exchanger (10), a through hole is formed in the heat-radiating row (16), the through hole is matched with the sizes of the water inlet pipe (14) and the water outlet pipe (15), the cooling pipe (17) is provided with a plurality of sections of continuous heat-absorbing pipes, two ends of the cooling pipe (17) are respectively connected with one ends, far away from the heat exchanger (10), of the water inlet pipe (14) and the water outlet pipe (15), the cooling pipe (17) is positioned under a heating element (8), and U-shaped fixing clamps (18), each U-shaped fixing clamp (18) notch (11) is matched with the diameter of a water inlet pipe (14), a water outlet pipe (15) and a cooling pipe (17) in size, sockets (23) matched with the size and the position are formed in the circuit board middle layer (1) and the circuit board lower layer (3), bayonets are formed in the inner walls of the two sides of each socket (23) on the circuit board lower layer (3), fixing blocks (25) matched with the sizes of the sockets (23) are arranged at the lower ends of the two protruding ends of each U-shaped fixing clamp (18), fixing grooves (26) are formed in the side walls of the two sides of each fixing block (25), limiting grooves are formed in the inner walls of the two sides of each fixing groove (26), two loop bars (28) are arranged in each limiting groove, each elastic bar (27) is arranged in each fixing groove (26), and an arc-shaped head is arranged at one end, far away from the fixing groove (26), of each elastic bar (27), each elastic rod (27) is located and all is connected with slide plate (29) on the one end both sides lateral wall in fixed slot (26), every slide plate (29) all overlap and establish on two loop bars (28) and with loop bar (28) sliding connection.

2. The embedded runner liquid cooling heat transfer device of claim 1, wherein the outer wall of the heating element (8) is provided with a vertical outward flange (30), and the flange (30) is located between the lower side wall of the upper layer (2) of the circuit board and the upper side wall of the middle layer (1) of the circuit board.

3. The embedded runner liquid cooling heat exchange device of the printed circuit board as claimed in claim 1, wherein the inner walls of the water inlet (5) and the water outlet (6) are provided with sealing elements.

4. The liquid-cooled heat exchange device with the embedded runner of the printed circuit board as claimed in claim 1, wherein the water inlet pipe (14) and the water outlet pipe (15) are respectively connected with a first communicating pipe (12) and a second communicating pipe (13), and two ends of the first communicating pipe (12) and the second communicating pipe (13) are respectively communicated with the water inlet (5) and the water outlet (6), and the water inlet pipe (14) and the water outlet pipe (15).

5. The embedded runner liquid-cooled heat exchange device of claim 1, wherein each heat absorbing pipe has an upward protrusion (19) on its lower inner wall, and a plurality of blocking teeth (20) are provided on the side of each protrusion (19) close to the inside of the heat absorbing pipe.

6. The liquid-cooled heat exchange device with the embedded runner of the printed circuit board as claimed in claim 1, wherein the middle layer (1) of the circuit board is provided with runners matching with the water inlet pipe (14), the water outlet pipe (15) and the cooling pipe (17), and the water inlet pipe (14), the water outlet pipe (15) and the cooling pipe (17) are installed in the runners.

7. The liquid-cooled heat exchange device with embedded runners of printed circuit board as claimed in claim 1, wherein said lower circuit board layer (3) has a plurality of heat dissipating ports (22) formed thereon.

8. The embedded runner liquid cooling heat transfer device of claim 1, characterized in that the circuit board (1), the circuit board upper layer (2) and the circuit board lower layer (3) are connected by an adhesive (21).