CN214313188U

CN214313188U - Power semiconductor module

Info

Publication number: CN214313188U
Application number: CN202120664327.4U
Authority: CN
Inventors: 黄斌斌
Original assignee: Zhongchuang Dufei Beijing Automotive Technology Co ltd
Current assignee: Zhongchuang Dufei Beijing Automotive Technology Co ltd
Priority date: 2021-04-01
Filing date: 2021-04-01
Publication date: 2021-09-28
Anticipated expiration: 2031-04-01

Abstract

The utility model discloses a power semiconductor module, power semiconductor module includes cooling device, semiconductor power component and covers copper ceramic substrate, semiconductor power component fixes cover on the copper ceramic substrate, it is in to cover the laminating of copper ceramic substrate on front side heating panel and/or the rear side heating panel. The cooling device comprises a cooling shell with a heat exchange cavity, and a front side heat dissipation plate and a rear side heat dissipation plate which are arranged on the front side and the rear side of the cooling shell and form the side walls of the heat exchange cavity; the cooling shell is also provided with a water inlet channel and a water outlet channel which are communicated with the heat exchange cavity. The utility model discloses reduced auxiliary assembly, simplified assembly process, the point of failure reduces, can be more stable dispel the heat for semiconductor power component.

Description

Power semiconductor module

Technical Field

The utility model relates to a new energy automobile technical field, especially power semiconductor module.

Background

With the continuous improvement of awareness of environmental protection, energy conservation and emission reduction of people, new energy automobiles become hot spots for controversy and development of various big vehicle enterprises and related institutions in the world. The power semiconductor module in the electric vehicle controller is one of key parts of the new energy vehicle, and generates a large amount of heat in the working process, so how to effectively dissipate the heat of the power semiconductor module affects the operating performance of the power semiconductor module.

The power semiconductor module cooling device in the prior art is complex in structure, more in required spare and accessory parts, and not only is complex in assembly process, so that the production efficiency is reduced, but also more failure points can be caused due to errors or assembly reasons in the process of mutual association among all the accessories, so that the cooling effect is reduced.

Therefore, it is necessary to provide a power semiconductor module having a simple structure and capable of stable operation.

Disclosure of Invention

The utility model aims at providing a power semiconductor module to solve not enough among the prior art, it has reduced auxiliary fittings, and assembly process is simple, and the point of failure reduces, and heat dispersion is excellent.

The utility model provides a power semiconductor module, which comprises a cooling device, a semiconductor power component and a copper-clad ceramic substrate, wherein the semiconductor power component is fixed on the copper-clad ceramic substrate, and the copper-clad ceramic substrate is attached on the front side heat dissipation plate and/or the rear side heat dissipation plate; the cooling device is characterized by comprising a cooling shell with a heat exchange cavity, and a front side heat dissipation plate and a rear side heat dissipation plate which are arranged on the front side and the rear side of the cooling shell and form the side walls of the heat exchange cavity; the cooling shell is also provided with a water inlet channel and a water outlet channel which are communicated with the heat exchange cavity.

The power semiconductor module as described above, wherein it is preferable that the cooling case includes a body, a through hole penetrating the body in the front-rear direction, a front-side opening provided on a front-side wall of the body, and a rear-side opening provided on a rear-side wall of the body; the front side heating panel is fixedly installed on the body and used for covering the front side opening, and the rear side heating panel is fixedly installed on the body and used for covering the rear side opening.

In the power semiconductor module, it is preferable that the body of the cooling case further includes a front positioning groove for positioning the front heat sink.

The power semiconductor module as described above, wherein preferably, the water inlet channel and the water outlet channel are relatively disposed at two opposite sides of the heat exchange cavity in a horizontal direction, and the water inlet channel is disposed at an upper side of the water outlet channel in a vertical direction.

In the power semiconductor module, it is preferable that the front-side heat dissipation plate and the rear-side heat dissipation plate are each provided with a heat dissipation substrate and a heat dissipation fin protruding from the heat dissipation substrate into the heat exchange cavity, the heat dissipation fin has a pin-tooth structure, and the heat dissipation substrate is fixedly connected to the cooling housing; the radiating fins on the front side radiating plate and the radiating fins on the rear side radiating plate are arranged in a mutually crossed mode, and a fin array is formed in the heat exchange cavity.

The power semiconductor module as described above, preferably, a flow guiding space is formed between the upper side of the fin array and the upper side wall of the heat exchanging cavity, one end of the flow guiding space extends to the water inlet channel, and the height of the upper side wall of the heat exchanging cavity gradually decreases towards the direction away from the water inlet channel, so that the flow guiding space gradually shrinks towards the direction away from the water inlet channel.

In the power semiconductor module, preferably, a drainage space is formed between a lower side of the fin array and a lower side wall of the heat exchange cavity, one end of the drainage space extends to the water outlet channel, and the lower side wall of the heat exchange cavity is inclined toward the direction of the water outlet channel so that the drainage space gradually increases toward a direction close to the water outlet channel.

In the power semiconductor module, preferably, an end of the water inlet channel away from the heat exchange cavity is a rectangular hole, and an end of the water outlet channel away from the heat exchange cavity is a rectangular hole.

Compared with the prior art, the utility model discloses a be connected fixed realization installation with front side heating panel and rear side heating panel and cooling casing and accomplish to semiconductor power component is through covering the laminating of copper ceramic substrate on front side heating panel or rear side heating panel, and the structure is retrencied more, has improved the packaging efficiency of whole equipment. Compared with the traditional module, the module has the advantages that the number of auxiliary accessories is reduced, the assembly process is simple, failure points are reduced, and the module is stable and runs more.

Drawings

Fig. 1 is a schematic structural diagram of a power semiconductor module disclosed in an embodiment of the present invention;

fig. 2 is an exploded view of a power semiconductor module cooling device according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of a cooling housing in a power semiconductor module cooling device disclosed in an embodiment of the present invention;

FIG. 4 is a bottom view of FIG. 3;

fig. 5 is a schematic diagram of an internal structure of a power semiconductor module according to an embodiment of the present invention.

Description of reference numerals: 1-cooling shell, 10-heat exchange cavity, 11-water inlet channel, 12-water outlet channel, 13-body, 130-front side positioning groove, 131-front side opening, 132-rear side opening, 14-flow guiding space, 15-flow guiding space,

2-front side heat dissipation plate, 21-heat dissipation substrate, 22-heat dissipation fin, 3-rear side heat dissipation plate,

100-cooling device, 200-semiconductor power assembly, 300-copper-clad ceramic substrate.

Detailed Description

The embodiments described below by referring to the drawings are exemplary only for explaining the present invention, and should not be construed as limiting the present invention.

The embodiment of the utility model provides a:

as shown in fig. 1, the utility model discloses a power semiconductor module, including cooling device 100, semiconductor power component 200 and copper-clad ceramic substrate 300, semiconductor power component 200 is fixed on copper-clad ceramic substrate 300, copper-clad ceramic substrate 300 laminating is in on front side heating panel 2 and/or the rear side heating panel 3. Wherein the copper clad ceramic substrate 300 is a DBC copper clad ceramic substrate. The heat dissipation of the semiconductor power module 200 can be effectively realized by the above structure.

As shown in fig. 2 to 5, there is disclosed a cooling device 100 in a power semiconductor module, including: the cooling device comprises a cooling shell 1 with a heat exchange cavity 10, and a front side heat dissipation plate 2 and a rear side heat dissipation plate 3 which are arranged at the front side and the rear side of the cooling shell 1 and form the side walls of the heat exchange cavity 10. The cooling shell 1 is also provided with a water inlet channel 11 and a water outlet channel 12 which are communicated with the heat exchange cavity 10; the front side heat dissipation plate 2 is tightly connected with the cooling shell 1 through integrated welding, and the rear side heat dissipation plate 3 is tightly connected with the cooling shell 1 through integrated welding.

In this embodiment, the water inlet channel 11, the heat exchange cavity 10 and the water outlet channel 12 form a circulation channel for the cooling medium, and the cooling medium exchanges heat with the front-side heat dissipation plate 2 and the rear-side heat dissipation plate 3 in the heat exchange cavity 10 during circulation in the circulation channel, so as to conduct heat on the front-side heat dissipation plate 2 and the rear-side heat dissipation plate 3. The semiconductor power module 200 can be fixedly mounted on the front heat dissipation plate 2 and the rear heat dissipation plate 3, and the semiconductor power module 200 can be specifically attached to the front heat dissipation plate 2 and/or the rear heat dissipation plate 3 through the copper-clad ceramic substrate 300, so that the heat dissipation of the semiconductor power module 200 is realized.

The installation is completed by fixedly connecting the front side heat dissipation plate 2 and the rear side heat dissipation plate 3 with the cooling shell 1 in the embodiment, and the semiconductor power assembly 200 is attached to the front side heat dissipation plate 2 or the rear side heat dissipation plate 3 through the copper-clad ceramic substrate 300, so that the structure is more simplified, and the assembly efficiency of the whole equipment is improved. Compared with the traditional module, the module has the advantages that auxiliary accessories are reduced, the assembly process is simple, failure points are reduced, and the semiconductor power component 200 can be cooled more stably.

In addition the embodiment of the utility model discloses the integral type welding is one of friction weld, ultrasonic welding or laser welding. The integral welding is a mode in which the two are welded to form a seal directly therebetween and a gap is prevented from being formed therebetween, so that the two are integrated. In the embodiment, friction welding is preferably adopted for connection and fixation, and the friction welding can play a role in sealing the heat exchange cavity 10, and has better sealing performance and higher reliability. Compare in the sealed heat exchange chamber of clip for traditional module, the sealed validity in effectual improvement heat exchange chamber, the clamp force of clip is difficult to control in traditional structure in addition, and the clamp force is too big can lead to parts such as heat exchange chamber to damage, and the undersize can't be sealed, has avoidd important failure point.

Meanwhile, the pressure resistance of the integrated welding heat exchange cavity 10 is improved from 0.2mpa to 0.5mpa, so that the heat exchange cavity 10 can meet the requirement of wider flow and the cooling effect of the cooling device is improved.

Specifically, the cooling casing 1 includes a body 13, a through hole penetrating the body 13 in the front-rear direction, a front side opening 131 provided on a front side wall of the body 13, and a rear side opening 132 provided on a rear side wall of the body 13; the front heat sink 2 is fixed to the body 1 and covers the front opening 131, and the rear heat sink 3 is fixed to the body 1 and covers the rear opening 132.

In order to facilitate the installation and fixation of the body 13 with the front heat dissipation plate 2 and the rear heat dissipation plate 3, the body 13 is further provided with a front positioning groove 130 for positioning the front heat dissipation plate 2 and a rear positioning groove for positioning the rear heat dissipation plate 3. The front side heating panel 2 is positioned in the front side positioning groove 130 and then is connected with the body 13 through friction welding, the front side positioning groove 130 can play a role of avoiding while positioning, the outer surface of the front side heating panel 2 after welding does not exceed the front side surface of the body 13, and the outer surface of the rear side heating panel 3 after welding does not exceed the rear side surface of the body 13.

The water inlet channel 11 and the water outlet channel 12 are arranged on two opposite sides of the heat exchange cavity 10 in a horizontal direction, and the water inlet channel 11 is arranged on the upper side of the water outlet channel 12 in a vertical direction. The arrangement of the structure enables the water inlet channel 11 and the water outlet channel 12 to be relatively far away, so that the flowing distance of the cooling medium in the flow channel can be increased, and heat exchange can be better realized.

As a further improvement, a heat dissipation substrate 21 and heat dissipation fins 22 protruding from the heat dissipation substrate 21 into the heat exchange cavity 10 are respectively disposed on the front side heat dissipation plate 2 and the rear side heat dissipation plate 3, the heat dissipation fins 22 have a pin-tooth structure, a plurality of heat dissipation fins 22 are uniformly arranged on the heat dissipation substrate 21 at intervals, and the heat dissipation substrate 21 is fixedly connected with the cooling housing 1; the radiating fins on the front side radiating plate 2 and the radiating fins on the rear side radiating plate 3 are arranged in a mutually crossed manner and form a fin array in the heat exchange cavity 10. Adopt pin tooth type radiator, can effectual improvement cooling effect, can avoid traditional fin type radiator simultaneously and block up the problem because of the cleanliness, influence radiating efficiency after blockking up. The fin array formed by the pin-tooth radiators forms different circulation channels in the heat exchange cavity 10, so that a plurality of loops can be arranged between the water inlet channel 11 and the water outlet channel 12, the flowing process of the cooling medium flowing in the heat exchange cavity 10 is more disordered, the flowing time of the cooling medium in the heat exchange cavity 10 is prolonged, and the cooling efficiency can be better improved.

Further, the upside of fin array with form water conservancy diversion space 14 between the last lateral wall of heat exchange chamber 10, water conservancy diversion space 14 one end extends to inhalant canal 11, just the last lateral wall of heat exchange chamber 10 is to keeping away from inhalant canal 11's direction height reduces gradually so that water conservancy diversion space 14 is to keeping away from inhalant canal 11's direction space shrinks gradually. The arrangement of the above structure makes the space of the guide space 14 larger at the position close to the water inlet channel 11, and the space of the guide space 14 gradually decreases as the heat exchange chamber 10 extends. It should be noted that there are no heat dissipating fins in the air guiding space 14. The purpose of providing the guide space 14 is to avoid the situation that the backflow from the water inlet channel 11 is likely to occur due to the influence of the heat dissipation fins provided at the inlet of the water inlet channel 11 on the flow of the heat dissipation medium, but the guide space 14 can effectively avoid the backflow of the cooling medium from the water inlet channel 11.

Further, a drainage space 15 is formed between the lower side of the fin array and the lower side wall of the heat exchange cavity 10, one end of the drainage space 15 extends to the water outlet channel 12, and the lower side wall of the heat exchange cavity 10 inclines towards the direction of the water outlet channel 12 so that the drainage space 15 gradually increases towards the direction space close to the water outlet channel 12. The position department of drainage space 15 also does not set up radiating fin, and the setting of above-mentioned structure can effectual guide fluid flow from going out water passageway 12, can increase water outlet area and reduce the water reflux and guarantee going out water usually, and the cooperation pin tooth type radiator structure makes rivers pressure drop obviously can satisfy bigger flow requirement simultaneously.

In this embodiment, one end of the water inlet channel 11, which is far away from the heat exchange cavity 10, is a rectangular hole, and one end of the water outlet channel 12, which is far away from the heat exchange cavity 10, is a rectangular hole. The inlet and the outlet are set to be rectangular, water flow vortexes of the old traditional round inlet or outlet can be effectively reduced, dead zones formed by water flows are avoided, and therefore smoothness of the water flows is guaranteed.

It should be noted that in this embodiment, the heat dissipation substrate 21 and the heat dissipation fins 22 are integrally formed, and both are made of aluminum, and the cooling housing 1 is made of aluminum alloy, so that the heat conduction efficiency can be improved and the cooling device can be more durable and stable by using the aluminum alloy.

The structure, features and effects of the present invention have been described in detail above according to the embodiment shown in the drawings, and the above description is only the preferred embodiment of the present invention, but the present invention is not limited to the implementation scope shown in the drawings, and all changes made according to the idea of the present invention or equivalent embodiments modified to the same changes should be considered within the protection scope of the present invention when not exceeding the spirit covered by the description and drawings.

Claims

1. The power semiconductor module comprises a cooling device, a semiconductor power assembly and a copper-clad ceramic substrate, wherein the semiconductor power assembly is fixed on the copper-clad ceramic substrate, and the copper-clad ceramic substrate is attached to a front side heat dissipation plate and/or a rear side heat dissipation plate;

the cooling device is characterized by comprising a cooling shell with a heat exchange cavity, and a front side heat dissipation plate and a rear side heat dissipation plate which are arranged on the front side and the rear side of the cooling shell and form the side walls of the heat exchange cavity; the cooling shell is also provided with a water inlet channel and a water outlet channel which are communicated with the heat exchange cavity.

2. The power semiconductor module of claim 1, wherein: the cooling housing includes a body, a through hole penetrating the body in a front-rear direction, a front-side opening provided on a front-side wall of the body, and a rear-side opening provided on a rear-side wall of the body; the front side heating panel is fixedly installed on the body and used for covering the front side opening, and the rear side heating panel is fixedly installed on the body and used for covering the rear side opening.

3. The power semiconductor module of claim 2, wherein: the body of the cooling shell is also provided with a front side positioning groove for positioning the front side heat dissipation plate.

4. The power semiconductor module of claim 1, wherein: the inlet channel with the exhalant canal is in relative setting in the horizontal direction the relative both sides in heat exchange cavity, and in vertical direction the inlet channel sets up the upside of exhalant canal.

5. The power semiconductor module of claim 4, wherein: the front side heat dissipation plate and the rear side heat dissipation plate are respectively provided with a heat dissipation substrate and heat dissipation fins protruding from the heat dissipation substrate into the heat exchange cavity, the heat dissipation fins are provided with a pin-tooth structure, and the heat dissipation substrate is fixedly connected with the cooling shell; the radiating fins on the front side radiating plate and the radiating fins on the rear side radiating plate are arranged in a mutually crossed mode, and a fin array is formed in the heat exchange cavity.

6. The power semiconductor module of claim 5, wherein: the upside of fin array with form the water conservancy diversion space between the last lateral wall in heat exchange chamber, water conservancy diversion space one end extends to inhalant canal, just the last lateral wall in heat exchange chamber is to keeping away from inhalant canal's direction height reduces gradually so that the water conservancy diversion space is to keeping away from inhalant canal's direction space contracts gradually.

7. The power semiconductor module of claim 6, wherein: the lower side of the fin array and the lower side wall of the heat exchange cavity form a drainage space, one end of the drainage space extends to the water outlet channel, and the lower side wall of the heat exchange cavity inclines towards the direction of the water outlet channel so that the drainage space gradually increases towards the direction space close to the water outlet channel.