CN112889145A - 升降杆固持器组件和包括升降杆固持器组件的主体 - Google Patents

升降杆固持器组件和包括升降杆固持器组件的主体 Download PDF

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Publication number
CN112889145A
CN112889145A CN201980069562.2A CN201980069562A CN112889145A CN 112889145 A CN112889145 A CN 112889145A CN 201980069562 A CN201980069562 A CN 201980069562A CN 112889145 A CN112889145 A CN 112889145A
Authority
CN
China
Prior art keywords
base
diameter
substrate support
bore
elongated portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201980069562.2A
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English (en)
Chinese (zh)
Inventor
J·M·舒浩勒
J·C·伯拉尼克
J·李
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of CN112889145A publication Critical patent/CN112889145A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4582—Rigid and flat substrates, e.g. plates or discs
    • C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
    • C23C16/4586—Elements in the interior of the support, e.g. electrodes, heating or cooling devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6326—Deposition processes
    • H10P14/6328—Deposition from the gas or vapour phase
    • H10P14/6334—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Furnace Charging Or Discharging (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
CN201980069562.2A 2018-11-15 2019-09-26 升降杆固持器组件和包括升降杆固持器组件的主体 Pending CN112889145A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862767823P 2018-11-15 2018-11-15
US62/767,823 2018-11-15
PCT/US2019/053259 WO2020101808A1 (en) 2018-11-15 2019-09-26 Lift pin holder assemblies and bodies including lift pin holder assemblies

Publications (1)

Publication Number Publication Date
CN112889145A true CN112889145A (zh) 2021-06-01

Family

ID=70726318

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980069562.2A Pending CN112889145A (zh) 2018-11-15 2019-09-26 升降杆固持器组件和包括升降杆固持器组件的主体

Country Status (6)

Country Link
US (1) US20200157678A1 (https=)
JP (1) JP7507759B2 (https=)
KR (1) KR102851410B1 (https=)
CN (1) CN112889145A (https=)
TW (1) TWI822892B (https=)
WO (1) WO2020101808A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116246992A (zh) * 2021-12-08 2023-06-09 美科陶瓷科技有限公司 静电吸盘

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019185124A1 (de) * 2018-03-27 2019-10-03 Vat Holding Ag Stifthubvorrichtung mit kupplung zum aufnehmen und lösen eines tragstifts
DE102020123556A1 (de) * 2020-09-11 2022-03-17 Mbs Ag Vorrichtung zur Montage mindestens eines Stromleiters in einen Sensor und Stromsensor
JP7715464B2 (ja) * 2021-09-02 2025-07-30 東京エレクトロン株式会社 基板処理装置
TWI831544B (zh) * 2021-12-31 2024-02-01 南韓商細美事有限公司 升降銷單元、包括其的基板支撐單元及基板處理設備
TW202431530A (zh) 2022-09-26 2024-08-01 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 提昇銷總成及配重

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE29709988U1 (de) * 1997-06-09 1997-08-14 Hoechst Ag, 65929 Frankfurt Leicht lösbare Arretierung für Abdeckhauben von Maschinen mit bewegten Teilen
US6984097B1 (en) * 1999-06-28 2006-01-10 Tokyo Electron Limited Mounting/demounting device for wafer carrier lid
CN103639100A (zh) * 2011-09-22 2014-03-19 迪士博机械制造有限公司 型材涂覆机
CN106653674A (zh) * 2015-11-04 2017-05-10 应用材料公司 用于消除四乙氧基硅烷氧化膜中的局部厚度不均匀性的增强升降杆设计
US20180090363A1 (en) * 2016-09-29 2018-03-29 Lam Research Corporation Lift pin holder with spring retention for substrate processing systems

Family Cites Families (12)

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Publication number Priority date Publication date Assignee Title
JP2804003B2 (ja) * 1995-04-06 1998-09-24 日本ピラー工業株式会社 半導体ウエハーの熱処理装置
DE19728273C1 (de) * 1997-07-02 1998-12-10 Fuss Fritz Gmbh & Co Verriegelungseinrichtung für Möbel
JPH1164177A (ja) * 1997-08-22 1999-03-05 Shinku Kogaku Kk 真空チャンバー用のトランスファー装置
JP3559176B2 (ja) 1998-09-25 2004-08-25 大日本スクリーン製造株式会社 基板保持装置および基板処理装置
KR20040092831A (ko) * 2003-04-29 2004-11-04 아남반도체 주식회사 Ｓｍｉｆ의 분리용이용 파드위치결정핀과 파드플레이트의결합구조 및 그 방법
KR101381207B1 (ko) * 2007-05-31 2014-04-04 주성엔지니어링(주) 가동부재를 가지는 기판지지핀 홀더 및 이를 포함하는기판처리장치
KR101433864B1 (ko) * 2007-11-30 2014-09-01 주성엔지니어링(주) 기판 승강 장치
US20090314211A1 (en) * 2008-06-24 2009-12-24 Applied Materials, Inc. Big foot lift pin
US20110014396A1 (en) * 2009-07-14 2011-01-20 Applied Materials, Inc. Recirculating linear rolling bushing
US20110164955A1 (en) * 2009-07-15 2011-07-07 Applied Materials,Inc. Processing chamber with translating wear plate for lift pin
JP2017022343A (ja) * 2015-07-15 2017-01-26 ルネサスエレクトロニクス株式会社 半導体装置の製造方法および半導体製造装置、ウエハリフトピン穴清掃治具
US10262887B2 (en) * 2016-10-20 2019-04-16 Lam Research Corporation Pin lifter assembly with small gap

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE29709988U1 (de) * 1997-06-09 1997-08-14 Hoechst Ag, 65929 Frankfurt Leicht lösbare Arretierung für Abdeckhauben von Maschinen mit bewegten Teilen
US6984097B1 (en) * 1999-06-28 2006-01-10 Tokyo Electron Limited Mounting/demounting device for wafer carrier lid
CN103639100A (zh) * 2011-09-22 2014-03-19 迪士博机械制造有限公司 型材涂覆机
CN106653674A (zh) * 2015-11-04 2017-05-10 应用材料公司 用于消除四乙氧基硅烷氧化膜中的局部厚度不均匀性的增强升降杆设计
US20180090363A1 (en) * 2016-09-29 2018-03-29 Lam Research Corporation Lift pin holder with spring retention for substrate processing systems

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116246992A (zh) * 2021-12-08 2023-06-09 美科陶瓷科技有限公司 静电吸盘
CN116246992B (zh) * 2021-12-08 2024-05-10 美科陶瓷科技有限公司 静电吸盘

Also Published As

Publication number Publication date
KR20210077781A (ko) 2021-06-25
TWI822892B (zh) 2023-11-21
US20200157678A1 (en) 2020-05-21
WO2020101808A1 (en) 2020-05-22
TW202021035A (zh) 2020-06-01
JP2022507297A (ja) 2022-01-18
KR102851410B1 (ko) 2025-08-26
JP7507759B2 (ja) 2024-06-28

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