CN115020283B - Surface mount diode packaging equipment suitable for batch production - Google Patents
Surface mount diode packaging equipment suitable for batch production Download PDFInfo
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- CN115020283B CN115020283B CN202210590275.XA CN202210590275A CN115020283B CN 115020283 B CN115020283 B CN 115020283B CN 202210590275 A CN202210590275 A CN 202210590275A CN 115020283 B CN115020283 B CN 115020283B
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
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Abstract
The invention relates to the field of diode production, in particular to a surface mount diode packaging device suitable for batch production, which comprises a conveying device, a support and a placing device, wherein the conveying device is arranged on the support; the two driving devices are arranged on the bracket; the two bearing components are respectively arranged on one opposite side of the two driving devices, and the driving devices are used for driving the diode packaging box to move on the bearing components; the fixed seat is arranged on one side of the bracket; the first rotary driver is fixedly arranged on the fixed seat, and the output end of the first rotary driver is horizontally arranged; the rotating seat is fixedly arranged on the output end of the first rotating driver; the first linear drivers are uniformly and fixedly arranged on the rotating seat around the axis of the rotating seat; the sucker is fixedly arranged on the output end of the first linear driver; the unlocking assembly is arranged on the side wall of the sucker. This application has improved the encapsulation efficiency of diode encapsulation box through setting up placer.
Description
Technical Field
The invention relates to the field of diode production, in particular to a surface mount diode packaging device suitable for batch production.
Background
A diode is an electronic device made of semiconductor material (silicon, selenium, germanium, etc.). It has one-way conducting performance, that is, when positive voltage is applied to the anode of the diode, the diode is conducted. When a reverse voltage is applied to the anode and the cathode, the diode is turned off. Therefore, turning on and off the diode corresponds to turning on and off the switch. In the production of the diode, the absorbed diode packaging device can only move a single packaging box at a time, and is inconvenient for batch processing.
Chinese patent CN202121198630.6 discloses an encapsulation device for production of a chip diode, which comprises an encapsulation box, a support box, a jacking device, a jacking plate, a plurality of encapsulation boxes, and an extension plate, wherein a transmission device for transmitting the support box and a diode component is arranged in the middle of the extension plate, a transfer device for moving the encapsulation boxes is arranged at the rear of the extension plate, the transfer device comprises two support plates, a frame plate, a first motor, a first support shaft, a transmission circular plate, a transmission sleeve, a second support shaft, an upper beam, a rotating plate, a transmission plate, a third support shaft, and a shifting plate, the left ends of the rotating plate and the third support shaft are both fixedly connected with a connecting plate, the left side of the upper beam is provided with an upper plate, the right end of the upper plate and the left ends of the connecting plates are rotatably connected through shafts, the left end of the upper plate is fixedly connected with a longitudinal plate, the bottom end of the longitudinal plate is fixedly connected with a linkage plate, and the middle of the linkage plate is connected with a plurality of suckers.
Although the scheme realizes the simultaneous installation of a plurality of packaging boxes, the whole conveying line still needs to be stopped during packaging, so that the efficiency of diode packaging is not obviously improved.
Disclosure of Invention
Based on this, it is necessary to provide a surface mount diode packaging apparatus suitable for mass production, which includes a conveying device, a support and a placing device; the placing device comprises a driving device, a bearing assembly, a fixed seat, a first rotary driver, a rotating seat, a first linear driver, a sucker and a unlocking assembly; the two driving devices are arranged on the bracket; the two bearing components are respectively arranged on one opposite side of the two driving devices, and the driving devices are used for driving the diode packaging box to move on the bearing components; the fixed seat is arranged on one side of the bracket; the first rotary driver is fixedly arranged on the fixed seat, and the output end of the first rotary driver is horizontally arranged; the rotating seat is fixedly arranged on the output end of the first rotating driver; the first linear drivers are uniformly and fixedly arranged on the rotating seat around the axis of the rotating seat; the sucker is fixedly arranged on the output end of the first linear driver; the unlocking assembly is arranged on the side wall of the sucker and used for eliminating the suction force of the sucker.
Preferably, the unlocking assembly comprises a tube and an on-off valve; the switch valves correspond to the suckers one by one, and the switch valves are uniformly arranged on the rotating seat around the axis of the rotating seat; two ends of the pipe are respectively and fixedly connected with the pipe opening valve and the sucker.
Preferably, the placing device further comprises a triggering assembly, and the triggering assembly comprises a sliding chute, a ball body and a touch control piece; the sliding grooves are arranged in a plurality of numbers, the sliding grooves correspond to the first linear drivers one by one, and the sliding grooves are uniformly arranged on the side wall of the rotating seat around the axis of the rotating seat; the ball body is arranged in the chute in a rolling way; the touch control pieces are arranged at two ends of the sliding groove respectively, the touch control pieces are electrically connected with the first linear driver, and the touch control pieces are electrically connected with the unlocking assembly.
Preferably, the driving device comprises a second rotary driver, a first synchronous wheel, a second synchronous wheel and a synchronous belt; the second rotary driver is fixedly arranged on the bracket, and the output end of the second rotary driver is vertically upward; the first synchronous wheel is fixedly arranged on the output end of the second rotary driver; the second synchronizing wheel is arranged on one side of the first synchronizing wheel along the length direction of the bracket; the two ends of the synchronous belt are meshed with the first synchronous wheel and the second synchronous wheel respectively.
Preferably, the bearing assembly comprises a bearing block, a rotating groove and a bearing wheel; the bearing block is fixedly arranged on the bracket; the rotating groove is formed in the bearing block along the length direction of the bearing block; the supporting wheels are arranged in a plurality of numbers, and the supporting wheels are evenly arranged in the rotating groove in a rotatable mode along the length direction of the rotating groove.
Preferably, the placing device further comprises a guide assembly, and the guide assembly comprises a guide sleeve and a sliding seat; the guide sleeve is of a rectangular annular structure and is sleeved on the first linear driver; the sliding seat is arranged on the guide sleeve in a sliding manner along the length direction of the guide sleeve, and the sliding seat is fixedly arranged at the bottom of the sucker.
Preferably, the device further comprises an auxiliary mechanism, wherein the auxiliary mechanism comprises a pressing component and an identification component; the pressing component is arranged on the upper part of the bracket above the rotating seat; the identification component is arranged on one side of the pressing component and is electrically connected with the pressing component.
Preferably, the pressing assembly comprises a placing frame, a second linear driver and a pressing block; the placing frame is fixedly arranged on the upper part of the bracket above the rotating seat; the second linear driver is fixedly arranged at the upper part of the placing frame, and the output end of the second linear driver is vertically downward; the pressing block is fixedly arranged on the output end of the second linear driver.
Preferably, the identification component comprises an infrared sensor; the infrared sensor is fixedly arranged on one side of the pressing component.
Preferably, the device further comprises a baffle; the baffle is provided with two, and two baffles are fixed the setting respectively in conveyor's both sides.
Compared with the prior art, the beneficial effect of this application is:
1. this application has realized not needing to pause when encapsulating the diode through setting up drive arrangement, accepting subassembly, fixing base, first rotary actuator, rotating seat, first linear actuator, sucking disc and unblock subassembly to the encapsulation efficiency's of diode encapsulation box technical requirement has been improved.
2. This application realizes the unblock function of unblock subassembly through setting up pipe and ooff valve.
3. According to the technical requirement that the unlocking assembly and the first linear driver can be automatically triggered by the triggering assembly through the sliding groove, the ball body and the touch piece.
4. This application has realized drive arrangement's driving function through setting up second rotary actuator, first synchronizing wheel, second synchronizing wheel and hold-in range.
5. This application has realized the more smooth technical requirement that diode encapsulation box can remove on accepting the subassembly through setting up and accepting the piece, rotating groove and accepting the wheel.
Drawings
FIG. 1 is a first perspective view of the present application;
FIG. 2 is a second perspective view of the present application;
FIG. 3 is a first perspective view of the present application with the transport apparatus removed;
FIG. 4 is a second perspective view of the present application with the delivery device removed;
FIG. 5 is a partial perspective view of the first embodiment of the present application;
FIG. 6 is a partial perspective view of the second embodiment of the present application;
FIG. 7 is a third perspective view of a portion of the present application;
FIG. 8 is a partially assembled perspective view of the present application;
FIG. 9 is an enlarged partial schematic view at A of FIG. 8 of the present application;
FIG. 10 is a partially assembled perspective view of the second embodiment of the present application;
the reference numbers in the figures are:
1-a conveying device; 1 a-a baffle;
2-a scaffold;
3-placing the device; 3 a-a drive; 3a 1-a second rotary drive; 3a 2-first synchronizing wheel; 3a 3-a second synchronizing wheel; 3a 4-synchronous belt; 3 b-a receiving assembly; 3b 1-a receiving block; 3b 2-a rotating groove; 3b 3-a receiving wheel; 3 c-a fixed seat; 3 d-a first rotary drive; 3 e-a rotating seat; 3f — first linear driver; 3 g-sucker; 3 h-unlocking the assembly; 3h 1-tube; 3h 2-switching the valve; 3 i-a trigger component; 3i 1-chute; 3i 2-sphere; 3 j-a guide assembly; 3j 1-a guide sleeve; 3j 2-sliding seat;
4-an auxiliary mechanism; 4 a-a pressing assembly; 4a 1-placing rack; 4a 2-second linear drive; 4a 3-pressing block; 4 b-infrared sensor.
Detailed Description
For further understanding of the features and technical means of the present invention, as well as the specific objects and functions attained by the present invention, the present invention will be described in further detail with reference to the accompanying drawings and detailed description.
As shown in fig. 1-10, the present application provides:
the chip diode packaging equipment suitable for batch production comprises a conveying device 1, a support 2 and a placing device 3; the placing device 3 comprises a driving device 3a, a bearing component 3b, a fixed seat 3c, a first rotary driver 3d, a rotating seat 3e, a first linear driver 3f, a sucker 3g and a unlocking component 3h; two driving devices 3a are arranged, and the driving devices 3a are arranged on the bracket 2; the two bearing components 3b are arranged, the two bearing components 3b are respectively arranged on one opposite side of the two driving devices 3a, and the driving devices 3a are used for driving the diode packaging box to move on the bearing components 3 b; the fixed seat 3c is arranged on one side of the bracket 2; the first rotary driver 3d is fixedly arranged on the fixed seat 3c, and the output end of the first rotary driver 3d is horizontally arranged; the rotating seat 3e is fixedly arranged on the output end of the first rotating driver 3 d; a plurality of first linear drivers 3f are arranged, and the first linear drivers 3f are uniformly and fixedly arranged on the rotating seat 3e around the axis of the rotating seat 3 e; the sucker 3g is fixedly arranged on the output end of the first linear driver 3 f; the unlocking assembly 3h is arranged on the side wall of the sucker 3g, and the unlocking assembly 3h is used for eliminating the suction force of the sucker 3 g.
Based on the above embodiments, the technical problem to be solved by the present application is how to improve the packaging efficiency of the diode packaging box. Therefore, the support 2 is fixedly arranged on the upper portion of the conveying device 1, the placing device 3 is arranged on the support 2, the placing device 3 is used for conveying the diode packaging box, the conveying device 1 is used for conveying the diode, after the conveying device 1 is started, the diode is arranged and driven to move, and the diode packaging box can be conveyed and placed on the diode through the placing device 3. The placing device 3 works according to the following principle, after the device is started, the diode packaging box is placed on the receiving component 3b, two receiving components 3b are arranged, the driving device 3a is arranged on the opposite side of the two receiving components 3b, when the diode packaging box is placed on the receiving component 3b, two ends of the diode packaging box are respectively contacted with the driving device 3a, so that after the diode packaging box is placed on the receiving component 3b, the driving device 3a is started, the driving device 3a drives the diode packaging box arranged on the receiving component 3b to move along the length direction of the receiving component 3b, the diode packaging box moves along the length direction of the receiving component 3b, when the diode packaging box moves to one end of the receiving component 3b, the rotating seat 3e is arranged below the diode packaging box, the first linear driver 3f arranged on the rotating seat 3e starts to be started, the first linear driver 3f is preferably a servo electric cylinder, when the first linear driver 3f is started, the first linear driver 3f is arranged on the output end of the diode packaging box, and the first linear driver 3f is driven by the sucking disc 3g and forms a sucking disc for slowly sucking disc for sucking disc to suck the diode packaging box, and the sucking disc 3g is finally, and the diode packaging box is lifted up. Then the first rotary driver 3d arranged at one side of the rotary base 3e starts to start, the first rotary driver 3d is preferably a servo motor, the first rotary driver 3d drives the rotary base 3e arranged at the output end thereof to rotate, so that the rotary base 3e drives the first linear driver 3f arranged thereon to rotate, the sucker 3g arranged at the output end of the first linear driver 3f drives the diode package box to rotate along with the diode package box, when the sucker 3g drives the diode package box to rotate to one side of the rotary base 3e close to the conveying device 1, the diode package box arranged on the sucker 3g seals the diode arranged on the conveying device 1, after the diode is sealed, the unlocking component 3h arranged on the side wall of the sucker 3g starts, the unlocking component 3h blows the outside air into the sucker 3g, so that the sucker 3g loses the adsorption force on the diode package box, then the output end of the first linear driver 3f under the sucker 3g retracts, and the first linear driver 3f arranged at the upper part of the rotary base 3e starts to adsorb the diode again, and the diode package box starts to repeatedly adsorb. Therefore, the diode is packaged without pause, and the technical requirement of the packaging efficiency of the diode packaging box is improved.
Further, as shown in fig. 10:
the unlocking assembly 3h comprises a pipe 3h1 and a switch valve 3h2; the switch valves 3h2 correspond to the suckers 3g one by one, and the switch valves 3h2 are uniformly arranged on the rotating seat 3e around the axis of the rotating seat 3 e; the two ends of the pipe 3h1 are respectively fixedly connected with the pipe opening valve and the sucker 3 g.
Based on the above embodiments, the technical problem to be solved by the present application is how to implement the unlocking function on the unlocking component 3 h. Therefore, the switching valve 3h2 can be independently controlled, when the first linear driver 3f is positioned at the upper part of the rotating seat 3e, the first linear driver 3f can drive the sucker 3g arranged on the output end of the first linear driver to be in contact with the diode packaging box positioned on the bearing component 3b, and the switching valve 3h2 arranged on one side of the sucker 3g is in a closed state, so that after the sucker 3g is in close contact with the diode packaging box, air between the sucker 3g and the diode packaging box can be exhausted, and the sucker 3g can suck the diode packaging box. And when the rotating seat 3e drives the first linear driver 3f arranged on the rotating seat to rotate to one side close to the conveying device 1, after the diode packaging box is contacted with the diode, the sucker 3g on the output end of the first linear driver 3f positioned below the rotating seat 3e needs to be separated from the diode packaging box, so the switch valve 3h2 on one side of the sucker 3g can be opened, at the moment, the external air can flow into the sucker 3g through the pipe 3h1, and the sucker 3g loses suction force. Thus, the unlocking function of the unlocking assembly 3h is realized.
Further, as shown in fig. 8-9:
the placing device 3 further comprises a triggering component 3i, and the triggering component 3i comprises a chute 3i1, a ball 3i2 and a touch control piece; a plurality of sliding grooves 3i1 are arranged, the sliding grooves 3i1 correspond to the first linear drivers 3f one by one, and the sliding grooves 3i1 are uniformly arranged on the side wall of the rotating seat 3e around the axis of the rotating seat 3 e; the ball 3i2 is arranged in the chute 3i1 in a rolling way; the touch control pieces are arranged at two ends of the sliding groove 3i1 respectively, the touch control pieces are electrically connected with the first linear driver 3f, and the touch control pieces are electrically connected with the unlocking component 3 h.
Based on the above-described embodiment, the technical problem that the present application intends to solve is how to cause the unlocking assembly 3h and the first linear driver 3f to be automatically triggered. For this reason, in the present application, since the sliding groove 3i1 is provided with two touch pieces, for convenience of separation, when the first linear actuator 3f disposed on the upper portion of the rotating base 3e is started, the touch piece disposed on the upper portion of the sliding groove 3i1 on the side of the first linear actuator 3f is referred to as a first pressing piece, and the touch piece disposed on the lower end of the sliding groove 3i1 is referred to as a second pressing piece, and the ball 3i2 is pressed on the second pressing piece. The second pressing member is electrically connected to the first linear actuator 3f, so that the first linear actuator 3f is activated, and the suction cup 3g provided at the output end of the first linear actuator 3f is in contact with the diode package provided on the receiving member 3 b. At this time, the ball 3i2 in the sliding groove 3i1 on one side of the first linear actuator 3f located below the rotating seat 3e presses down the first pressing member, and after the first pressing member is triggered, the first pressing member stops the first linear actuator 3f, and then the switch valve 3h2 on one side of the first linear actuator 3f is opened, so that the suction cup 3g arranged on the output end of the first linear actuator 3f is not contacted with the diode packaging box any more. This achieves the technical requirement that the triggering assembly 3i can cause the unlocking assembly 3h and the first linear drive 3f to be triggered automatically.
Further, as shown in fig. 7:
the driving device 3a includes a second rotary driver 3a1, a first synchronizing wheel 3a2, a second synchronizing wheel 3a3, and a synchronizing belt 3a4; the second rotary driver 3a1 is fixedly arranged on the bracket 2, and the output end of the second rotary driver 3a1 is vertically upward; the first synchronous wheel 3a2 is fixedly arranged on the output end of the second rotary driver 3a 1; the second synchronous wheel 3a3 is arranged at one side of the first synchronous wheel 3a2 along the length direction of the bracket 2; both ends of the timing belt 3a4 are engaged with the first timing pulley 3a2 and the second timing pulley 3a3, respectively.
Based on the above embodiments, the technical problem to be solved by the present application is how to drive the diode package on the receiving component 3b to move by the driving device 3 a. For this reason, the second rotary driver 3a1 is preferably a servo motor, when the second rotary driver 3a1 is started, the first synchronous wheel 3a2 is driven by the second rotary driver 3a1 to rotate, and then the synchronous belt 3a4 is driven together, because the synchronous belt 3a4 contacts with the diode packaging box, the synchronous belt 3a4 can drive the diode packaging box to move on the bearing component 3 b. The drive function of the drive device 3a is thus realized.
Further, as shown in fig. 6:
the bearing component 3b comprises a bearing block 3b1, a rotating groove 3b2 and a bearing wheel 3b3; the bearing block 3b1 is fixedly arranged on the bracket 2; the rotating groove 3b2 is formed in the receiving block 3b1 along the length direction of the receiving block 3b 1; the receiving wheel 3b3 is provided in plurality, and the receiving wheel 3b3 is rotatably and uniformly arranged in the rotating groove 3b2 along the length direction of the rotating groove 3b 2.
Based on the above embodiments, the technical problem that the present application intends to solve is how to make the movement of the diode enclosure on the receiving component 3b smoother. Therefore, when the driving device 3a is started, the diode packaging box slides on the bearing component 3b, and because the bottom of the diode packaging box is connected with the bearing wheel 3b3, the diode packaging box is not subjected to excessive resistance when moving. This achieves the technical requirement that the diode package can be moved on the receiving component 3b more smoothly.
Further, as shown in fig. 8 and 10:
the placing device 3 further comprises a guide assembly 3j, wherein the guide assembly 3j comprises a guide sleeve 3j1 and a sliding seat 3j2; the guide sleeve 3j1 is a rectangular annular structure, and the guide sleeve 3j1 is sleeved on the first linear driver 3 f; the sliding seat 3j2 is slidably disposed on the guide sleeve 3j1 along the length direction of the guide sleeve 3j1, and the sliding seat 3j2 is fixedly disposed at the bottom of the suction cup 3 g.
Based on the above embodiments, the technical problem to be solved by the present application is how to make the suction cup 3g lift by the first linear actuator 3f more stably. Therefore, the first linear driver 3f is arranged on the guide sleeve 3j1 and the sliding seat 3j2, and when the first linear driver 3f drives the sucker 3g provided with the sliding seat 3j2 to move, the sucker 3g is not easy to bend.
Further, as shown in fig. 2-3:
the device also comprises an auxiliary mechanism 4, wherein the auxiliary mechanism 4 comprises a pressing component 4a and an identification component; the pressing component 4a is arranged at the upper part of the bracket 2 above the rotating seat 3 e; the recognition component is arranged on one side of the pressing component 4a and is electrically connected with the pressing component 4 a.
Based on the above embodiment, the technical problem that the present application is intended to solve is how to make the suction cup 3g contact with the diode packaging box on the receiving component 3b better when the suction cup contacts with the diode packaging box, so as to ensure the absorption firmness of the suction cup 3 g. Therefore, after the first linear driver 3f on the upper portion of the displacement rotating seat 3e is started, the first linear driver 3f can drive the sucker 3g on the output end of the displacement rotating seat to move towards the diode packaging box, when the sucker 3g is contacted with the bottom of the diode packaging box, the pressing component 4a can be also contacted with the upper portion of the diode packaging box, and the identification component arranged on one side of the pressing component 4a is used for identifying the moving diode packaging box. When the identification component identifies the diode package, the pressing component 4a is activated. The pressing component 4a and the suction cup 3g synchronously press the diode packaging box.
Further, as shown in fig. 4:
the pressing assembly 4a comprises a placing frame 4a1, a second linear driver 4a2 and a pressing block 4a3; the placing rack 4a1 is fixedly arranged at the upper part of the bracket 2 above the rotating seat 3 e; the second linear driver 4a2 is fixedly arranged at the upper part of the placing rack 4a1, and the output end of the second linear driver 4a2 is vertically downward; the pressing block 4a3 is fixedly arranged at the output end of the second linear actuator 4a 2.
Based on the above-mentioned embodiments, the technical problem that the present application intends to solve is how the pressing member 4a implements the pressing function. For this reason, the second linear actuator 4a2 is preferably a linear cylinder, and when the identification component identifies the diode packaging box, the second linear actuator 4a2 is started, and the second linear actuator 4a2 drives the pressing block 4a3 arranged on the output end of the second linear actuator to slowly descend, so that the pressing function of the pressing component 4a is realized.
Further, as shown in fig. 4:
the identification component comprises an infrared sensor 4b; the infrared sensor 4b is fixedly provided at one side of the pressing member 4 a.
Based on the above embodiments, the technical problem that the present application intends to solve is how to identify the diode packaging box by the identification component. Therefore, the identification of the passing diode packaging box can be realized by arranging the infrared sensor 4 b.
Further, as shown in fig. 1:
also comprises a baffle plate 1a; two baffles 1a are arranged, and the two baffles 1a are respectively and fixedly arranged at two sides of the conveying device 1.
Based on the above embodiments, the technical problem that the present application intends to solve is how to prevent the diode from falling when the diode is conveyed by the conveying device 1. Therefore, the phenomenon that the diode falls when the diode is driven to be conveyed by the conveying device 1 can be avoided by arranging the baffle plate 1 a.
The above examples, which are intended to represent only one or more embodiments of the present invention, are described in greater detail and with greater particularity, and are not to be construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. The chip diode packaging equipment suitable for batch production comprises a conveying device (1), a bracket (2) and a placing device (3);
the device is characterized in that the placing device (3) comprises a driving device (3 a), a bearing component (3 b), a fixed seat (3 c), a first rotary driver (3 d), a rotary seat (3 e), a first linear driver (3 f), a sucker (3 g) and a unlocking component (3 h);
two driving devices (3 a) are arranged, and the driving devices (3 a) are arranged on the bracket (2);
the two bearing components (3 b) are arranged, the two bearing components (3 b) are respectively arranged on one opposite side of the two driving devices (3 a), and the driving devices (3 a) are used for driving the diode packaging box to move on the bearing components (3 b);
the fixed seat (3 c) is arranged on one side of the bracket (2);
the first rotary driver (3 d) is fixedly arranged on the fixed seat (3 c), and the output end of the first rotary driver (3 d) is horizontally arranged;
the rotating seat (3 e) is fixedly arranged on the output end of the first rotating driver (3 d);
a plurality of first linear drivers (3 f) are arranged, and the first linear drivers (3 f) are uniformly and fixedly arranged on the rotating seat (3 e) around the axis of the rotating seat (3 e);
the sucker (3 g) is fixedly arranged on the output end of the first linear driver (3 f);
the unlocking assembly (3 h) is arranged on the side wall of the sucker (3 g), and the unlocking assembly (3 h) is used for eliminating the suction force of the sucker (3 g);
the output end of the first linear driver (3 f) below the sucker (3 g) retracts, the first linear driver (3 f) positioned at the upper part of the rotating seat (3 e) begins to extend, the diode packaging box on the bearing component (3 b) is adsorbed again, and the operation is repeated in a circulating mode.
2. The chip diode packaging apparatus suitable for mass production according to claim 1, wherein the unlocking assembly (3 h) comprises a tube (3 h 1) and a switching valve (3 h 2);
the switch valves (3 h 2) correspond to the suckers (3 g) one by one, and the switch valves (3 h 2) are uniformly arranged on the rotating seat (3 e) around the axis of the rotating seat (3 e);
two ends of the pipe (3 h 1) are respectively and fixedly connected with the pipe opening valve and the sucker (3 g).
3. The chip diode packaging equipment suitable for batch production according to claim 1, wherein the placing device (3) further comprises a triggering component (3 i), and the triggering component (3 i) comprises a chute (3 i 1), a sphere (3 i 2) and a touch piece;
a plurality of sliding chutes (3 i 1) are arranged, the sliding chutes (3 i 1) correspond to the first linear drivers (3 f) one by one, and the sliding chutes (3 i 1) are uniformly arranged on the side wall of the rotating seat (3 e) around the axis of the rotating seat (3 e);
the ball body (3 i 2) is arranged in the chute (3 i 1) in a rolling way;
the touch control pieces are arranged at two ends of the sliding groove (3 i 1) respectively, the touch control pieces are electrically connected with the first linear driver (3 f), and the touch control pieces are electrically connected with the unlocking assembly (3 h).
4. The chip diode packaging apparatus suitable for mass production according to claim 1, wherein the driving device (3 a) comprises a second rotary driver (3 a 1), a first synchronous wheel (3 a 2), a second synchronous wheel (3 a 3) and a synchronous belt (3 a 4);
the second rotary driver (3 a 1) is fixedly arranged on the bracket (2), and the output end of the second rotary driver (3 a 1) is vertically upward;
the first synchronous wheel (3 a 2) is fixedly arranged on the output end of the second rotary driver (3 a 1);
the second synchronizing wheel (3 a 3) is arranged on one side of the first synchronizing wheel (3 a 2) along the length direction of the bracket (2);
two ends of the synchronous belt (3 a 4) are respectively meshed with the first synchronous wheel (3 a 2) and the second synchronous wheel (3 a 3).
5. The chip diode packaging device suitable for mass production according to claim 1, wherein the receiving assembly (3 b) comprises a receiving block (3 b 1), a rotating groove (3 b 2) and a receiving wheel (3 b 3);
the bearing block (3 b 1) is fixedly arranged on the bracket (2);
the rotating groove (3 b 2) is formed in the bearing block (3 b 1) along the length direction of the bearing block (3 b 1);
the plurality of receiving wheels (3 b 3) are arranged, and the receiving wheels (3 b 3) are uniformly arranged in the rotating groove (3 b 2) in a rotatable manner along the length direction of the rotating groove (3 b 2).
6. The chip diode packaging device suitable for mass production according to claim 1, wherein the placing device (3) further comprises a guiding assembly (3 j), the guiding assembly (3 j) comprises a guiding sleeve (3 j 1) and a sliding seat (3 j 2);
the guide sleeve (3 j 1) is of a rectangular annular structure, and the guide sleeve (3 j 1) is sleeved on the first linear driver (3 f);
the sliding seat (3 j 2) is arranged on the guide sleeve (3 j 1) in a sliding way along the length direction of the guide sleeve (3 j 1), and the sliding seat (3 j 2) is fixedly arranged at the bottom of the sucker (3 g).
7. The chip diode packaging apparatus suitable for mass production according to claim 1, further comprising an auxiliary mechanism (4), wherein the auxiliary mechanism (4) comprises a pressing component (4 a) and an identification component;
the pressing component (4 a) is arranged on the upper part of the bracket (2) above the rotating seat (3 e);
the identification component is arranged on one side of the pressing component (4 a), and the identification component is electrically connected with the pressing component (4 a).
8. The chip diode packaging device suitable for mass production according to claim 7, wherein the pressing assembly (4 a) comprises a placing frame (4 a 1), a second linear driver (4 a 2) and a pressing block (4 a 3);
the placing rack (4 a 1) is fixedly arranged at the upper part of the bracket (2) above the rotating seat (3 e);
the second linear driver (4 a 2) is fixedly arranged at the upper part of the placing rack (4 a 1), and the output end of the second linear driver (4 a 2) is vertically downward;
the pressing block (4 a 3) is fixedly arranged on the output end of the second linear actuator (4 a 2).
9. The chip diode packaging apparatus suitable for mass production according to claim 7, wherein the identification component includes an infrared sensor (4 b);
the infrared sensor (4 b) is fixedly arranged on one side of the pressing component (4 a).
10. The chip diode packaging device suitable for mass production according to claim 1, further comprising a baffle plate (1 a);
two baffles (1 a) are arranged, and the two baffles (1 a) are respectively fixedly arranged on two sides of the conveying device (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210590275.XA CN115020283B (en) | 2022-05-26 | 2022-05-26 | Surface mount diode packaging equipment suitable for batch production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210590275.XA CN115020283B (en) | 2022-05-26 | 2022-05-26 | Surface mount diode packaging equipment suitable for batch production |
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| Publication Number | Publication Date |
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| CN115020283A CN115020283A (en) | 2022-09-06 |
| CN115020283B true CN115020283B (en) | 2023-03-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210590275.XA Active CN115020283B (en) | 2022-05-26 | 2022-05-26 | Surface mount diode packaging equipment suitable for batch production |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0512126A1 (en) * | 1991-05-02 | 1992-11-11 | LIGMATECH MASCHINENBAU GmbH | Device for manipulating panel shaped workpieces |
| EP2799349A1 (en) * | 2013-04-30 | 2014-11-05 | Theegarten-Pactec Gmbh & Co. Kg | Method for grouping articles in article bars and grouping device and packaging machine comprising one such and control device for product holding device |
| CN209544291U (en) * | 2019-04-17 | 2019-10-25 | 安徽巨合电子科技有限公司 | Detection device is continuously truncated in a kind of LED support |
| CN111660081A (en) * | 2020-07-13 | 2020-09-15 | 朱陈芳 | Car vacuum booster adjustment fork rigging equipment |
| CN112853719A (en) * | 2021-03-05 | 2021-05-28 | 苏州工业职业技术学院 | Dust collecting equipment for PTFE filter bag grey cloth |
| CN215183873U (en) * | 2021-05-31 | 2021-12-14 | 威海新晶电子科技有限公司 | Packaging hardware is used in paster diode production |
-
2022
- 2022-05-26 CN CN202210590275.XA patent/CN115020283B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0512126A1 (en) * | 1991-05-02 | 1992-11-11 | LIGMATECH MASCHINENBAU GmbH | Device for manipulating panel shaped workpieces |
| EP2799349A1 (en) * | 2013-04-30 | 2014-11-05 | Theegarten-Pactec Gmbh & Co. Kg | Method for grouping articles in article bars and grouping device and packaging machine comprising one such and control device for product holding device |
| CN209544291U (en) * | 2019-04-17 | 2019-10-25 | 安徽巨合电子科技有限公司 | Detection device is continuously truncated in a kind of LED support |
| CN111660081A (en) * | 2020-07-13 | 2020-09-15 | 朱陈芳 | Car vacuum booster adjustment fork rigging equipment |
| CN112853719A (en) * | 2021-03-05 | 2021-05-28 | 苏州工业职业技术学院 | Dust collecting equipment for PTFE filter bag grey cloth |
| CN215183873U (en) * | 2021-05-31 | 2021-12-14 | 威海新晶电子科技有限公司 | Packaging hardware is used in paster diode production |
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| Publication number | Publication date |
|---|---|
| CN115020283A (en) | 2022-09-06 |
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