CN112909097A - 一种石墨烯/黑磷烯复合薄膜晶体管及制备方法 - Google Patents
一种石墨烯/黑磷烯复合薄膜晶体管及制备方法 Download PDFInfo
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- CN112909097A CN112909097A CN202110219358.3A CN202110219358A CN112909097A CN 112909097 A CN112909097 A CN 112909097A CN 202110219358 A CN202110219358 A CN 202110219358A CN 112909097 A CN112909097 A CN 112909097A
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- black phosphorus
- graphene
- film transistor
- thin film
- phosphorus alkene
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 116
- 229910021389 graphene Inorganic materials 0.000 title claims abstract description 100
- -1 black phosphorus alkene Chemical class 0.000 title claims abstract description 82
- 239000010409 thin film Substances 0.000 title claims abstract description 46
- 239000002131 composite material Substances 0.000 title claims abstract description 42
- 238000002360 preparation method Methods 0.000 title claims abstract description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 39
- 239000008367 deionised water Substances 0.000 claims abstract description 35
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 35
- 239000006185 dispersion Substances 0.000 claims abstract description 23
- 239000007788 liquid Substances 0.000 claims abstract description 22
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 238000000034 method Methods 0.000 claims abstract description 17
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 11
- 239000010703 silicon Substances 0.000 claims abstract description 11
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 75
- 238000001132 ultrasonic dispersion Methods 0.000 claims description 39
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 32
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 30
- 239000011259 mixed solution Substances 0.000 claims description 26
- 239000010408 film Substances 0.000 claims description 24
- 238000000926 separation method Methods 0.000 claims description 23
- NWZSZGALRFJKBT-KNIFDHDWSA-N (2s)-2,6-diaminohexanoic acid;(2s)-2-hydroxybutanedioic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O.NCCCC[C@H](N)C(O)=O NWZSZGALRFJKBT-KNIFDHDWSA-N 0.000 claims description 19
- ZUJURJDZOPMJPH-UHFFFAOYSA-N 5-diazocyclohexa-1,3-diene;hydrochloride Chemical compound Cl.[N-]=[N+]=C1CC=CC=C1 ZUJURJDZOPMJPH-UHFFFAOYSA-N 0.000 claims description 19
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims description 19
- 239000004202 carbamide Substances 0.000 claims description 19
- IKDUDTNKRLTJSI-UHFFFAOYSA-N hydrazine monohydrate Substances O.NN IKDUDTNKRLTJSI-UHFFFAOYSA-N 0.000 claims description 19
- 229910002804 graphite Inorganic materials 0.000 claims description 16
- 239000010439 graphite Substances 0.000 claims description 16
- 238000010438 heat treatment Methods 0.000 claims description 16
- 235000012239 silicon dioxide Nutrition 0.000 claims description 16
- 239000000377 silicon dioxide Substances 0.000 claims description 16
- 239000006228 supernatant Substances 0.000 claims description 15
- 238000003756 stirring Methods 0.000 claims description 14
- 238000001027 hydrothermal synthesis Methods 0.000 claims description 9
- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- 238000004108 freeze drying Methods 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 238000001259 photo etching Methods 0.000 claims description 8
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 8
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 8
- 238000002207 thermal evaporation Methods 0.000 claims description 8
- 238000005406 washing Methods 0.000 claims description 8
- 239000002994 raw material Substances 0.000 claims description 7
- 238000000151 deposition Methods 0.000 abstract description 3
- 238000001962 electrophoresis Methods 0.000 abstract description 3
- 239000012776 electronic material Substances 0.000 abstract description 2
- 230000000052 comparative effect Effects 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 230000007547 defect Effects 0.000 description 5
- 238000002835 absorbance Methods 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000006731 degradation reaction Methods 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 125000004437 phosphorous atom Chemical group 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 229910001868 water Inorganic materials 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- CQXXYOLFJXSRMT-UHFFFAOYSA-N 5-diazocyclohexa-1,3-diene Chemical compound [N-]=[N+]=C1CC=CC=C1 CQXXYOLFJXSRMT-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- OUUQCZGPVNCOIJ-UHFFFAOYSA-M Superoxide Chemical compound [O-][O] OUUQCZGPVNCOIJ-UHFFFAOYSA-M 0.000 description 2
- AFCIMSXHQSIHQW-UHFFFAOYSA-N [O].[P] Chemical class [O].[P] AFCIMSXHQSIHQW-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
- 238000005660 chlorination reaction Methods 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000011065 in-situ storage Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000005119 centrifugation Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000010525 oxidative degradation reaction Methods 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000009210 therapy by ultrasound Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78684—Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising semiconductor materials of Group IV not being silicon, or alloys including an element of the group IV, e.g. Ge, SiN alloys, SiC alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/1025—Channel region of field-effect devices
- H01L29/1029—Channel region of field-effect devices of field-effect transistors
- H01L29/1033—Channel region of field-effect devices of field-effect transistors with insulated gate, e.g. characterised by the length, the width, the geometric contour or the doping structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66742—Thin film unipolar transistors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Carbon And Carbon Compounds (AREA)
- Thin Film Transistor (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
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CN202110219358.3A CN112909097B (zh) | 2021-02-27 | 2021-02-27 | 一种石墨烯/黑磷烯复合薄膜晶体管及制备方法 |
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CN202110219358.3A CN112909097B (zh) | 2021-02-27 | 2021-02-27 | 一种石墨烯/黑磷烯复合薄膜晶体管及制备方法 |
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CN112909097A true CN112909097A (zh) | 2021-06-04 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113725010A (zh) * | 2021-08-30 | 2021-11-30 | 广东工业大学 | 一种电致图案化黑磷烯/石墨烯电极的制备方法及其装置 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012169720A1 (ko) * | 2011-06-08 | 2012-12-13 | 금오공과대학교 산학협력단 | 그래핀 트랜지스터 및 그 제조 방법 |
CN105239136A (zh) * | 2015-09-15 | 2016-01-13 | 东南大学 | 一种黑磷烯量子点修饰的石墨烯薄膜的电泳沉积制备方法 |
WO2016056661A1 (ja) * | 2014-10-10 | 2016-04-14 | 学校法人東京理科大学 | 黒リン原子膜、熱電材料、熱電変換素子、及び半導体素子 |
CN106024861A (zh) * | 2016-05-31 | 2016-10-12 | 天津理工大学 | 二维黑磷/过渡金属硫族化合物异质结器件及其制备方法 |
CN106876584A (zh) * | 2017-02-13 | 2017-06-20 | 东莞市佳乾新材料科技有限公司 | 一种含黑磷烯的石墨烯柔性阻变存储器及其制备方法 |
CN106995946A (zh) * | 2017-02-23 | 2017-08-01 | 南通强生石墨烯科技有限公司 | 石墨烯‑氨纶复合纤维的制备方法 |
CN107682943A (zh) * | 2017-09-20 | 2018-02-09 | 中国科学院山西煤炭化学研究所 | 一种多功能石墨烯电热浆料和其制成的多功能电热膜及制备方法和应用 |
CN108987565A (zh) * | 2018-04-17 | 2018-12-11 | 张晗 | 基于金属阳离子修饰黑磷的突触器件及其制备方法 |
CN109817703A (zh) * | 2019-01-02 | 2019-05-28 | 湖南工业大学 | 高开关比石墨烯异质结场效应管及其制作方法 |
-
2021
- 2021-02-27 CN CN202110219358.3A patent/CN112909097B/zh active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012169720A1 (ko) * | 2011-06-08 | 2012-12-13 | 금오공과대학교 산학협력단 | 그래핀 트랜지스터 및 그 제조 방법 |
WO2016056661A1 (ja) * | 2014-10-10 | 2016-04-14 | 学校法人東京理科大学 | 黒リン原子膜、熱電材料、熱電変換素子、及び半導体素子 |
CN105239136A (zh) * | 2015-09-15 | 2016-01-13 | 东南大学 | 一种黑磷烯量子点修饰的石墨烯薄膜的电泳沉积制备方法 |
CN106024861A (zh) * | 2016-05-31 | 2016-10-12 | 天津理工大学 | 二维黑磷/过渡金属硫族化合物异质结器件及其制备方法 |
CN106876584A (zh) * | 2017-02-13 | 2017-06-20 | 东莞市佳乾新材料科技有限公司 | 一种含黑磷烯的石墨烯柔性阻变存储器及其制备方法 |
CN106995946A (zh) * | 2017-02-23 | 2017-08-01 | 南通强生石墨烯科技有限公司 | 石墨烯‑氨纶复合纤维的制备方法 |
CN107682943A (zh) * | 2017-09-20 | 2018-02-09 | 中国科学院山西煤炭化学研究所 | 一种多功能石墨烯电热浆料和其制成的多功能电热膜及制备方法和应用 |
CN108987565A (zh) * | 2018-04-17 | 2018-12-11 | 张晗 | 基于金属阳离子修饰黑磷的突触器件及其制备方法 |
CN109817703A (zh) * | 2019-01-02 | 2019-05-28 | 湖南工业大学 | 高开关比石墨烯异质结场效应管及其制作方法 |
Non-Patent Citations (2)
Title |
---|
AHMET AVSAR等: "Air-Stable Transport in Graphene-Contacted, Fully Encapsulated Ultrathin Black Phosphorus-Based Field-Effect Transistors", 《ACS NANO》 * |
CHRISTOPHER R. RYDER等: "Covalent functionalization and passivation of exfoliated black phosphorus via aryl diazonium chemistry", 《NATURE CHEMISTRY》 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113725010A (zh) * | 2021-08-30 | 2021-11-30 | 广东工业大学 | 一种电致图案化黑磷烯/石墨烯电极的制备方法及其装置 |
CN113725010B (zh) * | 2021-08-30 | 2022-04-15 | 广东工业大学 | 一种电致图案化黑磷烯/石墨烯电极的制备方法及其装置 |
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