CN112864066A - Push-pull type wafer box loading and conveying system of wafer cleaning equipment - Google Patents
Push-pull type wafer box loading and conveying system of wafer cleaning equipment Download PDFInfo
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- CN112864066A CN112864066A CN202011636179.1A CN202011636179A CN112864066A CN 112864066 A CN112864066 A CN 112864066A CN 202011636179 A CN202011636179 A CN 202011636179A CN 112864066 A CN112864066 A CN 112864066A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
Abstract
The invention discloses a push-pull type wafer box loading and conveying system of wafer cleaning equipment, which comprises a wafer loading device and a mechanical clamping device which are used in a combined mode, wherein the wafer loading device comprises a loading shell, a chamber partition plate, a cart placing cavity, a wafer box bearing cart and a cleaning cavity, the chamber partition plate is arranged in the loading shell along the length direction of the loading shell and divides the interior of the loading shell into a first moving cavity and a second moving cavity, the cart placing cavity is arranged on one side of the lower portion of the second moving cavity, the wafer box bearing cart is arranged in the cart placing cavity, the cleaning cavity is arranged on the other side of the lower portion of the second moving cavity, a rack is arranged on one side, facing the first moving cavity, of the chamber partition plate, and the mechanical clamping device can move along the length direction of the wafer loading device. The invention can realize the smooth transfer of the manipulator in the wafer loading area, improve the conveying efficiency of the wafer and reduce the whole volume of the wafer cleaning equipment.
Description
Technical Field
The invention belongs to the technical field of semiconductor cleaning equipment, and particularly relates to a push-pull type wafer box loading and conveying system of wafer cleaning equipment.
Background
In a semiconductor wet process equipment, different configurations are often set up according to different use requirements, and the semiconductor process equipment adjusts the wafer load throughput according to the configuration.
When the wafer box is subjected to a series of cleaning processes in the wet equipment, the wafer box needs to be picked by the manipulator from the wafer loading area and then conveyed to each cleaning process area for cleaning, so that the configuration of the wafer loading area and the manipulator can directly influence the conveying efficiency of the wafer. The wafer cleaning equipment is often required to be compact in structure, and if the arrangement of the wafer loading area and the mechanical arm is not reasonable, the occupied space of the equipment is greatly increased, and meanwhile, the movement stroke becomes complicated.
In summary, how to design a wafer loading area and a robot with reasonable configuration is a problem to be solved.
Disclosure of Invention
Aiming at the problems in the prior art, the invention provides a push-pull type wafer box loading and conveying system of wafer cleaning equipment, which can realize the smooth transfer of a manipulator in a wafer loading area, improve the conveying efficiency of wafers and reduce the whole volume of the wafer cleaning equipment.
In order to achieve the purpose, the invention adopts the following technical scheme:
the invention provides a push-pull type wafer box loading and conveying system of wafer cleaning equipment, which comprises a wafer loading device and a mechanical clamping device, wherein the wafer loading device comprises a loading shell, a chamber partition plate, a cart placing cavity, a wafer box bearing cart and a cleaning cavity, the chamber partition plate is arranged in the loading shell along the length direction of the loading shell and divides the interior of the loading shell into a first moving cavity and a second moving cavity, the cart placing cavity is arranged on one side of the lower part of the second moving cavity, the wafer box bearing cart is arranged in the cart placing cavity, the cleaning cavity is arranged on the other side of the lower part of the second moving cavity, and a rack is arranged on one side of the chamber partition plate facing the first moving cavity;
the mechanical clamping device comprises a transverse moving mechanism, a lifting mechanism, a clamping mechanism and a rack, wherein the transverse moving mechanism and the lifting mechanism are both arranged on the rack;
the transverse moving mechanism comprises a rotary cylinder, a driving gear and a driven gear, the rotary cylinder is mounted on the rack, the output end of the rotary cylinder is connected with the driving gear, the driving gear is connected with the driven gear through a conveyor belt, and the driven gear is meshed with the rack;
the lifting mechanism comprises a lifting cylinder, the lifting cylinder is arranged on the rack, and the output end of the lifting mechanism is connected with the clamping mechanism;
the clamping mechanism comprises a first clamping hand, a second clamping hand, a first clamping arm, a second clamping arm, an installation base, a cylinder installation base, a driving cylinder and a driving mechanism, the driving mechanism is installed on the installation base, the installation base is installed at the output end of the lifting cylinder, the driving cylinder is installed on the cylinder installation base, the first clamping hand is installed at one end of the first clamping arm, the second clamping hand is installed at one end of the second clamping arm, and the first clamping arm and the second clamping arm are driven by the driving mechanism;
the top of cavity baffle in the shallow place the chamber, wash the chamber and be provided with a set of centre gripping groove respectively directly over, the centre gripping groove with first centre gripping arm, second centre gripping arm phase-match, the frame set up in first removal intracavity, first centre gripping hand second centre gripping hand set up in the second removes the intracavity.
As a preferable technical solution, the driving mechanism includes a first driving arm, a second driving arm, a first moving arm, a second moving arm, a first driving block, a second driving block, a first rotating block, a second rotating block, a first limiting block, a second limiting block, and a limiting spring, one end of the first driving arm and one end of the second driving arm are respectively connected to an output end of the driving cylinder, the other end of the first driving arm and the other end of the second driving arm are elliptical cone-shaped, one end of the first moving arm is connected to the other end of the first holding arm, one end of the second moving arm is connected to the other end of the second holding arm, the first rotating block is mounted to the other end of the first moving arm, the second rotating block is mounted to the other end of the second moving arm, the first driving block is mounted to the first rotating block, the second driving block is mounted to the second rotating block, the other end of the first driving arm is located below the first driving block and is in contact with the first driving block, the other end of the second driving arm is located below the second driving block and is in contact with the second driving block, the first limiting block is installed on the first rotating block, the second limiting block is installed on the second rotating block, the limiting spring is connected with the first limiting block and the second limiting block, and the limiting spring is located below the first driving arm and the second driving arm.
As a preferred technical scheme, the wafer box carrying cart is provided with two wafer box placing grooves, and a group of clamping grooves is arranged above each wafer box placing groove.
As a preferred technical scheme, a first proximity switch is installed on the first rotating block, a second proximity switch is installed on the second rotating block, a first inductor is arranged below the first proximity switch, and a second inductor is arranged below the second proximity switch.
As a preferable technical solution, the first rotating block is provided coaxially with the first moving arm, and the second rotating block is provided coaxially with the second moving arm.
Preferably, the first rotation block and the shaft are attached to an end of the first moving arm, and the second rotation block is attached to an end of the second moving arm.
According to the preferable technical scheme, the first clamping glove is arranged at one end of the first clamping arm, and the second clamping glove is arranged at one end of the second clamping arm.
As a preferable technical solution, the movement angle of the first rotation block and the second rotation block is 1 to 3 degrees, and the relative movement distance of the first clamping arm and the second clamping arm is 16 to 25 mm.
According to the preferable technical scheme, the clamping device further comprises a fixed seat, the fixed seat and the air cylinder installation seat are of an integrated structure, a limiting groove is formed in the fixed seat, the first clamping arm is connected with the first moving arm through a first connecting external member, the second clamping arm is connected with the second moving arm through a second connecting external member, and the first connecting external member and the second connecting external member are arranged in the limiting groove and can move left and right in the limiting groove.
Preferably, the first and second rotating blocks have an octagonal transverse cross section.
Compared with the prior art, the invention has the beneficial effects that:
(1) the invention can realize the smooth transfer of the manipulator in the wafer loading area, improve the conveying efficiency of the wafer and reduce the whole volume of the wafer cleaning equipment.
(2) The wafer clamping device is provided with the symmetrical U-shaped clamping hands, the U-shaped clamping hands are driven by the driving mechanism to open and close, the wafer boxes are clamped, the opening and closing distances of the clamping hands are correspondingly adjusted according to the sizes of different wafer boxes, and the integrity and the stability of the clamping actions are guaranteed.
(3) The driving mechanism realizes the accurate opening and closing control of the clamping arm through the linkage of the driving arm, the driving block, the rotating block and the limiting block, only one driving cylinder needs to be controlled, the space occupied by the driving mechanism is greatly reduced, and the smooth operation of loading and unloading the wafers is met.
(4) According to the invention, through the limiting spring, the reset process of the clamping arm is realized, the use of a power device is reduced, the stability of the action process is ensured, and the clamping efficiency of the wafer is improved.
(5) The wafer box clamping device has the advantages that the transverse moving mechanism is arranged, so that the transfer of the mechanical arm among different process areas is realized, the lifting mechanism is arranged, the clamping mechanism is driven to move up and down, and the effective clamping of the wafer box is realized.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a wafer loading apparatus according to the present invention.
FIG. 2 is a second schematic structural diagram of the wafer loading apparatus of the present invention.
FIG. 3 is a third schematic view of the wafer loader according to the present invention.
FIG. 4 is a schematic structural diagram of a mechanical clamping device according to the present invention.
FIG. 5 is a second schematic view of the mechanical clamping device of the present invention.
Fig. 6 is a partially enlarged view of the mechanical clamping device of the present invention.
Fig. 7 is a second enlarged view of the mechanical clamping device of the present invention.
Fig. 8 is a third enlarged view of the mechanical clamping device of the present invention.
Wherein the reference numerals are specified as follows: the wafer cassette loading device comprises a first clamping arm 1, a second clamping arm 2, a first clamping hand 3, a second clamping hand 4, a first moving arm 5, a second moving arm 6, a mounting base 7, a cylinder mounting seat 8, a driving cylinder 9, a first driving arm 10, a second driving arm 11, a first rotating block 12, a second rotating block 13, a first driving block 14, a second driving block 15, a first limiting block 16, a second limiting block 17, a limiting spring 18, a first proximity switch 19, a second proximity switch 20, a first inductor 21, a second inductor 22, a fixed seat 23, a rotating cylinder 24, a driving gear 25, a driven gear 26, a lifting cylinder 27, a loading shell 28, a cavity partition plate 29, a first moving cavity 30, a second moving cavity 31, a wafer cassette bearing cart 32, a wafer cassette placing groove 33 and a cleaning cavity 34.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without inventive effort based on the embodiments of the present invention, are within the scope of the present invention.
The embodiment provides a push-pull type wafer box loading and conveying system of wafer cleaning equipment, which comprises a wafer loading device and a mechanical clamping device which are matched with each other.
The mechanical clamping device comprises a transverse moving mechanism, a lifting mechanism, a clamping mechanism and a rack, wherein the transverse moving mechanism and the lifting mechanism are both arranged on the rack.
The transverse moving mechanism comprises a rotary cylinder 24, a driving gear 25 and a driven gear 26, wherein the rotary cylinder 24 is installed on the rack, the output end of the rotary cylinder 24 is connected with the driving gear 25, the driving gear 25 is connected with the driven gear 26 through a conveyor belt, all process areas of the wafer cleaning equipment are connected through a rack, and the driven gear 26 is meshed with the rack.
The lifting mechanism comprises a lifting cylinder 27, the lifting cylinder 27 is installed on the rack, and the output end of the lifting mechanism 27 is connected with the clamping mechanism.
The clamping mechanism comprises a first clamping hand 3, a second clamping hand 4, a first clamping arm 1, a second clamping arm 2, a mounting base 7, a cylinder mounting base 8, a fixing base 23, a driving cylinder 9 and a driving mechanism. The first clamping hand 3 and the second clamping hand 4 are symmetrically arranged in a U-shaped structure and can be clamped at the edge positions of two sides of the wafer box, so that the wafer box can be clamped. The first clamping hand 3 is arranged at one end of the first clamping arm 1, the second clamping hand 4 is arranged at one end of the second clamping arm 2, and the first clamping hand 3 and the second clamping hand 4 are driven to open and close through the movement of the first clamping arm 1 and the second clamping arm 2. More preferably, the first clamping arm 3 is sleeved at one end of the first clamping arm 1, the second clamping arm 4 is sleeved at one end of the second clamping arm 2, and the first clamping arm 3 and the second clamping arm 4 can be opened and closed only along with the first clamping arm 1 and the second clamping arm 2 without rotating in a sleeved installation mode.
The driving mechanism is installed on the installation base 7, the installation base 7 is installed at the output end of the lifting cylinder 27, the driving cylinder 9 is installed on the cylinder installation base 8, the driving mechanism comprises a first driving arm 10, a second driving arm 11, a first moving arm 5, a second moving arm 6, a first driving block 14, a second driving block 15, a first rotating block 12, a second rotating block 13, a first limiting block 16, a second limiting block 17, a limiting spring 18, a first proximity switch 19, a second proximity switch 20, a first inductor 21 and a second inductor 22, wherein one end of the first driving arm 10 and one end of the second driving arm 11 are respectively connected with the output end of the driving cylinder 9 and extend out or retract under the action of the driving cylinder 9, the other ends of the first driving arm 10 and the second driving arm 11 are in an elliptical cone shape, the radius of the two ends changes along the length direction, one end of the first moving arm 5 is connected with the other end of the first clamping arm 1, one end of the second moving arm 6 is connected with the other end of the second clamping arm 2, the first rotating block 12 is axially installed at the other end of the first moving arm 5, the second rotating block 13 is axially installed at the other end of the second moving arm 6, the first rotating block 12 and the first moving arm 5 are coaxially arranged, and the second rotating block 13 and the second moving arm 6 are coaxially arranged. The first and second rotating blocks 12 and 13 have octagonal transverse cross sections. The first driving block 14 is mounted on a side of the first rotating block 12 facing the second rotating block 13, and the second driving block 15 is mounted on a side of the second rotating block 13 facing the first rotating block 12. The other end of the first driving arm 10 is positioned below the first driving block 14 and is always in contact with the first driving block 14; the other end of the second drive arm 11 is located below the second drive block 15 and always abuts against the second drive block 15. The first limiting block 16 is mounted on the first rotating block 12, the second limiting block 17 is mounted on the second rotating block 13, the limiting spring 18 is connected with the first limiting block 16 and the second limiting block 17, the limiting spring 18 is located below the first driving arm 10 and the second driving arm 11, the limiting spring 18 is used for ensuring that the first driving arm 10 and the first driving block 14 are always in a contact state, and the second driving arm 11 and the second driving block 15 are always in a contact state. The first rotating block 12 is provided with a first proximity switch 19, the second rotating block 13 is provided with a second proximity switch 20, a first inductor 21 is arranged below the first proximity switch 19, and a second inductor 22 is arranged below the second proximity switch 20. The movement angle of the first rotating block 12 and the second rotating block 13 is 1-3 degrees, and the relative movement distance of the first clamping arm 1 and the second clamping arm 2 is 16-25 mm. Fixing base 23 and 8 formula structures as an organic whole of cylinder mount pad, seted up the spacing groove on the fixing base 23, first centre gripping arm 1 is connected through first connecting external member with first moving arm 5, and second centre gripping arm 2 is connected through second connecting external member with second moving arm 6, and first connecting external member, second connecting external member set up in the spacing inslot and can control about the spacing inslot.
Wafer loading attachment and mechanical clamping device, wafer loading attachment is including loading casing 28, chamber baffle 29, the chamber is placed to the shallow, the wafer box bears shallow 32 and washing chamber 34, chamber baffle 29 sets up the length direction who loads casing 28 and separates the inside of loading casing 28 into first removal chamber 30 and second removal chamber 31 in loading casing 28, the shallow is placed the chamber and is set up in one side of second removal chamber 31 lower part, wafer box bears shallow 32 and sets up in the shallow and places the intracavity, washing chamber 34 sets up in the opposite side of second removal chamber 31 lower part, one side that chamber baffle 29 moves chamber 30 towards first is provided with the rack, driven gear 26 is connected with the rack meshing. The top of the cavity partition 29 is provided with a group of clamping grooves directly above the cart placing cavity and the cleaning cavity 34, the wafer box bearing cart 32 is provided with two wafer box placing grooves 33, and a group of clamping grooves is arranged above each wafer box placing groove 33. The clamping groove is matched with the first clamping arm and the second clamping arm, the rack is arranged in the first moving cavity 30, and the first clamping hand and the second clamping hand are arranged in the second moving cavity 31.
The working process is as follows:
step one, the wafer cassette is placed in the wafer placing groove on the wafer cassette carrying cart 32, and then the wafer carrying cart is pushed into the cart placing cavity.
And step two, the driving cylinder 9 is in a retraction state, the first clamping arm 1 and the second clamping arm 2 are in a close state, the lifting mechanism controls the height of the first clamping arm 1 and the height of the second clamping arm 2 to be located above the placing groove, and the transverse moving mechanism drives the first clamping arm 1 and the second clamping arm 2 to move towards the direction of the wafer bearing cart.
And step three, when the first clamping hand 3 and the second clamping hand 4 move to the position right above the wafer placing groove, the lifting mechanism drives the first clamping arm 1 and the second clamping arm 2 to descend into the wafer placing groove, the driving cylinder 9 acts to push the first driving arm 10 and the second driving arm 11, the first driving arm 10 and the second driving arm 11 push the first driving block 14 and the second driving block 15, the first driving block 14 and the second driving block 15 drive the first rotating block 12 and the second rotating block 13 to rotate, the first rotating block 12 and the second rotating block 13 rotate to drive the first limiting block 16 and the second limiting block 17 to be far away, so that the first moving arm 5 and the second moving arm 6 are driven to be far away, and the first moving arm 5 and the second moving arm 6 drive the first clamping arm 1 and the second clamping arm 2 to be opened. When the first clamping arm 1 and the second clamping arm 2 need to be closed, the driving cylinder 9 retracts, the first rotating block 12 and the second rotating block 13 reset under the action of the limiting spring 18, the first clamping arm 1 and the second clamping arm 2 are opened, the lifting cylinder 27 controls the clamping mechanism to move downwards, the first clamping hand 3 and the second clamping hand 4 reach the clamping position, and the first clamping hand 3 and the second clamping hand 4 are closed to clamp the wafer box.
And fourthly, the lifting mechanism drives the first clamping arm 1 and the second clamping arm 2 to move upwards, so that the first clamping arm 1 and the second clamping arm 2 are located above the placing groove, and the transverse moving mechanism drives the wafer box to move to the cleaning cavity 34 to clean the wafer box.
Although the present invention has been described in detail with respect to the above embodiments, it will be understood by those skilled in the art that modifications or improvements based on the disclosure of the present invention may be made without departing from the spirit and scope of the invention, and these modifications and improvements are within the spirit and scope of the invention.
Claims (10)
1. A push-pull type wafer box loading and conveying system of wafer cleaning equipment is characterized by comprising a wafer loading device and a mechanical clamping device, wherein the wafer loading device comprises a loading shell, a chamber partition plate, a cart placing cavity, a wafer box bearing cart and a cleaning cavity, the chamber partition plate is arranged in the loading shell along the length direction of the loading shell and divides the interior of the loading shell into a first moving cavity and a second moving cavity, the cart placing cavity is arranged on one side of the lower portion of the second moving cavity, the wafer box bearing cart is arranged in the cart placing cavity, the cleaning cavity is arranged on the other side of the lower portion of the second moving cavity, and a rack is arranged on one side, facing the first moving cavity, of the chamber partition plate;
the mechanical clamping device comprises a transverse moving mechanism, a lifting mechanism, a clamping mechanism and a rack, wherein the transverse moving mechanism and the lifting mechanism are both arranged on the rack;
the transverse moving mechanism comprises a rotary cylinder, a driving gear and a driven gear, the rotary cylinder is mounted on the rack, the output end of the rotary cylinder is connected with the driving gear, the driving gear is connected with the driven gear through a conveyor belt, and the driven gear is meshed with the rack;
the lifting mechanism comprises a lifting cylinder, the lifting cylinder is arranged on the rack, and the output end of the lifting mechanism is connected with the clamping mechanism;
the clamping mechanism comprises a first clamping hand, a second clamping hand, a first clamping arm, a second clamping arm, an installation base, a cylinder installation base, a driving cylinder and a driving mechanism, the driving mechanism is installed on the installation base, the installation base is installed at the output end of the lifting cylinder, the driving cylinder is installed on the cylinder installation base, the first clamping hand is installed at one end of the first clamping arm, the second clamping hand is installed at one end of the second clamping arm, and the first clamping arm and the second clamping arm are driven by the driving mechanism;
the top of cavity baffle in the shallow place the chamber, wash the chamber and be provided with a set of centre gripping groove respectively directly over, the centre gripping groove with first centre gripping arm, second centre gripping arm phase-match, the frame set up in first removal intracavity, first centre gripping hand second centre gripping hand set up in the second removes the intracavity.
2. A push-pull type wafer cassette loading and conveying system for a wafer cleaning apparatus as claimed in claim 1, wherein said driving mechanism comprises a first driving arm, a second driving arm, a first moving arm, a second moving arm, a first driving block, a second driving block, a first rotating block, a second rotating block, a first stopper, a second stopper and a stopper spring, one end of said first driving arm and one end of said second driving arm are connected to the output end of said driving cylinder, respectively, the other end of said first driving arm and said second driving arm are elliptical cone, one end of said first moving arm is connected to the other end of said first holding arm, one end of said second moving arm is connected to the other end of said second holding arm, said first rotating block is mounted to the other end of said first moving arm, said second rotating block is mounted to the other end of said second moving arm, the first driving block is mounted on the first rotating block, the second driving block is mounted on the second rotating block, the other end of the first driving arm is located below the first driving block and is in contact with the first driving block, the other end of the second driving arm is located below the second driving block and is in contact with the second driving block, the first limiting block is mounted on the first rotating block, the second limiting block is mounted on the second rotating block, the limiting spring is connected with the first limiting block and the second limiting block, and the limiting spring is located below the first driving arm and the second driving arm.
3. A push-pull type wafer cassette loading and conveying system for a wafer cleaning apparatus as claimed in claim 1, wherein said wafer cassette carrying cart is provided with two wafer cassette placing grooves, and a set of clamping grooves is provided above each of said wafer cassette placing grooves.
4. A push-pull type wafer cassette loading and conveying system for a wafer cleaning apparatus as claimed in claim 2, wherein a first proximity switch is installed on the first rotary block, a second proximity switch is installed on the second rotary block, a first sensor is installed below the first proximity switch, and a second sensor is installed below the second proximity switch.
5. A push-pull type wafer cassette loading conveyor system according to claim 2, wherein said first rotating block is coaxially disposed with said first moving arm, and said second rotating block is coaxially disposed with said second moving arm.
6. A push-pull type wafer cassette loading conveyor system for a wafer cleaning apparatus as claimed in claim 5, wherein said first rotary block and shaft are mounted to the end of said first moving arm, and said second rotary block is shaft mounted to the end of said second moving arm.
7. A push-pull type wafer cassette loading and conveying system for a wafer cleaning apparatus as claimed in claim 1, wherein said first clamp glove is installed at one end of said first clamp arm, and said second clamp glove is installed at one end of said second clamp arm.
8. A push-pull type wafer cassette loading and conveying system for a wafer cleaning apparatus as claimed in claim 2, wherein the moving angle of the first and second rotary blocks is 1-3 degrees, and the relative moving distance of the first and second clamp arms is 16-25 mm.
9. The push-pull type wafer cassette loading and conveying system for wafer cleaning equipment as claimed in claim 2, further comprising a fixing base, wherein the fixing base and the cylinder mounting base are of an integrated structure, the fixing base is provided with a limiting groove, the first clamping arm is connected with the first moving arm through a first connecting sleeve, the second clamping arm is connected with the second moving arm through a second connecting sleeve, and the first connecting sleeve and the second connecting sleeve are arranged in the limiting groove and can move left and right in the limiting groove.
10. A push-pull type wafer cassette loading conveyor system for a wafer cleaning apparatus as claimed in claim 2, wherein the first rotary block and the second rotary block have an octagonal transverse cross-section.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011636179.1A CN112864066B (en) | 2020-12-31 | 2020-12-31 | Push-pull type wafer box loading and conveying system of wafer cleaning equipment |
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| CN202011636179.1A CN112864066B (en) | 2020-12-31 | 2020-12-31 | Push-pull type wafer box loading and conveying system of wafer cleaning equipment |
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| CN112864066B CN112864066B (en) | 2022-06-10 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113437004A (en) * | 2021-06-16 | 2021-09-24 | 北京北方华创微电子装备有限公司 | Wafer transmission device and wafer transmission system |
| CN115274492A (en) * | 2022-06-22 | 2022-11-01 | 江苏亚电科技有限公司 | Swing type wafer drying equipment and wafer drying method |
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| CN115274492A (en) * | 2022-06-22 | 2022-11-01 | 江苏亚电科技有限公司 | Swing type wafer drying equipment and wafer drying method |
| CN115274492B (en) * | 2022-06-22 | 2023-10-03 | 江苏亚电科技有限公司 | Swing type wafer drying equipment and wafer drying method |
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