CN108184305A - Printed circuit board embeds runner liquid cooling heat-exchanger - Google Patents
Printed circuit board embeds runner liquid cooling heat-exchanger Download PDFInfo
- Publication number
- CN108184305A CN108184305A CN201711459277.0A CN201711459277A CN108184305A CN 108184305 A CN108184305 A CN 108184305A CN 201711459277 A CN201711459277 A CN 201711459277A CN 108184305 A CN108184305 A CN 108184305A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- water inlet
- exchanger
- heat
- middle level
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/064—Fluid cooling, e.g. by integral pipes
Abstract
The invention discloses printed circuit boards to embed runner liquid cooling heat-exchanger, including circuit board middle level, the top and bottom sidewall in the circuit board middle level is respectively equipped with circuit board upper strata and circuit board lower floor, the circuit board middle level, the outer wall of circuit board upper strata and circuit board lower floor is equipped with polyethylene layer, the upper side wall on the circuit board upper strata offers inlet and outlet, the upper side wall on the circuit board upper strata is further opened with soldering opening, heater element is equipped in the soldering opening, multiple ventilation openings are offered on the both sides side wall in the circuit board middle level, it is described to be equipped with cooling device, the cooling device includes heat exchanger, water inlet pipe, outlet pipe, heat dissipation row and cooling tube.The present invention is by setting liquid cooling heat-exchanger in printed circuit board, avoiding the problem of power added efficiency for causing device is declined or even failed by device operating temperature, ensure that the normal work of printed circuit board, convenient and practical, generalization is high.
Description
Technical field
The present invention relates to printed circuit board technology fields more particularly to printed circuit board to embed runner liquid cooling heat-exchanger.
Background technology
Printed circuit board, also known as printed circuit board, are the suppliers of electronic component electrical connection, its development has
The history of more than 100 years, its design are mainly layout design, and the major advantage using circuit board is to greatly reduce wiring and dress
The mistake matched improves the gentle productive labor rate of Automated water.
It can be divided into single sided board, dual platen, four laminates, six laminates and other multilayer circuit boards according to the wiring board number of plies.Print
Circuit board processed develops to dual platen, multi-layer board and flex plate from individual layer, and constantly to high-precision, high density and high reliability side
To development.Volume is constantly reduced, cost is reduced, improves performance so that printed circuit board is in the evolution of future electronic product
In, still maintain powerful vitality.
By ripe advanced integrated circuit technology, high-power electronic component integrated level is higher and higher, and size is increasingly
It is small.However, the raising of device integration is so that the internal heat generated can not scatter away in time, so as to cause chip local temperature hurricane
It rises, device working performance and service life drastically decline.Such as if current most of monolithic integrated power amplifiers are in continuous wave
It generates heat under working condition, heat flow density will reach hundreds of watts of every square centimeter, the eutectic welderings to exchange heat using direct heat exchange pattern
Sintering technology cannot be met the requirements, and higher device operating temperature declines the power added efficiency for causing device even to go out
Now fail.
Invention content
It is the purpose of the present invention is to solve device operating temperature higher in the prior art that the power for causing device is attached
Efficiency is added to decline the problem of even failing, and the printed circuit board proposed embeds runner liquid cooling heat-exchanger.
To achieve these goals, present invention employs following technical solutions：
Printed circuit board embeds runner liquid cooling heat-exchanger, including circuit board middle level, the top and bottom sidewall point in the circuit board middle level
Not She You circuit board upper strata and circuit board lower floor, set on the outer wall in the circuit board middle level, circuit board upper strata and circuit board lower floor
There is polyethylene layer, the upper side wall on the circuit board upper strata offers inlet and outlet, the upper side wall on the circuit board upper strata
Soldering opening is further opened with, heater element is equipped in the soldering opening, is offered on the both sides side wall in the circuit board middle level more
A ventilation opening, described to be equipped with cooling device, the cooling device includes heat exchanger, water inlet pipe, outlet pipe, heat dissipation row and cooling
Pipe, the upper side wall of the heat exchanger and heat dissipation row with circuit board middle level are fixedly connected, and the water inlet pipe distinguishes position with outlet pipe
It is connected in the both sides of heat exchanger and with the inside of heat exchanger, port, the port and water inlet pipe is offered on the heat dissipation row
Match with the size of outlet pipe, the cooling tube is made of multistage and continuous endothermic tube, the both ends difference of the cooling tube
It is connect with the one end of water inlet pipe and outlet pipe far from heat exchanger, the cooling tube is located at the underface of heater element, the water inlet
U-shaped geometrical clamp is inserted on pipe, outlet pipe and cooling tube, size and water inlet pipe, the water outlet of each U-shaped geometrical clamp recess
The diameter of pipe and cooling tube matches, and offering size position on the circuit board middle level and circuit board lower floor matches
Socket, offer bayonet on the both sides inner wall of the socket in circuit board lower floor, each U-shaped geometrical clamp
The lower end of two jags is equipped with the fixed block to match with socket size, is opened on the both sides side wall of each fixed block
Equipped with fixing groove, limiting slot is equipped on the both sides inner wall of each fixing groove, be all provided in each limiting slot there are two
Loop bar is each equipped with elastic rod in the fixing groove, and each one end of the elastic rod far from fixing groove is equipped with arc head, often
A elastic rod, which is located on one end both sides side wall in fixing groove, is respectively connected with slide plate, and each slide plate is set in two
It is slidably connected on loop bar and with loop bar.
Preferably, the outer wall of the heater element is equipped with vertical outside flange, and the flange is located at circuit board upper strata
Lower wall and circuit board middle level upper side wall between.
Preferably, it is equipped with sealing element on the inner wall of the inlet and outlet.
Preferably, it is connected separately with the first communicating pipe and the second communicating pipe on the water inlet pipe and outlet pipe, described first
Inside of the both ends of communicating pipe and the second communicating pipe respectively with inlet and outlet, water inlet pipe and outlet pipe connects.
Preferably, upward protrusion is equipped on the downside inner wall of each endothermic tube, each protrusion is close to suction
The side of inside heat pipe is equipped with multiple obstruction teeth.
Preferably, the runner to match with water inlet pipe, outlet pipe and cooling tube is offered on the circuit board middle level, it is described
Water inlet pipe, outlet pipe and cooling tube are mounted in runner.
Preferably, multiple thermovents are offered in the circuit board lower floor.
Preferably, it is attached between the circuit board, circuit board upper strata and circuit board lower floor by bonding agent.
In the present invention, it is laid in runner together with cooling tube after water inlet pipe, outlet pipe are arranged across heat dissipation, it will be U-shaped solid
Clamp is mounted on water inlet pipe, outlet pipe and cooling tube, and fixed block is inserted into socket, and elastic rod is sliding on loop bar by slide plate
Dynamic, elastic rod is stuck in the fixation that folder is fixed in socket, so as to be clamped to water inlet pipe, outlet pipe and cooling tube, then will
Circuit board middle level, circuit board upper strata and circuit board lower floor are bonded together by bonding agent, are completed to fix, are passed through water inlet
Flow is injected, is later sealed inlet and outlet by sealing element, flow is in water inlet pipe, outlet pipe and cooling
Pipe is flowed, interior due to the specific heat capacity super large of water, can absorb a large amount of heat and temperature is kept significantly not become
Change, the temperature of heater element can good control, the operation of burst will not all cause heater element internal temperature moment substantially
The variation of degree since the surface area of heat exchanger is very big, and combines ventilation opening and ventilation opening and external connection, while row of radiating will
The partial heat of the water of water inlet pipe and outlet pipe absorbs, and by distinguished and admirable blowout, radiating efficiency is made to reach best.It is right that the present invention passes through
Setting liquid cooling heat-exchanger in printed circuit board avoids device operating temperature and declines the power added efficiency for causing device very
To the problem of failure, ensure that the normal work of printed circuit board, convenient and practical, generalization is high.
Description of the drawings
Fig. 1 is the structure diagram that printed circuit board proposed by the present invention embeds runner liquid cooling heat-exchanger main view；
Fig. 2 is the structural representation that printed circuit board proposed by the present invention embeds runner liquid cooling heat-exchanger circuit board middle level vertical view
Figure；
Fig. 3 is the structure diagram that printed circuit board proposed by the present invention embeds runner liquid cooling heat-exchanger cooling tube side view；
Fig. 4 is the circuit board lower floor plan structure signal that printed circuit board proposed by the present invention embeds runner liquid cooling heat-exchanger
Figure；
Fig. 5 is the structure diagram that printed circuit board proposed by the present invention embeds runner liquid cooling heat-exchanger geometrical clamp side view；
Fig. 6 is the structure diagram that printed circuit board proposed by the present invention embeds the amplification of runner liquid cooling heat-exchanger part A；
Fig. 7 is the structure diagram that printed circuit board proposed by the present invention embeds runner liquid cooling heat-exchanger heater element vertical view.
In figure：1 circuit board middle level, 2 circuit board upper stratas, 3 circuit board lower floors, 4 polyethylene layers, 5 water inlets, 6 water outlets, 7
Soldering opening, 8 heater elements, 9 ventilation openings, 10 heat exchangers, 11 recesses, 12 first communicating pipes, 13 second communicating pipes, 14 water inlet pipes,
15 outlet pipes, 16 heat dissipation rows, 17 cooling tubes, 18 U-shaped geometrical clamps, 19 protrusions, 20 hinder tooth, 21 bonding agents, 22 thermovents, 23
Socket, 24 limiting slots, 25 fixed blocks, 26 fixing grooves, 27 elastic rods, 28 loop bars, 29 slide plates, 30 flange.
Specific embodiment
Below in conjunction with the attached drawing in the embodiment of the present invention, the technical solution in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, instead of all the embodiments.
In the description of the present invention, it is to be understood that term " on ", " under ", "front", "rear", "left", "right", " top ",
The orientation or position relationship of the instructions such as " bottom ", " interior ", " outer " are based on orientation shown in the drawings or position relationship, merely to just
In the description present invention and simplify description rather than instruction or imply signified device or element must have specific orientation, with
Specific azimuth configuration and operation, therefore be not considered as limiting the invention.
Printed circuit board embeds runner liquid cooling heat-exchanger, including circuit board middle level 1, the top and bottom sidewall in circuit board middle level 1
Circuit board upper strata 2 and circuit board lower floor 3 are respectively equipped with, passes through bonding between circuit board 1, circuit board upper strata 2 and circuit board lower floor 3
Agent 21 is attached, and is fixed by bonding agent 21, easy to operate, and stationarity is good, circuit board middle level 1, circuit board upper strata 2 and circuit
The outer wall of plate lower floor 3 is equipped with polyethylene layer 4, and the outer wall of printed circuit board is protected by polyethylene layer, reduces outer
Influence of the vibrations or shock in portion to printed circuit board, the upper side wall on circuit board upper strata 2 offer water inlet 5 and water outlet 6, into
It is equipped with sealing element on the inner wall of the mouth of a river 5 and water outlet 6, sealing element ensure that after water filling or water inlet 5 and go out after draining
The leakproofness at the mouth of a river 6, avoids the situation of water leakage, and the upper side wall on circuit board upper strata 2 is further opened with soldering opening 7, in soldering opening 7
Equipped with heater element 8, the outer wall of heater element 8 is equipped with vertical outside flange 30, and flange 30 is located under circuit board upper strata 2
Between side wall and the upper side wall in circuit board middle level 1, by flange 30 being set to be welded again on the side wall of heater element 8, keep away
Scolding tin flows to the inside of printed circuit board by the inner wall of heater element 8 and soldering opening 7 when having exempted from welding, reduces scolding tin blocking
The situation of printed circuit intralamellar part, applicability is wider, and multiple ventilation openings 9 are offered on the both sides side wall in circuit board middle level 1, if
There is cooling device, cooling device includes heat exchanger 10, water inlet pipe 14, outlet pipe 15, heat dissipation row 16 and cooling tube 17, heat exchanger 10
It is fixedly connected with heat dissipation 16 upper side wall with circuit board middle level 1 of row, water inlet pipe 14 is located at heat exchanger 10 respectively with outlet pipe 15
Both sides and connected with the inside of heat exchanger 10, be connected separately with for the first communicating pipe 12 and second on water inlet pipe 14 and outlet pipe 15
The both ends of communicating pipe 13, the first communicating pipe 12 and the second communicating pipe 13 are respectively with water inlet 5 and water outlet 6, water inlet pipe 14 and going out
The inside of water pipe 15 connects, and port is offered on heat dissipation row 16, and the size of port and water inlet pipe 14 and outlet pipe 15 matches,
Cooling tube 17 is made of multistage and continuous endothermic tube, and it is more preferable that multistage is continuously available endothermic tube heat absorption efficiency, on circuit board middle level 1
The runner to match with water inlet pipe 14, outlet pipe 15 and cooling tube 17 is offered, water inlet pipe 14, outlet pipe 15 and cooling tube 17 are pacified
In runner, upward protrusion 19 is equipped on the downside inner wall of each endothermic tube, each protrusion 19 is inside endothermic tube
Side be equipped with it is multiple obstruction teeth 20, by protrusion and hinder tooth 20 reduce flow flow to rate in cooling tube 17, just
In the heat for effectively absorbing heater element 8, the both ends of cooling tube 17 are respectively with water inlet pipe 14 and outlet pipe 15 far from heat exchanger 10
One end connection, cooling tube 17 is located at the underface of heater element 8, plugged on water inlet pipe 14, outlet pipe 15 and cooling tube 17
There is U-shaped geometrical clamp 18, the size of each U-shaped 18 recess 11 of geometrical clamp and the diameter of water inlet pipe 14, outlet pipe 15 and cooling tube 17
Size matches, and multiple thermovents 22 are offered in circuit board lower floor 3, are injected flow by water inlet 5, pass through sealing later
Water inlet 5 and water outlet 6 are sealed by element, flow water inlet pipe 14, outlet pipe 15 and cooling 16 pipes flowed, it is interior by
In the specific heat capacity super large of water, therefore a large amount of heat can be absorbed and temperature is kept significantly not change, the temperature of heater element 8
Degree can good control, the operation of burst will not all cause 8 internal temperature moment of heater element significantly to change, due to changing
The surface area of hot device 10 is very big, and combines ventilation opening 9 and ventilation opening 22 and external connection, while radiates and arrange 16 by water inlet pipe 14
It is absorbed with the partial heat of the water of outlet pipe 15, by distinguished and admirable blowout, radiating efficiency is made to reach best, circuit board middle level 1 and electricity
The socket 23 that size position matches, the both sides inner wall of the socket 23 in circuit board lower floor 3 are offered in road plate lower floor 3
On offer bayonet, the lower end of two jags of each U-shaped geometrical clamp 18 is equipped with to be consolidated with what 23 size of socket matched
Determine block 25, fixing groove 26 is offered on the both sides side wall of each fixed block 25, is all provided on the both sides inner wall of each fixing groove 26
There is limiting slot, be all provided in each limiting slot there are two loop bar 28, elastic rod 27, each elastic rod are equipped in each fixing groove 26
27 one end far from fixing groove 26 are equipped with arc head, and each elastic rod 27 is located on one end both sides side wall in fixing groove 26 and connects
Slide plate 29 is connected to, each slide plate 29 is set on two loop bars 28 and is slidably connected with loop bar 28, U-shaped geometrical clamp 18 is installed
On water inlet pipe 14, outlet pipe 15 and cooling tube 17, fixed block 25 is inserted into socket 23, and elastic rod 27 is by slide plate 29 in loop bar
It is slided on 28, elastic rod 27 is stuck in the fixation that folder 18 is fixed in socket 23, so as to water inlet pipe 14, outlet pipe 15 and cooling
Pipe 17 is clamped, you can completes the laying work of water inlet pipe 14, outlet pipe 15 and cooling tube 17.
In the present invention, it is laid in runner together with cooling tube 17 after water inlet pipe 14, outlet pipe 15 are arranged 16 across heat dissipation,
U-shaped geometrical clamp 18 is mounted on water inlet pipe 14, outlet pipe 15 and cooling tube 17, fixed block 25 is inserted into socket 23, elastic rod
27 are slided by slide plate 29 on loop bar 28, and elastic rod 27 is stuck in the fixation that folder 18 is fixed in socket 23, so as to water inlet
Pipe 14, outlet pipe 15 and cooling tube 17 are clamped, then circuit board middle level 1, circuit board upper strata 2 and circuit board lower floor 3 are passed through
Bonding agent 21 bonds together, and completes to fix, is injected flow by water inlet 5, will be intake by sealing element later
Mouth 5 and water outlet 6 are sealed, and flow is flowed in water inlet pipe 14, outlet pipe 15 and cooling tube 17, interior due to the specific heat of water
Hold super large, therefore a large amount of heat can be absorbed and temperature is kept significantly not change, the temperature of heater element 8 can it is good
Control, the operation of burst will not all cause 8 internal temperature moment of heater element significantly to change, due to the table of heat exchanger 10
Area is very big, and combines ventilation opening 9 and ventilation opening 22 and external connection, while radiates and arrange 16 by water inlet pipe 14 and outlet pipe 15
Water partial heat absorb, by distinguished and admirable blowout, radiating efficiency is made to reach best.
The foregoing is only a preferred embodiment of the present invention, but protection scope of the present invention be not limited thereto,
Any one skilled in the art in the technical scope disclosed by the present invention, according to the technique and scheme of the present invention and its
Inventive concept is subject to equivalent substitution or change, should be covered by the protection scope of the present invention.
Claims (8)
1. printed circuit board embeds runner liquid cooling heat-exchanger, including circuit board middle level（1）, which is characterized in that the circuit board
Middle level（1）Top and bottom sidewall be respectively equipped with circuit board upper strata（2）With circuit board lower floor（3）, the circuit board middle level（1）, circuit
Plate upper strata（2）With circuit board lower floor（3）Outer wall be equipped with polyethylene layer（4）, the circuit board upper strata（2）Upper side wall open up
There is water inlet（5）And water outlet（6）, the circuit board upper strata（2）Upper side wall be further opened with soldering opening（7）, the soldering opening
（7）It is interior to be equipped with heater element（8）, the circuit board middle level（1）Both sides side wall on offer multiple ventilation openings（9）, it is described
Equipped with cooling device, the cooling device includes heat exchanger（10）, water inlet pipe（14）, outlet pipe（15）, heat dissipation row（16）With it is cold
But it manages（17）, the heat exchanger（10）It is arranged with heat dissipation（16）With circuit board middle level（1）Upper side wall be fixedly connected, the water inlet
Pipe（14）With outlet pipe（15）It is located at heat exchanger respectively（10）Both sides and and heat exchanger（10）Inside connection, it is described heat dissipation row
（16）On offer port, the port and water inlet pipe（14）And outlet pipe（15）Size match, the cooling tube
（17）It is made of multistage and continuous endothermic tube, the cooling tube（17）Both ends respectively with water inlet pipe（14）And outlet pipe（15）
Far from heat exchanger（10）One end connection, the cooling tube（17）Positioned at heater element（8）Underface, the water inlet pipe
（14）, outlet pipe（15）And cooling tube（17）On be inserted with U-shaped geometrical clamp（18）, each U-shaped geometrical clamp（18）Recess
（11）Size and water inlet pipe（14）, outlet pipe（15）And cooling tube（17）Diameter match, the circuit board middle level
（1）With circuit board lower floor（3）On offer the socket that size position matches（23）, positioned at circuit board lower floor（3）On institute
State socket（23）Both sides inner wall on offer bayonet, each U-shaped geometrical clamp（18）Two jags lower end it is equal
It is equipped with and socket（23）The fixed block that size matches（25）, each fixed block（25）Both sides side wall on offer it is solid
Determine slot（26）, each fixing groove（26）Both sides inner wall on be equipped with limiting slot, be equipped with two in each limiting slot
A loop bar（28）, each fixing groove（26）Inside it is equipped with elastic rod（27）, each elastic rod（27）Far from fixing groove
（26）One end be equipped with arc head, each elastic rod（27）Positioned at fixing groove（26）It is all connected on interior one end both sides side wall
There is slide plate（29）, each slide plate（29）It is set in two loop bars（28）Upper and and loop bar（28）It is slidably connected.
2. printed circuit board according to claim 1 embeds runner liquid cooling heat-exchanger, which is characterized in that the fever member
Part（8）Outer wall be equipped with vertical outside flange（30）, the flange（30）Positioned at circuit board upper strata（2）Lower wall with electricity
Road plate middle level（1）Upper side wall between.
3. printed circuit board according to claim 1 embeds runner liquid cooling heat-exchanger, which is characterized in that the water inlet
（5）And water outlet（6）Inner wall on be equipped with sealing element.
4. printed circuit board according to claim 1 embeds runner liquid cooling heat-exchanger, which is characterized in that the water inlet pipe
（14）And outlet pipe（15）On be connected separately with for the first communicating pipe（12）With the second communicating pipe（13）, first communicating pipe（12）
With the second communicating pipe（13）Both ends respectively with water inlet（5）And water outlet（6）, water inlet pipe（14）And outlet pipe（15）Inside
Connection.
5. printed circuit board according to claim 1 embeds runner liquid cooling heat-exchanger, which is characterized in that each suction
Upward protrusion is equipped on the downside inner wall of heat pipe（19）, each protrusion（19）Side inside endothermic tube is all provided with
There are multiple obstruction teeth（20）.
6. printed circuit board according to claim 1 embeds runner liquid cooling heat-exchanger, which is characterized in that the circuit board
Middle level（1）On offer and water inlet pipe（14）, outlet pipe（15）And cooling tube（17）The runner to match, the water inlet pipe
（14）, outlet pipe（15）And cooling tube（17）In runner.
7. printed circuit board according to claim 1 embeds runner liquid cooling heat-exchanger, which is characterized in that the circuit board
Lower floor（3）On offer multiple thermovents（22）.
8. printed circuit board according to claim 1 embeds runner liquid cooling heat-exchanger, which is characterized in that the circuit board
（1）, circuit board upper strata（2）With circuit board lower floor（3）Between pass through bonding agent（21）It is attached.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711459277.0A CN108184305B (en) | 2017-12-28 | 2017-12-28 | Liquid cooling heat exchange device with embedded runner of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711459277.0A CN108184305B (en) | 2017-12-28 | 2017-12-28 | Liquid cooling heat exchange device with embedded runner of printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108184305A true CN108184305A (en) | 2018-06-19 |
| CN108184305B CN108184305B (en) | 2020-04-03 |
Family
ID=62548251
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711459277.0A Active CN108184305B (en) | 2017-12-28 | 2017-12-28 | Liquid cooling heat exchange device with embedded runner of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108184305B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110113867A (en) * | 2019-05-31 | 2019-08-09 | 维沃移动通信有限公司 | Radiator structure and mobile terminal |
| CN110146956A (en) * | 2019-04-25 | 2019-08-20 | 东南大学 | A kind of inside thermotransport micro-structure of optical module |
| CN111511093A (en) * | 2020-04-09 | 2020-08-07 | 东莞万钧电子科技有限公司 | Liquid cooling circuit board |
| CN113784501A (en) * | 2021-08-17 | 2021-12-10 | 中国电子科技集团公司第二十九研究所 | Micro-channel embedded printed circuit board integrated structure and manufacturing method |
| US11602044B2 (en) | 2020-07-30 | 2023-03-07 | Toyota Motor Engineering & Manufacturing North America, Inc. | Driver board assemblies and methods of forming the same |
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| US20060092235A1 (en) * | 2004-10-27 | 2006-05-04 | Brother Kogyo Kabushiki Kaisha | Electronic part-mounted substrate, thermal conductive member for electronic part-mounted substrate and liquid-jetting head |
| CN201115229Y (en) * | 2007-06-14 | 2008-09-10 | 讯凯国际股份有限公司 | A heat exchange structure and heat radiation device with this structure |
| CN102207763A (en) * | 2010-03-29 | 2011-10-05 | 研能科技股份有限公司 | Miniature liquid cooling system |
| CN105188260A (en) * | 2015-11-02 | 2015-12-23 | 中国电子科技集团公司第二十六研究所 | Printed circuit board embedded runner liquid cooling heat exchange device |
| CN205490100U (en) * | 2016-03-30 | 2016-08-17 | 北京合康亿盛变频科技股份有限公司 | Water -cooling heat transfer device of converter |
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| US20060092235A1 (en) * | 2004-10-27 | 2006-05-04 | Brother Kogyo Kabushiki Kaisha | Electronic part-mounted substrate, thermal conductive member for electronic part-mounted substrate and liquid-jetting head |
| CN201115229Y (en) * | 2007-06-14 | 2008-09-10 | 讯凯国际股份有限公司 | A heat exchange structure and heat radiation device with this structure |
| CN102207763A (en) * | 2010-03-29 | 2011-10-05 | 研能科技股份有限公司 | Miniature liquid cooling system |
| CN105188260A (en) * | 2015-11-02 | 2015-12-23 | 中国电子科技集团公司第二十六研究所 | Printed circuit board embedded runner liquid cooling heat exchange device |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110146956A (en) * | 2019-04-25 | 2019-08-20 | 东南大学 | A kind of inside thermotransport micro-structure of optical module |
| CN110113867A (en) * | 2019-05-31 | 2019-08-09 | 维沃移动通信有限公司 | Radiator structure and mobile terminal |
| CN111511093A (en) * | 2020-04-09 | 2020-08-07 | 东莞万钧电子科技有限公司 | Liquid cooling circuit board |
| CN111511093B (en) * | 2020-04-09 | 2021-09-24 | 东莞万钧电子科技有限公司 | Liquid cooling circuit board |
| US11602044B2 (en) | 2020-07-30 | 2023-03-07 | Toyota Motor Engineering & Manufacturing North America, Inc. | Driver board assemblies and methods of forming the same |
| CN113784501A (en) * | 2021-08-17 | 2021-12-10 | 中国电子科技集团公司第二十九研究所 | Micro-channel embedded printed circuit board integrated structure and manufacturing method |
| CN113784501B (en) * | 2021-08-17 | 2022-12-13 | 中国电子科技集团公司第二十九研究所 | Micro-channel embedded printed circuit board integrated structure and manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108184305B (en) | 2020-04-03 |
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