WO2021042781A1

WO2021042781A1 - Double-sided water-cooled radiator

Info

Publication number: WO2021042781A1
Application number: PCT/CN2020/094018
Authority: WO
Inventors: 田飞; 张伟龙
Original assignee: 华为技术有限公司
Priority date: 2019-09-04
Filing date: 2020-06-02
Publication date: 2021-03-11
Also published as: CN110719717A

Abstract

The present application provides a double-sided water-cooled radiator. The double-sided water-cooled radiator comprises a radiating fin group, the radiating fin group comprises a plurality of radiating fins which are fixed by means of connectors and provided in a stacked manner, and a space for holding an insulated gate bipolar transistor (IGBT) is formed between every two adjacent radiating fins. Each radiating fin has a water inlet channel and a water outlet channel, and a flow-through inner cavity is formed between the water inlet channel and the water outlet channel. In any two adjacent radiating fins, the water inlet channels of the two radiating fins are in communication with each other by means of elastic communication pipe fittings, and the water outlet channels of the two radiating fins are also in communication with each other by means of elastic communication pipe fittings. In the double-sided water-cooled radiator, two adjacent radiating fins are in communication with each other by means of elastic communication pipe fittings which have a telescopic performance, and in conjunction with the connection and fixation of the radiating fins by means of the connectors, the distance between the two radiating fins can be adjusted according to needs, thereby satisfying the radiating requirements of IGBTs with different thicknesses.

Description

Double-sided water cooling radiator

Cross-references to related applications

This application claims the priority of a Chinese patent application filed with the Chinese Patent Office with application number 201910832392.0 and application name "double-sided water-cooled radiator" on September 4, 2019, the entire content of which is incorporated into this application by reference.

Technical field

This application relates to the technical field of heat dissipation of motor controllers, and in particular to a double-sided water-cooled radiator.

Background technique

With the development of the automobile industry, electric vehicles have become the future trend due to their advantages in energy saving and environmental protection. Electric vehicles use a drive motor instead of a traditional fuel engine to drive the vehicle. As the core component of an electric vehicle, the three-electric system is generally composed of a battery 10, a drive motor 20, and a motor control unit (MCU) 30 (as shown in the figure). The schematic diagram of the three-electric system structure arrangement shown in 1 and the schematic diagram of the working principle of the three-electric system shown in Figure 2). One of the core components included in the motor controller is an insulated gate bipolar transistor (IGBT). Due to the high loss of the insulated gate bipolar transistor, the overall heat dissipation capacity of the motor controller is required to be high. The requirements for the radiator are also higher. The new generation of motor controllers introduces a double-sided water-cooled insulated gate bipolar transistor. For this double-sided water-cooled insulated gate bipolar transistor, a double-sided water-cooled radiator is generally used.

At present, double-sided water-cooled radiators are divided into integrated and split types. Figure 3 shows an integrated double-sided water-cooled radiator, which uses N groups of separate heat sinks 3061 to be assembled in parallel, and is integrally formed by brazing. The insulated gate bipolar transistor 305 exerts a lateral outward force on the double-sided water-cooled radiator through the pressing plate 3062 and the cylindrical pressing block 3063, and clamps the insulated gate bipolar transistor 305 by the plastic deformation of the lip 3064 of the body of the double-sided water-cooled radiator. This kind of radiator structure is clamped by the plastic deformation of the material of the radiator. When the stress is too large, the radiator may be deformed too much, leading to the failure of the welding seam, and the structure is complicated to assemble and the load is difficult to control.

Summary of the invention

This application provides a double-sided water-cooled radiator, which makes the deformation of the entire radiator controllable and simple to assemble.

The double-sided water-cooled heat sink provided by the present application includes a heat sink group; wherein the heat sink group includes a plurality of heat sinks connected and fixed by a connector, and the plurality of heat sinks are arranged in a layered manner. When in use, two adjacent heat sinks The space between the fins is used to clamp the insulated gate bipolar transistor to dissipate heat from the insulated gate bipolar transistor; specifically, each heat sink has a water inlet channel and a water outlet channel, between the water inlet channel and the water outlet channel A circulation cavity is formed, and the cooling liquid can circulate in the circulation cavity between the water inlet channel and the water outlet channel; in any two adjacent radiating fins, the water inlet channels of the two radiating fins are connected by elastic connecting pipes , And the water outlet channels of the two radiating fins are also connected by elastic connecting pipes; on the one hand, the elastic connecting pipes connect the above-mentioned multiple radiating fins to form a channel for cooling liquid to circulate, and the cooling liquid enters the cooling fin group in turn. After passing through the water inlet channel of each heat sink, it is discharged through the water outlet channel of each heat sink in turn. When the coolant flows in the circulation cavity of the heat sink, it exchanges cold and heat with the insulated gate bipolar transistor clamped by the heat sink , Cooling and dissipating the insulated gate bipolar transistor; on the other hand, combined with the connection and fixing effect of the connecting piece on each heat sink, the structure of the elastic connecting pipe itself can be elastically deformed under stress, and the two adjacent ones can be adjusted according to needs. The distance between the heat sinks can be adapted to insulated gate bipolar transistors of different thicknesses. In addition, the double-sided water-cooling radiator connects and fixes the radiating fins through the cooperation of elastic connecting pipes and connectors, which can improve the controllability of deformation of the entire structure and also make the entire structure more stable.

The above-mentioned multiple heat sinks are connected and fixed as a heat sink group by connecting pieces to ensure that the positions of the multiple heat sinks are fixed; wherein, the connecting pieces can be screws or buckles, and the two connecting pieces are firmly fixed and easy to assemble. In addition, the above-mentioned heat sink may be integrally formed, or may be formed by the cooperation of the first sheet body and the second sheet body under the premise of ensuring the sealing performance.

In a possible implementation manner, the elastic connecting pipe may include a corrugated tube, which can be extended or contracted in the direction of its axis; the two ends of the corrugated tube in the direction of its axis are respectively connected to two adjacent heat sinks. The water inlet channel of the fins (or the water outlet channel of the two radiating fins), the distance between the two radiating fins can be adjusted according to the thickness of the insulated gate bipolar transistor under the feature that the bellows is stretchable under the force. Wherein, the inner diameter of the bellows can be 13-15 mm, and such an inner diameter can meet the circulation requirements of the cooling liquid. In addition, the material of the bellows can be stainless steel or copper.

In order to achieve sufficient cold and heat exchange between the cooling liquid and the insulated gate bipolar transistor, it is better for the cooling liquid to have a lower flow velocity in the circulation cavity of the heat sink. Therefore, the circulation cavity of the cooling fin is provided with Buffer fins; through the setting of buffer fins, the contact area between the heat sink and the coolant is increased, which is equivalent to increasing the heat exchange area, which can improve the cooling effect; at the same time, the buffer fins can also increase the circulation cavity of the coolant The internal flow is obstructed, thereby reducing the flow rate of the cooling liquid to achieve a more sufficient heat exchange effect. Of course, the shape and structure of the buffer fins are not limited. For example, one or a combination of a wave shape, a broken line shape, a spiral shape, and a cylindrical shape can achieve the above-mentioned purpose. Specifically, the buffer fins may be fixed in the circulation cavity of the heat sink by means of brazing.

In addition, aluminum alloy can be selected for the heat sink in all the above embodiments, and such a heat sink can achieve cold and heat exchange with the insulated gate bipolar transistor as fully as possible.

Description of the drawings

Figure 1 is a schematic diagram of the structure of an existing three-electric system for electric vehicles;

Figure 2 is a schematic diagram of the working principle of an existing three-electric system for electric vehicles;

Fig. 3 is a schematic diagram of the structure of an existing double-sided water-cooled radiator;

Fig. 4 is a schematic structural diagram of an existing motor controller;

FIG. 5 is a schematic structural diagram of a double-sided water-cooled radiator provided by an embodiment of the application;

6 is a schematic diagram of a working state of a double-sided water-cooled radiator provided by an embodiment of the application;

7 is a schematic diagram of the internal structure of a heat sink in a double-sided water-cooled heat sink provided by an embodiment of the application;

Fig. 8 is a top view of a heat sink in the double-sided water-cooled radiator shown in Fig. 7;

FIG. 9 is a schematic diagram of the internal structure of another heat sink in a double-sided water-cooled radiator provided by an embodiment of the application;

FIG. 10 is a schematic diagram of a working state of a double-sided water-cooled radiator provided by an embodiment of the application;

11 is a schematic structural diagram of an elastic connecting pipe in a double-sided water-cooled radiator provided by an embodiment of the application;

12 is a schematic structural diagram of another elastic connecting pipe in a double-sided water-cooled radiator provided by an embodiment of the application;

13 is a schematic diagram of the internal structure of a heat sink with buffer fins in a double-sided water-cooled heat sink provided by an embodiment of the application;

14 is a schematic structural diagram of a buffer fin in a double-sided water-cooled radiator provided by an embodiment of the application;

15 is a schematic structural diagram of a buffer fin in a double-sided water-cooled radiator provided by an embodiment of the application;

16 is a schematic structural diagram of a buffer fin in a double-sided water-cooled radiator provided by an embodiment of the application;

17 is a schematic structural diagram of a buffer fin in a double-sided water-cooled radiator provided by an embodiment of the application;

FIG. 18 is a schematic structural diagram of another double-sided water-cooled radiator provided by an embodiment of the application.

detailed description

In order to make the purpose, technical solutions, and advantages of the application more clear, the application will be further described in detail below with reference to the accompanying drawings.

First, let us introduce the application scenario of this application: With the development of the automobile industry, electric vehicles have become the future development trend due to their advantages in energy saving and environmental protection. As the core components of electric vehicles, the three-electric system composed of motors, motor controllers, and batteries has become a key factor affecting the power performance, battery life, and safe and reliable driving of electric vehicles.

Fig. 1 shows the layout of a typical three-electric system in an electric vehicle, and Fig. 2 shows the working principle of the above-mentioned three-electric system. In FIG. 2, the battery 10 provides current for the motor controller 30, and the current is inverted by the motor controller 30 to control the operation of the driving motor 20. The motor controller 30 is an important signal and energy transmission element in the electric vehicle. The voltage and current of the driving motor 20 are controlled by the motor controller 30. The motor controller 30 can make the electric vehicle follow the set direction, speed, and angle. , Response time to work, and then control the start-stop state of the electric vehicle, advance and retreat speed, climbing strength and other driving conditions. Specifically, the structure of the motor controller 30 is shown in FIG. 4, which is mainly composed of an upper cover 301, a main housing 302, a capacitor 303, a drive control board 304, an insulated gate bipolar transistor 305, and a heat sink 306. With the development of the motor controller 30 towards high voltage and high power density, the new generation of motor controller 30 introduces a double-sided water-cooled insulated gate bipolar transistor. This insulated gate bipolar transistor 305 has a smaller volume. , Strong scalability and other advantages, can meet the needs of high power density. For the insulated gate bipolar transistor 305, a double-sided water-cooled radiator is generally used for heat dissipation. However, the current double-sided water-cooled radiator generally clamps the insulated gate bipolar transistor 305 through the plastic deformation of the material of the radiator (a double-sided water-cooled radiator provided in Figure 3). Due to the limited plastic deformation of the material itself Moreover, it cannot bear a large stress load, and therefore cannot meet the heat dissipation requirements of insulated gate bipolar transistors 305 of different sizes.

In this case, the embodiment of the present application proposes a double-sided water-cooled heat sink to meet the heat dissipation requirements of insulated gate bipolar transistors, and at the same time, make the structure of the heat sink have more adjustable space, so that the deformation can be adjusted. The control and assembly are simple, so as to adapt to insulated gate bipolar transistors of different thicknesses.

The terms used in the following embodiments are only for the purpose of describing specific embodiments, and are not intended to limit the application. As used in the specification and appended claims of this application, the singular expressions "a", "an", "said", "above", "the" and "this" are intended to also This includes expressions such as "one or more" unless the context clearly indicates to the contrary.

References described in this specification to "one embodiment" or "some embodiments", etc. mean that one or more embodiments of the present application include a specific feature, structure, or characteristic described in conjunction with the embodiment. Therefore, the sentences "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. appearing in different places in this specification are not necessarily All refer to the same embodiment, but mean "one or more but not all embodiments" unless it is specifically emphasized otherwise. The terms "including", "including", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized.

The embodiment of the present application provides a double-sided water-cooled radiator, which is used for water-cooling and heat-dissipating insulated gate bipolar transistors in a motor controller. Specifically, as shown in Figure 5, the double-sided water-cooled radiator includes a heat sink group 1. The heat sink group 1 has a water inlet 11 and a water outlet 12. The external coolant enters the heat sink group 1 from the water inlet 11 and passes through the heat sink group 1 in turn. After a stack of radiating fins 13 are discharged from the water outlet 12, a plurality of radiating fins 13 are fixed by connecting piece screws 14, and the circulation of cooling liquid between any two adjacent radiating fins 13 is realized by elastic connecting pipes 15. The gap between every two adjacent radiating fins 13 can be used to clamp the structure to be radiated. As shown in Figure 6, the double-sided water-cooled radiator is applied to the insulated gate bipolar transistor 2 to dissipate heat. The insulated gate bipolar transistor 2 is sandwiched between every two adjacent heat sinks 13, and the cooling When the liquid flows from the water inlet 11 of the heat sink group 1 to the water outlet 12, the flow path of the coolant in the heat sink group 1 can be as shown by the arrow in Figure 6, so that it can be taken away and clamped between the two heat sinks. 13 between the heat of the insulated gate bipolar transistor 2, so as to realize the heat dissipation of the insulated gate bipolar transistor 2. It should be noted that the positions of the water inlet 11 and the water outlet 12 in FIG. 5 or FIG. 6 are only schematic illustrations, and the positions of the water inlet 11 and the water outlet 12 can be changed as needed.

As shown in Fig. 6 for the flow path of the cooling liquid in the heat sink group 1, each cooling fin 13 needs to introduce the cooling liquid into the next adjacent heat sink 13, and at the same time, the cooling liquid needs to be inside the structure of the heat sink 13 Flow to cool down the insulated gate bipolar transistor 2. Fig. 7 or 9 exemplarily shows the internal structure of the heat sink 13. Each heat sink 13 has a water inlet channel 131 and a water outlet channel 132, where the water inlet channel 131 and the water outlet channel 132 are relative to the entire heat sink group 1. Refer to FIG. 7 in conjunction with FIG. 6, the water inlet channel 131 refers to the channel corresponding to the water inlet side of the entire heat sink group 1, and the water outlet channel 132 refers to The channel on the water outlet side of the entire heat sink group 1; in order to fix each heat sink 13 with screws 14, screw holes 134 for screws 14 to pass through are also provided at both ends of the heat sink 13, and the screws 14 pass through the multiple heat sinks sequentially from top to bottom. After the cooling fins 13, the multiple cooling fins 13 are fixed by nut locking; among them, Fig. 6 shows the structure of five cooling fins 13 from bottom to top; the four cooling fins in the bottom of the five cooling fins in Fig. 6 The internal structure of the fin 13 is shown in Figure 7. The four radiating fins 13 need to transport the cooling liquid from the water inlet 11 to another adjacent radiating fin 13 through the elastic connecting pipe 15. Therefore, in Figure 7 this The water inlet channel 131 and the water outlet channel 132 of the heat sink 13 penetrate up and down. Figure 8 shows a top view of the heat sink 13; and Figure 9 shows the top one of the five heat sinks in Figure 6 The internal structure of the cooling fluid, as shown in Figure 6, the cooling fluid entering the topmost heat sink 13 only needs to flow from its water inlet channel 131 to its water outlet channel 132. Therefore, the cooling fin 13 enters The water channel 131 only needs to introduce the cooling liquid into the radiating fin 13, and the outlet channel 132 only needs to export the cooling liquid inside it to the next radiating fin 13. The top of the water inlet channel 131 and the water outlet channel 132 are closed, as shown in Figure 9. Show. Moreover, it can be understood that FIG. 7 or FIG. 9 shows a heat sink 13 with an integrated structure. The heat sink 13 in this embodiment can also be achieved by the cooperation of the first and second fins. For example, they are welded together in a top-bottom fit or a left-right fit. Specifically, brazing with higher sealing reliability can be selected.

10, the working process of the double-sided water-cooled radiator provided in this embodiment is introduced. Taking the heat sink group 1 shown in FIG. 10 as an example with five heat sinks 13, the water inlet of the first heat sink 13a Between the channel 131 (the water inlet channel 131 and the water outlet channel 132 of all the heat sinks 13 are not shown in the figure, please refer to Figure 7 or 9) and the water inlet channel 131 of the second heat sink 13b, the second Between the water inlet channel 131 of the first heat sink 13b and the water inlet channel 131 of the third heat sink 13c, between the water inlet channel 131 of the third heat sink 13c and the water inlet channel 131 of the fourth heat sink 13d, The water inlet channel 131 of the fourth heat sink 13d and the water inlet channel 131 of the fifth heat sink 13e are respectively connected by elastic connecting pipes 15. The water outlet channel 132 of the first heat sink 13a and the second heat sink 13b Between the water outlet channels 132 of the second heat sink 13b, between the water outlet channels 132 of the second heat sink 13b and the water outlet channels 132 of the third heat sink 13c, between the water outlet channels 132 of the third heat sink 13c and the water outlet of the fourth heat sink 13d Between the channels 132, the water outlet channel 132 of the fourth heat sink 13d and the water outlet channel 132 of the fifth heat sink 13e are connected through the elastic connecting pipe 15, and the coolant entering from the water inlet 11 under the heat sink group 1 passes through The water inlet channel 131 of the first heat sink 13a enters the water inlet channel 131 of the second heat sink 13b through the elastic connecting tube 15 and so on, the cooling liquid continues to flow into the fifth heat sink 13e at the top; Pass through the circulation cavity 133 of the fifth heat sink 13e (not shown in the figure, please refer to FIG. 9) to reach the water outlet channel 132 of the fifth heat sink 13e, and pass through the elastic connecting pipe 15 to the fourth heat sink 13d The cooling liquid continues to flow through all the cooling fins 13 to the water outlet 12 and is discharged by analogy.

It is understandable that the two radiating fins 13 connected in the above-mentioned double-sided water-cooling radiator are communicated with each other through the elastic connecting pipe 15, and the elastic characteristic of the elastic connecting pipe 15 can allow the distance between the two radiating fins 13 to increase or decrease. Therefore, structures to be dissipated with different thicknesses (for example, the insulated gate bipolar transistor 2 shown in FIG. 6) can be clamped according to requirements.

Specifically, taking the insulated gate bipolar transistor 2 as an example, based on the structure shown in FIG. 6, if the thickness of the insulated gate bipolar transistor 2 is increased, it is necessary to increase the size for holding the insulated gate bipolar transistor. The distance between the two radiating fins 13 of 2, as the distance between the two radiating fins 13 increases, the elastic connecting pipe 15 extends along the stacking direction of the radiating fins 13 to meet the requirements for adjusting the distance between the two radiating fins 13 At the same time, ensure the coolant conduction. On the contrary, based on the structure shown in FIG. 6, if the thickness of the insulated gate bipolar transistor 2 is reduced, the distance between the two heat sinks 13 for clamping the insulated gate bipolar transistor 2 needs to be reduced. As the distance between the two radiating fins 13 is smaller, the elastic connecting tube 15 is shortened along the stacking direction of the radiating fins 13 to satisfy the adjustment of the distance between the two radiating fins 13 while ensuring the conduction of the coolant. Of course, after the adjustment (increase or decrease) of the distance between the heat sinks 13 is completed, each heat sink 13 needs to be fixed by screws 14 to complete the installation and fixation of the heat sink group 1.

Exemplarily, the elastic connecting tube 15 may be a corrugated tube 15a as shown in FIG. 11. This corrugated tube 15a can be extended or contracted in the direction of its axis (in the direction of the arrow shown in FIG. 11). Adjacent radiating fins 13, if each radiating fin 13 has a water inlet channel 131 and a water outlet channel 132, two corrugated pipes 15a can be arranged between two adjacent radiating fins 13, and one of the corrugated pipes 15a is along the axis One end in the direction of the core line is hermetically connected to one of the radiating fins 13 and communicating with the water inlet channel 131 of the radiating fin 13, and the other end is hermetically connected to the other radiating fin 13 and communicating with the water inlet channel 131 of the radiating fin 13; and One end of the other corrugated tube 15a along the axial direction is hermetically connected to one of the radiating fins 13 and communicating with the water outlet channel 132 of the radiating fin 13, and the other end is hermetically connected to the other radiating fin 13 and to the water outlet of the radiating fin 13 The passage 132 communicates. When the thickness of the insulated gate bipolar transistor 2 clamped between two adjacent heat sinks 13 is changed, the elasticity of the bellows 15a itself can satisfy the insulation clamped between two adjacent heat sinks 13 The thickness of the gate bipolar transistor 2 varies. The inner diameter of the bellows 15a can be 13-15 mm. Such an inner diameter can meet the circulation requirements of the cooling liquid, and its length can be set according to specific usage requirements. In addition, the material of the bellows 15a may be stainless steel, copper, or other metals or alloys. It should be noted that the bellows 15a has high sealing performance, can withstand a pressure of 400Kpa, 600,000 pulses without leakage, and can meet the sealing requirements of the radiator.

In a possible implementation manner, the elastic connecting tube 15 may be a tube assembly 15b, and this tube assembly 15b may be a combination of a flexible connecting tube 151 and a spring 152. Wherein, both ends of the flexible connecting pipe 151 are respectively sealedly connected with the water inlet channels 131 of two adjacent radiating fins 13 (or the water outlet channels 132 of two adjacent radiating fins 13), and play a role of conducting coolant; The two ends of the spring 152 are respectively connected to two adjacent heat sinks 13 to provide an elastic connection effect. When the thickness of the insulated gate bipolar transistor 2 between the two heat sinks 13 changes, the elastic deformation generated by the force of the spring 152 can satisfy the change in the distance between the two heat sinks 13 and thus satisfy the gap between the two heat sinks 13 The thickness of the insulated gate bipolar transistor 2 varies as required. The flexible connecting pipe 151 is used to circulate the cooling liquid between the two radiating fins 13. Of course, the flexible connecting pipe 151 in this manner also needs to meet the sealing requirements similar to the above-mentioned bellows.

Specifically, the flexible connecting tube 151 and the spring 152 may be an integrated structure (as shown in FIG. 12), the flexible connecting tube 151 is provided in the spring 152, and both ends of the flexible connecting tube 151 and the two ends of the spring 151 are fixedly connected as one body. Then, it is connected to the heat sink 13 in a sealed manner, or the flexible connecting tube 151 and the spring 152 are provided separately, and they are separately connected to the heat sink 13 in a sealed manner (not shown in the figure).

10, the coolant needs to enter from the water inlet 11 of the heat sink group 1 through each heat sink 13 and then be discharged from the water outlet 12, and the cold and heat exchange with the insulated gate bipolar transistor 2 is mainly through the heat sink 13 The cooling liquid in the circulating cavity 133 is implemented (refer to FIG. 7 or FIG. 9). In order to further improve the heat dissipation effect, the heat sink 13 in this embodiment is provided with buffer fins 135 in the circulating cavity 133, as shown in FIG. A cylindrical buffer fin 135 uniformly arrayed along the length of the circulation cavity 133 is shown. The columnar buffer fins 135 are fixed in the circulation cavity 133 of the heat sink 13, which is equivalent to increasing the surface area of the circulation cavity 133 of the heat sink 13, which can increase the heat exchange area between the heat sink 13 and the coolant. , In order to improve the cooling effect. In addition, if the cooling liquid flow rate is too slow, the cooling liquid cannot be delivered to each heat sink 13 in time. If the cooling liquid flow rate is too fast, the cooling liquid cannot sufficiently interact with the bipolar insulation grid clamped between the two heat sinks 13 The type transistor 2 performs cold and heat exchange and is discharged, resulting in a waste of coolant. The columnar buffer fin 135 forms an angle with the extension direction of the circulation cavity 133 (Figure 13 shows the case where the angle between the two is 90°), which can increase the obstacles to the circulation of the cooling liquid in the circulation cavity 133 Therefore, the flow speed of the cooling liquid can be reduced, so that the cooling liquid can fully exchange heat and cold with the insulated gate bipolar transistor 2 clamped between the two heat sinks 13, which improves the utilization rate of the cooling liquid and saves resources.

The above-mentioned buffer fin 135 may also have other structural forms. For example, FIG. 14 shows a wave-shaped buffer fin 135 extending along the length of the circulation cavity 133, and FIG. 15 shows a wavy buffer fin 135 that extends along the circulation cavity 133. The spiral buffer fins 135 extending in the length direction of 133. FIG. 16 shows a folding line buffer fin 135 extending in the length direction of the circulation cavity 133. Of course, the above-mentioned buffer fins 135 are only exemplary descriptions, and the buffer fins 135 of at least two shapes and structures may be combined to be arranged in the circulation cavity 133 of the heat sink 13, as shown in FIG. 17. A schematic view of the structure of the combination of the circular buffer fin 135a and the spiral buffer fin 135b.

In order to enable the buffer fins 135 to be stably fixed in the circulating cavity of the heat sink 13 to deal with the impact of the flowing coolant, the buffer fins 135 in this embodiment can be fixed to the buffer of the heat sink 13 by brazing. Inside the cavity.

In addition, for fixing each heat sink 13 so that a plurality of heat sinks 13 are combined to form a connecting piece of the heat sink group 1, in addition to the screw 14 shown in FIG. 6, it can also be a bolt (the structure of the bolt is similar to that of a screw, which is not shown. The figure shows), it can also be the buckle 16 as shown in Fig. 18. Two buckles 16 are provided on both sides of the heat sink set 1 symmetrically, and each buckle 16 has a fixed portion 161 and is movably arranged at the fixed portion. The movable part 162 on the part 161 and the fixed part 161 can be matched with each heat sink 13 so that the heat sink 13 is arranged in sequence based on the fixed part 161 to position the heat sink 13 to prevent the heat sink 13 from being misaligned In use, one end of the heat sink set 1 abuts against one end of the fixed portion 161 of the buckle (M in FIG. 18), and adjust the movable portion 162 on the fixed portion 161 according to the thickness of the insulated gate bipolar transistor 2 The position is such that the other end of the heat sink group 1 is limited by the movable portion 162, so that the fixed connection to each heat sink 13 is realized.

It can be seen that both the screw 14 and the buckle 16 can realize the fixed connection of the heat sinks 13, and ensure that the heat sinks 13 are arranged neatly, which is convenient for stress control. Of course, these two connection structures also have simple assembly Advantages, convenient for later maintenance and replacement.

The above are only specific implementations of this application, but the scope of protection of this application is not limited to this. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed in this application, and they should all cover Within the scope of protection of this application. Therefore, the protection scope of this application should be subject to the protection scope of the claims.

Claims

A double-sided water-cooling radiator is characterized by comprising: a heat sink group; the heat sink group includes a plurality of stacked heat sinks connected and fixed by a connecting piece, and between every two adjacent heat sinks Form a space for holding insulated gate bipolar transistors;

Each of the radiating fins has a water inlet channel and a water outlet channel, and a circulation cavity is formed between the water inlet channel and the water outlet channel;

In any two adjacent radiating fins, the water inlet passages of the two radiating fins are connected by elastic connecting pipes, and the water outlet passages of the two radiating fins are connected by elastic connecting pipes. Connected.
The double-sided water-cooled radiator according to claim 1, wherein the elastic connecting pipe includes a corrugated pipe.
The double-sided water-cooled radiator according to claim 2, wherein the inner diameter of the bellows is 13-15 mm.
The double-sided water-cooled radiator according to claim 2, wherein the material of the bellows is stainless steel or copper.
The double-sided water-cooled radiator according to claim 1, wherein a buffer fin is provided in the circulation inner cavity of each of the radiating fins.
The double-sided water-cooled radiator according to claim 5, wherein the buffer fin is one or a combination of wave shape, broken line shape, spiral shape, and cylindrical shape.
The double-sided water-cooled radiator according to claim 5, wherein the buffer fin is fixed in the circulation cavity of the heat sink by welding.
The double-sided water-cooled heat sink according to any one of claims 1-7, wherein the heat sink includes a first fin and a second fin that are matched with each other.
The double-sided water-cooled radiator according to any one of claims 1-7, wherein the connecting member is a screw or a buckle.
The double-sided water-cooled heat sink according to any one of claims 1-7, wherein the material of the heat sink is aluminum alloy.