KR102851410B1 - 리프트 핀 홀더 조립체들 및 리프트 핀 홀더 조립체들을 포함하는 바디들 - Google Patents

리프트 핀 홀더 조립체들 및 리프트 핀 홀더 조립체들을 포함하는 바디들

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Publication number
KR102851410B1
KR102851410B1 KR1020217017893A KR20217017893A KR102851410B1 KR 102851410 B1 KR102851410 B1 KR 102851410B1 KR 1020217017893 A KR1020217017893 A KR 1020217017893A KR 20217017893 A KR20217017893 A KR 20217017893A KR 102851410 B1 KR102851410 B1 KR 102851410B1
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KR
South Korea
Prior art keywords
lift pin
bore
pin holder
base
diameter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020217017893A
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English (en)
Korean (ko)
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KR20210077781A (ko
Inventor
제이슨 엠. 쉘러
제프리 찰스 블라닉
정민 리
Original Assignee
어플라이드 머티어리얼스, 인코포레이티드
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Application filed by 어플라이드 머티어리얼스, 인코포레이티드 filed Critical 어플라이드 머티어리얼스, 인코포레이티드
Publication of KR20210077781A publication Critical patent/KR20210077781A/ko
Application granted granted Critical
Publication of KR102851410B1 publication Critical patent/KR102851410B1/ko
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H01L21/68728—
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4582—Rigid and flat substrates, e.g. plates or discs
    • C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
    • C23C16/4586—Elements in the interior of the support, e.g. electrodes, heating or cooling devices
    • H01L21/02271—
    • H01L21/67259—
    • H01L21/68742—
    • H01L21/68785—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6326—Deposition processes
    • H10P14/6328—Deposition from the gas or vapour phase
    • H10P14/6334—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Furnace Charging Or Discharging (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
KR1020217017893A 2018-11-15 2019-09-26 리프트 핀 홀더 조립체들 및 리프트 핀 홀더 조립체들을 포함하는 바디들 Active KR102851410B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862767823P 2018-11-15 2018-11-15
US62/767,823 2018-11-15
PCT/US2019/053259 WO2020101808A1 (en) 2018-11-15 2019-09-26 Lift pin holder assemblies and bodies including lift pin holder assemblies

Publications (2)

Publication Number Publication Date
KR20210077781A KR20210077781A (ko) 2021-06-25
KR102851410B1 true KR102851410B1 (ko) 2025-08-26

Family

ID=70726318

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020217017893A Active KR102851410B1 (ko) 2018-11-15 2019-09-26 리프트 핀 홀더 조립체들 및 리프트 핀 홀더 조립체들을 포함하는 바디들

Country Status (6)

Country Link
US (1) US20200157678A1 (https=)
JP (1) JP7507759B2 (https=)
KR (1) KR102851410B1 (https=)
CN (1) CN112889145A (https=)
TW (1) TWI822892B (https=)
WO (1) WO2020101808A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019185124A1 (de) * 2018-03-27 2019-10-03 Vat Holding Ag Stifthubvorrichtung mit kupplung zum aufnehmen und lösen eines tragstifts
DE102020123556A1 (de) * 2020-09-11 2022-03-17 Mbs Ag Vorrichtung zur Montage mindestens eines Stromleiters in einen Sensor und Stromsensor
JP7715464B2 (ja) * 2021-09-02 2025-07-30 東京エレクトロン株式会社 基板処理装置
KR102396865B1 (ko) * 2021-12-08 2022-05-12 주식회사 미코세라믹스 정전척
TWI831544B (zh) * 2021-12-31 2024-02-01 南韓商細美事有限公司 升降銷單元、包括其的基板支撐單元及基板處理設備
TW202431530A (zh) 2022-09-26 2024-08-01 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 提昇銷總成及配重

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090314211A1 (en) * 2008-06-24 2009-12-24 Applied Materials, Inc. Big foot lift pin
US20110014396A1 (en) * 2009-07-14 2011-01-20 Applied Materials, Inc. Recirculating linear rolling bushing
JP2017022343A (ja) * 2015-07-15 2017-01-26 ルネサスエレクトロニクス株式会社 半導体装置の製造方法および半導体製造装置、ウエハリフトピン穴清掃治具
US20180090363A1 (en) * 2016-09-29 2018-03-29 Lam Research Corporation Lift pin holder with spring retention for substrate processing systems

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2804003B2 (ja) * 1995-04-06 1998-09-24 日本ピラー工業株式会社 半導体ウエハーの熱処理装置
DE29709988U1 (de) * 1997-06-09 1997-08-14 Hoechst Ag, 65929 Frankfurt Leicht lösbare Arretierung für Abdeckhauben von Maschinen mit bewegten Teilen
DE19728273C1 (de) * 1997-07-02 1998-12-10 Fuss Fritz Gmbh & Co Verriegelungseinrichtung für Möbel
JPH1164177A (ja) * 1997-08-22 1999-03-05 Shinku Kogaku Kk 真空チャンバー用のトランスファー装置
JP3559176B2 (ja) 1998-09-25 2004-08-25 大日本スクリーン製造株式会社 基板保持装置および基板処理装置
JP3954287B2 (ja) * 1999-06-28 2007-08-08 東京エレクトロン株式会社 ウェハキャリア用蓋体の着脱装置
KR20040092831A (ko) * 2003-04-29 2004-11-04 아남반도체 주식회사 Ｓｍｉｆ의 분리용이용 파드위치결정핀과 파드플레이트의결합구조 및 그 방법
KR101381207B1 (ko) * 2007-05-31 2014-04-04 주성엔지니어링(주) 가동부재를 가지는 기판지지핀 홀더 및 이를 포함하는기판처리장치
KR101433864B1 (ko) * 2007-11-30 2014-09-01 주성엔지니어링(주) 기판 승강 장치
US20110164955A1 (en) * 2009-07-15 2011-07-07 Applied Materials,Inc. Processing chamber with translating wear plate for lift pin
DE202011051396U1 (de) * 2011-09-22 2013-01-08 Düspohl Maschinenbau Gmbh Profilummantelungsmaschine
US10490436B2 (en) * 2015-11-04 2019-11-26 Applied Materials, Inc. Enhanced lift pin design to eliminate local thickness non-uniformity in teos oxide films
US10262887B2 (en) * 2016-10-20 2019-04-16 Lam Research Corporation Pin lifter assembly with small gap

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090314211A1 (en) * 2008-06-24 2009-12-24 Applied Materials, Inc. Big foot lift pin
US20110014396A1 (en) * 2009-07-14 2011-01-20 Applied Materials, Inc. Recirculating linear rolling bushing
JP2017022343A (ja) * 2015-07-15 2017-01-26 ルネサスエレクトロニクス株式会社 半導体装置の製造方法および半導体製造装置、ウエハリフトピン穴清掃治具
US20180090363A1 (en) * 2016-09-29 2018-03-29 Lam Research Corporation Lift pin holder with spring retention for substrate processing systems

Also Published As

Publication number Publication date
KR20210077781A (ko) 2021-06-25
TWI822892B (zh) 2023-11-21
US20200157678A1 (en) 2020-05-21
CN112889145A (zh) 2021-06-01
WO2020101808A1 (en) 2020-05-22
TW202021035A (zh) 2020-06-01
JP2022507297A (ja) 2022-01-18
JP7507759B2 (ja) 2024-06-28

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